Laser diode light source mounting structure

Abstract

The utility model discloses a laser diode light source installation structure which comprises a light source shell, a plurality of installation holes used for installing laser diodes are formed in the upper surface of the light source shell, and a heat dissipation plate used for making contact with the laser diodes for heat conduction is installed on the upper portion of the light source shell. The heat dissipation plate is provided with receding holes for pins of the laser diodes to penetrate out, the flexible circuit board is provided with a plurality of flexible circuit board supporting feet extending to the positions above the pins of the laser diodes, and the flexible circuit board supporting feet are connected with the pins of the laser diodes in a welded mode. The laser diodes are connected through the flexible circuit board supporting feet, the penetrating difficulty of the laser diode pins is reduced, and all the laser diodes can be independently arranged in a penetrating and welding mode and can also be independently desoldered. Meanwhile, the flexible circuit board supporting feet can absorb certain stress deformation, damage to the laser diode is avoided, the accuracy of the light emitting direction of the laser diode is guaranteed, and the coupling efficiency of the light source is guaranteed.

Description

Technical Field

[0001] This application relates to the technical field of laser diode light source structures, and particularly to a laser diode light source mounting structure. Background Art

[0002] A light source using a laser diode generally has a housing on which a plurality of laser diodes are mounted, and beam combination is performed by an optical coupling component in the housing. Currently, the pins of laser diodes are mostly connected to a rigid circuit board, and the rigid circuit board is mounted on one side of the housing where the laser diodes are mounted. The pins of the laser diodes pass through the pin holes of the rigid circuit board and are welded to the rigid circuit board.

[0003] Such a mounting structure will cause the following problems:

[0004] 1. When installing the rigid circuit board, the pins of all laser diodes need to be aligned simultaneously and accurately inserted into the corresponding pin holes, which is difficult to install.

[0005] 2. When a single laser diode needs to be maintained separately, or when one of the light sources in a module composed of multiple light sources needs to be replaced, all laser diodes need to be desoldered and disassembled simultaneously. After removing the rigid circuit board, it is possible to maintain or detect a single one separately. Then, all laser diodes need to be inserted and welded simultaneously, which is a large amount of work and extremely inconvenient to operate. Moreover, during the process of removing the rigid circuit board, all pin welding positions need to be heated simultaneously. Excessive temperature will also cause the position change of the diode, which will have an irreversible impact on the coupling efficiency of the light source and even damage the laser diode.

[0006] 3. The laser diode and the rigid circuit board are in a welded structure. During the assembly process, the deformation or displacement of the rigid circuit board caused by force will directly pull the pins of the laser diode board. In the lightest case, it will cause the position change of the laser diode and affect the coupling efficiency of the light source. In the worst case, it will lead to the damage of the laser diode.

[0007] The above technical problems all lead to the difficult assembly and low efficiency of the light source structure, affecting the production efficiency and the difficult maintenance. Utility Model Content

[0008] An embodiment of this application provides a laser diode light source mounting structure to at least solve the technical problem that laser diodes are not easy to install and replace.

[0009] In order to achieve the above-mentioned application purpose, the present application provides a laser diode light source installation structure, including a light source housing, a plurality of installation holes for installing laser diodes are arranged on one side of the light source housing, the laser diodes are installed in the corresponding installation holes and are arranged to emit light beams into the light source housing, the side of the light source housing where the installation holes are arranged is the upper surface, a heat sink for contacting and conducting heat with each laser diode is installed on the upper part of the light source housing, the heat sink is provided with clearance holes for the pins of each laser diode to pass through, the pins of the laser diodes are located in the corresponding clearance holes on the heat sink, a flexible circuit board is installed on the outer side of the heat sink, the flexible circuit board has a plurality of flexible circuit board legs extending above the pins of each laser diode, and the flexible circuit board legs are welded and connected to the pins of the laser diode.

[0010] The present application connects the laser diode via a flexible circuit board leg, which reduces the difficulty of threading the laser diode pins compared to connecting the laser diode with a hard circuit board, so that each laser diode can be threaded, welded, and desoldered individually, which is convenient for individual inspection or maintenance, reduces the difficulty of assembly, and facilitates the maintenance of the laser diode.

