Circuit board, electronic module, and electronic device
By setting conductive vias on the pad and connecting them to the circuit, the solder paste gasification gas is prevented from impacting the pin connector, and the board stability and processing cost problems are solved, and the circuit board is compactly arranged and low-cost production is achieved.
Patent Information
- Application Number
- CN202421673540.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-15
- Publication Date
- 2025-07-22
- Estimated Expiration
- 2034-07-15
AI Technical Summary
In the prior art, the gas generated by the gasification of solder paste during the reflow furnace of the circuit board causes an impact on the pin connector, resulting in a reduction in alignment deviation and circuit board stability, and high processing costs.
A conductive via is opened on the pad. The conductive via penetrates the pad and the substrate and is electrically connected to the line. The axial projection of the conductive via does not coincide with the axial projection of the pin connector, avoiding the impact of the solder paste gasification gas, and preventing the solder paste from entering the via through through the plug material.
Improves the integration rate and signal integrity of the circuit board, reduces processing costs, avoids pin connector alignment deviations, and improves the stability and reliability of the circuit board.
Smart Images
Figure CN223142212U_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to the technical field of circuit boards, and in particular, to a circuit board, an electronic module, and an electronic device. Background Art
[0002] A circuit board includes a substrate, pads connected to the substrate, circuits, pin connectors, and electronic components. For a circuit board having multiple wiring layers, in order to realize the connection between the electronic components and the wiring layers of different layers, conductive vias need to be formed on the substrate. The conductive vias connected to the substrate are respectively connected to the pads and the circuits, thereby realizing the connection between the electronic components and the circuits.
[0003] In order to save space on the substrate, related technologies have made improvements by forming conductive vias on the pads. Although this method solves the problem of the conductive vias occupying the substrate space, the solder paste on the substrate is likely to flow into the conductive vias. When the circuit board passes through the reflow oven, the solder paste in the conductive vias will vaporize into gas and impact the pin connectors connected to the pads, thereby affecting the stability and service life of the circuit board. Summary of the Utility Model
[0004] The purpose of the present disclosure is to provide a circuit board, an electronic module, and an electronic device to solve the technical problems existing in the related technologies.
[0005] To achieve the above purpose, according to the first aspect of the present disclosure, a circuit board is provided, including a substrate, pads, and pin connectors. The substrate is integrated with circuits. The pads are welded on the outer surface of the substrate. The circuit board has conductive vias that penetrate the pads and the substrate. The pads are electrically connected to the circuits through the conductive vias. The pin connectors are mounted on the pads and are electrically connected to the pads. The projection of the conductive via along its axial direction does not coincide with the projection of the pin connector along the axial direction of the conductive via.
[0006] Optionally, the distance between the pin connector and the conductive via is between a first preset distance and a second preset distance.
[0007] Optionally, the conductive via includes a first section and a second section. The first section penetrates the pad, and the second section penetrates the substrate. The first section is close to the edge of the pad.
[0008] Optionally, the conductive via and the pad form an L shape.
[0009] Optionally, the inner wall of the conductive via has a conductive layer, and the pad is electrically connected to the circuit through the conductive layer.
[0010] Optionally, the substrate includes a plurality of wiring layers which are stacked along the thickness direction of the substrate. The plurality of wiring layers include a top wiring layer, a bottom wiring layer, and at least one inner wiring layer located between the top wiring layer and the bottom wiring layer. The pad is electrically connected to at least one of the inner wiring layers through the conductive via, or the pad is electrically connected to the bottom wiring layer through the conductive via.
[0011] Optionally, at least part of the conductive via is filled with a plugging material; the plugging material is filled in a part of the conductive via away from the pad;
[0012] The plugging material is an insulating material.
[0013] Optionally, the pin connector includes a connecting portion and an extending portion. The connecting portion is connected to a side of the pad facing away from the substrate, and the extending portion is connected to an end of the connecting portion away from the conductive via and extends obliquely in a direction away from the substrate.
