Automatic laser processing machine for glass micropores

Abstract

The utility model discloses an automatic laser processing machine for glass micropores, which mainly solves the problems of low efficiency and poor quality of existing glass drilling. The machining machine comprises an AGV feeding set, a feeding mechanism, a machining platform, a discharging mechanism and an AGV discharging set which are sequentially connected. The AGV is used for conveying a stack of trays (containing products) to the feeding suction position, the feeding robot sucks the products and places the products on the machining platform, the empty tray mechanical arm conveys the empty trays to the discharging position, after a certain number of trays are stacked, the empty trays are carried away through the AGV, the next circulation is conducted, unmanned machining is achieved in the whole process, the machining efficiency is high, and the product quality is stable. After punching machining of glass is completed on the machining platform 3, a discharging robot sucks a product into a discharging position empty disc, a customized suction cup is adopted, the glass can be sucked stably, and the product cannot be damaged due to too large pressure. And meanwhile, after a certain number of trays are stacked, the trays are carried away by the AGV, the next circulation is carried out, and unmanned machining is achieved in the whole process.

Description

Technical Field

[0001] The utility model belongs to the technical field of glass processing, and specifically relates to an automatic laser processing machine for glass micro-holes. Background Art

[0002] In the advanced packaging field, silicon-based interposer integration technology, as a leading system integration technology, has experienced rapid development in recent years. However, silicon-based interposers present two major challenges: 1) high cost. Through-silicon vias (TSVs) are fabricated using a silicon etching process, which subsequently requires an oxide insulating layer and thin wafers. 2) poor electrical performance. Silicon is a semiconductor material, and when transmitting signals through transmission lines, there is strong electromagnetic coupling between the signal and the substrate material, generating eddy currents in the substrate and resulting in poor signal integrity (insertion loss, crosstalk, etc.). As a possible alternative to silicon-based interposers, through-glass via (TGV) interposers are currently a popular technology.

[0003] Existing glass drilling methods mainly include mechanical drilling and laser drilling. Laser drilling is widely used due to its unique characteristics such as non-contact, no edge collapse, and ability to process precise micro-holes. However, the currently mature laser drilling technology has a large thermal impact around the processed holes, and it needs to go through cleaning, etching and other process flows before it can be strengthened. In addition, the size of the holes is limited (only micro-holes with a diameter of ≥25μm can be processed), which cannot increase the utilization rate of the product. Laser etching is currently the fastest method for deep hole etching in TGV manufacturing. The basic principle of laser etching glass is that the atoms of the glass substrate produce high-frequency oscillations and rapidly heat up under the excitation of the laser. When their energy exceeds the atomic bond energy, the atoms detach from the substrate and are burned and volatilized. Laser etching does not require a mask, so the relevant process can be omitted, reducing manufacturing costs. Laser etching can naturally form deep holes with a certain inclination angle, which is conducive to the subsequent filling of metal in deep holes with high aspect ratios. The main disadvantages of laser etching are: it requires serial processing, which affects etching efficiency and output, so it is generally suitable for situations where a relatively small number of through holes are required; the instantaneous high temperature caused by laser etching and the low thermal conductivity of the glass itself cause the substrate to undergo higher thermal stress concentration, which can easily cause microcracks on the sidewalls of the blind holes, and the shape of the sidewalls is more difficult to control and the surface roughness is very poor; in addition, the molten products and residues caused by laser ablation adhere to the openings of deep holes, and an additional flattening process must be used after etching to remove the surface residues.

[0004] Laser-induced denaturation (LID) can address these shortcomings by creating TGV vias. The principle is to use a pulsed laser to induce continuous denaturation in glass. This denatured glass etches faster in hydrofluoric acid than undenatured areas. The laser-treated glass is then placed in the hydrofluoric acid solution for further etching, forming the via. Utility Model Content

[0005] The purpose of the utility model is to provide a glass micro-hole automatic laser processing machine, which mainly solves the problems of low efficiency and poor quality of existing glass drilling.

[0006] In order to achieve the above purpose, the technical solution adopted by the present utility model is as follows:

[0007] A glass micro-hole automatic laser processing machine includes an AGV loading group, a loading mechanism, a processing platform, a unloading mechanism and an AGV unloading group connected in sequence; wherein, the glass to be processed is transported to the loading mechanism by the AGV loading group, and the loading mechanism transfers the glass to be processed to the processing platform. After processing is completed, the unloading mechanism transfers the processed finished product to the AGV unloading group to complete the transfer of the finished product.

[0008] Furthermore, in the present invention, the AGV loading group includes an AGV full tray loading trolley and an AGV empty tray unloading trolley; the AGV unloading group includes an AGV empty tray loading trolley and an AGV full tray unloading trolley.