[0011] At the same time, the flexible circuit board legs can absorb a certain amount of force and deformation. Compared with rigid circuit boards, they can effectively reduce the force and deformation caused to the laser diode during the assembly process, which not only avoids damage to the laser diode, but also ensures the accuracy of the laser diode's light output direction and the coupling efficiency of the light source.

[0012] Preferably, the clearance holes correspond to the mounting holes one by one.

[0013] Optionally, the laser diode is installed in the corresponding installation hole and is configured to emit a light beam into the light source housing.

[0014] Preferably, a support plate is installed on the outer side of the heat dissipation plate, and the flexible circuit board is arranged on the support plate.

[0015] Preferably, the heat sink is a heat sink.

[0016] Preferably, the upper surface of the heat sink is provided with a groove matching each flexible circuit board leg, and the groove extends from the edge of the upper surface of the heat sink to the clearance hole corresponding to each flexible circuit board leg. Further preferably, the groove depth of the groove is not less than the thickness of the flexible circuit board leg.

[0017] Preferably, the upper surface of the support plate is lower than the upper surface of the heat sink. Preferably, the outer edge of the heat sink is provided with a step surface for supporting the support plate, the step surface is parallel to the upper surface of the heat sink and is lower in height than the upper surface of the heat sink, and the support plate is mounted on the step surface.

[0018] Further preferably, the support plate is annular, with a central hole for accommodating the heat dissipation plate. The support plate is sleeved on the outer side of the heat dissipation plate, and the upper surface of the support plate is lower than the upper surface of the heat dissipation plate.

[0019] Preferably, a heat conduction gasket is provided at the bottom of the heat dissipation plate. The heat conduction gasket is provided with holes for the pins of each laser diode to pass through. The pins of the laser diode extend into the corresponding relief holes of the heat dissipation plate through the corresponding holes on the heat conduction gasket. The heat conduction gasket is in contact with each laser diode for heat conduction. The heat dissipation plate is in contact with each laser diode through the heat conduction gasket, and the heat generated by the laser diode is conducted to the heat dissipation plate through the heat conduction gasket.

[0020] Preferably, an insulating filling member is installed in the relief hole. The insulating filling member has through holes for the pins of the laser diode to cooperate one by one. The insulating filling member is a structural member made of insulating materials such as PC and bakelite, which can play a role in insulating, limiting and guiding the pins, avoiding short circuits and facilitating pin soldering.

[0021] The heat dissipation plate is fixedly connected to the light source housing. The number and position of the mounting holes on the side surface of the light source housing are set according to the working conditions, and there is no limitation on this.

[0022] One or more technical solutions in the embodiments of the present application have at least the following technical effects or advantages:

[0023] In the present application, the laser diode is connected by the flexible circuit board feet, which reduces the difficulty of passing through the pins of the laser diode compared with using a rigid circuit board to connect the laser diode. Each laser diode can be individually passed through and soldered, and can also be individually disassembled and replaced, reducing the assembly difficulty and facilitating the replacement and repair of the laser diode.

[0024] At the same time, the flexible circuit board feet can absorb a certain amount of force deformation. Compared with the rigid circuit board, it can effectively reduce the force deformation on the laser diode during the assembly process, avoiding damage to the laser diode and ensuring the accuracy of the light emitting direction of the laser diode, thus ensuring the coupling efficiency of the light source. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 is a schematic structural diagram of the present invention;

[0026] Figure 2 is an exploded structural diagram of the present invention. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0027] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0028] like Figure 1 , Figure 2 As shown, the embodiment of the present application provides a laser diode light source, including a light source housing 100, a plurality of mounting holes 101 for mounting laser diodes 102 are arranged on one side of the light source housing 100, the laser diodes 102 are installed in the corresponding mounting holes 101 and are arranged to emit light beams into the light source housing 100, the side of the light source housing 100 where the mounting holes 101 are arranged is the upper surface, a heat sink 200 for contacting and conducting heat with each laser diode 102 is installed on the upper part of the light source housing 100, the heat sink 200 is provided with clearance holes 201 for pins of each laser diode 102 to pass through, the clearance holes 201 correspond to the mounting holes 101 one by one, the pins of the laser diodes 102 are located in the corresponding clearance holes 201 on the heat sink 200, a flexible circuit board 300 is installed on the outer side of the heat sink 200, the flexible circuit board 300 has a plurality of flexible circuit board legs 301 extending to the top of the pins of each laser diode 102, and the flexible circuit board legs 301 are welded and connected to the pins of the laser diode 102.

