Switching value output matrix control device
By integrating the switching output matrix control device of the DO matrix module, touch screen, control module and current voltage monitoring module, the problems of low control accuracy and limited load capacity in the detection of the protection measurement and control device are solved, and accurate control and efficient detection of high-voltage and high-current tests are realized.
Patent Information
- Application Number
- CN202422493730.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-15
- Publication Date
- 2025-08-01
- Estimated Expiration
- 2034-10-15
AI Technical Summary
The prior art has problems such as low control accuracy, weak logic complexity processing capacity, high labor intensity and limited load capacity in the detection of protection measurement and control devices, which is difficult to meet the needs of high voltage and high current application scenarios.
A switching output matrix control device is designed, integrating DO matrix module, touch screen, control module, contactor module, power supply module and current voltage monitoring module. Complex logic judgment and precise current control are realized through multiple relays and drive control circuits, and combined with the touch screen to provide an intuitive operating interface, supporting high current and high voltage testing.
It realizes precise control of the complex logic judgment function of the protection measurement and control device, improves the accuracy, efficiency and flexibility of testing, adapts to high voltage and high current testing scenarios, and provides rich operating interfaces and user experience.
Smart Images

Figure CN223180593U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of switch quantity control equipment, in particular to a switch quantity output matrix control device. Background Art
[0002] Protection, measurement, and control devices (hereinafter referred to as the test sample) constitute ideal intelligent equipment for integrated automation systems in power plants, such as substations and power plants. They integrate multiple functions, including protection, measurement, control, monitoring, communication, event logging, fault recording, and error prevention. Complex logic judgment is the primary function of protection, measurement, and control devices. This complex logic is typically composed of multiple switching inputs, voltage analog inputs, and current analog inputs combined in different time sequences. The protection, measurement, and control device must perform corresponding actions based on this complex logic. Furthermore, according to the requirements of "GB / T 14598.2-2011 Measuring Relays and Protection Devices - Part 1: General Requirements," the contacts of the test relay (hereinafter referred to as the test sample) must be tested for both continuous and short-term current. The continuous current is 5A for a 2-hour test duration, while the short-term current is 30A for a 200-ms test duration. The test relay contacts must only conduct current and must not disconnect current. Current disconnection must be performed by the test equipment.
[0003] Currently, testing of protection and measurement and control devices is performed through manual switch controls. This method has the following disadvantages: 1. Low control accuracy: Manual operation cannot guarantee precise timing control, making it unsuitable for testing scenarios requiring millisecond-level response times. 2. Poor logic complexity handling capabilities: Manual switching cannot achieve fast and accurate transitions in complex logic state sequences, making it prone to errors. 3. High labor intensity: For repetitive testing, manual operation is time-consuming and inefficient. Another method for testing protection and measurement and control devices is to interact with a microcontroller via a touchscreen or host computer, and then control the relay module output through the microcontroller and driver circuits. This testing method has the following disadvantages: 1. It lacks sequence control functionality: Most devices cannot automatically execute multi-step control according to a preset logical sequence, thus limiting the flexibility of protection and measurement and control device testing. 2. It lacks an integrated current and voltage monitoring module, making it impossible to monitor the analog signal values of the controlled device in real time when connected to an external analog signal. 3. The human-computer interface is rudimentary, the user interface is not user-friendly, and user customization capabilities are limited, impacting user experience and testing efficiency.
[0004] For the detection of the contact closing current of the relay under test, it can also be detected by interacting with the single-chip microcomputer through the touch screen or the host computer, and then controlling the output of the relay module through the single-chip microcomputer and the drive circuit. However, in addition to the above-mentioned disadvantages, this method also has limited load capacity, does not integrate high-current and high-voltage contactors, and is only applicable to the small-current or signal control of the relay under test, which limits its use in high-voltage and high-current application scenarios.
[0005] Therefore, in view of the deficiencies of the existing technology, it is very necessary to provide a switching quantity output matrix control device to solve the deficiencies of the existing technology. Utility Model Content
[0006] The purpose of the present utility model is to provide a switching quantity output matrix control device to avoid the deficiencies of the existing technology. The switching quantity output matrix control device can control the switching quantity level analog quantity required for the complex logic judgment function of the protection and measurement and control device, and can also accurately control and monitor the contact closing current of the relay under test.
[0007] The above object of the present utility model is achieved by the following technical measures:
[0008] Provide a switching quantity output matrix control device, which is provided with a DO matrix module for detecting the complex logic judgment function and contact closing current of the sample under test, a touch screen for issuing control instructions and real-time displaying the test status and progress of the sample under test, a control module for controlling the operation of the DO matrix module according to the control instructions, a contactor module for expanding the load, a power supply module for supplying power to the entire switching quantity output matrix control device, and a current and voltage monitoring module for real-time monitoring of current and voltage signals. The DO matrix module is connected to the control module, the contactor module and the device under test, the touch screen is connected to the power supply module and the touch screen, the contactor module is connected to the power supply module, and the current and voltage monitoring module is connected to the power supply module.
[0009] Preferably, the above DO matrix module is provided with a plurality of relays and a plurality of drive control circuits for separately controlling the relays, and the number of relays is the same as the number of paths of the drive control circuits. Each relay and each path of the drive control circuit form a single-channel unit. The drive control circuit in each group of single-channel units is connected to the control module, and the relay is connected to the sample under test.
[0010] When the sample under test is the contact of the relay under test, the normally open contact of one relay in the DO matrix module is connected in series with the coil of the contactor module, and the normally open contact of another relay is connected in series with the coil of the relay under test.
[0011] When the device under test is a relay protection and control device under test and the DO matrix module is provided with 12 relays, the normally open contacts of one relay in the DO matrix module are respectively connected to the voltage input channel of the relay protection and control device under test and an external 70V voltage source, and the normally open contacts of another relay are respectively connected to the current input channel of the relay protection and control device under test and an external 1A current source, and the normally open contacts of the remaining 10 relays are respectively connected to the input channels.
