Heat conduction assembly and food thermometer
By installing heat conduction parts in the thermometer shell, an integrated thermal conduction system of thermal conduction tips, thermometer circuit components and thermal conduction parts is built, which solves the problem of poor heat dissipation effect in the existing technology, and achieves more efficient heat dissipation effect and temperature consistency.
Patent Information
- Application Number
- CN202422369407.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-27
- Publication Date
- 2025-08-01
- Estimated Expiration
- 2034-09-27
AI Technical Summary
In the existing thermal conductivity components, the heat in the storage tank cannot be further transmitted, resulting in poor heat dissipation effect.
The thermal conductivity parts are arranged in the thermometer shell, and the thermal conductivity parts wrap some of the thermometer circuit components and the inner wall of the accommodating groove to conduct heat to the outer wall of the thermometer shell, and an integrated thermal conductivity system of the thermal conductivity tip, the thermometer circuit components and the thermal conductivity parts are constructed.
It improves the heat dissipation effect of the thermal conductivity component, maintains the consistency of the internal and external temperatures of the thermometer shell, makes full use of the external heat dissipation effect, and avoids the inability to further conduct heat in the accommodating tank.
Smart Images
Figure CN223179658U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of food thermometers, and particularly relates to a heat conduction component and a food thermometer. Background Art
[0002] With the development of technology, food thermometers are applicable to multiple fields such as families, refrigeration, heating, food processing, rubber and plastic processing, etc. Food thermometers are used to measure the temperature of food, and the heat conduction component is a part of the food thermometer.
[0003] In the prior art, the existing heat conduction component includes a thermometer housing and thermometer circuit components. The thermometer housing is provided with a heat conduction tip; the heat conduction tip is used for plugging into food and conducting heat with the food; a receiving groove is provided in the thermometer housing; the thermometer circuit components are arranged in the receiving groove and are used for sensing the heat of the food received by the heat conduction tip. However, the heat in the receiving groove cannot be further conducted, resulting in poor heat dissipation effect of the existing heat conduction component. Summary of the Utility Model
[0004] The purpose of the utility model is to provide a heat conduction component and a food thermometer. The thermometer housing is provided with a heat conduction tip; the heat conduction tip is used for plugging into food and conducting heat with the food; a receiving groove is provided in the thermometer housing; the thermometer circuit components are arranged in the receiving groove and are used for sensing the heat of the food received by the heat conduction tip; a heat conducting member is arranged in the receiving groove, and the heat conducting member wraps part of the thermometer circuit components and contacts the inner side wall of the receiving groove to transfer the heat of the heat conduction tip and the heat of the thermometer circuit components to the outer side wall of the thermometer housing, so as to construct an integrated heat conduction system of the heat conduction tip, the thermometer circuit components and the heat conducting member, and based on the heat conducting member, transfer the heat of the heat conduction tip and the heat of the thermometer circuit components to the outer side wall of the thermometer housing, so as to facilitate maintaining the consistency of the internal temperature and the external temperature of the thermometer housing, make full use of the external heat dissipation effect of the thermometer housing, avoid the heat in the receiving groove from not being further conducted, and improve the heat dissipation effect of the heat conduction component.
[0005] To achieve the above purpose, the utility model provides the following technical solutions:
[0006] A heat conduction component is applied to a food thermometer, and the heat conduction component includes:
[0007] A thermometer housing, which is provided with a heat conduction tip; the heat conduction tip is used for plugging into food and conducting heat with the food; a receiving groove is provided in the thermometer housing;
[0008] Thermometer circuit components, which are arranged in the receiving groove and are used for sensing the heat of the food received by the heat conduction tip;
[0009] The heat conducting member is disposed in the receiving groove. The heat conducting member wraps part of the thermometer circuit components and contacts the inner side wall of the receiving groove to transfer the heat of the heat conducting tip and the heat of the thermometer circuit components to the outer side wall of the thermometer housing.
[0010] Optionally, the heat conducting member fills the receiving groove. The heat conducting member is located between the thermometer circuit components and the thermometer housing and conducts heat between the thermometer circuit components and the thermometer housing.
[0011] Optionally, the heat conducting member is made of heat conducting glue.
