Silicon wafer grooving machine table
By designing lifting components and cleaning sinks on the silicon wafer groove machine, the removal of debris on the surface of the silicon wafer is achieved and the debris falls off is prevented, improving the processing quality and stability of the silicon wafer laser groove.
Patent Information
- Application Number
- CN202422401135.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-30
- Publication Date
- 2025-08-01
- Estimated Expiration
- 2034-09-30
AI Technical Summary
The existing silicon wafer laser groove machine does not effectively remove the debris on the surface of the silicon wafer and prevent the debris from falling back, which affects the processing quality and subsequent processes.
A silicon wafer groove machine including a silicon wafer groove working device and a cleaning sink is designed. The lifting and lifting components are used to make the silicon wafer placement box obliquely immerse in the cleaning liquid. The cleaning liquid takes away debris and prevents debris from escaping and falling back.
Effectively remove debris on the surface of the silicon wafer to prevent debris from falling back to the surface of the silicon wafer, and improve processing quality and stability.
Smart Images
Figure CN223172162U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of grooving processing machines for silicon wafer production, and specifically relates to a silicon wafer grooving machine. Background Technique
[0002] In semiconductor chip processing, there is a silicon wafer grooving process. High-precision silicon wafer grooving is one of the key steps in semiconductor chip manufacturing processes. It involves opening slits or holes in silicon wafers or chips to facilitate subsequent process steps such as circuit wiring or metal coating. Generally, the grooving depth ranges from a few micrometers to dozens of micrometers. There are various methods for silicon wafer grooving. One common and efficient method is the laser grooving technology that uses a laser beam to cut the silicon wafer. The laser grooving machine has very high precision and control performance. This technology can perform cutting at the micrometer level to meet the grooving requirements of different chips;
[0003] During the silicon wafer laser grooving process, removing debris is an important link, which directly affects the processing quality and the progress of subsequent processes; One common debris removal method during the grooving process is the auxiliary gas purging method. High-pressure gas (such as inert gases like nitrogen, argon, etc.) is used to purge the processing area through a nozzle to promptly blow away the debris generated during laser cutting or grooving; However, if the gas flow rate and pressure are not well controlled, it will cause damage to the silicon wafer surface or affect the stability of the laser beam. In addition, the blown debris may be mixed in the air and fall back onto the silicon wafer surface;
[0004] In the existing silicon wafer laser grooving processing, there is a problem that there is no design on the laser grooving machine to remove the debris on the silicon wafer surface and prevent the debris from falling back. For this reason, this application proposes a silicon wafer grooving machine. Summary of the Utility Model
[0005] The purpose of the utility model is to provide a silicon wafer grooving machine to solve the problem in the above background technique that there is no design on the laser grooving machine to remove the debris on the silicon wafer surface and prevent the debris from falling back.
[0006] To achieve the above purpose, the utility model provides the following technical solution: A silicon wafer grooving machine, including
[0007] A silicon wafer grooving working device, including a silicon wafer grooving working machine table, a moving frame installed on the silicon wafer grooving working machine table, and a silicon wafer grooving laser arm movably installed on the moving frame;
[0008] A cleaning water tank installed on the silicon wafer grooving working machine table. The inside of the cleaning water tank is provided with a lifting assembly. The lifting assembly includes a support rod installed on the inner surface of the cleaning water tank, a "U"-shaped support plate connected to the top end of the support rod, and a lifting rotating cylinder installed between the opposing surfaces of the support plate;
[0009] The lifting assembly includes a lifting cylinder symmetrically installed on a silicon wafer grooving workbench, a connecting plate connected to the top of the lifting cylinder at one end, a fixing ring installed between the opposite connecting plates, a connecting shaft passing through the fixing ring, and a silicon wafer placement box for containing a silicon wafer workpiece B installed between the opposite connecting shafts. A contraction spring is sleeved on the outer side of the connecting shaft, and its two ends are respectively connected to the fixing ring and the silicon wafer placement box. A bent plate is provided on the bottom surface of the silicon wafer placement box.
[0010] Preferably, the connecting plate is an "L"-shaped structure, a mounting groove for holding the silicon wafer workpiece B is provided on the surface of the silicon wafer placement box, and a protrusion is provided on the surface of the bent plate.
[0011] Preferably, the bent plate and the protrusion are curved, the cross section of the protrusion is a semicircular plate, and the bent plate and the protrusion correspond to the lifting drum.
