Full-automatic thickness measuring equipment

Abstract

The utility model discloses full-automatic thickness measuring equipment, which comprises a rack, a wafer measuring assembly, a wafer turnover assembly, a wafer boat box positioning assembly and a wafer boat box cover opening assembly, a locking transverse groove is formed in the center of the lower end of the wafer boat box; three positioning grooves are formed in the lower end of the wafer boat box; the positioning assembly comprises a positioning plate horizontally connected to the outer side of the rack in a sliding mode, a containing plate longitudinally connected to the upper end of the positioning plate in a sliding mode and a transverse plate rotationally connected to the upper end of the positioning plate. Three positioning support columns are arranged at the upper end of the placing plate; and the transverse plate can selectively rotate in the positioning groove for locking and limiting. And the position of the wafer box placed on the placing plate can be automatically locked by the transverse plate, so that stable positioning precision is provided. The wafer boat box is automatically opened and closed and the wafer is taken and placed, manual drying is not needed in the whole process, interference of external environmental factors can be isolated, the cleanliness of the surface of the wafer is guaranteed, meanwhile, a fine adjustment assembly and a standard gauge block are arranged, and the measurement precision is high.

Description

Technical Field

[0001] The utility model belongs to the field of electronic information technology, and particularly relates to a full-automatic thickness measuring device. Background Art

[0002] In the field of cold processing of semiconductor glass wafers, during the manufacturing process of glass wafers with ultra-high precision surface profiles, the detection of TTV is particularly important. Due to the requirement for surface cleanliness, a non-contact measurement method is adopted during the measurement process. At the same time, for the loading and unloading process of the measurement wafers, the manual contact needs to be reduced. Therefore, it is necessary to develop a full-automatic thickness measuring device to improve the measurement efficiency and reduce the influence of human factors.

[0003] Chinese patent document with the publication number CN216081330U discloses a wafer thickness automatic measuring device, which includes a frame, a wafer placement platform, a measurement laser head and a main control unit. The frame includes an upper layer and a lower layer. The lower layer is internally provided with the main control unit and a circuit unit. An elevation adjustment frame and a wafer placement platform are sequentially arranged in the upper layer from bottom to top. A plurality of limit clips are arranged in the wafer placement platform. An XY load structure for installing the measurement laser head is arranged on both sides of the wafer placement platform. The measurement laser head measures multiple-point values of the measured wafer; a display screen and an audible and visual alarm are installed on the top of the frame. Both the display screen and the audible and visual alarm are electrically connected to the main control unit. The manual measurement of the wafer thickness by humans is changed to the automatic measurement of the thickness by the device, reducing the manual measurement error; the device automatically calculates the maximum and minimum values to obtain the average thickness value, replacing the manual calculation and reducing the manual calculation error; the device automatically uploads and saves the wafer thickness measurement value, replacing the manual tabular recording of the measurement value and reducing the manual recording error.

[0004] The above patent solution can only realize the measurement of wafers. The process of taking and placing wafers still needs to be completed manually. And in the actual application process, wafers are often taken and placed in a cassette, and the distance between two adjacent wafers in the cassette is often very small. It is very easy to contaminate the surface of the wafers during the process of taking and placing wafers and placing the wafers at the detection position. Summary of the Invention

[0005] In order to overcome the technical problem that the surface of wafers is extremely easy to be contaminated during the process of manually taking and placing wafers from the cassette and the detection position in the prior art; an object of the utility model is to provide a full-automatic thickness measuring device. By arranging positioning struts for positioning the cassette outside the frame and rotatably connecting a cross plate for locking the cassette, the device automatically opens the cassette and takes and places wafers for detection, completely without manual intervention, and thoroughly eliminating the manual contamination of the wafer surface.

[0006] To achieve the above object, the utility model adopts the following technical solutions: A fully automatic thickness measuring device includes a frame, a measuring component and a turnover component for wafers, a positioning component and an opening component for a cassette; a locking horizontal groove is provided at the central position of the lower end of the cassette; three positioning grooves are provided at the lower end of the cassette and are evenly distributed along the circumferential direction; the positioning component includes a positioning plate slidably connected horizontally outside the frame, a placement plate slidably connected longitudinally at the upper end of the positioning plate, and a cross plate rotatably connected at the upper end of the positioning plate; three positioning pillars respectively facing the positioning grooves are provided at the upper end of the placement plate; the cross plate can selectively extend above the placement plate; the cross plate can selectively rotate within the positioning groove for locking and limiting.

