Die for improving utilization rate of FPC (Flexible Printed Circuit) jointed board

Abstract

The utility model discloses a die for improving the utilization rate of an FPC (Flexible Printed Circuit) jointed board, which comprises a first die, the first die comprises a plurality of first punches which extend along the first direction of the FPC and are arranged at intervals, and the first die is provided with a guide hole and a first positioning hole; the second die is used for punching the outline of the whole FPC board, and the second die is provided with a second positioning hole; the first die and the second die jointly punch the FPC whole board to form a plurality of single FPC products, and the distance between every two adjacent single FPC products is 1 mm. The utility model has the following advantages: the effective utilization rate of the layout is utilized to the greatest extent in a limited plane space, meanwhile, the processing capability of a mould processing technology for batch production is considered, the utilization rate of the FPC jointed board is generally improved by more than 30%, and the manufacturing unit price of the FPC is greatly reduced, so that the number of single FPC products in a unit area is maximized, and the production cost is reduced. And the production and manufacturing cost of the FPC is more advantageous.

Description

Technical Field

[0001] The utility model relates to the technical field of FPC, in particular to a mold for improving the utilization rate of FPC panel. Background Technique

[0002] The description of this part only provides background information related to the disclosure of the utility model, and does not constitute prior art.

[0003] Flexible printed circuit board (i.e., FPC, Flexible Printed Circuit board) has many advantages compared with rigid PCB board. When punching FPC panel, an FPC panel mold is required. At present, in the FPC industry, in order to improve the mold manufacturing ability, the design utilization rate of FPC panel is sacrificed, resulting in fewer PCS numbers per unit area and affecting the unit price of products.

[0004] The final forming process of FPC production will use a steel mold for punching. The mold processing is to wire-cut corresponding positioning holes, guide posts, the FPC outline to be punched, etc. on the surface of a flat steel plate. Usually, considering production efficiency, multiple pieces are punched at one time. Therefore, the distance setting between flexible circuit board pieces is the most important technical index considering the manufacturing process ability of the mold. Usually, the distance value between pieces is not less than 3mm. If it is too small, when the punch and die bite up and down during punching on a 25-ton punching machine, the FPC pieces are too close to each other, and it is extremely easy to cause the mold cavity in the middle area to deform and collapse due to the lack of metal parts support around. The mold cannot be used for punching processing for a long time. In order to ensure the punching life of the mold, it is necessary to increase the distance between FPC pieces during panel making, that is, "sacrifice" the panel utilization rate to meet the punching life requirements of the mold.

[0005] It should be noted that the above introduction of the technical background is only for the convenience of clearly and completely explaining the technical solution of the utility model and facilitating the understanding of those skilled in the art. It cannot be considered that the above technical solutions are well-known to those skilled in the art just because these solutions are described in the background art part of the utility model. Summary of the Utility Model

[0006] The technical problem to be solved by the utility model is to provide a mold for improving the utilization rate of FPC panel, which can avoid the double problems that the distance between FPC pieces is too small to be punched and the distance is too large to affect the material utilization rate. In this solution, the distance between FPC and FPC can be 1mm and normal production can also be carried out.

[0007] The embodiment of the present application discloses a mold for improving the utilization rate of FPC panel, including:

[0008] The first mold, the first mold includes a plurality of first punches extending along the first direction of the FPC and arranged at intervals, and the first mold is provided with a guide hole and a first positioning hole;

[0009] The second mold is used for punching the outer contour of the FPC whole board, and the second mold is provided with a second positioning hole;

[0010] The first mold and the second mold jointly punch the FPC whole board to form a plurality of single-piece FPC products, and the distance between adjacent single-piece FPC products is 1 mm.

[0011] Further, for the above-mentioned mold for improving the utilization rate of FPC panel, the first mold further includes a plurality of second punches, the second punches are arranged at intervals with the first punches, and the length of the second punches along the second direction of the FPC product is greater than the length of the first punches.