[0014] According to a second aspect of the present disclosure, there is provided an electronic module including the circuit board as described above.
[0015] According to a third aspect of the present disclosure, there is provided an electronic device including the electronic module as described above.
[0016] Through the above technical solutions, the conductive via penetrates through the pad and the substrate, and the pad can be electrically connected to the circuit through the conductive via. On the one hand, since the conductive via is opened on the pad, the conductive via does not occupy the space outside the pad (that is, there is no need to preset a space on the substrate for the conductive via to pass through), so that the layout of related structures on the circuit board can be made more compact, thereby improving the integration rate of the circuit board; and opening the above conductive via on the pad is not interfered or obstructed by electronic components near the pad or the size of the substrate, so that the pin connector can adapt to different assembly scenarios.
[0017] In addition, the projection of the conductive via along its axial direction does not coincide with the projection of the pin connector along the axial direction of the conductive via. In other words, the pin connector does not cover the above conductive via. In this way, it is possible to avoid the problem that the gas generated by the vaporization of the solder paste flowing into the conductive via when passing through the reflow oven impacts the pin connector and causes the pin connector to have a misalignment deviation. And precisely because there is no such problem, there is no need to perform an electroplating filling process on the conductive via, so that the processing cost of the circuit board can also be reduced.
[0018] Other features and advantages of the present disclosure will be described in detail in the subsequent specific implementation section. Description of the Drawings
[0019] The accompanying drawings are used to provide a further understanding of the present disclosure and form a part of the specification. Together with the following detailed description, they are used to explain the present disclosure but do not limit the present disclosure. In the accompanying drawings:
[0020] Figure 1 is a schematic cross-sectional view of a circuit board provided by an exemplary embodiment of the present disclosure, wherein the plug hole material partially fills the conductive via.
[0021] Description of the reference numerals
[0022] 1 - Circuit board; 10 - Substrate; 11 - Circuit; 12 - Wiring layer; 20 - Pad; 30 - Pin connector; 31 - Connection part; 32 - Extension part; 40 - Conductive via; 41 - Conductive layer; 50 - Plug hole material. Detailed description of the specific embodiment
[0023] The following will describe in detail the specific embodiments of the present disclosure with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are only used to illustrate and explain the present disclosure and do not limit the present disclosure.
[0024] In the present disclosure, unless otherwise stated, the orientation or positional relationship indicated by the orientation words is defined based on the drawing direction shown in the accompanying drawings. This is only for the convenience of describing the present disclosure and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, as well as a specific orientation structure and operation. Therefore, it should not be construed as a limitation of the present disclosure. The terms "inside" and "outside" refer to the inside and outside of the corresponding structural contour.
[0025] In addition, the "thickness direction" can be referred to as shown in Figure 1 the drawing direction of. In addition, it should be noted that the terms such as "first" and "second" are used to distinguish one element from another and do not have sequentiality and importance. In addition, in the description with reference to the accompanying drawings, the same reference numerals in different drawings represent the same elements.
[0026] In the description of the present disclosure, it should also be noted that unless otherwise clearly specified and limited, the terms "set", "connected", "coupled", and "installed" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in the present disclosure can be understood according to specific circumstances.
[0027] Refer to Figure 1As shown, according to the first aspect of the present disclosure, a circuit board 1 is provided, including a substrate 10, pads 20, and pin connectors 30. A circuit 11 is integrated on the substrate 10. The pads 20 are soldered on the outer surface of the substrate 10. The circuit board 1 has conductive vias 40 that penetrate through the pads 20 and the substrate 10. The pads 20 are electrically connected to the circuit 11 through the conductive vias 40. The pin connectors 30 are mounted on the pads 20 and are electrically connected to the pads 20. The projection of the conductive via 40 along its axial direction does not coincide with the projection of the pin connector 30 along the axial direction of the conductive via 40.
