Structure for protecting solder paste to be clean

Abstract

The utility model discloses a structure for protecting solder paste to be clean, which comprises a solder paste tank, an outer cover is sleeved at the upper end of the solder paste tank in a threaded manner, an inner cover is arranged in an inner cavity of the solder paste tank, the surface of the inner cover is matched with the inner cavity of the solder paste tank, the surface of the middle of the inner cover integrally extends upwards to form a discharge nozzle, and the discharge nozzle is communicated with the inner cover. The utility model relates to the technical field of solder paste tanks. According to the structure for protecting the solder paste to be clean, by optimizing the inner cover of the solder paste tank, the solder paste does not make contact with other components except the solder paste tank when the solder paste is taken, the solder paste is protected to be clean and free of pollution, the material taking component does not need to be cleaned, and the production time is saved.

Description

Technical Field

[0001] The utility model relates to the technical field of solder paste cans, in particular to a structure for protecting solder paste from being dirty. Background Art

[0002] Solder paste is the material used to solder electronic components onto circuit boards. Before soldering, it must be printed onto the circuit board using a printing machine. Solder paste is stored in a canister, and before printing, it must be removed from the canister for later use.

[0003] There are many types of solder paste. Different types of solder paste differ in material composition, particle size, viscosity, etc. Different types of solder paste cannot be mixed together, otherwise the performance of the solder paste will be reduced and the subsequent welding quality will be affected.

[0004] To remove solder paste from existing solder paste cans, you first open the outer lid, then remove the inner lid. Then, the dispensing component reaches into the can to remove the paste. During this process, some solder paste adheres to the dispensing component. When other types of solder paste are dispensed, the newly replaced solder paste mixes with the solder paste adhered to the dispensing component, contaminating the newly replaced solder paste and reducing its performance. To ensure the cleanliness of the solder paste, the dispensing component must be cleaned before each solder paste change. However, solder paste has a high degree of adhesion, making cleaning difficult and potentially incomplete. Furthermore, cleaning takes up production time, increasing production cycle times. Utility Model Content

[0005] In response to the deficiencies in the prior art, the utility model provides a structure for protecting solder paste from being dirty, which solves the problem that in order to ensure the cleanliness of solder paste when taking it, the material taking parts must be cleaned before each solder paste change, and the solder paste has a relatively large adhesion, making cleaning difficult, and there is a possibility of incomplete cleaning. In addition, cleaning takes up production time, increasing the production rhythm.

[0006] To achieve the above objectives, the present invention is implemented through the following technical solutions: a structure for protecting solder paste from being dirty, comprising a solder paste can, wherein an outer cover is threadedly sleeved on the upper end of the solder paste can, and an inner cover is provided in the inner cavity of the solder paste can.

[0007] The surface of the inner cover matches the inner cavity of the solder paste can, and a discharge nozzle is integrally extended upward from the middle surface of the inner cover, and the discharge nozzle is communicated with the inner cover.

[0008] Preferably, the inner cover is U-shaped.

[0009] Preferably, a limiting ring is integrally extended outward from the surface of the upper end of the solder paste can.

[0010] Preferably, the bottom of the outer cover and the limiting ring abut against each other.

[0011] Preferably, a groove is provided on the top of the outer cover.

[0012] The utility model provides a structure for protecting solder paste from being dirty. Compared with the prior art, it has the following advantages:

[0013] Beneficial effects:

[0014] 1. The structure for protecting the cleanliness of solder paste is realized by optimizing the inner cover of the solder paste tank. When taking out the solder paste, the solder paste does not come into contact with other parts except the solder paste tank, thus protecting the cleanliness of the solder paste and preventing pollution. There is no need to clean the material taking parts, thus saving production time.

[0015] 2. The structure of the solder paste cleaning protection device is simple in structure. The function of protecting the solder paste from being dirty can be achieved by simply optimizing the structure of the inner cover, and the cost is low.

[0016] 3. The structure of protecting the solder paste from being dirty makes it easy to replace the solder paste can and easy to use. The solder paste can be directly taken out by unscrewing the outer cover. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic diagram of the structure of the utility model;

[0018] Figure 2 This is a cross-sectional view of the structure of the utility model.

[0019] In the figure: 1. Outer cover; 2. Inner cover; 3. Solder paste can; 4. Discharge nozzle. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0021] See also Figure 1-2 The utility model provides a technical solution: a structure for protecting solder paste from being dirty, comprising a solder paste tank 3, an outer cover 1 being threadedly sleeved on the upper end of the solder paste tank 3, a limiting ring being integrally extended outward from the surface of the upper end of the solder paste tank 3, the bottom of the outer cover 1 abutting against the limiting ring, wherein the limiting ring plays a limiting role, and a groove is provided on the top of the outer cover 1, and the groove is used to optimize the appearance of the outer cover 1.

[0022] The inner cavity of the solder paste can 3 is provided with an inner cover 2, the surface of the inner cover 2 is consistent with the inner cavity of the solder paste can 3, and the middle surface of the inner cover 2 is integrally extended upward with a discharge nozzle 4, and the discharge nozzle 4 is connected to the inner cover 2. The inner cover 2 is U-shaped, and the U-shape can better squeeze the solder paste. When installing the inner cover 2, it is necessary to first load the solder paste into the inner cavity of the solder paste can 3, and then put the inner cover 2 along with the inner wall of the solder paste can 3 and press it against the surface of the solder paste.

[0023] When in use, to take solder paste, unscrew the outer cover 1 without taking out the inner cover 2. There is a discharge nozzle 4 on the inner cover 2. The outer wall of the inner cover 2 is close to the inner wall of the solder paste tank 3 and can move up and down in the solder paste tank 3. When taking material, the taking part contacts the inner cover 2 and extends into the solder paste tank 3. The inner cover 2 is squeezed toward the inside of the solder paste tank 3. At this time, the solder paste will flow out from the discharge nozzle 4 of the inner cover 2. During the taking process, the solder paste will not contact other parts except the solder paste tank 3 itself, ensuring the cleanliness and pollution-free of the solder paste, and realizing the no-cleaning of the taking part.

[0024] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "include," "comprise," or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article, or device that includes a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. In the absence of further limitations. The phrase "includes an element defined by..." does not exclude the presence of other identical elements in the process, method, article, or device that includes the element.

[0025] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A structure for protecting solder paste from being dirty, comprising a solder paste tank (3), characterized in that: The upper end of the solder paste tank (3) is threadedly sleeved with an outer cover (1), and the inner cavity of the solder paste tank (3) is provided with an inner cover (2); The surface of the inner cover (2) matches the inner cavity of the solder paste can (3), and a discharge nozzle (4) is integrally extended upward from the middle surface of the inner cover (2), and the discharge nozzle (4) and the inner cover (2) are connected to each other.

2. The structure for protecting solder paste from being clean according to claim 1, characterized in that: The inner cover (2) is U-shaped.

3. The structure for protecting solder paste from being cleaned according to claim 1, characterized in that: The surface of the upper end of the solder paste tank (3) is integrally provided with a limiting ring extending outward.

4. The structure for protecting solder paste from being cleaned according to claim 3, characterized in that: The bottom of the outer cover (1) abuts against the limiting ring.

5. The structure for protecting solder paste from being cleaned according to claim 3, characterized in that: The top of the outer cover (1) is provided with a groove.

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