SMD (Surface Mount Device) type ceramic component
By designing chip-type ceramic components and using welding and insulating coating, the high cost and high and low temperature cycle problems of SMD products are solved, and an efficient packaging structure is achieved, which avoids the wire pins falling off, and improves process efficiency and reliability.
Patent Information
- Application Number
- CN202421607172.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-08
- Publication Date
- 2025-07-25
- Estimated Expiration
- 2034-07-08
AI Technical Summary
The existing SMD product manufacturing process has problems of high cost and low automation, and it is difficult to meet the requirements of 1,000 high and low temperature cycles. The risk of wire pins falling off due to solder melting has not been effectively solved.
The chip-type ceramic components are adopted, including shells, ceramic components, wire pins, cover plates and metal electrode sheets. Through welding and insulating coating, the wire pins and metal electrode sheets are connected by current welding to form a stable packaging structure to meet the requirements of high and low temperature cycles.
It achieves the requirements of 1000 dual 85 and high and low temperature cycles simultaneously, avoids the risk of wire pin falling off caused by solder melting, and improves process efficiency and reliability.
Smart Images
Figure CN223155751U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of electronic components, in particular to a chip-type ceramic component. Background Art
[0002] At present, the manufacturing process of SMD products usually adopts the hot injection molding encapsulation process or the coating flattening process. Among them, the operation cost of the hot injection molding encapsulation process is relatively high, and the automation cost is also high; the degree of automation of the coating flattening process is high, but it cannot meet the requirement of 1000 times of high and low temperature cycles due to the limitation of the coating. In the prior art, the SMD product welds the varistor and the electrode sheet, and then performs leg folding after injection molding. Summary of the Utility Model
[0003] The technical problem to be solved by the utility model is: in order to solve the problems existing in the above background art, a chip-type ceramic component is provided, which can meet both double 85 and 1000 times of high and low temperature cycles. At the same time, the wire pin is connected with the metal electrode sheet on the cover plate through electric current welding, which can eliminate the risk of the wire pin falling off caused by the melting of the solder.
[0004] The technical solution adopted by the utility model to solve its technical problem is: a chip-type ceramic component, including a housing, a ceramic component, a wire pin, a cover plate and a metal electrode sheet. The ceramic component is welded and connected with the wire pin. The wire pin is fixedly connected with the cover plate. The metal electrode sheet is fixed on the cover plate. The wire pin is bent and placed on the metal electrode sheet. The housing and the cover plate connected with the ceramic component are combined into an encapsulated component.
[0005] Further specifically defined, in the above technical solution, the surfaces of the ceramic component and the wire pin are wrapped with an insulating coating layer.
[0006] Further specifically defined, in the above technical solution, the ceramic component is a varistor component, a thermistor component or a photosensitive component.
[0007] Further specifically defined, in the above technical solution, a part of the metal electrode sheet is located on the upper surface of the cover plate, and a part of the metal electrode sheet is located on the lower surface of the cover plate.
[0008] Further specifically defined, in the above technical solution, the wire pin passes through one side of the cover plate and is connected with the metal electrode sheet located on the lower surface of the cover plate.
[0009] Further specifically defined, in the above technical solution, the wire pin is connected with the metal electrode sheet located on the upper surface of the cover plate.
[0010] Further specifically defined, in the above technical solution, there are two wire pins, and the two wire pins are welded on both sides of the ceramic element. The number of metal electrode sheets is two, and one metal electrode sheet corresponds to one wire pin.
[0011] Further specifically defined, in the above technical solution, the surface of the cover plate is provided with a first buckle and a groove, and the metal electrode sheet is placed on the cover plate through the first buckle and the groove.
[0012] Further specifically defined, in the above technical solution, the housing is a shell with an opening on one side. Through holes are provided on both sides adjacent to the opening of the housing. The ceramic element is placed inside the housing. The side of the cover plate is provided with a second buckle, and the second buckle of the cover plate is embedded in the through hole of the housing.