[0012] Optionally, the thermometer housing further includes a housing main body. The housing main body is disposed on one side of the heat conducting tip. The housing main body is provided with the receiving groove and houses the thermometer circuit components and the heat conducting member.
[0013] Optionally, the heat conducting tip is detachably connected to the housing main body, or
[0014] the heat conducting tip is integrally connected to the housing main body.
[0015] Optionally, the housing main body is cylindrical. The housing main body is exposed to the external environment and dissipates heat around the circumferential direction of the housing main body.
[0016] Optionally, the thermometer circuit components include a temperature sensitive electronic device and a circuit board;
[0017] The temperature sensitive electronic device is close to the heat conducting tip and is used to sense the heat of the food received by the heat conducting tip; the circuit board is on one side of the temperature sensitive electronic device and is electrically connected to the temperature sensitive electronic device.
[0018] Optionally, both the temperature sensitive electronic device and the circuit board are disposed in the receiving groove and are arranged along the length direction of the receiving groove.
[0019] Optionally, the heat conducting tip is provided with an inner cavity. The inner cavity communicates with the receiving groove. The heat conducting member fills the inner cavity and the receiving groove in sequence and wraps the temperature sensitive electronic device and the circuit board.
[0020] A food thermometer includes the heat conducting assembly as described above.
[0021] Compared with the prior art, the beneficial effects of the present utility model are:
[0022] The present utility model provides a heat conduction component and a food thermometer. The thermometer housing is provided with a heat conduction tip; the heat conduction tip is used for inserting into food and conducting heat with the food; a receiving groove is arranged inside the thermometer housing; a thermometer circuit component is arranged in the receiving groove and is used for sensing the heat of the food received by the heat conduction tip; a heat conducting member is arranged in the receiving groove, and the heat conducting member wraps part of the thermometer circuit component and contacts the inner side wall of the receiving groove to transfer the heat of the heat conduction tip and the heat of the thermometer circuit component to the outer side wall of the thermometer housing, so as to construct an integrated heat conduction system of the heat conduction tip, the thermometer circuit component and the heat conducting member, and transfer the heat of the heat conduction tip and the heat of the thermometer circuit component to the outer side wall of the thermometer housing based on the heat conducting member, so as to facilitate maintaining the consistency of the internal temperature and the external temperature of the thermometer housing, make full use of the external heat dissipation effect of the thermometer housing, avoid the heat of the receiving groove being unable to be further conducted, and improve the heat dissipation effect of the heat conduction component. BRIEF DESCRIPTION OF THE DRAWINGS
[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative efforts.
[0024] In order to more completely understand the present application and its beneficial effects, the following will be described in conjunction with the drawings. Among them, the same reference numerals in the following description represent the same parts.
[0025] Figure 1 FIGURE 12 shows a schematic diagram of a heat conduction component according to an embodiment of the present application.
[0026] Figure 2 FIG. 16 shows a front view of a heat conduction component according to an embodiment of the present application.
[0027] Figure 3 FIG. 20 shows a cross-sectional view of a heat conduction component according to an embodiment of the present application.
[0028] Figure 4 FIG. 24 shows a schematic diagram of the thermometer housing of a heat conduction component according to an embodiment of the present application.
[0029] Figure 5 FIG. 28 shows a schematic diagram of the thermometer circuit component of a heat conduction component according to an embodiment of the present application.
[0030] REFERENCE NUMERALS
[0031] 100, heat conduction component;
[0032] 10. Thermometer housing; 10a. Accommodation groove; 11. Heat-conducting tip; 11a. Inner cavity; 12. Housing body;
[0033] 20. Thermometer circuit component; 21. Temperature-sensitive electronic device; 22. Circuit board;
[0034] 30. Heat-conducting member;
[0035] 40. Grip member. Detailed implementation manner
[0036] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative efforts belong to the scope of protection of the present application.
[0037] Please refer to the attached Figures 1 to 3 , an embodiment of the present application provides a heat-conducting component 100, and the heat-conducting component 100 is applied to a food thermometer. At this time, the heat-conducting component 100 belongs to a part of the food thermometer, and the heat-conducting component 100 is used to conduct the food temperature.
