Wafer lens taking mechanism

Abstract

The utility model relates to the technical field of lens taking, in particular to a wafer lens taking mechanism, which is characterized in that a plastic disc displacement mechanism comprises a plastic disc moving linear module and a plastic disc moving seat connected to the plastic disc moving linear module; a glue disc is fixed on the glue disc moving seat; a lens ejection mechanism is arranged below the front pick-and-place mechanism; the rubber disc displacement mechanism is arranged between the lens ejection mechanism and the front taking and placing mechanism; the lens ejection mechanism comprises an ejector pin moving linear module, an ejector pin fixing seat connected to the ejector pin moving linear module and an ejector pin lifting cylinder with one end connected to the ejector pin fixing seat; a thimble is fixed at the other end of the thimble jacking cylinder; and the moving direction of the plastic plate moving linear module is perpendicular to the moving direction of the ejector pin moving linear module. When the suction pen is used, the friction force between the wafer lens to be taken and the adjacent lens is reduced, so that the target wafer lens is easier to take out, the no-load probability of the suction pen is reduced, and the feeding efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of lens material taking, in particular to a wafer lens material taking mechanism. Background Art

[0002] Lens assembly consists of a wafer lens, a housing and a locking ring. Large wafer lens raw materials are generally placed on a sticky glue tray and then cut into wafer lenses of specified specifications. After the wafer lenses are cut, the wafer lenses need to be taken out and placed into the housing. The existing wafer lens material taking generally adsorbs the lens directly with a suction head. However, after being cut into several small lenses, there will be resistance interference between them, and it is difficult to take out the target small lens. Therefore, during lens material taking, the situation of material shortage often occurs. Content of the Utility Model

[0003] The purpose of the utility model is to provide a wafer lens material taking mechanism aiming at the defects and deficiencies of the prior art.

[0004] To achieve the above purpose, the technical solution adopted by the utility model is:

[0005] A wafer lens material taking mechanism of the utility model includes a front picking and placing mechanism and a glue tray displacement mechanism; a suction pen is arranged on the front picking and placing mechanism;

[0006] The glue tray displacement mechanism includes a glue tray moving linear module and a glue tray moving seat connected to the glue tray moving linear module; a glue tray is fixed on the glue tray moving seat;

[0007] A lens ejecting mechanism is arranged below the front picking and placing mechanism; the glue tray displacement mechanism is arranged between the lens ejecting mechanism and the front picking and placing mechanism;

[0008] The lens ejecting mechanism includes a thimble moving linear module, a thimble fixing seat connected to the thimble moving linear module, and a thimble lifting cylinder with one end connected to the thimble fixing seat; a thimble is fixed at the other end of the thimble lifting cylinder; the movement direction of the glue tray moving linear module is perpendicular to the movement direction of the thimble moving linear module.

[0009] Furthermore, at least one counterbore hole for the moving seat is arranged on the glue tray moving seat; a glue tray fixing frame is fixed outside the glue tray; the glue tray fixing frame is embedded into the counterbore of the counterbore hole for the moving seat; a glue tray pressing mechanism for pressing the glue tray fixing frame in the counterbore hole for the moving seat is arranged on the glue tray moving seat.

[0010] Further, the rubber disk pressing mechanism is composed of multiple pressing modules; the pressing modules are circumferentially distributed on the counterbored holes of the moving seat; the pressing module is composed of a forward pushing cylinder and a rubber disk pressing cylinder; one end of the forward pushing cylinder is fixed on the rubber disk moving seat; the other end of the forward pushing cylinder is fixed on one end of the rubber disk pressing cylinder.

[0011] Further, a slide is arranged on the ejector pin moving linear module; the ejector pin fixing seat is slidably connected to the slide; a differential head is arranged between the slide and the ejector pin fixing seat.