[0012] Preferably, the outer surface of the lifting drum is in rolling contact with the outer surface of the corresponding protrusion.
[0013] Preferably, a rebound part is provided on the bottom end of the connecting plate located on one side, and the rebound part includes a connecting rod passing through the connecting plate, a reset rod rotatably sleeved on the outside of the connecting rod, and a rebound spring sleeved on the outside of the connecting rod and connected to the reset rod and the connecting plate at both ends.
[0014] Preferably, the reset rod is tangent to the horizontal surface of the corresponding silicon wafer placement box.
[0015] Preferably, the maximum rotation angle C of the silicon wafer placement box about the connecting axis is 30 degrees.
[0016] Compared with the prior art, the beneficial effects of the present invention are:
[0017] In the present invention, the laser grooving machine is designed to remove debris from the surface of the silicon wafer and prevent the debris from falling back. The lifting cylinder is in operation, and the lifting cylinder drives the connecting plate, the fixing ring and the silicon wafer placement box to move vertically downward, so that the silicon wafer workpiece B is immersed in the cleaning liquid. As the inclined silicon wafer placement box is raised and lowered, the cleaning liquid takes away the debris on the surface of the silicon wafer workpiece B, which can prevent the debris blown by the air from escaping into the air and falling back to the surface of the silicon wafer workpiece B. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] Figure 1 It is a structural diagram of the utility model;
[0019] Figure 2 For the utility model Figure 1 A schematic diagram of the enlarged structure of the middle part A;
[0020] Figure 3 This is a schematic cross-sectional view of the cleaning sink of the present invention;
[0021] Figure 4 It is a top - view structural schematic diagram of the fixing ring of the present utility model;
[0022] Figure 5 It is a side - view structural schematic diagram of the bottom end of the connecting plate of the present utility model;
[0023] In the figure: 2, cleaning water tank; 11, silicon wafer grooving workbench; 12, moving frame; 13, silicon wafer grooving laser arm; 31, lifting cylinder; 32, connecting plate; 33, fixing ring; 34, connecting shaft; 35, silicon wafer placement box; 36, bent plate; 41, connecting rod; 42, reset rod; 43, return spring; 51, support rod; 52, support plate; 53, lifting rotating cylinder; 341, contraction spring; 361, protrusion. Specific embodiments
[0024] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.
[0025] Embodiment
[0026] Please refer to Figures 1 to 5The utility model provides a technical solution: a silicon wafer slotting machine, including a silicon wafer slotting working device, including a silicon wafer slotting working machine 11, a mobile frame 12 installed on the silicon wafer slotting working machine 11, and a silicon wafer slotting laser arm 13 movably installed on the mobile frame 12. The silicon wafer slotting laser arm 13 uses a laser beam to cut the silicon wafer using a laser slotting technology. The laser slotting technology is a conventional technical means and is not described in detail in this application; a cleaning water tank 2 is installed on the silicon wafer slotting working machine 11, and the cleaning water tank 2 is connected to the silicon wafer slotting working machine 11 by screws. The interior of the cleaning water tank 2 is filled with a liquid for removing debris. The cleaning liquid is provided in the cleaning water tank 2, and a lifting assembly is provided inside the cleaning water tank 2. The lifting assembly includes a support rod 51 installed on the inner surface of the cleaning water tank 2, a "U"-shaped support plate 52 connected to the top of the support rod 51, and a lifting drum 53 installed between the opposite surfaces of the support plate 52. The support rod 51 is combined with the cleaning water tank 2 and the support plate 52 by conventional means (such as screw connection). The support plate 52 supports the lifting drum 53. When the silicon wafer placement box 35 containing the silicon wafer workpiece B moves vertically downward, the lifting drum 53 lifts the bent plate 36, thereby rotating the silicon wafer placement box 35, which is conducive to the cleaning liquid taking away the debris on the surface of the silicon wafer workpiece B; the lifting assembly , including a lifting cylinder 31 symmetrically mounted on the silicon wafer slotting workbench 11, a connecting plate 32 at one end connected to the top of the lifting cylinder 31, a fixing ring 33 installed between the opposite connecting plates 32, a connecting shaft 34 passing through the fixing ring 33, and a silicon wafer placement box 35 installed between the opposite connecting shafts 34 for holding the silicon wafer workpiece B. The lifting cylinder 31 is connected to the silicon wafer slotting workbench 11 and the connecting plate 32 by screws, and the fixing ring 33 is connected to the connecting plate 32 by screws. The lifting cylinder 31 drives the connecting plate 32, the fixing ring 33 and the silicon wafer placement box 35 to move vertically downward, so that the silicon wafer workpiece B is immersed in the cleaning liquid. When the lifting cylinder 31 drives the silicon wafer placement box 35 to move vertically upward, the cleaning liquid takes away the debris on the surface of the silicon wafer workpiece B. The outer side of the connecting shaft 34 is provided with a contraction spring 341 with two ends connected to the fixing ring 33 and the silicon wafer placement box 35 respectively. When the silicon wafer placement box 35 moves downward, under the action of the lifting drum 53 lifting the bent plate 36, the bent plate 36 and the silicon wafer placement box 35 are in an inclined state. The silicon wafer workpiece B is limited by the silicon wafer placement box 35 and will not be deflected, which is conducive to the cleaning liquid taking away the debris on the surface of the silicon wafer workpiece B. A bent plate 36 is provided on the bottom surface of the silicon wafer placement box 35, and the bent plate 36 is screwed together with the silicon wafer placement box 35.