[0038] Please refer to the attached Figures 1 to 3 , in the embodiment of the present application, the heat-conducting component 100 includes a thermometer housing 10, a thermometer circuit component 20, and a heat-conducting member 30. The thermometer circuit component 20 and the heat-conducting member 30 are located inside the thermometer housing 10, and the thermometer circuit component 20 is located between the housing and the heat-conducting member 30. At this time, the heat-conducting member 30 is connected to the thermometer housing 10, and the thermometer circuit component 20 is connected to the heat-conducting member 30, so that the heat of the thermometer circuit component 20 is conducted to the thermometer housing 10 through the heat-conducting member 30, thereby facilitating the heat dissipation of the thermometer housing 10, making use of the heat-conducting characteristics of the thermometer housing 10, and dissipating heat based on the exposure of the thermometer housing 10 to the external environment, ensuring the heat conduction effect of the heat-conducting component 100.
[0039] Please refer to the attached Figures 1 to 4 , in the embodiment of the present application, the thermometer housing 10 serves as a support component of the heat-conducting component 100. The thermometer housing 10 is used to support the thermometer circuit component 20 and the heat-conducting member 30. The thermometer housing 10 is provided with a heat-conducting tip 11; at this time, optionally, the heat-sensing tip 11 is arranged in a conical shape, and the heat-sensing tip 11 can also be arranged in an arc shape, which is not limited herein. The heat-sensing tip 11 is composed of a heat-conducting metal part.
[0040] Further, the heat-conducting tip 11 is at the front end of the thermometer housing 10. The heat-conducting tip 11 is used to be inserted into food, and the outer surface of the heat-conducting tip 11 contacts the food. Heat conduction occurs between the heat-conducting tip 11 and the food, so that the heat of the food is conducted to the heat-conducting tip 11. An accommodation groove 10a is provided in the thermometer housing 10. The accommodation groove 10a serves as the internal space of the thermometer housing 10 and is used to accommodate the thermometer circuit component 20 and the heat-conducting member 30. At this time, the thermometer circuit component 20 and the heat-conducting member 30 are within the accommodation groove 10a, making full use of the internal space of the thermometer housing 10. At the same time, the thermometer circuit component 20 and the heat-conducting member 30 are protected by the periphery of the thermometer housing 10, thereby ensuring the working stability of the thermometer circuit component 20 and the heat-conducting member 30. Please refer to the appendix Figures 1 to 4 , in the embodiment of the present application, the thermometer circuit component 20 is arranged in the accommodation groove 10a so that the thermometer circuit component 20 can be fixedly connected to the thermometer housing 10 through the accommodation groove 10a. The thermometer circuit component 20 is used to sense the heat of the food received by the heat-conducting tip 11, so that the thermometer circuit component 20 can detect the food temperature to determine the food temperature. Optionally, the thermometer circuit component 20 is a food detection electronic component, which is not limited here.
[0041] Please refer to the appendix Figure 2 and 5 , at this time, the thermometer circuit component 20 includes a temperature-sensitive electronic device 21 and a circuit board 22; the temperature-sensitive electronic device 21 is close to the heat-conducting tip 11 and is used to sense the heat of the food received by the heat-conducting tip 11, so that the heat of the food is conducted to the temperature-sensitive electronic device 21; the circuit board 22 is on the upper side of the temperature-sensitive electronic device 21 and is electrically connected to the temperature-sensitive electronic device 21, so that the circuit board 22 can receive the heat of the food absorbed by the temperature-sensitive electronic device 21, thereby facilitating the circuit board 22 to detect the food temperature to determine the food temperature.
[0042] Please refer to the appendix Figure 2 and 5 , wherein, both the temperature-sensitive electronic device 21 and the circuit board 22 are arranged in the accommodation groove 10a and are arranged along the length direction of the accommodation groove 10a, so that the temperature-sensitive electronic device 21 and the circuit board 22 can make full use of the internal space of the accommodation groove 10a. Optionally, the temperature-sensitive electronic device 21 and the circuit board 22 are arranged along the length direction of the accommodation groove 10a, and there may be an overlapping area in the arrangement of the temperature-sensitive electronic device 21 and the circuit board 22, so as to make full use of the internal space of the accommodation groove 10a.