[0012] Preferably, the power supply module is provided with a first power supply sub-module for supplying power to the control module, the touch screen and the current and voltage monitoring module, and a second power supply sub-module for supplying power to the contactor module and the relays in the DO matrix module.
[0013] When the device under test is the contact of the relay under test, the normally open contact of the contactor module is connected in series with the current monitoring module in the current and voltage monitoring module, an external load and the contact of the relay under test, and the voltage monitoring module in the current and voltage monitoring module is connected in parallel with the external system power supply.
[0014] Preferably, the contactor module is an AC contactor and a DC contactor. The AC contactor is detachably connected to the external AC power supply and the DO matrix module, and the DC contactor is detachably connected to the second power supply sub-module and the DO matrix module.
[0015] Each single-channel unit is provided with a relay J1, an optocoupler U0, a resistor R1 and a diode D1. The 1st pin of the relay J1 and the positive pole of the diode D1 are connected to the 24V power supply terminal. The 8th pin of the relay J1 and the negative pole of the diode D1 are connected to the 3rd pin of the optocoupler U0. The 1st pin of the optocoupler U0 is connected in series with the resistor R1 and connected to the chip U1 of the control module through the interface P13 of the control module. The 4th pin of the optocoupler U0 is connected to the V24GND terminal, and the 2nd pin of the optocoupler U0 is connected to the GND terminal.
[0016] In each single-channel unit, the 2nd, 3rd and 4th pins of the relay J1 or the 4th, 6th and 7th pins of the relay J1 are used as a group of connection interfaces, and each group of connection interfaces is connected to a banana socket.
[0017] Preferably, the AC contactor is detachably connected to the connection interface of one group of single-channel units; or the DC contactor is detachably connected to the connection interface of one group of single-channel units.
[0018] Preferably, the PC0 pin, PC1 pin, PC2 pin, PC3 pin, PA0 pin, PA1 pin, PA2 pin, PA3 pin, PA4 pin, PA5 pin, PA6 pin and PA7 pin in the chip U1 are respectively used to connect to 1 single-channel unit.
[0019] Preferably, the first power sub-module is a 5V / 24V power supply, and the second power sub-module is a 24V power supply.
[0020] Preferably, the control module is further provided with a transceiver U2, an interface J5, a capacitor C14, a capacitor C15, a capacitor C16, a capacitor C17, and a capacitor C22. The 11th pin of the transceiver U2 is connected to the PA9 pin of the chip U1, the 12th pin of the transceiver U2 is connected to the PA10 pin of the chip U1, the 7th pin of the transceiver U2 is connected to the 5th pin of the interface J5, the 8th pin of the transceiver U2 is connected to the 6th pin of the interface J5, the 13th pin of the transceiver U2 is connected to the 2nd pin of the interface J5, the 14th pin of the transceiver U2 is connected to the 1st pin of the interface J5, the 1st pin of the transceiver U2 is connected in series with the capacitor C16 and then connected to the 3rd pin, the 2nd pin of the transceiver U2 is connected in series with the capacitor C15 and grounded, the 4th pin of the transceiver U2 is connected in series with the capacitor C17 and then connected to the 5th pin, the 16th pin of the transceiver U2 is connected in series with the capacitor C14 and grounded, the 16th pin of the transceiver U2 is further connected to the 3V3 terminal, the 6th pin of the transceiver U2 is connected in series with the capacitor C22 and grounded, the 15th pin of the transceiver U2 is grounded, the 3rd pin of the interface J5 is connected to the 3rd pin of the interface DB9 of the touch screen, and the 4th pin of the interface J5 is connected to the 3rd pin of the interface DB9.
[0021] Preferably, the control module is provided with an interface J2, a capacitor C3, a capacitor C5, a resistor R2, a resistor R3, a resistor R5, a crystal oscillator X2, a switch S1 and a switch S2. The PD0 pin of the chip U1 is connected in series with the capacitor C3 to the ground. The PD0 pin of the chip U1 is also connected in series with the resistor R3 to the PD1 pin. The PD0 pin of the chip U1 is also connected in series with the crystal oscillator X2 to the PD1 pin. The PD1 pin of the chip U1 is connected in series with the capacitor C5 to the ground. The PB2 pin of the chip U1 is connected in series with the resistor R2 to the 2nd pin of the switch S2. The 1st pin of the switch S2 is connected to the 3V3 terminal. The 3rd pin of the switch S2 is grounded. The BOOT0 pin of the chip U1 is connected in series with the resistor R5 to the 2nd pin of the switch S1. The 1st pin of the switch S1 is connected to the 3V3 terminal. The 3rd pin of the switch S1 is grounded. The 13th pin of the chip U1 is connected to the VDDA terminal. The 12th, 18th, 31st, 47th, 63rd pins of the chip U1 are grounded. The PC0 pin of the chip U1 is connected to the 3rd pin of the interface J2. The PC1 pin of the chip U1 is connected to the 3rd pin of the interface J2. The PC2 pin of the chip U1 is connected to the 5th pin of the interface J2. The PC3 pin of the chip U1 is connected to the 6th pin of the interface J2. The PA0 pin of the chip U1 is connected to the 7th pin of the interface J2. The PA1 pin of the chip U1 is connected to the 8th pin of the interface J2. The PA2 pin of the chip U1 is connected to the 9th pin of the interface J2. The PA3 pin of the chip U1 is connected to the 10th pin of the interface J2. The PA4 pin of the chip U1 is connected to the 11th pin of the interface J2. The PA5 pin of the chip U1 is connected to the 12th pin of the interface J2. The PA6 pin of the chip U1 is connected to the 13th pin of the interface J2. The PA7 pin of the chip U1 is connected to the 14th pin of the interface J2. The PC4 pin of the chip U1 is connected to the 15th pin of the interface J2. The PC5 pin of the chip U1 is connected to the 16th pin of the interface J2. The PB0 pin of the chip U1 is connected to the 17th pin of the interface J2. The PB1 pin of the chip U1 is connected to the 18th pin of the interface J2. The PB2 pin of the chip U1 is connected to the 19th pin of the interface J2. The PB10 pin of the chip U1 is connected to the 20th pin of the interface J2. The PB11 pin of the chip U1 is connected to the 21st pin of the interface J2. The PB12 pin of the chip U1 is connected to the 22nd pin of the interface J2. The PB13 pin of the chip U1 is connected to the 23rd pin of the interface J2. The PB14 pin of the chip U1 is connected to the 24th pin of the interface J2. The PB15 pin of the chip U1 is connected to the 25th pin of the interface J2. The PC6 pin of the chip U1 is connected to the 26th pin of the interface J2. The PC7 pin of the chip U1 is connected to the 27th pin of the interface J2. The 7th pin of the chip U1 is connected to the 28th pin of the interface J2. The 29th pin of the interface J2 is grounded. The 30th pin of the interface J2 is connected to the 5V terminal.