[0028] Through the above technical solution, the conductive vias 40 penetrate through the pads 20 and the substrate 10, and the pads 20 can be electrically connected to the circuit 11 through the conductive vias 40. On the one hand, since the conductive vias 40 are formed on the pads 20, the conductive vias 40 do not occupy the space outside the pads 20 (that is, there is no need to preset a space on the substrate 10 for the conductive vias 40 to pass through). Therefore, the layout of the relevant structures on the circuit board 1 can be made more compact, thereby improving the integration rate of the circuit board 1. On the other hand, forming the above conductive vias 40 on the pads 20 is not interfered or obstructed by the electronic components near the pads 20 or the size of the substrate 10, so that the pin connectors 30 can adapt to different assembly scenarios.
[0029] Moreover, since the conductive vias 40 are provided at the ends of the pin connectors 30, the stub (stub wire length) can be shortened, thereby improving the signal integrity and performance of the circuit board design, reducing interference and loss during signal transmission, and thus improving the reliability and stability of the system. In addition, the projection of the conductive via 40 of the present disclosure along its axial direction does not coincide with the projection of the pin connector 30 along the axial direction of the conductive via 40. In other words, the pin connector 30 does not cover the above conductive via 40. In this way, it is possible to avoid the problem that the gas generated by the vaporization of the solder paste flowing into the conductive via 40 during passing through the reflow oven impacts the pin connector 30 and causes the pin connector 30 to have a misalignment deviation. And precisely because there is no such problem, there is no need to perform an electroplating filling process on the conductive via 40, so the processing cost of the circuit board 1 can also be reduced.
[0030] To avoid the situation where the conductive via 40 detaches from the pad 20 due to an excessive distance between the conductive via 40 and the pin connector 30, the distance between the pin connector 30 and the conductive via 40 provided in the present disclosure should be within a preset range. Specifically, in the present disclosure, the distance between the pin connector 30 and the conductive via 40 is between a first preset distance and a second preset distance. It can be understood that the distance between the conductive via 40 and the pin connector 30 is within an interval greater than the first preset distance and less than the second preset distance. Within this interval range, it is possible to reduce the occupation of space on the circuit board 1 and also enable the distance between the conductive via 40 and the pin connector 30 to reduce or avoid the problem that the gas generated by the vaporization of the solder paste flowing into the conductive via 40 during passing through the reflow oven impacts the pin connector 30, resulting in a misalignment deviation of the pin connector 30, thereby improving the stability and accuracy of the pin connector 30 during use.
[0031] To further reduce the impact of the gas generated by the vaporization of the solder paste flowing into the conductive via 40 during passing through the reflow oven on the pin connector 30, when the space on the substrate 10 permits, the distance between the pin connector 30 and the conductive via 40 should be large enough.
[0032] Optionally, the conductive via 40 may include a first section and a second section. The first section penetrates the pad 20, and the second section penetrates the substrate 10. The first section is close to the edge of the pad 20. In this way, on the premise of not occupying the area of the substrate 10, the conductive via 40 is arranged as close as possible to the edge of the pad 20 to increase the distance between the first section of the conductive via 40 and the pin connector 30 also arranged on the pad 20, and reduce the impact of the gas generated when the solder paste is heated on the pin connector 30.
[0033] In an exemplary embodiment provided by the present disclosure, as Figure 1 shown, the conductive via 40 may form an L shape with the pad 20. At this time, when both the conductive via 40 and the pin connector 30 are arranged on the pad 20, the distance between the conductive via 40 arranged on the pad 20 and the pin connector 30 arranged on the pad 20 can be maximized.
[0034] To facilitate the connection between the pad 20 and the circuit 11 through the conductive via 40, in the present disclosure, as Figure 1 shown, the inner wall of the conductive via 40 has a conductive layer 41, and the pad 20 can be conductively connected to the circuit 11 through the conductive layer 41. The above-mentioned conductive layer 41 can be arranged on the inner wall of the conductive via 40 by electroplating.