[0043] Please refer to the appendix Figures 1 to 3, in the embodiment of the present application, the heat conducting member 30 is disposed in the receiving groove 10a. The heat conducting member 30 wraps part of the thermometer circuit component 20 and contacts the inner side wall of the receiving groove 10a, so as to transfer the heat of the heat conducting tip 11 and the heat of the thermometer circuit component 20 to the outer side wall of the thermometer housing 10, thereby constructing an integrated heat conducting system of the heat conducting tip 11, the thermometer circuit component 20 and the heat conducting member 30. And based on the heat conducting member 30, the heat of the heat conducting tip 11 and the heat of the thermometer circuit component 20 are transferred to the outer side wall of the thermometer housing 10, so as to facilitate maintaining the consistency between the internal temperature and the external temperature of the thermometer housing 10, and make full use of the external heat dissipation effect of the thermometer housing 10, avoiding the heat in the receiving groove 10a from not being further conducted, and improving the heat dissipation effect of the heat conducting assembly 100.
[0044] Please refer to the attached Figures 1 to 3 , at this time, the heat conducting member 30 fills the receiving groove 10a, so as to facilitate the outer side wall of the heat conducting member 30 to contact the inner side wall of the receiving groove 10a. The heat conducting member 30 is located between the thermometer circuit component 20 and the thermometer housing 10 and conducts heat between the thermometer circuit component 20 and the thermometer housing 10, so that the temperature of the thermometer circuit component 20 is conducted to the thermometer housing 10 through the heat conducting member 30, thereby facilitating maintaining the consistency between the internal temperature and the external temperature of the thermometer housing 10, and making full use of the external heat dissipation effect of the thermometer housing 10, avoiding the heat in the receiving groove 10a from not being further conducted, and improving the heat dissipation effect of the heat conducting assembly 100. Optionally, the heat conducting member 30 is made of heat conducting glue, and the heat conducting glue has a heat conducting effect. In addition, the heat conducting member 30 can also be a heat conducting sheet, which is not limited herein.
[0045] Please refer to the attached Figures 1 to 4 , in the embodiment of the present application, the thermometer housing 10 further includes a housing main body 12. The housing main body 12 is disposed on the upper side of the heat conducting tip 11. The housing main body 12 is provided with a receiving groove 10a. The receiving groove 10a serves as the internal space of the housing main body 12. The housing main body 12 bears the thermometer circuit component 20 and the heat conducting member 30, so as to facilitate the thermometer circuit component 20 and the heat conducting member 30 to be received in the receiving groove 10a, thereby facilitating the inner side wall of the receiving groove 10a to contact the outer side wall of the heat conducting member 30. The temperature of the thermometer circuit component 20 is conducted to the housing main body 12 through the heat conducting member 30, thereby facilitating maintaining the consistency between the internal temperature and the external temperature of the housing main body 12, and making full use of the external heat dissipation effect of the housing main body 12, avoiding the heat in the receiving groove 10a from not being further conducted, and improving the heat dissipation effect of the heat conducting assembly 100.
[0046] Please refer to the attached Figures 1 to 3 , in another embodiment of the present application, the heat conducting tip 11 is detachably connected to the housing main body 12, so as to facilitate the heat conducting tip 11 to be connected to or detached from the housing main body 12, improving the replacement convenience of the heat conducting tip 11.
[0047] Alternatively, the heat-conducting tip 11 is integrally connected to the housing main body 12, which improves the connection stability between the heat-conducting tip 11 and the housing main body 12, ensures the connection strength between the heat-conducting tip 11 and the housing main body 12, facilitates the heat conduction of the heat-conducting tip 11 to the housing main body 12, and makes full use of the external heat dissipation effect of the thermometer housing 10. At this time, both the heat-conducting tip 11 and the housing main body 12 are made of heat-conducting metal.