[0027] In this embodiment, the connecting plate 32 has an "L" - shaped structure. An installation groove for containing the silicon wafer workpiece B is provided on the surface of the silicon wafer placement box 35. A protrusion 361 is provided on the surface of the bent plate 36. The bent plate 36 and the protrusion 361 are adhesively connected by glue. The bent plate 36 and the protrusion 361 are in a curved shape. The cross - section of the protrusion 361 is in the shape of a semi - circular plate. The bent plate 36 and the protrusion 361 correspond to the lifting rotating cylinder 53. The outer surface of the lifting rotating cylinder 53 is in rolling contact with the outer surface of the corresponding and fitting protrusion 361. When the lifting rotating cylinder 53 is in rolling contact with the protrusion 361, the lifting rotating cylinder 53 presses against the bent plate 36 and the protrusion 361, thereby tilting the silicon wafer placement box 35. According to actual needs, the included angle between the lifting rotating cylinder 53 and the bent plate 36 can be adjusted so that the lifting rotating cylinder 53 smoothly presses against the bent plate 36 and the protrusion 361, and the silicon wafer placement box 35 is in an inclined state.
[0028] In this embodiment, a resilient member is provided at the bottom end of the connecting plate 32 located on one side. The resilient member includes a connecting rod 41 passing through the connecting plate 32, a reset rod 42 rotatably sleeved outside the connecting rod 41, and a resilient spring 43 sleeved outside the connecting rod 41 and connected to the reset rod 42 and the connecting plate 32 at both ends respectively. The reset rod 42 is tangent to the horizontal surface of the corresponding silicon wafer placement box 35. The maximum rotation angle C of the silicon wafer placement box 35 with the connecting shaft 34 as the axis is 30 degrees. The connecting rod 41 and the connecting plate 32 are screwed together. Both ends of the resilient spring 43 are embedded inside the reset rod 42 and the connecting plate 32 respectively. When the silicon wafer placement box 35 is tilted, the silicon wafer placement box 35 swings the reset rod 42, and both the resilient spring 43 and the contraction spring 341 are in a contracted state. Both the resilient spring 43 and the contraction spring 341 generate elastic forces to straighten the silicon wafer placement box 35. When the lifting cylinder 31 drives the silicon wafer placement box 35 to move upward, under the action of the elastic forces of the resilient spring 43 and the contraction spring 341, the silicon wafer placement box 35 is straightened.
[0029] The working principle and usage process of the present utility model:
[0030] When cleaning the debris on the surface of the silicon wafer workpiece B installed in the silicon wafer placement box 35, the lifting cylinder 31 operates. The lifting cylinder 31 drives the connecting plate 32, the fixed ring 33, and the silicon wafer placement box 3 down vertically, so that the silicon wafer workpiece B is immersed in the cleaning liquid.
[0031] When the silicon wafer placement box 35 moves down to the point where the lifting rotating cylinder 53 is in rolling contact with the protrusion 361, the lifting rotating cylinder 53 presses against the bent plate 36 and the protrusion 361, thereby tilting the silicon wafer placement box 35. The silicon wafer workpiece B is limited by the silicon wafer placement box 35 and will not be deflected, which is conducive to the cleaning liquid taking away the debris on the surface of the silicon wafer workpiece B, and avoids the debris from escaping into the air and falling back onto the surface of the silicon wafer workpiece B. According to actual needs, the included angle between the lifting rotating cylinder 53 and the bent plate 36 can be adjusted so that the lifting rotating cylinder 53 smoothly presses against the bent plate 36 and the protrusion 361, and the silicon wafer placement box 35 is in an inclined state.