[0007] When the cassette is placed on the placement plate, under the guiding and positioning action of the positioning pillars, the position of the cassette is uniquely determined. The placement plate slides downward relative to the positioning plate, the cross plate extends upward into the positioning groove, and the cross plate rotates to lock the positioning groove, and the cassette is positioned, providing precise positioning information for the opening component and the positioning component.

[0008] Further, a lid is detachably connected to one side of the cassette facing the frame; the opening component includes an opening cover plate slidably connected horizontally to the frame and an opening lifting push rod provided on the frame for driving the opening cover plate to slide longitudinally; the opening cover plate can selectively face the lid.

[0009] Further, two guiding holes and two locking holes are provided on one side of the lid facing the frame; two suction cups are provided on one side of the opening cover plate facing the lid; a guiding column is provided at the central position on the side of the suction cup facing the lid; the guiding column can selectively be inserted into the guiding hole.

[0010] Specifically, two unlocking rods are rotatably connected to one side of the opening cover plate facing the lid; an eccentric shaft is provided on the unlocking rod; the axis of the eccentric shaft is parallel to and does not coincide with the rotation axis of the unlocking rod; the unlocking rod can selectively be inserted into the locking hole; a linkage plate is slidably connected to the side of the opening cover plate away from the lid; a vertical groove slidably connected to the eccentric shaft is provided on the linkage plate; a transverse moving cylinder for driving the linkage plate to slide is provided on the opening cover plate.

[0011] The opening cover plate can slide horizontally and longitudinally to make the opening cover plate adhere to the lid, the guiding column is inserted into the guiding hole, and the unlocking rod is inserted into the locking hole; the suction cup sucks the lid, the unlocking rod rotates to unlock the lid, and then the lid is removed.

[0012] Further, the measurement component includes a flat plate horizontally arranged inside the frame; through holes are provided on the flat plate; the diameter of the through holes is larger than the diameter of the wafer; a hollowed-out plate is detachably connected inside the through holes; a plurality of gaskets are evenly arranged at the upper end of the hollowed-out plate.

[0013] Further, the measurement component includes two X-direction linear modules arranged on the frame, a Y-direction linear module arranged on the sliders of the two X-direction linear modules, and a U-shaped frame arranged on the slider of the Y-direction linear module; the flat plate is located inside the opening of the U-shaped frame; measurement modules are respectively arranged at the upper end and the lower end of the opening of the U-shaped frame; a fine adjustment component is arranged between the measurement module and the U-shaped frame.

[0014] Preferably, two notches are symmetrically arranged on the hollowed-out plate; two symmetrically arranged brackets are longitudinally slidably connected to the frame; the brackets are opposite to the notches; the brackets can be selectively located above or below the flat plate; the distance between the two brackets is smaller than the diameter of the wafer.

[0015] Further, the turnover component includes a pick-up lifting push rod arranged inside the frame, a steering module arranged at the upper end of the pick-up lifting push rod, and a pick-up linear module arranged on the steering module; a plug board for adsorbing the wafer is arranged on the pick-up linear module; the plug board reciprocates between the inside of the wafer cassette and the two brackets.

[0016] Specifically, a plurality of cross grooves penetrating the flat plate are arranged on the flat plate around the periphery of the through hole; standard blocks are arranged inside the cross grooves.

[0017] Specifically, at least three negative pressure holes are arranged at the lower end of the plug board; the negative pressure holes are evenly distributed along the circumferential direction.

[0018] The plug board is inserted between two adjacent wafers to adsorb the wafer located below, and then moves to the hollowed-out plate for detection; after the detection is completed, the two brackets move upward through the notches to lift the wafer on the hollowed-out plate, and the plug board moves the wafer back into the wafer cassette.

[0019] Since the distance between two adjacent wafers inside the wafer cassette is small, the thickness of the plug board will be as thin as possible, so it is inconvenient to adsorb the wafer from inside the through hole. After the wafer is lifted, a larger adsorption space is provided for the plug board, which helps to reduce the adsorption error rate.

[0020] Further, a lifting frame is arranged inside the frame; a plurality of damping shock absorbers are arranged between the lifting frame and the frame; the measurement component is arranged on the lifting frame.