[0048] Please refer to the attached Figures 1 to 4 , in the embodiment of the present application, the housing main body 12 is cylindrical, the housing main body 12 is exposed to the external environment, and heat is dissipated around the housing main body 12 in the circumferential direction, so that the heat of the housing main body 12 can be dissipated from multiple directions, improving the heat dissipation effect of the housing main body 12. Optionally, the housing main body 12 can also be in the shape of a square tube, which is not limited here.
[0049] Please refer to the attached Figures 3 to 4 , at this time, the heat-conducting tip 11 is provided with an inner cavity 11a. The inner cavity 11a serves as the internal space of the heat-conducting tip 11. The inner cavity 11a communicates with the receiving groove 10a. The heat-conducting member 30 is sequentially filled in the inner cavity 11a and the receiving groove 10a, so that the outer side wall of the heat-conducting member 30 is in contact with the inner side wall of the inner cavity 11a and the inner side wall of the receiving groove 10a.
[0050] At this time, the heat-conducting member 30 wraps the temperature-sensitive electronic device 21 and the circuit board 22, so that the inner side wall of the heat-conducting member 30 is in contact with the outer side wall of the temperature-sensitive electronic device 21 and the outer side wall of the circuit board 22, and based on the heat-conducting member 30, the heat of the heat-conducting tip 11 and the heat of the temperature-sensitive electronic device 21 and the circuit board 22 are transferred to the outer side wall of the thermometer housing 10, so as to maintain the consistency of the internal temperature and the external temperature of the thermometer housing 10, make full use of the external heat dissipation effect of the thermometer housing 10, avoid the heat in the receiving groove 10a from not being further conducted, and improve the heat dissipation effect of the heat-conducting assembly 100.
[0051] Please refer to the attached Figure 1 , in the embodiment of the present application, the heat-conducting assembly 100 further includes a gripping member 40. The gripping member 40 is arranged on the outer side of the thermometer housing 10. The gripping member 40 is connected to the outer side of the thermometer housing 10. The gripping member 40 is used for the user to grip. Optionally, the gripping member 40 is arranged in an arc shape, so as to facilitate the user's grip, ensure the gripping effect of the user on the gripping member 40, and at the same time, ensure the use effect of the food thermometer.
[0052] In another embodiment, a food thermometer includes a heat-conducting component 100. The heat-conducting component 100 serves as the food thermometer, and the food thermometer is used to measure the temperature of food. At this time, the heat-conducting member 30 wraps part of the thermometer circuit components 20 and contacts the inner side wall of the receiving groove 10a to transfer the heat of the heat-conducting tip 11 and the heat of the thermometer circuit components 20 to the outer side wall of the thermometer housing 10, so as to construct an integrated heat-conducting system of the heat-conducting tip 11, the thermometer circuit components 20, and the heat-conducting member 30. And based on the heat-conducting member 30, the heat of the heat-conducting tip 11 and the heat of the thermometer circuit components 20 are transferred to the outer side wall of the thermometer housing 10, so as to facilitate maintaining the consistency between the internal temperature and the external temperature of the thermometer housing 10, make full use of the external heat dissipation effect of the thermometer housing 10, avoid the heat in the receiving groove 10a being unable to be further conducted, and improve the heat dissipation effect of the heat-conducting component 100.
[0053] Compared with the prior art, the beneficial effects of the present utility model are as follows:
[0054] The present utility model provides a heat-conducting component 100 and a food thermometer. The thermometer housing 10 is provided with a heat-conducting tip 11; the heat-conducting tip 11 is used for inserting into food and conducting heat with the food; a receiving groove 10a is provided in the thermometer housing 10; the thermometer circuit components 20 are arranged in the receiving groove 10a and are used for sensing the food heat received by the heat-conducting tip 11; the heat-conducting member 30 is arranged in the receiving groove 10a. The heat-conducting member 30 wraps part of the thermometer circuit components 20 and contacts the inner side wall of the receiving groove 10a to transfer the heat of the heat-conducting tip 11 and the heat of the thermometer circuit components 20 to the outer side wall of the thermometer housing 10, so as to construct an integrated heat-conducting system of the heat-conducting tip 11, the thermometer circuit components 20, and the heat-conducting member 30. And based on the heat-conducting member 30, the heat of the heat-conducting tip 11 and the heat of the thermometer circuit components 20 are transferred to the outer side wall of the thermometer housing 10, so as to facilitate maintaining the consistency between the internal temperature and the external temperature of the thermometer housing 10, make full use of the external heat dissipation effect of the thermometer housing 10, avoid the heat in the receiving groove 10a being unable to be further conducted, and improve the heat dissipation effect of the heat-conducting component 100.