[0009] Furthermore, in the present invention, the loading mechanism includes a loading rack with two picking hole areas in the middle that are adapted to the plane size of the glass product, a linear drive slide rail arranged above the loading rack and located close to the AGV loading group, an empty material tray manipulator arranged on the linear drive slide rail, a loading robot arranged above the loading rack and located close to the processing platform, a glass suction cup arranged on the loading robot, and a rack shell arranged on the loading rack.

[0010] Furthermore, in the present invention, the processing platform includes a platform frame, a base arranged on the platform frame, a transverse cross seat arranged on the base, a Y-axis linear platform arranged on the base and located below the transverse cross seat, an X-axis linear platform arranged on the Y-axis linear platform, a laser generator installed on the transverse cross seat, a laser head arranged on the side wall of the transverse cross seat and located above the X-axis linear platform, a CCD positioning camera arranged on the side wall of the transverse cross seat, and a platform housing arranged on the platform frame.

[0011] Furthermore, in the present invention, the unloading mechanism has the same structure as the loading mechanism, and the overall layout is symmetrical about the processing platform.

[0012] Furthermore, in the present invention, the base is a marble base.

[0013] Compared with the prior art, the present invention has the following beneficial effects:

[0014] (1) The utility model adopts AGV to transport a stack of trays (including products) to the loading and sucking position. The loading robot sucks the products and places them on the processing platform. The empty tray manipulator transports the empty trays to the unloading position. After a certain number of trays are stacked, the AGV trolley transports them away for the next cycle. The entire process realizes unmanned processing, with high processing efficiency and stable product quality.

[0015] (2) The unloading robot of this utility model sucks the product into the empty tray at the unloading position. It uses a customized suction cup to stably absorb the glass without damaging the product due to excessive pressure. At the same time, after a certain number of trays are stacked, the AGV car transports them away for the next cycle, and the entire process is unmanned. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the overall structure of the utility model.

[0017] Figure 2 It is a top view schematic diagram of the overall structure of the utility model.

[0018] Figure 3 A schematic diagram of the internal structure of the feeding mechanism in the present invention.

[0019] Figure 4 A schematic diagram of the internal structure of the processing platform in the present invention.

[0020] The names corresponding to the reference numerals are:

[0021] 1-AGV loading group, 2-loading mechanism, 3-processing platform, 4-unloading mechanism, 5-AGV unloading group, 6-AGV full tray loading trolley, 7-AGV empty tray unloading trolley, 8-AGV empty tray loading trolley, 9-AGV full tray unloading trolley, 10-picking hole area, 11-loading rack, 12-linear drive slide, 13-empty tray manipulator, 14-loading robot, 15-glass suction cup, 16-rack housing, 17-platform rack, 18-base, 19-horizontal straddle, 20-Y-axial linear platform, 21-X-axial linear platform, 22-laser generator, 13-laser head, 24-CCD positioning camera, 25-platform housing. DETAILED DESCRIPTION

[0022] The present invention will be further described below with reference to the accompanying drawings and embodiments. The present invention includes but is not limited to the following embodiments.

[0023] Example

[0024] like Figure 1 、 2As shown, the present invention discloses an automatic laser processing machine for glass micro-holes, characterized by comprising an AGV loading group 1, a loading mechanism 2, a processing platform 3, a unloading mechanism 4, and an AGV unloading group 5 connected in sequence. The glass to be processed is transported by the AGV loading group 1 to the loading mechanism 2, which then transfers the glass to the processing platform 3. After processing is completed, the unloading mechanism 4 transfers the finished product to the AGV unloading group 5, completing the transfer of the finished product. The AGV loading group 1 includes an AGV full tray loading trolley 6 and an AGV empty tray unloading trolley 7; the AGV unloading group 5 includes an AGV empty tray loading trolley 8 and an AGV full tray unloading trolley 9. During use, an AGV transports a stack of trays (containing products) to a loading and absorbing position. The loading robot picks up the products and places them on the processing platform. The empty tray manipulator transports the empty trays to the unloading position. After a certain number of trays are stacked, the AGV trolley moves away for the next cycle. The entire process achieves unmanned processing, high processing efficiency, and stable product quality. After the glass is punched on processing platform 3, the unloading robot picks up the product and places it on an empty tray at the unloading location. Using a custom suction cup, it securely holds the glass without damaging it due to excessive pressure. Once a certain number of trays are stacked, the AGV transports them away for the next cycle, making the entire process unmanned.

[0025] like Figure 3 As shown, in this embodiment, the loading mechanism 2 includes a loading rack 11 with two picking hole areas 10 in the middle that are adapted to the plane size of the glass product, a linear drive slide 12 arranged above the loading rack 11 and located close to the AGV loading group 1, an empty tray manipulator 13 arranged on the linear drive slide 12, a loading robot 14 arranged above the loading rack 12 and located close to the processing platform 3, a glass suction cup 15 arranged on the loading robot 14, and a rack shell 16 arranged on the loading rack 11. During loading, the AGV full tray loading trolley 6 runs to the bottom of the loading rack 11 and makes the glass product face the picking hole area 10. The loading robot 14 sucks the glass through the glass suction cup 15 and transfers it to the processing platform 3. At the same time, the empty tray manipulator 13 grabs the empty tray after the glass is sucked away and transfers the controlled tray to the AGV empty tray unloading trolley 7 under the picking hole area 10 on the other side through the linear drive slide rail 12, thereby completing the loading of glass drilling.