[0012] After adopting the above structure, the beneficial effects of the present utility model are as follows: the large wafer lens is cut into multiple wafer lenses and loaded onto the rubber disk; then the rubber disk moving linear module drives the rubber disk moving seat to convey the large wafer lens to the lower part of the suction pen of the front picking and placing mechanism; the ejector pin moving linear module on the lens ejecting mechanism adjusts the position of the ejector pin so that the ejector pin is aligned with the wafer lens to be taken out; the ejector pin lifting cylinder drives the ejector pin to jack up the corresponding wafer lens, so that the wafer lens rises against the resistance of the adjacent lenses. When the wafer lens is misaligned with the adjacent lens in the height direction to a certain extent, the friction between the wafer lens to be taken and the adjacent lens is reduced, making it easier to take out the target wafer lens, reducing the probability of the suction pen being idle, and improving the feeding efficiency. Description of the Drawings

[0013] Figure 1 is the front sectional view of the present utility model;

[0014] Figure 2 is Figure 1 the enlarged view of part L in

[0015] Figure 3 is the top view of the present utility model;

[0016] Figure 4 is the structural diagram of the lens ejecting mechanism;

[0017] Figure 5 is the structural diagram of the rubber disk displacement mechanism;

[0018] Description of the Reference Numerals:

[0019] A, front picking and placing mechanism; A3, suction pen; J, lens ejecting mechanism; J1, ejector pin moving linear module;

[0020] J101, slide; J2, differential head; J3, ejector pin fixing seat; J4, ejector pin;

[0021] J5, ejector pin lifting cylinder; K, rubber disk displacement mechanism; K1, rubber disk moving linear module;

[0022] K2, rubber disk moving seat; K201, counterbored hole of the moving seat; K3, forward pushing cylinder; K4, rubber disk;

[0023] K5, rubber disk fixing frame; K6, rubber disk pressing cylinder. Specific embodiments

[0024] The present invention will be further described below in conjunction with the accompanying drawings.

[0025] As Figures 1 to 5 shown, a wafer lens picking mechanism of the present invention includes a front picking and placing mechanism A and a rubber disk displacement mechanism K; a suction pen 3 is provided on the front picking and placing mechanism A.

[0026] The rubber disk displacement mechanism K includes a rubber disk moving linear module K1 and a rubber disk moving seat K2 connected to the rubber disk moving linear module K1; a rubber disk K4 is fixed on the rubber disk moving seat K2.

[0027] A lens ejecting mechanism J is provided below the front picking and placing mechanism A; the rubber disk displacement mechanism K is arranged between the lens ejecting mechanism J and the front picking and placing mechanism A.

[0028] The lens ejecting mechanism J includes a thimble moving linear module J1, a thimble fixing seat J3 connected to the thimble moving linear module J1, and a thimble lifting cylinder J5 with one end connected to the thimble fixing seat J3; a thimble J4 is fixed to the other end of the thimble lifting cylinder J5; the moving direction of the rubber disk moving linear module K1 is perpendicular to the moving direction of the thimble moving linear module J1.

[0029] The thimble moving linear module J1 and the rubber disk moving linear module K1 are both linear modules, which have no essential difference from the prior art, so they will not be described in detail here; the thimble moving linear module J1 and the rubber disk moving linear module K1 can move horizontally and vertically respectively.

[0030] Large wafer lenses are cut into multiple wafer lenses X and loaded onto the rubber disk K4; then the rubber disk moving linear module K1 drives the rubber disk moving seat K2 to transport the large wafer lens to the lower part of the suction pen A3 of the front picking and placing mechanism A; the thimble moving linear module J1 on the lens ejecting mechanism J adjusts the position of the thimble J4 so that the thimble J4 is aligned with the wafer lens X to be taken out; the thimble lifting cylinder J5 drives the thimble J4 to jack up the corresponding wafer lens X, so that the wafer lens X rises against the resistance of the adjacent lenses. When the wafer lens X is misaligned with the adjacent lens in the height direction to a certain extent, the friction between the wafer lens X to be taken and the adjacent lens decreases, making it easier to take out the target wafer lens X, reducing the probability of the suction pen A3 being unloaded, and improving the feeding efficiency.

[0031] As a preferred embodiment of the present utility model, at least one counterbore hole K201 is provided on the glue disk moving seat K2; a glue disk fixing frame K5 is fixed to the outside of the glue disk K4; the glue disk fixing frame K5 is embedded into the counterbore of the counterbore hole K201; a glue disk pressing mechanism for pressing the glue disk fixing frame K5 tightly in the counterbore hole K201 is provided on the glue disk moving seat K2;

[0032] The glue disk K4 is a layer of film material. When the film material is lifted and extruded, the position in contact with the ejector pin J4 can undergo plastic deformation and be lifted by a certain height together with the ejector pin J4;

[0033] The soft glue disk K4 is fixed and positioned in the counterbore hole K201 of the moving seat through the glue disk fixing frame K5, so that the wafer lens is positioned on the glue disk displacement mechanism K.