[0021] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0022] 1. By setting the positioning component, the position of the susceptor box placed on the placement plate can be automatically locked by the cross plate, thus providing stable positioning accuracy for the subsequent opening component and turnover component.

[0023] 2. By setting the opening component and turnover component, the susceptor box is automatically opened and closed, and the wafers are picked up and placed, without manual intervention throughout the process, and can isolate the interference of external environmental factors to ensure the cleanliness of the wafer surface.

[0024] 3. By setting the measuring component, the thickness of the wafer is measured by two upper and lower measuring modules, and a fine-tuning component and a standard gauge block are also set, with high measuring accuracy.

[0025] 4. By setting the bracket, after the wafer is lifted from the hollow plate, it is convenient for the plug board to adsorb and move the wafer, with a low adsorption error rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 is a schematic structural diagram of the present utility model;

[0027] Figure 2 is a schematic structural diagram of the table of the present utility model;

[0028] Figure 3 is a schematic structural diagram of the susceptor box of the present utility model;

[0029] Figure 4 、 Figure 5 is a schematic structural diagram of the placement plate of the present utility model;

[0030] Figure 6 is a schematic structural diagram of the linear cylinder and rotary cylinder of the present utility model;

[0031] Figure 7 、 Figure 8 is a schematic structural diagram of the opening cover plate of the present utility model;

[0032] Figure 9 is a schematic structural diagram of the flat plate of the present utility model;

[0033] Figure 10 is a schematic structural diagram of the bracket of the present utility model;

[0034] Figure 11 、 Figure 12 is a schematic structural diagram of the measuring component of the present utility model;

[0035] Figure 13 、 Figure 14 is a schematic structural diagram of the turnover component of the present utility model.

[0036] In the figure: 11, frame; 12, table; 13, elevation frame; 14, damping shock absorber; 15, communication port; 21, X-direction linear module; 22, Y-direction linear module; 31, U-shaped frame; 32, measurement module; 33, camera; 34, fine-tuning component; 41, pick-up lifting push rod; 42, steering module; 43, pick-up linear module; 44, insertion plate; 441, negative pressure hole; 51, flat plate; 511, through hole; 512, hollowed-out disc; 513, gasket; 514, notch; 515, cross slot; 52, carrier lifting push rod; 521, bracket; 61, wafer cassette; 611, positioning slot; 612, locking horizontal slot; 62, lid; 621, guiding hole; 622, locking hole; 71, lid-opening linear module; 72, lid-opening lifting push rod; 73, lid-opening plate; 74, transverse cylinder; 75, linkage plate; 751, vertical slot; 76, unlocking rod; 761, eccentric shaft; 77, suction cup; 771, guiding column; 81, positioning linear module; 82, positioning plate; 83, placement plate; 831, positioning support pillar; 84, linear cylinder; 85, rotary cylinder; 851, transverse plate. Detailed implementation mode

[0037] Next, in combination with the attached drawings and the detailed implementation mode, the present utility model will be further described. It should be noted that, on the premise of no conflict, the following-described embodiments or technical features can be combined arbitrarily to form new embodiments.

[0038] In the description of the present utility model, it should be noted that for the orientation terms, if there are terms such as "center", "horizontal", "longitudinal", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., the indicated orientation and position relationship are based on the orientation or position relationship shown in the attached drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and should not be construed as limiting the specific protection scope of the present utility model.

[0039] In addition, if there are terms such as "first" and "second", they are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present utility model, the meaning of "several" is two or more, unless otherwise specifically defined.

[0040] In the present utility model, unless otherwise clearly specified and defined, terms such as "arrangement", "installation", etc. shall be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can also be a mechanical connection; it can be directly connected, or connected through an intermediate medium, and can be internally connected and communicated between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0041] See Figure 1 , a fully automatic thickness measuring device, including a machine frame 11, a measuring component and a turnover component for wafers, a positioning component and an opening / closing component for a cassette; a lifting frame 13 is arranged inside the machine frame 11; damping shock absorbers 14 are arranged between the four corners at the lower end of the lifting frame 13 and the machine frame 11; a table 12 is arranged on one side of the machine frame 11; the height of the table 12 is lower than the height of the machine frame 11; a sheet metal housing for sealing is arranged on the outer periphery of the machine frame 11, and for the convenience of disclosure and introduction, part of the sheet metal housing is hidden.