[0029] The present application connects the laser diode 102 via a flexible circuit board leg 301, which reduces the difficulty of threading the pins of the laser diode 102 compared to connecting the laser diode 102 with a hard circuit board, so that each laser diode 102 can be threaded, welded, and desoldered individually, which is convenient for individual inspection or maintenance, reduces the difficulty of assembly, and facilitates the maintenance of the laser diode 102.

[0030] At the same time, the flexible circuit board support 301 can absorb a certain amount of force deformation, and can effectively reduce the force deformation caused to the laser diode 102 during the assembly process compared to the hard circuit board, thereby avoiding damage to the laser diode 102 and ensuring the accuracy of the light emitting direction of the laser diode 102, thereby ensuring the coupling efficiency of the light source.

[0031] Preferably, a support plate 302 is installed on the outer side of the heat dissipation plate 200, and the flexible circuit board 300 is arranged on the support plate 302. Further preferably, the flexible circuit board 300 and the support plate 302 are an integrally formed flexible circuit board assembly with a rigid component, which is convenient for fixing and installing the flexible circuit board and for mounting electronic components on the flexible circuit board.

[0032] Preferably, a heat-conducting gasket 400 is provided at the bottom of the heat sink 200. The heat-conducting gasket 400 is provided with holes for the pins of each laser diode 102 to pass through. The pins of the laser diode 102 extend into the corresponding relief holes 201 of the heat sink through the corresponding holes on the heat-conducting gasket 400. The heat-conducting gasket 400 contacts and conducts heat with each laser diode 102, and the heat sink 200 contacts and conducts heat with each laser diode 102 through the heat-conducting gasket 400. The heat generated by the laser diode 102 is conducted to the heat sink 200 through the heat-conducting gasket 400. The heat-conducting gasket 400 can play a role in the flexible contact between the laser diode 102 and the heat sink 200 and has a buffering function, avoiding phenomena such as damage to the laser diode 102 or deviation of the light-emitting direction caused by the direct contact between the heat sink 200 and the laser diode 102.

[0033] Preferably, the upper surface of the heat sink 200 is provided with grooves 202 that cooperate with the legs 301 of each flexible circuit board. The grooves 202 extend from the edge of the upper surface of the heat sink 200 to the relief holes 201 corresponding to the legs 301 of each flexible circuit board. Further preferably, the depth of the grooves 202 is not less than the thickness of the legs 301 of the flexible circuit board.

[0034] Further preferably, the upper surface of the support plate 302 is lower than the upper surface of the heat sink 200. Further preferably, the outer edge of the heat sink 200 is provided with a step surface for supporting the support plate 302. The step surface is parallel to the upper surface of the heat sink 200 and has a height lower than the upper surface of the heat sink 200. The support plate 302 is installed on the step surface.

[0035] Further preferably, the support plate 302 is annular and has a central hole for accommodating the heat sink 200 in the middle. The support plate 302 is sleeved on the outside of the heat sink 200, and the upper surface of the support plate 302 is lower than the upper surface of the heat sink 200.

[0036] Preferably, an insulating filling member 203 is installed in the relief hole 201. The insulating filling member 203 has through holes for the pins of each laser diode 102 to be correspondingly fitted. The insulating filling member 203 is an insulating material structural member such as PC or bakelite, which can play a role in insulating, limiting, and guiding the pins, avoiding short circuits, and facilitating pin soldering.