[0013] Further specifically defined, in the above technical solution, the two wire pins are formed on the same horizontal plane and are in contact with the corresponding metal electrode sheets.
[0014] The beneficial effects of the present utility model are as follows: For the surface-mounted ceramic component provided by the present utility model, the ceramic element and the wire pins are first welded, and after both are insulated and painted, they are welded to the metal electrode sheets and then put into the shell. It can simultaneously meet the requirements of double 85 and 1000 times of high and low temperature cycles. At the same time, the wire pins and the metal electrode sheets on the cover plate are connected by current welding, and fixing by current welding can eliminate the risk of the wire pins falling off caused by the melting of the solder. Description of the Drawings
[0015] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments recorded in the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.
[0016] Figure 1 It is a schematic structural diagram of Embodiment 1 of the surface-mounted ceramic component of the present utility model;
[0017] Figure 2 It is Figure 1 the front view of;
[0018] Figure 3 It is Figure 1 the side view of;
[0019] Figure 4 It is Figure 1 the exploded structural schematic Figure 1 of;
[0020] Figure 5 It isFigure 1 Exploded view Figure 2 ;
[0021] Figure 6 Is the assembly structure diagram of the varistor body, wire pins, metal electrode sheets and cover plate in Embodiment 1 Figure 1 ;
[0022] Figure 7 Is the assembly structure diagram of the varistor body, wire pins, metal electrode sheets and cover plate in Embodiment 1 Figure 2 ;
[0023] Figure 8 Is the assembly structure diagram of the metal electrode sheet and the cover plate in Embodiment 1;
[0024] Figure 9 Is the structure diagram of Embodiment 2 of the patch-type ceramic component of the present utility model;
[0025] Figure 10 Is Figure 9 Front view of
[0026] Figure 11 Is Figure 9 Side view of
[0027] Figure 12 Is Figure 9 Bottom view of
[0028] Figure 13 Is Figure 9 Exploded view of
[0029] Figure 14 Is the assembly structure diagram of the ceramic element, wire pins, metal electrode sheets and cover plate in Embodiment 2;
[0030] Figure 15 Is the assembly structure diagram of the metal electrode sheet and the cover plate in Embodiment 2;
[0031] Figure 16 Is the schematic diagram of the ceramic element in the patch-type ceramic component being in a horizontal structure Figure 1 ;
[0032] Figure 17 Is the schematic diagram of the ceramic element in the patch-type ceramic component being in a horizontal structure Figure 2 ;
[0033] Figure 18 Is Figure 16 Exploded view of Figure 1 ;
[0034] Figure 19 Is Figure 16 Exploded view of Figure 2 ;
[0035] Figure 20 It is a schematic diagram of the ceramic element in the chip-type ceramic component having a square sheet structure Figure 1 ;
[0036] Figure 21 It is a schematic diagram of the ceramic element in the chip-type ceramic component having a square sheet structure Figure 2 ;
[0037] Figure 22 It is a schematic diagram of the ceramic element in the chip-type ceramic component having a square sheet structure Figure 3 ;
[0038] Figure 23 is Figure 20 exploded structure schematic diagram of
[0039] The reference numerals in the accompanying drawings are: 1, housing; 11, through hole; 2, ceramic element; 3, wire pin; 4, cover plate; 41, first buckle; 42, groove; 43, second buckle; 5, metal electrode sheet. Detailed implementation manners
[0040] To make the objectives, technical solutions and advantages of the embodiments of the present utility model clearer, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are some, but not all, of the embodiments of the present utility model. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.
[0041] In the description of the present utility model, it should be understood that the orientation or positional relationships indicated by the terms "one side", "the other side", "both sides", "between", "middle part", "upper end", "lower end", etc. are based on the orientation or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present utility model.
[0042] In the description of the present utility model, it should be noted that unless otherwise clearly defined and limited, the terms "arrangement", "connection" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be directly connected, or indirectly connected through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.