[0012] Further, for the above-mentioned mold for improving the utilization rate of FPC panel, the number of the first punches is N, and the number of the second punches is N + 1.

[0013] Further, for the above-mentioned mold for improving the utilization rate of FPC panel, the length of the second punches along the second direction is greater than the length of the second mold along the second direction, and the distance between the two second punches farthest apart in the first direction is greater than the distance between the two side edges of the second mold.

[0014] Further, for the above-mentioned mold for improving the utilization rate of FPC panel, the second positioning hole coincides with the guide hole.

[0015] In summary, the above structure adopted in the embodiments of the present invention has the following advantages:

[0016] The mold for improving the utilization rate of FPC panel of the present invention reduces the distance between FPC sheets, and the distance between adjacent single-piece FPC products is 1 mm, achieving the maximum panel of FPC per unit area, which can improve the utilization rate of FPC materials, effectively reduce the production cost of FPC and improve the competitiveness of enterprises.

[0017] To further understand the features and technical content of the present invention, please refer to the following detailed description and drawings of the present invention. However, the provided drawings are only for reference and illustration, and are not used to limit the present invention. Description of the Drawings

[0018] To more clearly illustrate the technical solutions in the embodiments of this specification or the prior art, the following will briefly introduce the accompanying drawings required for describing the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only some embodiments recorded in this specification. For those of ordinary skill in the art, without creative efforts, other accompanying drawings can also be obtained based on these drawings.

[0019] Figure 1 It is a schematic diagram of a mold for improving the utilization rate of FPC panel splicing in an embodiment of the present invention;

[0020] Figure 2 It is a schematic diagram of the first mold in an embodiment of the present invention;

[0021] Figure 3 It is a schematic diagram of the second mold in an embodiment of the present invention;

[0022] Figure 4 It is a schematic diagram of the structure of the FPC product after the mold punching in an embodiment of the present invention.

[0023] The reference numerals of the above accompanying drawings: 1. The first mold; 11. The first punch; 12. The second punch; 13. The first positioning hole; 14. The guide hole; 2. The second mold; 21. The second positioning hole; 3. The FPC product. Detailed implementation manners

[0024] In order to enable those skilled in the art to better understand the technical solutions in this specification, the following will clearly and completely describe the technical solutions in the embodiments of this specification in conjunction with the accompanying drawings in the embodiments of this specification. Obviously, the described embodiments are only some embodiments of this specification, rather than all embodiments. Based on the embodiments in this specification, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of this specification.

[0025] The following are specific embodiments to illustrate the implementation manners of the present invention. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. Additionally, the accompanying drawings of the present invention are only for simple schematic illustration and are not drawn according to actual dimensions, hereby stating in advance. The following implementation manners will further detail the related technical content of the present invention, but the disclosed content is not used to limit the protection scope of the present invention.

[0026] It should be understood that although terms such as "first", "second", "third", etc. may be used herein to describe various components or signals, these components or signals should not be limited by these terms. These terms are mainly used to distinguish one component from another, or one signal from another. In addition, the term "or" used herein may, depending on the actual situation, include any one or a combination of more of the associated listed items.

[0027] Referring to Figures 1 to 4 as shown, an embodiment of the present application discloses a mold for improving the utilization rate of FPC panels, including:

[0028] Referring to FIG. 2, a first mold 1, the first mold 1 includes a plurality of first punches 11 extending along the first direction of the FPC and arranged at intervals, and the first mold 1 is provided with a guide hole 14 and a first positioning hole 13;

[0029] Referring to Figure 3 FIG. 3, a second mold 2 for punching the outer contour of the FPC whole board, and the second mold 2 is provided with a second positioning hole 21;

[0030] Referring to Figure 1 FIG. 4, the first mold 1 and the second mold 2 jointly punch the FPC whole board to form a plurality of single-piece FPC products 3, as Figure 4 shown, and the distance between adjacent single-piece FPC products 3 is 1 mm.