[0035] The present disclosure does not limit the specific material of the conductive layer 41. For example, in an exemplary embodiment provided by the present disclosure, optionally, the conductive layer 41 may be a copper layer. Copper has the advantages of good electrical conductivity, large current-carrying capacity, good stability, oxidation resistance, and corrosion resistance, and can achieve a better connection effect on the pad 20 and the circuit 11.
[0036] In other embodiments provided by the present disclosure, the above-mentioned conductive layer 41 may also be made of conductive metal materials such as an aluminum layer, an iron layer, etc., which are not elaborated herein by the present disclosure.
[0037] Optionally, as Figure 1 shown, the substrate 10 includes a plurality of wiring layers 12, and the plurality of wiring layers 12 are stacked along the thickness direction of the substrate 10. The plurality of wiring layers 12 include a top wiring layer 12, a bottom wiring layer 12, and at least one inner wiring layer 12 located between the top wiring layer 12 and the bottom wiring layer 12. The pad 20 is electrically connected to at least one inner wiring layer 12 through a conductive via 40, or the pad 20 is electrically connected to the bottom wiring layer 12 through a conductive via 40. In this way, the operator can electrically connect the pad 20 to the inner wiring layer 12 or the bottom wiring layer 12 according to needs to meet the connection requirements of different electronic components with different layers of wiring layers.
[0038] In an embodiment where the pad 20 is connected to the circuit 11 through the conductive layer 41 of the conductive via 40, the conductive layer 41 extending along the thickness direction of the substrate 10 can be selectively connected to the inner wiring layer 12 or the bottom wiring layer 12.
[0039] To further improve the stability of the circuit board 1, optionally, at least part of the conductive via 40 is filled with a plugging material 50. The plugging material 50 filled in the conductive via 40 can prevent the solder paste on the pad 20 from flowing into the conductive via 40 during the reflow soldering of the circuit board 1, thereby avoiding the problem of false soldering due to insufficient solder volume on the pad 20.
[0040] Optionally, the plugging material 50 is an insulating material. In this way, the plugging material 50 can prevent the solder paste during reflow soldering, thereby avoiding the risk of the solder paste entering the conductive via 40 during reflow soldering, resulting in insufficient solder volume on the pad 20 and false soldering, and further improving the stability and yield rate of the circuit board 1.
[0041] In an exemplary embodiment provided by the present disclosure, the plugging material 50 is green oil, or, in another exemplary embodiment provided by the present disclosure, the above-mentioned plugging material 50 may also be resin. In short, the present disclosure does not limit the above-mentioned plugging material 50, as long as the corresponding plugging effect can be satisfied.
[0042] When plugging the conductive vias 40, either a full-plugging method or a half-plugging method can be used. Specifically, when performing a half-plugging operation on the conductive vias 40, the plugging material 50 can be ink or resin. When full-plugging the conductive vias 40, resin can be used as the plugging material 50 for the plugging operation. For the method of half-plugging the conductive vias 40, in the present disclosure, the plugging material 50 can be filled in the part of the conductive via 40 away from the pad 20.
[0043] Optionally, as Figure 1 shown, the pin connector 30 can include a connecting portion 31 and an extending portion 32. The connecting portion 31 is connected to one side of the pad 20 facing away from the substrate 10, and the extending portion 32 is connected to one end of the connecting portion 31 away from the conductive via 40 and extends obliquely in a direction away from the substrate 10.
[0044] It should be noted that, as Figure 1 shown, in the embodiment where the first section of the conductive via 40 is disposed near the edge of the pad 20, the connecting portion 31 should be connected to the other edge of the pad 20 away from the conductive via 40, so as to increase the distance between the conductive via 40 and the connecting portion 31 and reduce the impact of the gas generated by the solder paste when heated on the connecting portion 31.