[0022] A switching quantity output matrix control device of the present utility model is provided with a DO matrix module for detecting the complex logic judgment function of a measured sample and the contact closing current, a touch screen for sending control instructions and real-time displaying the test status and progress of the measured sample, a control module for controlling the operation of the DO matrix module according to the control instructions, a contactor module for expanding the load, a power supply module for supplying power to the entire switching quantity output matrix control device, and a current and voltage monitoring module for real-time monitoring of current and voltage signals. The DO matrix module is connected to the control module, the contactor module, and the device under test. The touch screen is connected to the power supply module and the touch screen. The contactor module is connected to the power supply module. The current and voltage monitoring module is connected to the power supply module. The beneficial effects of this switching quantity output matrix control device are as follows: 1. It can perform switching quantity-level analog control required for the complex logic judgment function of the protection measurement and control device, and can also accurately control and monitor the contact closing current of the measured relay. 2. The control module can control the DO matrix module, and the relays in the DO matrix module can be controlled individually, so as to be able to perform multi-state sequence control, meet the requirements of complex logic state transformation in automated testing, set parameters such as state sequence and time through the touch screen, reduce the manual operation burden and errors, avoid the time-consuming and laborious of a large number of repetitive manual tests, and improve the accuracy, efficiency, flexibility, and automation level of the test. 3. The present utility model can real-time monitor current and voltage by adding a current and voltage monitoring module, ensuring real-time feedback and safety during the test process. The addition of the current and voltage monitoring module makes the test more comprehensive, can immediately evaluate the performance of the device under test, and adapt to a wider range of test standards and requirements. 4. The present utility model integrates large-current AC and DC contactors, improves the load adaptability, can safely control and test devices with various current and voltage levels from low to high, meets the special requirements of high-voltage and large-current test scenarios, and solves the limitations of the prior art in high-power applications. 5. The touch screen can provide a rich and intuitive operation interface and set control instructions, such as state sequence, time interval, and number of cycles, significantly improving the user experience and the customization level of the test. Description of the Drawings
[0023] The present utility model will be further described with reference to the accompanying drawings, but the content in the drawings does not constitute any limitation to the present utility model.
[0024] Figure 1 It is a schematic structural diagram of the switching quantity output matrix control device.
[0025] Figure 2 It is a schematic diagram of the principle of the switching quantity output matrix control device.
[0026] Figure 3 It is a circuit diagram of each group of single-channel units.
[0027] Figure 4 Circuit diagram of chip U1 of the control module.
[0028] Figure 5 Circuit diagram of interface J2 of the control module.
[0029] Figure 6 Circuit diagram of the part for communicating with the touch screen in the control module.
[0030] Figure 7 Detection schematic diagram of the DO matrix module and the relay protection and measurement and control device under test in Embodiment 2.
[0031] Figure 8 Interface screenshot of the touch screen.
[0032] Figure 9 Program flow chart of Embodiment 2.
[0033] Figure 10 Detection schematic diagram of the contact closing current of the relay under test and the DO matrix module in Embodiment 2. Specific implementation mode
[0034] The technical solution of the present utility model will be further described in conjunction with the following embodiments.
[0035] Embodiment 1
[0036] A digital output matrix control device, as Figure 1 and Figure 2 shown, is provided with a DO matrix module for detecting the complex logic judgment function and contact closing current of the device under test, a touch screen for sending control instructions and real-time displaying the test status and progress of the device under test, a control module for controlling the operation of the DO matrix module according to the control instructions, a contactor module for expanding the load, a power supply module for supplying power to the entire digital output matrix control device, and a current and voltage monitoring module for real-time monitoring of the current and voltage signals of the power supply module. The DO matrix module is connected to the control module, the contactor module, and the device under test. The touch screen is connected to the power supply module and the touch screen. The contactor module is connected to the power supply module. The current and voltage monitoring module is connected to the power supply module.
[0037] It should be noted that the DO matrix module of the present utility model forms multiple state sequence control operations by setting multiple relays, thereby controlling the switch state of the relay under test. The control instructions are the state sequence, time parameters, and loop count parameters of the switch, and at the same time, the test status and progress are displayed in real time.
[0038] The power supply module is provided with a first power supply sub-module for supplying power to the control module, the touch screen and the current and voltage monitoring module, and a second power supply sub-module for supplying power to the relays in the contactor module and the DO matrix module. The first power supply sub-module is a 5V / 24V power supply, and the second power supply sub-module is a 24V power supply.