[0055] The thermometer circuit components 20 are arranged in the receiving groove 10a so that the thermometer circuit components 20 can be fixedly connected to the thermometer housing 10 through the receiving groove 10a. The thermometer circuit components 20 are used for sensing the food heat received by the heat-conducting tip 11 so that the thermometer circuit components 20 can detect the food temperature to determine the food temperature.
[0056] The thermometer circuit component 20 includes a temperature-sensitive electronic device 21 and a circuit board 22; the temperature-sensitive electronic device 21 is close to the heat-conducting tip 11 and is used to sense the heat of the food received by the heat-conducting tip 11 so that the heat of the food can be conducted to the temperature-sensitive electronic device 21; the circuit board 22 is located on the upper side of the temperature-sensitive electronic device 21 and is electrically connected to the temperature-sensitive electronic device 21 so that the circuit board 22 can receive the heat of the food absorbed by the temperature-sensitive electronic device 21, thereby facilitating the circuit board 22 to detect the food temperature to clarify the food temperature.
[0057] In the description of the present application, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more features.
[0058] Specific examples are used in this text to elaborate on the principles and implementation manners of the present application. The description of the above embodiments is only used to help understand the method and its core idea of the present application; at the same time, for those skilled in the art, according to the idea of the present application, there will be changes in the specific implementation manners and application scopes. In summary, the content of this specification should not be construed as a limitation to the present application.
Claims
1. A heat conducting component, characterized in that, Applied to a food thermometer, the heat conduction component includes: A thermometer housing provided with a heat conduction tip; the heat conduction tip is used for plugging into food and conducting heat with the food; a receiving groove is provided in the thermometer housing; A thermometer circuit component disposed in the receiving groove and used for sensing the heat of the food received by the heat conduction tip; A heat conducting member disposed in the receiving groove, the heat conducting member wrapping part of the thermometer circuit component and contacting the inner side wall of the receiving groove to transfer the heat of the heat conduction tip and the heat of the thermometer circuit component to the outer side wall of the thermometer housing.
2. The heat conducting component according to claim 1, characterized in that, The heat conducting member fills the receiving groove, the heat conducting member is between the thermometer circuit component and the thermometer housing, and conducts heat between the thermometer circuit component and the thermometer housing.
3. The heat conduction component according to claim 2, characterized in that, The heat conducting member is made of heat conducting glue.
4. The heat conduction component according to claim 1, wherein The thermometer housing further has a housing main body, the housing main body is disposed on one side of the heat conduction tip, the housing main body is provided with the receiving groove, and bears the thermometer circuit component and the heat conducting member.
5. The heat conduction component according to claim 4, wherein The heat conduction tip is detachably connected to the housing main body, or The heat conduction tip is integrally connected to the housing main body.
6. The heat conducting component according to claim 4, characterized in that The housing main body is cylindrical, the housing main body is exposed to the external environment, and dissipates heat around in the circumferential direction of the housing main body.
7. The heat conducting component according to claim 1, wherein The thermometer circuit component includes a temperature-sensitive electronic device and a circuit board; The temperature-sensitive electronic device is close to the heat conduction tip and used for sensing the heat of the food received by the heat conduction tip; the circuit board is on one side of the temperature-sensitive electronic device and is electrically connected to the temperature-sensitive electronic device.
8. The heat conducting component according to claim 7, wherein The temperature-sensitive electronic device and the circuit board are both disposed in the receiving groove and are arranged along the length direction of the receiving groove.
9. The heat conduction component according to claim 8, characterized in that The heat conduction tip has an inner cavity, the inner cavity communicates with the receiving groove, the heat conducting member sequentially fills the inner cavity and the receiving groove, and wraps the temperature-sensitive electronic device and the circuit board.
10. A food thermometer, characterized in that, Including the heat conduction component according to any one of claims 1 to 9.