[0031] Specifically, in this embodiment, the first mold 1 further includes a plurality of second punches 12, the second punches 12 are arranged at intervals with the first punches 11, and the length of the second punches 12 along the second direction of the FPC product 3 is greater than the length of the first punches 11.

[0032] Specifically, in this embodiment, the number of the first punches 11 is N, and the number of the second punches 12 is N + 1. The first punches and the second punches are used to cut the FPC whole board into a plurality of FPC single-piece products, but at the same time, the second mold is also required to punch the outer contour of the FPC whole board, so that a plurality of single-piece FPC products are finally obtained.

[0033] Specifically, in this embodiment, the length of the second punches 12 along the second direction is greater than the length of the second mold 2 along the second direction, and the distance between the two second punches 12 farthest apart in the first direction is greater than the distance between the two side edges of the second mold 2.

[0034] Specifically, in this embodiment, the second positioning hole 21 coincides with the guide hole 14, so that the second mold and the first mold perform alignment punching on the FPC whole board, improving the punching quality of the FPC product.

[0035] With the above structure, the first die 1 is used for internal punching of the entire FPC board, and the second die 2 is used for punching the outer contour of the entire FPC board. The first die 1 and the second die 2 jointly punch the entire FPC board to form a plurality of single-piece FPC products 3, and the spacing between adjacent single-piece FPC products 3 is 1 mm. When using the die in this embodiment, the utilization rate of the FPC panel will generally increase by more than 30%, greatly reducing the production cost per unit of the FPC, and the punching service life of the die will not be affected at all. The utilization rate of the FPC panel is improved, maximizing the material utilization rate, thereby reducing the product production cost and making the product more competitive in the market; the die in this embodiment simultaneously meets the requirements of improving the panel utilization rate and adapting to mass production; maximizing the effective utilization rate of the layout within a limited planar space, while taking into account the die processing process capabilities for mass production, so as to maximize the number of single-piece FPC products per unit area, making the production cost of FPC more advantageous.

[0036] The content disclosed above is only the preferred feasible embodiment of the present invention, and does not limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made by using the content of the specification and drawings of the present invention are included in the scope of the patent application of the present invention.

[0037] The various embodiments in this specification are described in a progressive manner. The same or similar parts between the various embodiments can be referred to each other, and the key points of each embodiment are the differences from other embodiments.

[0038] Although the present application is depicted through embodiments, those of ordinary skill in the art know that the present application has many variations and changes without departing from the spirit of the present application. It is hoped that the appended embodiments include these variations and changes without departing from the present application.

Claims

1. A mold for improving the utilization rate of FPC panel splicing, characterized in that Comprising: A first die, the first die includes a plurality of first punches extending along a first direction of the FPC and arranged at intervals, and the first die is provided with a guide hole and a first positioning hole; A second die, used for punching the outer contour of the FPC whole board, and the second die is provided with a second positioning hole; The first die and the second die jointly punch the FPC whole board to form a plurality of single-piece FPC products, and the distance between adjacent single-piece FPC products is 1 mm.

2. The mold for improving the utilization rate of FPC panels according to claim 1, characterized in that, The first die further includes a plurality of second punches, the second punches are arranged at intervals with the first punches, and the length of the second punches along a second direction of the FPC product is greater than the length of the first punches.

3. The mold for improving the utilization rate of FPC panels according to claim 2, characterized in that, The number of the first punches is N, and the number of the second punches is N + 1.

4. The mold for improving the utilization rate of FPC panels according to claim 3, characterized in that, The length of the second punches along the second direction is greater than the length of the second die along the second direction, and the distance between the two second punches farthest apart in the first direction is greater than the distance between the two side edges of the second die.

5. The mold for improving the utilization rate of FPC panels according to claim 1, characterized in that, The second positioning hole coincides with the guide hole.

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