[0039] It should be noted that the power supply module adopts an efficient rectifier circuit to convert the commercial power AC220V into a stable DC 5V / 24V to provide a reliable power supply for the entire system. The chip U1 of the control module is an integrated microprocessor, which is responsible for receiving the instructions of the touch screen. After being processed by the programmed control algorithm, it can send accurate control signals to the DO matrix module, and monitor the system status in real time to realize data exchange with external devices. Among them, the chip U1 specifically selects the 32-bit ARM microcontroller of the STM32F series of STMicroelectronics, and its core is Cortex-M3, so that the control module can complete signal output and logic control. The control module of the present utility model is connected to its own interface through a 30-core, that is, the interface J2 and the interface of the DO matrix module, so as to realize power supply and control signal interaction.
[0040] The touch screen adopts a 7-inch four-wire resistive touch screen, which provides an intuitive operation interface. Users can easily set parameters such as status sequences, time, and number of cycles, and at the same time display the real-time test status and progress. The touch screen can support 100 status sequences. The resolution of the touch screen is 800×480, the power supply is DC6V~42V (with reverse power connection protection), the power consumption is 4.2W, and it has an SD card interface and a serial port.
[0041] The current and voltage monitoring module is used to monitor the amplitude of the analog quantity signal to be controlled in real time. The current monitoring range is 0~70A, the voltage monitoring range is 0~300V, and the accuracy is 1%.
[0042] The normally open contacts of the contactor module are connected in series with the current and voltage monitoring module, the external load and the relay to be measured.
[0043] The contactor module includes an AC contactor and a DC contactor. The AC contactor is detachably connected to the external AC power supply and the DO matrix module, and the DC contactor is detachably connected to the second power supply sub-module and the DO matrix module.
[0044] It should be noted that the contactor module of the present utility model integrates AC and DC contactors to meet the requirements of large current testing. Through the flexible series connection of relay contacts, the expansion and safety control of the load are realized. Among them, the AC contactor is three-phase, and the rated current can reach 65A; the rated current of the DC contactor can reach 500A.
[0045] The DO matrix module is provided with multiple relays and drive control circuits for separately controlling multiple relays. The number of relays is the same as the number of circuits of the drive control circuits. Each relay and each circuit of the drive control circuit form a set of single-channel units. The drive control circuit in each set of single-channel units is connected to the control module, and the relay is connected to the measured sample.
[0046] Since the DO matrix module of the present utility model is provided with multiple relays, complex logic judgment functions of the measured relay protection measurement and control device and detection of the contact closing current of the measured relay can be realized through different relays.
[0047] This embodiment is described by taking the DO matrix module with 12 relays and 12 circuits of drive control circuits as an example. That is, the DO matrix module of this embodiment has a total of 12 sets of single-channel units. At the same time, the 12 sets of single-channel units are respectively defined as DO1, DO2, DO3, DO4, DO5, DO6, DO7, DO8, DO9, DO10, DO11, and DO12. It should be noted that in addition to 12, the number of relays and drive control circuits can also be 4, 6, 7, 8, 10, 11, etc., which is specifically determined according to the actual situation.
[0048] It should be noted that through multiple relays, and each relay is configured with an independent drive control circuit, it is ensured that it can quickly respond according to instructions and accurately control the switch state. By separately controlling the closing or opening position of each relay, complex logic determination conditions are realized.
[0049] Such as Figure 3 , each set of single-channel units is provided with a relay J1, an optocoupler U0, a resistor R1, and a diode D1. The 1st pin of the relay J1 and the positive pole of the diode D1 are connected to the 24V power supply terminal. The 8th pin of the relay J1 and the negative pole of the diode D1 are connected to the 3rd pin of the optocoupler U0. The 1st pin of the optocoupler U0 is connected in series with the resistor R1 and connected to the chip U1 of the control module through the interface P13 of the control module. The 4th pin of the optocoupler U0 is connected to the V24GND terminal, and the 2nd pin of the optocoupler U0 is connected to the GND terminal. In each set of single-channel units, the 2nd, 3rd, and 4th pins of the relay J1 or the 4th, 6th, and 7th pins of the relay J1 are used as a set of connection interfaces, and each set of connection interfaces is connected to a banana socket. The AC contactor is detachably connected to the connection interface of one set of single-channel units; or the DC contactor is detachably connected to the connection interface of one set of single-channel units.
[0050] It should be noted that, according to the test requirements, either the AC contactor or the DC contactor is selectively connected to the DO matrix module. For example, when using the AC contactor, the DC contactor is not connected to the DO matrix module. When using the DC contactor, the AC contactor is not connected to the DO matrix module.
[0051] In the DO matrix module of the present utility model, the relays of each group of single-channel units are each equipped with an independent drive control circuit, ensuring fast response according to instructions and precise control of the switch state. Moreover, an optocoupler is used as the drive of the relay module in each group of single-channel units, achieving electrical isolation between the input and output circuits. The optocoupler can achieve a response time at the microsecond level and has a high resistance to external electromagnetic interference, ensuring the accuracy of signal transmission. The excitation voltage of the relay coil is 24V DC, and it has one normally open and one normally closed contact. The power consumption is about 0.53W, the withstand voltage between the coil contacts is 5000V, the withstand impulse voltage is 10000V, and the rated energizing current is 10A. The model of the optocoupler U0 is Optoisolator1.
[0052] The connection interface between the AC contactor and one group of single-channel units is detachably connected; or the connection interface between the DC contactor and one group of single-channel units is detachably connected.
[0053] The PC0 pin, PC1 pin, PC2 pin, PC3 pin, PA0 pin, PA1 pin, PA2 pin, PA3 pin, PA4 pin, PA5 pin, PA6 pin, and PA7 pin in the chip U1 are respectively used to connect to 1 single-channel unit. For example, the PC0 pin is connected to DO1, the PC1 pin is connected to DO2, the PC2 pin is connected to DO3, the PC3 pin is connected to DO4, the PA0 pin is connected to DO5, the PA1 pin is connected to DO6, the PA2 pin is connected to DO7, the PA3 pin is connected to DO8, the PA4 pin is connected to DO9, the PA5 pin is connected to DO10, the PA6 pin is connected to DO11, and the PA7 pin is connected to DO12.