[0043] Embodiment 1
[0044] SeeFigures 1 - 8 , the utility model relates to a patch-type ceramic component, which comprises a housing 1, a ceramic component 2, wire pins 3, a cover plate 4 and metal electrode plates 5. The ceramic component 2 is welded to the wire pins 3, the wire pins 3 are fixedly connected to the cover plate 4, the metal electrode plates 5 are of a C-shaped structure, the metal electrode plates 5 are fixed on the cover plate 4, the wire pins 3 are bent and placed on the metal electrode plates 5, the ceramic component 2 and the cover plate 4 are injection-molded into an integral structure, and the housing 1 and the cover plate 4 connected with the ceramic component 2 are combined into a packaged component.
[0045] Among them, the surfaces of the ceramic component 2 and the wire pins 3 are wrapped with an insulating coating layer. The ceramic component 2 is a varistor, a thermistor, a photosensitive element, etc., such as a varistor chip. Part of the metal electrode plate 5 is located on the upper surface of the cover plate 4, and part of the metal electrode plate 5 is located on the lower surface of the cover plate 4. The wire pins 3 pass through one side of the cover plate 4 and are connected to the metal electrode plate 5 located on the lower surface of the cover plate 4. The wire pins 3 are connected to the metal electrode plate 5 located on the upper surface of the cover plate 4. The wire pins 3 are made of metal conductive material, there are two wire pins 3, the two wire pins 3 are welded to both sides of the ceramic component 2, the number of metal electrode plates 5 is two, and one metal electrode plate 5 corresponds to one wire pin 3.
[0046] The insulating coating is a flame-retardant insulating coating. The insulating coating covers the ceramic component 2 and the wire pins 3, and part of the wire pins 3 is exposed from the insulating coating. The insulating coating has the ability to withstand high temperature and humidity and multiple thermal and cold shocks.
[0047] The wire pins 3 are bent and placed on the metal electrode plates 5, and the wire pins 3 are fixed on the metal electrode plates 5 by welding. The surface of the cover plate 4 is provided with a first buckle 41 and a groove 42. The metal electrode plate 5 is placed on the cover plate 4 through the first buckle 41 and the groove 42. The metal electrode plate 5 is bent to the other side of the cover plate 4, and the metal electrode plate 5 bent to the other side is a plane available for welding. The groove 42 is arranged on the upper surface of the cover plate 4, the first buckle 41 is arranged in the groove 42, and the number of the first buckles 41 is two. Two fixing holes are arranged on the metal electrode plate 5 located on the upper surface of the cover plate 4, and the metal electrode plate 5 is clamped on the cover plate 4 by being matched and embedded into the fixing holes through the first buckle 41.
[0048] The housing 1 is a shell with an opening on one side. Through holes 11 are arranged on both sides close to the opening of the housing 1. The ceramic component 2 is placed inside the housing 1. The side part of the cover plate 4 is provided with a second buckle 43, and the second buckle 43 of the cover plate 4 is embedded into the through hole 11 of the housing 1.
[0049] The two wire pins 3 are formed to be on the same horizontal plane and are in contact with the corresponding metal electrode plates 5. That is, after the wire pins 3 are bent, their pins are parallel to the cover plate 4.
[0050] Of course, in addition to the vertical structure, the ceramic component 2 can also be adjusted to a horizontal structure according to the height limit of the ceramic component 2. For details, see Figure 16 , Figure 17 , Figure 18 and Figure 19 .
[0051] Of course, in addition to the wafer structure, the ceramic component 2 can also be a square wafer structure. For details, see Figure 20 , Figure 21 , Figure 22 and Figure 23 .
[0052] Embodiment 2
[0053] See Figures 9 - 15 . The difference between the present utility model, a surface-mounted ceramic component, and Embodiment 1 is that: the wire lead 3 does not pass through the cover plate 4, and the wire lead 3 is connected to the metal electrode sheet 5 located on the upper surface of the cover plate 4 by current welding.