[0032] When the silicon wafer placement box 35 is tilted, the swing reset rod 42 of the silicon wafer placement box 35, the return spring 43 and the contraction spring 341 are all in a contracted state, and both the return spring 43 and the contraction spring 341 generate elastic forces to straighten the silicon wafer placement box 35.
[0033] When the lifting cylinder 31 drives the silicon wafer placement box 35 to move vertically upward, the cleaning liquid takes away the debris on the surface of the silicon wafer workpiece B, and under the elastic forces of the return spring 43 and the contraction spring 341, the silicon wafer placement box 35 is in a straightened state.
[0034] To sum up: There is a design on the laser grooving machine table to remove the debris on the surface of the silicon wafer and prevent the debris from falling back. When the lifting cylinder 31 operates, the lifting cylinder 31 drives the connecting plate 32, the fixed ring 33 and the silicon wafer placement box 35 to move vertically downward, so that the silicon wafer workpiece B is immersed in the cleaning liquid. As the silicon wafer placement box 35 in the tilted state moves up and down, the cleaning liquid takes away the debris on the surface of the silicon wafer workpiece B, which can avoid the situation that the debris blown by air escapes into the air and falls back to the surface of the silicon wafer workpiece B.
[0035] Although the embodiments of the present invention have been shown and described (see the above detailed description), for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A silicon wafer grooving machine, characterized in that: include A silicon wafer slotting working device comprises a silicon wafer slotting working platform (11), a movable frame (12) mounted on the silicon wafer slotting working platform (11), and a silicon wafer slotting laser arm (13) movably mounted on the movable frame (12); A cleaning water tank (2) is installed on a silicon wafer slotting machine (11), wherein a lifting assembly is provided inside the cleaning water tank (2), and the lifting assembly comprises a support rod (51) installed on the inner surface of the cleaning water tank (2), a support plate (52) of a "U"-shaped structure connected to the top of the support rod (51), and a lifting drum (53) installed between opposite surfaces of the support plate (52); The lifting assembly comprises a lifting cylinder (31) symmetrically mounted on a silicon wafer slotting workbench (11), a connecting plate (32) one end of which is connected to the top of the lifting cylinder (31), a fixing ring (33) mounted between opposite connecting plates (32), a connecting shaft (34) passing through the fixing ring (33), and a silicon wafer placement box (35) for containing a silicon wafer workpiece B and mounted between the opposite connecting shafts (34). The outer side of the connecting shaft (34) is provided with a contraction spring (341) whose two ends are respectively connected to the fixing ring (33) and the silicon wafer placement box (35). A bent plate (36) is provided on the bottom surface of the silicon wafer placement box (35).
2. The wafer grooving machine table according to claim 1, characterized in that: The connecting plate (32) is an "L"-shaped structure. The surface of the silicon wafer placement box (35) is provided with a mounting groove for containing the silicon wafer workpiece B. The surface of the bent plate (36) is provided with a protrusion (361).
3. The wafer grooving machine table according to claim 2, wherein: The bent plate (36) and the protrusion (361) are in a curved shape, the cross section of the protrusion (361) is in the shape of a semicircular plate, and the bent plate (36) and the protrusion (361) correspond to the lifting drum (53).
4. A silicon wafer grooving machine table according to claim 3, characterized in that: The outer surface of the lifting drum (53) is in rolling contact with the outer surface of the correspondingly fitted protrusion (361).
5. A silicon wafer grooving machine table according to claim 1, characterized in that: A rebound member is provided at the bottom end of the connecting plate (32) located at one side, and the rebound member comprises a connecting rod (41) penetrating the connecting plate (32), a reset rod (42) rotatably sleeved on the outside of the connecting rod (41), and a rebound spring (43) sleeved on the outside of the connecting rod (41) and having two ends respectively connected to the reset rod (42) and the connecting plate (32).
6. The wafer grooving machine platform according to claim 5, characterized in that: The reset rod (42) is tangent to the horizontal surface of the corresponding silicon wafer placement box (35).
7. A silicon wafer grooving machine table according to claim 6, characterized in that: The silicon wafer placement box (35) can rotate about the connecting shaft (34) to a maximum angle C of 30 degrees.