[0054] Such as Figure 4 and Figure 5, the control module is provided with an interface J2, a capacitor C3, a capacitor C5, a resistor R2, a resistor R3, a resistor R5, a crystal oscillator X2, a switch S1 and a switch S2. The PD0 pin of the chip U1 is connected to the ground in series with the capacitor C3. The PD0 pin of the chip U1 is also connected to the PD1 pin in series with the resistor R3. The PD0 pin of the chip U1 is also connected to the PD1 pin in series with the crystal oscillator X2. The PD1 pin of the chip U1 is connected to the ground in series with the capacitor C5. The PB2 pin of the chip U1 is connected to the 2nd pin of the switch S2 in series with the resistor R2. The 1st pin of the switch S2 is connected to the 3V3 terminal. The 3rd pin of the switch S2 is grounded. The BOOT0 pin of the chip U1 is connected to the 2nd pin of the switch S1 in series with the resistor R5. The 1st pin of the switch S1 is connected to the 3V3 terminal. The 3rd pin of the switch S1 is grounded. The 13th pin of the chip U1 is connected to the VDDA terminal. The 12th, 18th, 31st, 47th, 63rd pins of the chip U1 are grounded. The PC0 pin of the chip U1 is connected to the 3rd pin of the interface J2. The PC1 pin of the chip U1 is connected to the 3rd pin of the interface J2. The PC2 pin of the chip U1 is connected to the 5th pin of the interface J2. The PC3 pin of the chip U1 is connected to the 6th pin of the interface J2. The PA0 pin of the chip U1 is connected to the 7th pin of the interface J2. The PA1 pin of the chip U1 is connected to the 8th pin of the interface J2. The PA2 pin of the chip U1 is connected to the 9th pin of the interface J2. The PA3 pin of the chip U1 is connected to the 10th pin of the interface J2. The PA4 pin of the chip U1 is connected to the 11th pin of the interface J2. The PA5 pin of the chip U1 is connected to the 12th pin of the interface J2. The PA6 pin of the chip U1 is connected to the 13th pin of the interface J2. The PA7 pin of the chip U1 is connected to the 14th pin of the interface J2. The PC4 pin of the chip U1 is connected to the 15th pin of the interface J2. The PC5 pin of the chip U1 is connected to the 16th pin of the interface J2. The PB0 pin of the chip U1 is connected to the 17th pin of the interface J2. The PB1 pin of the chip U1 is connected to the 18th pin of the interface J2. The PB2 pin of the chip U1 is connected to the 19th pin of the interface J2. The PB10 pin of the chip U1 is connected to the 20th pin of the interface J2. The PB11 pin of the chip U1 is connected to the 21st pin of the interface J2. The PB12 pin of the chip U1 is connected to the 22nd pin of the interface J2. The PB13 pin of the chip U1 is connected to the 23rd pin of the interface J2. The PB14 pin of the chip U1 is connected to the 24th pin of the interface J2. The PB15 pin of the chip U1 is connected to the 25th pin of the interface J2. The PC6 pin of the chip U1 is connected to the 26th pin of the interface J2. The PC7 pin of the chip U1 is connected to the 27th pin of the interface J2. The 7th pin of the chip U1 is connected to the 28th pin of the interface J2. The 29th pin of the interface J2 is grounded. The 30th pin of the interface J2 is connected to the 5V terminal.
[0055] Such as Figure 6, the control module is also provided with a transceiver U2, an interface J5, a capacitor C14, a capacitor C15, a capacitor C16, a capacitor C17 and a capacitor C22. The 11th pin of the transceiver U2 is connected to the PA9 pin of the chip U1, the 12th pin of the transceiver U2 is connected to the PA10 pin of the chip U1, the 7th pin of the transceiver U2 is connected to the 5th pin of the interface J5, the 8th pin of the transceiver U2 is connected to the 6th pin of the interface J5, the 13th pin of the transceiver U2 is connected to the 2nd pin of the interface J5, the 14th pin of the transceiver U2 is connected to the 1st pin of the interface J5, the 1st pin of the transceiver U2 is connected in series with the capacitor C16 and then connected to the 3rd pin, the 2nd pin of the transceiver U2 is connected in series with the capacitor C15 and grounded, the 4th pin of the transceiver U2 is connected in series with the capacitor C17 and then connected to the 5th pin, the 16th pin of the transceiver U2 is connected in series with the capacitor C14 and grounded, the 16th pin of the transceiver U2 is also connected to the 3V3 terminal, the 6th pin of the transceiver U2 is connected in series with the capacitor C22 and grounded, the 15th pin of the transceiver U2 is grounded, the 3rd pin of the interface J5 is connected to the 3rd pin of the interface DB9 of the touch screen, and the 4th pin of the interface J5 is connected to the 3rd pin of the interface DB9.
[0056] Description of the connection between the control module and the touch screen: After level conversion through the transceiver U2 of model SP3232E, the 1st and 2nd pins of the interface J5 are then connected to the PA9 and PA10 pins of the chip U1. Use a jumper to short-circuit the 1st pin and the 3rd pin of the interface J5, and use a jumper to short-circuit the 2nd pin and the 4th pin of the interface J5. At the same time, the 3rd pin of the interface J5 is connected to the 2nd pin of the interface DB9, and the 4th pin of the interface J5 is connected to the 3rd pin of the interface DB9, so that the control module can interact with the 232 communication port of the touch screen through the interface DB9.
[0057] The model of the chip U1 is a 32-bit ARM microcontroller of the STM32F series; the model of the transceiver U2 is SP3232E; the touch screen is a 7-inch four-wire resistive touch screen interface.