[0037] The heat sink 200 is fixedly connected to the light source housing 100. The number and position of the mounting holes 101 on the side surface of the light source housing 100 are set according to the working conditions, and there is no limit to this.

[0038] Generally, the laser diode 102 is fixedly installed in the mounting hole 101 by processes such as welding and bonding, and emits light beams into the light source housing 100 through the mounting hole 101.

[0039] It should be noted that the above embodiments illustrate the present application rather than limit the present application, and those skilled in the art can design alternative embodiments without departing from the scope of the appended claims. In the claims, any reference signs placed between parentheses shall not be construed as limiting the claim. The word "comprising" or "including" does not exclude the presence of elements or steps not listed in the claim. The word "a" or "an" preceding an element does not exclude the presence of a plurality of such elements. The use of the words first, second, and third, etc. does not denote any order and these words can be interpreted as names.

[0040] All features disclosed in this specification, except for mutually exclusive features, may be combined in any manner.

[0041] Any feature disclosed in this specification (including any additional claims, abstract, and drawings), unless specifically recited, may be replaced by other equivalent or similar-purpose alternative features. That is, unless specifically recited, each feature is only an example of a series of equivalent or similar features.

[0042] The present application is not limited to the foregoing specific embodiments. The present application extends to any new feature or any new combination disclosed in this specification, as well as to any new method or process step or any new combination disclosed.

Claims

1. A laser diode light source mounting structure, characterized in that It comprises a light source housing, a side surface of which is provided with a plurality of mounting holes for mounting laser diodes, the laser diodes being mounted in the corresponding mounting holes, the side surface of the light source housing on which the mounting holes are arranged being the upper surface, a heat sink for contacting and conducting heat with the laser diodes being mounted on the upper part of the light source housing, the heat sink being provided with clearance holes for the pins of the laser diodes to pass through, the pins of the laser diodes being located in the corresponding clearance holes on the heat sink, a flexible circuit board being mounted on the outer side of the heat sink, the flexible circuit board having a plurality of flexible circuit board legs extending above the pins of the laser diodes, the flexible circuit board legs being welded and connected to the pins of the laser diodes.

2. The installation structure of a laser diode light source according to claim 1, wherein, The laser diode is arranged to emit a light beam into the light source housing.

3. A laser diode light source mounting structure according to claim 1, characterized in that, A support plate is installed on the outer side of the heat dissipation plate, and the flexible circuit board is arranged on the support plate.

4. The installation structure of a laser diode light source according to claim 1, characterized in that, The upper surface of the heat dissipation plate is provided with grooves matched with the legs of each flexible circuit board, and the grooves extend from the edge of the upper surface of the heat dissipation plate to the clearance holes corresponding to the legs of each flexible circuit board.

5. The mounting structure of a laser diode light source according to claim 4, characterized in that, The depth of the groove is not less than the thickness of the flexible circuit board foot.

6. The mounting structure of a laser diode light source according to claim 3, wherein, The upper surface of the support plate is lower than the upper surface of the heat dissipation plate.

7. The mounting structure of a laser diode light source according to claim 6, characterized in that, The support plate is annular, with a central hole in the middle for accommodating the heat dissipation plate, and the support plate is sleeved on the outer side of the heat dissipation plate.

8. The installation structure of a laser diode light source according to claim 1, wherein An insulating filling piece is installed in the clearance hole, and the insulating filling piece has through holes for each pin of the laser diode to match one by one.

9. The mounting structure of a laser diode light source according to claim 8, characterized in that The clearance holes correspond to the light-through limit hole installation holes one by one.

10. The installation structure of a laser diode light source according to claim 1, characterized in that, A thermally conductive gasket is provided at the bottom of the heat sink, and a hole is provided on the thermally conductive gasket for the pins of each laser diode to pass through. The pins of the laser diode extend into the corresponding holes of the heat sink through the corresponding holes on the thermally conductive gasket. The thermally conductive gasket contacts with each laser diode for heat conduction. The heat sink contacts with each laser diode through the thermally conductive gasket for heat conduction. The heat generated by the laser diode is conducted to the heat sink through the thermally conductive gasket.

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