[0034] As a preferred embodiment of the present utility model, the glue disk pressing mechanism is composed of a plurality of pressing modules; the pressing modules are circumferentially distributed on the counterbore hole K201 of the moving seat; the pressing module is composed of a forward push cylinder K3 and a glue disk pressing cylinder K6; one end of the forward push cylinder K3 is fixed on the glue disk moving seat K2; the other end of the forward push cylinder K3 is fixed to one end of the glue disk pressing cylinder K6; the forward push cylinder K3 is used to drive the glue disk pressing cylinder K6 to perform a translational movement, so that before the glue disk K4 is placed, the glue disk pressing cylinder K6 moves to a position where it does not obstruct the glue disk K4 from being placed into the counterbore hole K201 of the moving seat; after the glue disk K4 is placed into the counterbore hole K201 of the moving seat, the forward push cylinder K3 drives the glue disk pressing cylinder K6 to move above the glue disk fixing frame K5, and then the glue disk pressing cylinder K6 descends to press the glue disk K4 tightly on the counterbore hole K201 of the moving seat.

[0035] As a preferred embodiment of the present utility model, a slide J101 is provided on the ejector pin moving linear module J1; the ejector pin fixing seat J3 is slidably connected to the slide J101; a differential head J2 is provided between the slide J101 and the ejector pin fixing seat J3; the differential head J2 has no essential difference from the prior art, so it will not be elaborated here; the movement direction of the differential head J2 for adjusting the ejector pin fixing seat J3 is perpendicular to the movement direction of the ejector pin moving linear module J1; the ejector pin moving linear module J1 can drive the slide J101 to perform a translational movement; after the differential head J2 rotates, it can drive the ejector pin fixing seat J3 to move relative to the slide J101, and the central position of the ejector pin J4 can be finely adjusted to be coaxial with the target lens through the differential head J2.

[0036] The above is only a preferred embodiment of the present utility model. Therefore, all equivalent changes or modifications made according to the structure, features and principles described in the scope of the patent application of the present utility model are included in the scope of the patent application of the present utility model.

Claims

1. A wafer lens picking mechanism, which includes a front picking and placing mechanism (A) and a glue disk displacement mechanism (K); a suction pen (3) is arranged on the front picking and placing mechanism (A). It is characterized in that: The glue disk displacement mechanism (K) includes a glue disk moving linear module (K1) and a glue disk moving seat (K2) connected to the glue disk moving linear module (K1); a glue disk (K4) is fixed on the glue disk moving seat (K2). A lens ejecting mechanism (J) is arranged below the front picking and placing mechanism (A); the glue disk displacement mechanism (K) is arranged between the lens ejecting mechanism (J) and the front picking and placing mechanism (A). The lens ejecting mechanism (J) includes a thimble moving linear module (J1), a thimble fixing seat (J3) connected to the thimble moving linear module (J1), and a thimble lifting cylinder (J5) with one end connected to the thimble fixing seat (J3); a thimble (J4) is fixed at the other end of the thimble lifting cylinder (J5); the moving direction of the glue disk moving linear module (K1) is perpendicular to the moving direction of the thimble moving linear module (J1).

2. The wafer lens material taking mechanism according to claim 1, characterized in that: At least one countersunk hole on the moving seat (K201) is arranged on the glue disk moving seat (K2); a glue disk fixing frame (K5) is fixed outside the glue disk (K4); the glue disk fixing frame (K5) is embedded into the countersunk hole of the countersunk hole on the moving seat (K201); a glue disk pressing mechanism for pressing the glue disk fixing frame (K5) in the countersunk hole on the moving seat (K201) is arranged on the glue disk moving seat (K2).

3. The wafer lens picking mechanism according to claim 1, characterized in that: The glue disk pressing mechanism is composed of a plurality of pressing modules; the pressing modules are circumferentially distributed on the countersunk hole on the moving seat (K201); the pressing module is composed of a front push cylinder (K3) and a glue disk pressing cylinder (K6); one end of the front push cylinder (K3) is fixed on the glue disk moving seat (K2); the other end of the front push cylinder (K3) is fixed at one end of the glue disk pressing cylinder (K6).

4. A wafer lens picking mechanism according to claim 1, characterized in that: A slide (J101) is arranged on the thimble moving linear module (J1); the thimble fixing seat (J3) is slidably connected to the slide (J101); a differential head (J2) is arranged between the slide (J101) and the thimble fixing seat (J3).

Images