[0058] The beneficial effects of the digital output matrix control device are as follows: 1. It can control the switch quantity and analog quantity required for the complex logic judgment function of the protection and measurement control device, and can also accurately control and monitor the contact closing current of the measured relay. 2. The control module can control the DO matrix module, and the relays in the DO matrix module can be controlled individually, so as to be able to perform multi-state sequence control, meet the complex logic state transformation requirements in automated testing, set parameters such as state sequence and time through the touch screen, reduce the burden and errors of manual operation, avoid the time-consuming and laborious of a large number of repetitive manual tests, and improve the accuracy, efficiency, flexibility and automation level of the test. 3. The present utility model can monitor the current and voltage in real time by adding a current and voltage monitoring module, ensuring real-time feedback and safety during the test process. The addition of the current and voltage monitoring module makes the test more comprehensive, can immediately evaluate the performance of the device under test, and adapt to a wider range of test standards and requirements. 4. The present utility model integrates high-current AC and DC contactors, improves the load adaptability, can safely control and test equipment with various current and voltage levels from low to high, meets the special requirements of high-voltage and high-current test scenarios, and solves the limitations of the prior art in high-power applications. 5. The touch screen can provide a rich and intuitive operation interface. Control instructions such as state sequence, time interval and cycle times can be set through the touch screen, significantly improving the user experience and the customization level of the test.
[0059] Embodiment 2
[0060] A digital output matrix control device as in Embodiment 1, with other features the same as those in Embodiment 1, and further having the following features: when the device under test is a measured relay protection and measurement control device and the DO matrix module is provided with 12 relays, the normally open contacts of one relay in the DO matrix module are respectively connected to the voltage input channel of the measured relay protection and measurement control device and an external 70V voltage source, the normally open contacts of another relay are respectively connected to the current input channel of the measured relay protection and measurement control device and an external 1A current source, and the normally open contacts of the remaining 10 relays are respectively connected to the input channels.
[0061] Such as Figure 7 , the normally open contacts of 12 relays are all connected to the measured relay protection and measurement control device, among which the normally open contacts of 10 relays are respectively connected to the input channels of the measured relay protection and measurement control device, the normally open contacts of another 1 relay are respectively connected to the voltage input channel of the measured relay protection and measurement control device and an external 70V voltage source, and the normally open contacts of the last 1 relay are respectively connected to the current input channel of the measured relay protection and measurement control device and an external 1A current source. The external 1A current source is composed of a 70V voltage source and a resistor.
[0062] Among them, the interface of the touch screen of the present utility model is as Figure 8As shown, 5 switch states are displayed on a single page, with a total of 20 pages, supporting 100 switch states. Each state can simultaneously control 12 relay digital outputs (abbreviated as "outputs"), and each output can be set to "actuate" and "release". The "duration" consists of two parts: "value" and "unit". The value range is 0 to 60000. When set to 0, this state is regarded as an invalid state during multi-state cyclic execution. When in single-state static output, the "duration" can be set to 0. The unit can be set to "s" and "ms". Multi-state cyclic execution: The default value of the "duration" for 100 states is 0. Set the "duration" of the state to be executed to a non-zero value, set the "number of cycles", and click the "Start" button to execute cyclically. During execution, you can click the "Pause" button to pause the cycle, click the "Start" button to continue execution, or click the "Stop" button to terminate the cyclic execution. Single-state static output: Set the state number (non-zero value) for static output, and click the "Static Output" button. Click the "Stop" button to end the static output. At this time, the "Pause" button is in a gray and invalid state. Current count: Displays the current number of executed cycles. Current state: Displays the current state number being executed.
[0063] Implementation of the logical determination conditions of the digital output matrix control device:
[0064] Suppose the relay protection and measurement control device under test needs to detect the following 6 logical conditions in sequence before it can respond, as shown in Table 1.
[0065] Table 1. Logical determination content in different logical sequences
[0066]
[0067]
[0068] For the implementation solution of the above logical determination, the normally open contacts of DO1 to DO10 in Embodiment 1 are used to simulate Switch 1 to Switch 10. The normally open contact of DO11 is connected in series with a 70V voltage source to control voltage output, and the normally open contact of DO12 is connected in series with a 1A current source (formed by connecting a voltage source in series with a load) to control current output. The logical conditions required by the relay protection and measurement control device under test are achieved through the state sequences in Table 2.
[0069] Table 2. Action content of 12 single channels in different state sequences
[0070] Status sequence Status content 1 DO1 and DO2 act, DO3 to DO12 are released, and the status duration is 10 s. 2 DO3 and DO11 act, the rest of the DOs are released, and the status duration is 1 s. 3 DO4 and DO12 act, the rest of the DOs are released, and the status duration is 500 ms. 4 DO5 acts, the rest of the DOs are released, and the status duration is 10 ms. 5 DO1 to DO10 all act, the rest of the DOs are released, and the status duration is 20 ms. 6 DO1 to DO12 are all released, and the status duration is 20 ms.
[0071] The program flow chart of the complex logical judgment function in this embodiment is as Figure 9 shown.
[0072] This embodiment is based on a DO matrix module with 12 relays and a touch screen, thus supporting the control of 100 state sequences. It can output complex digital quantity states by itself and, in cooperation with current and voltage sources, can also output complex analog quantity states. It can not only simulate the complex logic judgment conditions of measurement and control devices, but also easily set parameters such as state sequences and time through the touch screen, reducing human operation errors and improving the accuracy and efficiency of testing.