[0045] In addition, it should be noted that for the embodiment where the pin connector 30 includes the connecting portion 31 and the extending portion 32, the projection of the conductive via 40 along its axial direction does not coincide with the projection of the pin connector 30 along the axial direction of the conductive via 40, which means that the projection of the conductive via 40 along its axial direction does not coincide with the projection of the connecting portion 31 along the axial direction of the conductive via 40. That is to say, the distance between the connecting portion 31 of the pin connector 30 and the conductive via 40 is greater than or equal to zero.
[0046] Similarly, for the embodiment where the pin connector 30 includes the connecting portion 31 and the extending portion 32, the electronic component can be electrically connected to the connecting portion 31 through the extending portion 32, and further realize the electrical connection with the pad 20 and the conductive via 40 connected to the connecting portion 31.
[0047] According to the second aspect of the present disclosure, there is provided an electronic module including the circuit board 1 as above.
[0048] According to the third aspect of the present disclosure, there is provided an electronic device including the electronic module as above. The electronic device has all the beneficial effects of the above electronic module and the circuit board 1, and the present disclosure will not elaborate on this.
[0049] The preferred embodiments of the present disclosure have been described in detail above in conjunction with the accompanying drawings. However, the present disclosure is not limited to the specific details in the above embodiments. Within the scope of the technical concept of the present disclosure, various simple modifications can be made to the technical solutions of the present disclosure, and these simple modifications all fall within the protection scope of the present disclosure.
[0050] In addition, it should be noted that, in the various specific technical features described in the above specific embodiments, they can be combined in any suitable manner without conflict. To avoid unnecessary repetition, the present disclosure will not separately describe various possible combination manners.
[0051] Furthermore, any combination can be made among the various different embodiments of the present disclosure as long as it does not violate the idea of the present disclosure, and it should also be regarded as the content disclosed by the present disclosure.
Claims
1. A circuit board, characterized in that, It includes a substrate, pads, and pin connectors. A circuit is integrated on the substrate. The pads are soldered on the outer surface of the substrate. The circuit board has conductive vias that penetrate through the pads and the substrate. The pads are electrically connected to the circuit through the conductive vias. The pin connectors are mounted on the pads and electrically connected to the pads. The projection of the conductive via along its axial direction does not coincide with the projection of the pin connector along the axial direction of the conductive via.
2. The circuit board according to claim 1, wherein The distance between the pin connector and the conductive via is between a first preset distance and a second preset distance.
3. The circuit board according to claim 1, wherein The conductive via includes a first section and a second section. The first section penetrates through the pad, and the second section penetrates through the substrate. The first section is close to the edge of the pad.
4. The circuit board according to claim 3, characterized in that, The conductive via and the pad form an L shape.
5. The circuit board according to claim 1, characterized in that The wall of the conductive via has a conductive layer, and the pad is electrically connected to the circuit through the conductive layer.
6. The circuit board according to any one of claims 1-5, characterized in that, The substrate includes multiple wiring layers that are stacked along the thickness direction of the substrate. The multiple wiring layers include a top wiring layer, a bottom wiring layer, and at least one inner wiring layer located between the top wiring layer and the bottom wiring layer. The pad is electrically connected to at least one of the inner wiring layers through the conductive via, or the pad is electrically connected to the bottom wiring layer through the conductive via.
7. The circuit board according to any one of claims 1-5, characterized in that, At least part of the conductive via is filled with plugging material; the plugging material is filled in the part of the conductive via away from the pad. The plugging material is an insulating material.
8. The circuit board according to any one of claims 1-5, characterized in that, The pin connector includes a connecting portion and an extending portion. The connecting portion is connected to the side of the pad facing away from the substrate, and the extending portion is connected to the end of the connecting portion away from the conductive via and extends obliquely in a direction away from the substrate.
9. An electronic module, characterized in that, It includes a circuit board according to any one of claims 1-8.
10. An electronic device, characterized in that, It includes an electronic module according to claim 9.