[0026] like Figure 4As shown, in this embodiment, the processing platform 3 includes a platform frame 17, a base 18 mounted on the platform frame 17, a transverse support 19 mounted on the base 18, a Y-axis linear platform 20 mounted on the base 18 and located below the transverse support 19, an X-axis linear platform 21 mounted on the Y-axis linear platform 20, a laser generator 22 mounted on the transverse support 19, a laser head 23 mounted on the side wall of the transverse support 19 and located above the X-axis linear platform 21, a CCD positioning camera 24 mounted on the side wall of the transverse support 19, and a platform housing 25 mounted on the platform frame 17. The base 18 is a marble base. During use, the position of the glass to be processed is adjusted by alternating the Y-axis linear platform 20 and the X-axis linear platform 21, and the laser head 23 is then used to complete the drilling.

[0027] In this embodiment, the unloading mechanism and loading mechanism share the same structure, with their overall layout symmetrical about the processing platform. After the glass is punched on processing platform 3, the unloading robot in the unloading mechanism (corresponding to the loading robot 14 in the loading mechanism) picks up the glass using glass suction cups 15 and places it through the pick-up hole area 10 onto the AGV empty tray loading trolley 8. The empty tray manipulator 13 then transfers the tray containing the processed glass to the AGV full tray unloading trolley 9. Once a certain number of trays have been stacked, the AGV transports them away for the next cycle, achieving unmanned processing.

[0028] Through the above design, the utility model uses AGV to transport a stack of trays (including products) to the loading and suction position. The loading robot absorbs the products and places them on the processing platform. The empty tray manipulator transports the empty tray to the unloading position. After stacking a certain number, the AGV cart transports it away for the next cycle. The entire process realizes unmanned processing, with high processing efficiency and stable product quality.

[0029] The above embodiment is only one of the preferred implementation methods of the present invention and should not be used to limit the scope of protection of the present invention. Any changes or modifications that have no substantive meaning made to the main design concept and spirit of the present invention, as long as the technical problems they solve are still consistent with the present invention, should be included in the scope of protection of the present invention.

Claims

1. A glass micro-hole automatic laser processing machine, characterized in that: The system comprises an AGV loading group (1), a loading mechanism (2), a processing platform (3), a loading mechanism (4), and an AGV unloading group (5) connected in sequence; wherein the glass to be processed is transported by the AGV loading group (1) to the loading mechanism (2), and the loading mechanism (2) transfers the glass to be processed to the processing platform (3); after processing is completed, the unloading mechanism (4) transfers the processed finished product to the AGV unloading group (5), completing the transfer of the finished product.

2. The glass micro-hole automatic laser processing machine according to claim 1, characterized in that: The AGV loading group (1) includes an AGV full tray loading trolley (6) and an AGV empty tray unloading trolley (7); the AGV unloading group (5) includes an AGV empty tray loading trolley (8) and an AGV full tray unloading trolley (9).

3. The glass micro-hole automatic laser processing machine according to claim 2, characterized in that: The loading mechanism (2) comprises a loading frame (11) having two picking hole areas (10) in the middle thereof adapted to the size of the glass product plane, a linear drive slide rail (12) arranged above the loading frame (11) and located near the AGV loading group (1), an empty tray manipulator (13) arranged on the linear drive slide rail (12), a loading robot (14) arranged above the loading frame (11) and located near the processing platform (3), a glass suction cup (15) arranged on the loading robot (14), and a frame housing (16) arranged on the loading frame (11).

4. The glass micro-hole automatic laser processing machine according to claim 3, characterized in that: The processing platform (3) includes a platform frame (17), a base (18) arranged on the platform frame (17), a transverse cross seat (19) arranged on the base (18), a Y-axis linear platform (20) arranged on the base (18) and located below the transverse cross seat (19), an X-axis linear platform (21) arranged on the Y-axis linear platform (20), a laser generator (22) installed on the transverse cross seat (19), a laser head (23) arranged on the side wall of the transverse cross seat (19) and located above the X-axis linear platform (21), a CCD positioning camera (24) arranged on the side wall of the transverse cross seat (19), and a platform housing (25) arranged on the platform frame (17).

5. The glass micro-hole automatic laser processing machine according to claim 4, characterized in that: The unloading mechanism has the same structure as the loading mechanism, and the overall layout is symmetrical about the processing platform.

6. The glass micro-hole automatic laser processing machine according to claim 5, characterized in that: The base (18) is a marble base.

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