[0073] Embodiment 3
[0074] A digital quantity output matrix control device as in Embodiment 1, with other features the same as those in Embodiment 1, and further having the following features: When the sample under test is the contact of the relay under test, when the sample under test is the contact of the relay under test, the normally open contact of the contactor module is connected in series with the current monitoring module in the current and voltage monitoring module, the external load, and the contact of the relay under test, and the voltage monitoring module in the current and voltage monitoring module is connected in parallel with the external system power supply. Moreover, among the 12 relays, the normally open contact of one relay in the DO matrix module is connected in series with the coil of the contactor module, and the normally open contact of another relay is connected in series with the coil of the relay under test.
[0075] The realization of the contact current detection of the relay under test in this embodiment is as Figure 9 , and the control principle description of the contact current detection of the relay under test: The voltage monitoring module in the current and voltage monitoring module is connected in parallel with the external system power supply. One group of single-channel units, such as DO1, and the normally open contact K11 of DO1 is connected in series with the control coil of the contactor module, thereby driving the contact state of the contactor module. Another group of single-channel units, such as DO2, and the normally open contact K21 of DO2 is connected in series with the coil control circuit of the relay under test, thereby driving the contact of the relay under test. The normally open contact K1 of the contactor module is connected in series with the current monitoring module in the current and voltage monitoring module, the external load, and the contact of the relay under test. In Figure 9 , the components within the dashed box are external components.
[0076] State 1: DO1 operates, the normally open contact (K11) of DO1 closes, the contactor coil is excited, and the normally open contact K1 of the contactor closes; DO2 releases.
[0077] State 2: DO1 operates; DO2 operates, the normally open contact (K21) of DO2 closes, the coil of the relay under test is excited, and the contact of the relay under test closes to conduct current. The duration of State 2 is the duration of the on-current required for detection.
[0078] State 3: DO1 releases, K11 disconnects, the contactor coil loses magnetism, the normally open contact K1 of the contactor disconnects, cutting off the load; DO2 operates, the normally open contact (K21) of DO2 closes, and the contact of the relay under test remains closed.
[0079] Status 4: DO2 is released, the normally open contact (K21) of DO2 is disconnected, the coil of the relay under test demagnetizes, and the contacts of the relay under test are disconnected, without having to bear the breaking current.
[0080] It should be noted that the other 11 single-channel units of the DO matrix module, such as DO1 - DO12, are not directly connected to the contactor module, and DO1 - DO12 are connected externally through test wires. The relay under test is divided into two parts: contacts and coil. When the coil is excited, the corresponding normally open contact closes; when the coil demagnetizes, the corresponding normally open contact disconnects. The purpose of the test is to measure the short-time and continuous closing currents of the contact part. When DO1 controls the excitation of the coil of the relay under test, DO3 - DO12 do not participate in the test of the relay under test.
[0081] The digital output matrix control device of this embodiment can also accurately detect the closing current of the relay contacts, providing an efficient test tool for the performance inspection of power system protection and measurement and control devices.
[0082] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention rather than to limit the protection scope of the present invention. Although the present invention has been described in detail with reference to the preferred embodiments, those of ordinary skill in the art should understand that the technical solutions of the present invention can be modified or equivalently replaced without departing from the essence and scope of the technical solutions of the present invention.
Claims
1. A switching quantity output matrix control device, characterized in that: There is a DO matrix module for detecting the complex logic judgment function and contact closing current of the sample under test, a touch screen for sending control instructions and real-time displaying the test status and progress of the sample under test, a control module for controlling the operation of the DO matrix module according to the control instructions, a contactor module for expanding the load, a power supply module for supplying power to the entire digital output matrix control device, and a current and voltage monitoring module for real-time monitoring of current and voltage signals. The DO matrix module is connected to the control module, the contactor module, and the device under test. The touch screen is connected to the power supply module and the touch screen. The contactor module is connected to the power supply module. The current and voltage monitoring module is connected to the power supply module.
2. The switching quantity output matrix control device according to claim 1, characterized in that: The DO matrix module is provided with a plurality of relays and a plurality of drive control circuits for individually controlling the relays. The number of relays is the same as the number of drive control circuits. Each relay and each drive control circuit form a single-channel unit. The drive control circuit in each single-channel unit is connected to the control module, and the relay is connected to the sample under test.
3. The switching quantity output matrix control device according to claim 2, wherein: When the sample under test is the contact of the relay under test, the normally open contact of one relay in the DO matrix module is connected in series with the coil of the contactor module, and the normally open contact of another relay is connected in series with the coil of the relay under test.
4. The switching quantity output matrix control device according to claim 2, wherein: When the sample under test is the relay protection measurement and control device under test and the DO matrix module is provided with 12 relays, the normally open contact of one relay in the DO matrix module is respectively connected to the voltage input channel of the relay protection measurement and control device under test and the external 70V voltage source, and the normally open contact of another relay is respectively connected to the current input channel of the relay protection measurement and control device under test and the external 1A current source. The normally open contacts of the remaining 10 relays are respectively connected to the input channels.
5. The switching quantity output matrix control device according to any one of claims 2 to 4, characterized in that: The power supply module is provided with a first power supply sub-module for supplying power to the control module, the touch screen, and the current and voltage monitoring module, and a second power supply sub-module for supplying power to the contactor module and the relays in the DO matrix module. When the sample under test is the contact of the relay under test, the normally open contact of the contactor module is connected in series with the current monitoring module in the current and voltage monitoring module, the external load, and the contact of the relay under test. The voltage monitoring module in the current and voltage monitoring module is connected in parallel with the external system power supply.
6. The switching quantity output matrix control device according to claim 5, characterized in that: The contactor module is an AC contactor and a DC contactor. The AC contactor is detachably connected to the external AC power supply and the DO matrix module. The DC contactor is detachably connected to the second power supply sub-module and the DO matrix module.