[0042] See Figures 2 - 6 , a locking horizontal groove 612 is arranged at the central position of the lower end of the cassette 61; three positioning grooves 611 are arranged at the lower end of the cassette 61 and are evenly distributed along the circumferential direction; the length direction of the positioning groove 611 is arranged along the diameter direction of the above-mentioned circumference; a lid 62 is detachably connected to one side of the cassette 61 facing the machine frame 11; two guide holes 621 and two lock holes 622 are arranged on one side of the lid 62 facing the machine frame 11.

[0043] A communication port 15 is arranged on the sheet metal housing and is opposite to the cassette 61; when the cassette 61 abuts against the outside of the sheet metal housing, the lid 62 can be moved out from the communication port 15.

[0044] The positioning component includes a positioning plate 82 slidably connected horizontally on the table 12, a placing plate 83 slidably connected longitudinally on the upper end of the positioning plate 82, and a positioning linear module 81 arranged on the table 12 for driving the positioning plate 82 to slide.

[0045] A linear cylinder 84 is arranged between the positioning plate 82 and the placing plate 83; a rotary cylinder 85 is arranged at the central position of the upper end of the positioning plate 82; a cross plate 851 is arranged on the rotary cylinder 85; three positioning struts 831 respectively opposite to the positioning grooves 611 are arranged on the upper end of the placing plate 83; the cross plate 851 can optionally extend above the placing plate 83; the cross plate 851 can optionally rotate and be locked and limited in the positioning groove 611.

[0046] See Figures 7 - 8, the lid opening assembly includes a lid opening lifting push rod 72 longitudinally arranged inside the table 12, a lid opening linear module 71 horizontally arranged on the moving part of the lid opening lifting push rod 72, and a lid opening plate 73 arranged on the moving part of the lid opening linear module 71; the lid opening plate 73 can slide horizontally and longitudinally selectively; the lid opening plate 73 can be selectively aligned with the lid 62.

[0047] On one side of the lid opening plate 73 facing the lid 62, two suction cups 77 are arranged; in the central position on the side of the suction cup 77 facing the lid 62, a guide post 771 is arranged; the guide post 771 can be selectively inserted into the guide hole 621.

[0048] On one side of the lid opening plate 73 facing the lid 62, two unlocking rods 76 are rotatably connected; an eccentric shaft 761 is eccentrically arranged on the unlocking rod 76; the axis of the eccentric shaft 761 is parallel to and does not coincide with the rotation axis of the unlocking rod 76; the unlocking rod 76 can be selectively inserted into the lock hole 622; on the side of the lid opening plate 73 away from the lid 62, a linkage plate 75 is slidably connected; a vertical groove 751 for slidably connecting with the eccentric shaft 761 is arranged on the linkage plate 75; a transverse moving cylinder 74 for driving the sliding of the linkage plate 75 is arranged on the lid opening plate 73.

[0049] See Figure 9 , the measuring assembly includes a flat plate 51 horizontally arranged inside the frame 11; a through hole 511 is arranged on the flat plate 51; the diameter of the through hole 511 is larger than the diameter of the wafer; a hollowed-out disk 512 is detachably connected in the through hole 511; a plurality of gaskets 513 are evenly arranged at the upper end of the hollowed-out disk 512; a plurality of cross grooves 515 penetrating the flat plate 51 are arranged on the flat plate 51 around the periphery of the through hole 511; standard gauge blocks are arranged in the cross grooves 515; two notches 514 are symmetrically arranged on the hollowed-out disk 512.

[0050] See Figure 10 , a support lifting push rod 52 is arranged directly below the through hole 511 on the frame 11; two supports 521 are symmetrically arranged at the upper end of the moving part of the support lifting push rod 52; the supports 521 are aligned with the notches 514; the supports 521 can be selectively located above or below the flat plate 51; the distance between the two supports 521 is smaller than the diameter of the wafer.