[0054] For this surface-mounted ceramic component, the ceramic component and the wire lead are first welded. After both are insulated and coated, they are welded to the metal electrode sheet and shelled. It can meet both the double 85 and 1000 times of high and low temperature cycles. At the same time, the wire lead and the metal electrode sheet on the cover plate are connected by current welding. Fixing by current welding can eliminate the risk of the wire lead falling off due to the melting of the solder; that is, this surface-mounted ceramic component combines the existing sillcone coating to meet the requirement of 1000 times of high and low temperature cycles, and the shell injection molding process is more efficient than the thermal injection molding process. Therefore, according to the process requirements, the coated product is welded to the metal electrode sheet and then placed in the plastic housing 1; that is to say, the wire leads are placed on the same horizontal plane by wire lead forming, the wire leads are welded to the metal electrode sheet, and then the ceramic component is pushed upright perpendicular to the metal electrode sheet to form a vertical surface-mounted resistor. Compared with the known thermal injection packaging process, this structure of the surface-mounted ceramic component can meet the double 85, and compared with the known coating flattening process, this structure of the surface-mounted ceramic component can meet 1000 times of high and low temperature cycles.
[0055] The above is only the preferred specific implementation manner of the present utility model, but the protection scope of the present utility model is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present utility model, according to the technical solution of the present utility model and its inventive concept, makes equivalent substitutions or changes, and should be covered within the protection scope of the present utility model.
Claims
1. A chip-type ceramic component, comprising a housing (1), a ceramic element (2), wire pins (3), a cover plate (4), and a metal electrode sheet (5), characterized in that: The ceramic component (2) is welded to the wire pin (3), the wire pin (3) is fixedly connected to the cover plate (4), the metal electrode sheet (5) is fixed on the cover plate (4), the wire pin (3) is bent and placed on the metal electrode sheet (5), and the housing (1) and the cover plate (4) connected with the ceramic component (2) are combined into a packaged component.
2. The chip-type ceramic component according to claim 1, wherein: The surfaces of the ceramic component (2) and the wire pin (3) are coated with an insulating coating layer.
3. The chip-type ceramic component according to claim 1, characterized in that: The ceramic component (2) is a varistor component, a thermistor component or a photosensitive component.
4. The chip-type ceramic component according to claim 1, wherein: Part of the metal electrode sheet (5) is located on the upper surface of the cover plate (4), and part of the metal electrode sheet (5) is located on the lower surface of the cover plate (4).
5. The chip-type ceramic component according to claim 4, wherein: The wire pin (3) passes through one side of the cover plate (4) and is connected to the metal electrode sheet (5) located on the lower surface of the cover plate (4).
6. The chip-type ceramic component according to claim 4, wherein: The wire pin (3) is connected to the metal electrode sheet (5) located on the upper surface of the cover plate (4).
7. The chip-type ceramic component according to claim 1, characterized in that: There are two wire pins (3), and the two wire pins (3) are welded to both sides of the ceramic component (2). The number of metal electrode sheets (5) is two, and one metal electrode sheet (5) corresponds to one wire pin (3).
8. The chip-type ceramic component according to claim 1, characterized in that: The surface of the cover plate (4) is provided with a first buckle (41) and a groove (42), and the metal electrode sheet (5) is placed on the cover plate (4) through the first buckle (41) and the groove (42).
9. The chip-type ceramic component according to claim 1, wherein: The housing (1) is a shell with an opening on one side. Through holes (11) are provided on both sides adjacent to the opening of the housing (1). The ceramic component (2) is placed in the housing (1). The side part of the cover plate (4) is provided with a second buckle (43), and the second buckle (43) of the cover plate (4) is embedded in the through hole (11) of the housing (1).
10. The chip-type ceramic component according to claim 7, wherein: The two wire pins (3) are formed to be on the same horizontal plane and are in contact with the corresponding metal electrode sheets (5).