7. The switching quantity output matrix control device according to claim 6, characterized in that: Each single-channel unit is provided with a relay J1, an optocoupler U0, a resistor R1, and a diode D1. The 1st pin of the relay J1 and the positive pole of the diode D1 are connected to the 24V power supply terminal. The 8th pin of the relay J1 and the negative pole of the diode D1 are connected to the 3rd pin of the optocoupler U0. The 1st pin of the optocoupler U0 is connected in series with the resistor R1 and connected to the chip U1 of the control module through the interface P13 of the control module. The 4th pin of the optocoupler U0 is connected to the V24GND terminal, and the 2nd pin of the optocoupler U0 is connected to the GND terminal. In each group of single-channel units, pins 2, 3, and 4 of relay J1 or pins 4, 6, and 7 of relay J1 are used as a group of connection interfaces, and each group of connection interfaces is connected to a banana socket; The AC contactor is detachably connected to the connection interface of one group of single-channel units; or the DC contactor is detachably connected to the connection interface of one group of single-channel units.
8. The switching quantity output matrix control device according to claim 7, characterized in that: Pins PC0, PC1, PC2, PC3, PA0, PA1, PA2, PA3, PA4, PA5, PA6, and PA7 in chip U1 are respectively used to connect to 1 single-channel unit; The first power supply sub-module is a 5V / 24V power supply, and the second power supply sub-module is a 24V power supply.
9. The switching quantity output matrix control device according to claim 8, characterized in that: The control module is further provided with transceiver U2, interface J5, capacitor C14, capacitor C15, capacitor C16, capacitor C17, and capacitor C22. Pin 11 of transceiver U2 is connected to pin PA9 of chip U1, pin 12 of transceiver U2 is connected to pin PA10 of chip U1, pin 7 of transceiver U2 is connected to pin 5 of interface J5, pin 8 of transceiver U2 is connected to pin 6 of interface J5, pin 13 of transceiver U2 is connected to pin 2 of interface J5, pin 14 of transceiver U2 is connected to pin 1 of interface J5, pin 1 of transceiver U2 is connected in series with capacitor C16 and then connected to pin 3, pin 2 of transceiver U2 is connected in series with capacitor C15 and grounded, pin 4 of transceiver U2 is connected in series with capacitor C17 and then connected to pin 5, pin 16 of transceiver U2 is connected in series with capacitor C14 and grounded, pin 16 of transceiver U2 is also connected to the 3V3 terminal, pin 6 of transceiver U2 is connected in series with capacitor C22 and grounded, pin 15 of transceiver U2 is grounded, pin 3 of interface J5 is connected to pin 3 of interface DB9 of the touch screen, and pin 4 of interface J5 is connected to pin 3 of interface DB9.
10. The switching quantity output matrix control device according to claim 9, characterized in that: The control module is provided with an interface J2, a capacitor C3, a capacitor C5, a resistor R2, a resistor R3, a resistor R5, a crystal oscillator X2, a switch S1 and a switch S2. The PD0 pin in the chip U1 is connected to the ground in series with the capacitor C3. The PD0 pin in the chip U1 is also connected to the PD1 pin in series with the resistor R3. The PD0 pin in the chip U1 is also connected to the PD1 pin in series with the crystal oscillator X2. The PD1 pin in the chip U1 is connected to the ground in series with the capacitor C5. The PB2 pin in the chip U1 is connected to the 2nd pin of the switch S2 in series with the resistor R2. The 1st pin of the switch S2 is connected to the 3V3 terminal. The 3rd pin of the switch S2 is grounded. The BOOT0 pin in the chip U1 is connected to the 2nd pin of the switch S1 in series with the resistor R5. The 1st pin of the switch S1 is connected to the 3V3 terminal. The 3rd pin of the switch S1 is grounded. The 13th pin in the chip U1 is connected to the VDDA terminal. The 12th pin, 18th pin, 31st pin, 47th pin, 63rd pin in the chip U1 are grounded. The PC0 pin of the chip U1 is connected to the 3rd pin of the interface J2. The PC1 pin of the chip U1 is connected to the 3rd pin of the interface J2. The PC2 pin of the chip U1 is connected to the 5th pin of the interface J2. The PC3 pin of the chip U1 is connected to the 6th pin of the interface J2. The PA0 pin of the chip U1 is connected to the 7th pin of the interface J2. The PA1 pin of the chip U1 is connected to the 8th pin of the interface J2. The PA2 pin of the chip U1 is connected to the 9th pin of the interface J2. The PA3 pin of the chip U1 is connected to the 10th pin of the interface J2. The PA4 pin of the chip U1 is connected to the 11th pin of the interface J2. The PA5 pin of the chip U1 is connected to the 12th pin of the interface J2. The PA6 pin of the chip U1 is connected to the 13th pin of the interface J2. The PA7 pin of the chip U1 is connected to the 14th pin of the interface J2. The PC4 pin of the chip U1 is connected to the 15th pin of the interface J2. The PC5 pin of the chip U1 is connected to the 16th pin of the interface J2. The PB0 pin of the chip U1 is connected to the 17th pin of the interface J2. The PB1 pin of the chip U1 is connected to the 18th pin of the interface J2. The PB2 pin of the chip U1 is connected to the 19th pin of the interface J2. The PB10 pin of the chip U1 is connected to the 20th pin of the interface J2. The PB11 pin of the chip U1 is connected to the 21st pin of the interface J2. The PB12 pin of the chip U1 is connected to the 22nd pin of the interface J2. The PB13 pin of the chip U1 is connected to the 23rd pin of the interface J2. The PB14 pin of the chip U1 is connected to the 24th pin of the interface J2. The PB15 pin of the chip U1 is connected to the 25th pin of the interface J2. The PC6 pin of the chip U1 is connected to the 26th pin of the interface J2. The PC7 pin of the chip U1 is connected to the 27th pin of the interface J2. The 7th pin of the chip U1 is connected to the 28th pin of the interface J2. The 29th pin of the interface J2 is grounded. The 30th pin of the interface J2 is connected to the 5V terminal.