[0051] See Figure 11 , 12, the measurement component includes two X-direction linear modules 21 arranged on the lifting frame 13, a Y-direction linear module 22 arranged on the sliders of the two X-direction linear modules 21, and a U-shaped frame 31 arranged on the slider of the Y-direction linear module 22; the flat plate 51 is located within the opening of the U-shaped frame 31; measurement modules 32 are respectively arranged at the upper and lower ends of the opening of the U-shaped frame 31; a fine-tuning component 34 is arranged between the measurement module 32 and the U-shaped frame 31; the fine-tuning component 34 can finely adjust the position of the measurement module 32; a camera 33 is arranged at the upper end of the U-shaped frame 31; a fill light is arranged inside the frame 11 opposite to the flat plate 51.

[0052] See Figure 13 , 14 , the turnover component includes a pick-up lifting push rod 41 arranged inside the frame 11, a steering module 42 arranged at the upper end of the pick-up lifting push rod 41, and a pick-up linear module 43 arranged on the steering module 42; a plug board 44 for adsorbing wafers is arranged on the pick-up linear module 43; the plug board 44 reciprocates between the inside of the cassette 61 and the two brackets 521; at least three negative pressure holes 441 are arranged at the lower end of the plug board 44; the negative pressure holes 441 are evenly distributed along the circumferential direction.

[0053] During the use process: The operator places the cassette 61 on the upper end of the placement plate 83, with the lid 62 facing the direction of the frame 11. Under the guiding action of the positioning pillar 831, the positioning slot 611 automatically adjusts its position, and the locking horizontal slot 612 is aligned with the horizontal plate 851. The device is started, the linear cylinder 84 contracts, the placement plate 83 slides downward, and the horizontal plate 851 extends into the locking horizontal slot 612. After the linear cylinder 84 contracts to the limit position, the rotary cylinder 85 rotates by ninety degrees, and the horizontal plate 851 is perpendicular to the locking horizontal slot 612, and the cassette 61 cannot be removed from the placement plate 83, and the position of the cassette 61 is fixed. Immediately afterwards, the positioning linear module 81 drives the cassette 61 to move until it is in sealing contact with the sheet metal housing, and the lid 62 is located within the communication port 15.

[0054] Next, the lid-opening linear module 71 and the lid-opening lifting push rod 72 work, driving the lid-opening plate 73 to move until it is opposite to the lid 62. At the same time, the lid-opening plate 73 slides towards the lid 62 until they are in close contact, the guiding post 771 is inserted into the guiding hole 621, and the unlocking rod 76 is inserted into the lock hole 622. Subsequently, the transverse movement cylinder 74 drives the linkage plate 75 to slide horizontally, thereby causing the vertical slot 751 to slide. The vertical slot 751 drives the eccentric shaft 761 to rotate, thereby causing the unlocking rod 76 to rotate, unlocking the lid 62. During this process, the suction cup 77 sucks air simultaneously to adsorb the lid 62. Finally, after the lid-opening plate 73 drives the lid 62 to slide away from the cassette 61, it then drives the lid 62 to slide downward until it is no longer opposite to the cassette 61.

[0055] The plug board 44 is inserted into the cassette 61 driven by the pick-up linear module 43. After the negative pressure holes 441 adsorb the wafers, the pick-up linear module 43 drives the plug board 44 out of the cassette 61, and the turning module 42 drives the pick-up linear module 43 to rotate 180 degrees. After the pick-up linear module 43 drives the plug board 44 to place the wafers on the upper end of the hollow plate 512, after the negative pressure holes 441 cut off the air supply, the wafers fall on the upper end of the hollow plate 512. Finally, the plug board 44 moves away from the position of the flat plate 51, providing enough space for the movement of the U-shaped frame 31. During this process, the pick-up lifting push rod 41 adaptively adjusts the height of the plug board 44.

[0056] The X-direction linear module 21 and the Y-direction linear module 22 drive the U-shaped frame 31 to sequentially perform thickness measurements according to the predetermined points. After the measurement is completed, the U-shaped frame 31 returns to its original position, making room for the movement of the plug board 44 and the bracket 521.

[0057] Finally, the support lifting push rod 52 drives the bracket 521 to move upward, lifting the wafers on the hollow plate 512. After the wafers move above the flat plate 51, the plug board 44 moves above the wafers on the bracket 521 to adsorb them, and then moves the wafers to the original position of the cassette 61, and so on.

[0058] After all the wafers in the whole cassette 61 have been completely thickness-measured, the opening cover plate 73 drives the cover 62 to re-close the cassette 61. The transverse translation cylinder 74, the positioning linear module 81, the rotary cylinder 85, and the linear cylinder 84 sequentially move in the reverse direction to their original positions, and at the same time the suction cup 77 cuts off the air supply. The cassette 61 on the placement plate 83 is replaced.

[0059] The above are only specific embodiments of the present invention, but the technical features of the present invention are not limited thereto. Any changes or modifications made by those skilled in the art within the scope of the present invention are covered by the patent scope of the present invention.

Claims

1. An automatic thickness measurement device, characterized in that: It includes a machine frame, a measuring component and a turnover component for wafers, a positioning component and an opening cover component for a cassette; a locking horizontal groove is provided at the central position of the lower end of the cassette; three positioning grooves are evenly distributed along the circumferential direction at the lower end of the cassette; the positioning component includes a positioning plate horizontally slidably connected to the outside of the machine frame, a placement plate longitudinally slidably connected to the upper end of the positioning plate, and a cross plate rotatably connected to the upper end of the positioning plate; three positioning pillars respectively facing the positioning grooves are provided on the upper end of the placement plate; the cross plate can optionally extend above the placement plate; the cross plate can optionally rotate and lock in the positioning groove for limit.

2. The measuring device according to claim 1, characterized in that; A cover is detachably connected to the side of the cassette facing the machine frame; the opening cover component includes an opening cover plate horizontally slidably connected to the machine frame and an opening cover lifting push rod provided on the machine frame for driving the longitudinal sliding of the opening cover plate. The opening cover plate can optionally face the cover.

3. The measuring device according to claim 2, characterized in that; Two guiding holes and two locking holes are provided on the side of the cover facing the machine frame; two suction cups are provided on the side of the opening cover plate facing the cover; a guiding column is provided at the central position of the side of the suction cup facing the cover; the guiding column can optionally be inserted into the guiding hole.

4. The measuring device according to claim 3, characterized in that; Two unlocking rods are rotatably connected to the side of the opening cover plate facing the cover; an eccentric shaft is provided on the unlocking rod; the axis of the eccentric shaft is parallel and non-coincident with the rotation axis of the unlocking rod; the unlocking rod can optionally be inserted into the locking hole; a linkage plate is slidably connected to the side of the opening cover plate away from the cover; a vertical groove for slidably connecting with the eccentric shaft is provided on the linkage plate; a transverse moving cylinder for driving the sliding of the linkage plate is provided on the opening cover plate.

5. The measuring device according to any one of claims 1 to 4, characterized in that; The measuring component includes a flat plate horizontally arranged inside the machine frame; through holes are provided on the flat plate; the diameter of the through holes is larger than the diameter of the wafer; a hollowed-out plate is detachably connected in the through holes; a plurality of gaskets are evenly arranged on the upper end of the hollowed-out plate.

6. The measuring device according to claim 5, characterized in that; The measuring component includes two X-direction linear modules provided on the machine frame, a Y-direction linear module provided on the sliders of the two X-direction linear modules, and a U-shaped frame provided on the slider of the Y-direction linear module; the flat plate is located inside the opening of the U-shaped frame; measuring modules are respectively provided at the upper and lower ends of the opening of the U-shaped frame; a fine-tuning component is provided between the measuring module and the U-shaped frame.

7. The measuring device according to claim 5, characterized in that; Two notches are symmetrically provided on the hollowed-out plate; two symmetrically arranged brackets are longitudinally slidably connected to the machine frame; the brackets are opposite to the notches; the brackets can optionally be located above or below the flat plate; the distance between the two brackets is smaller than the diameter of the wafer.

8. The measuring device according to claim 7, characterized in that; The turnover component includes a pick-up lifting push rod provided inside the machine frame, a steering module provided at the upper end of the pick-up lifting push rod, and a pick-up linear module provided on the steering module; a plug board for transferring wafers is provided on the pick-up linear module; the plug board reciprocates between the inside of the cassette and the two brackets.

9. The measuring device according to claim 5, characterized in that; A plurality of cross grooves penetrating the flat plate are arranged on the flat plate around the outer periphery of the through hole; a standard gauge block is arranged in the cross groove.

10. The measuring device according to any one of claims 1-4, characterized in that; A lifting frame is arranged in the frame; a plurality of damping shock absorbers are arranged between the lifting frame and the frame; the measuring assembly is arranged on the lifting frame.

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