Two-dimensional code insert for semiconductor silicon wafer box

Abstract

The utility model discloses a two-dimensional code insert for a semiconductor silicon wafer box, which comprises a wafer box, and a two-dimensional code insert is detachably arranged at the bottom of the wafer box. The two-dimensional code insert comprises a mounting plate arranged at the bottom of the wafer box, at least one clamping pin is arranged on the upper side of the mounting plate, the clamping pin is detachably inserted into the bottom of the wafer box, and a two-dimensional code is arranged on the lower surface of the mounting plate. According to the utility model, the problems that the two-dimensional code is directly printed at the bottom of the wafer box for identification of the conventional silicon wafer box, so that light is reflected, burst points exist, and the two-dimensional code is easy to wear and not easy to read can be solved.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor silicon wafer processing, in particular to a two-dimensional code inlay block used for a semiconductor silicon wafer box. Background Art

[0002] Semiconductor silicon wafer cassettes require labeling for easier management during production and transportation. Existing labeling involves printing a QR code directly on the bottom of the cassette. However, because the cassettes are made of translucent polypropylene (PP) material, there are issues with glare, cracking, and the QR code easily wears and becomes difficult to read. To improve the lifespan and readability of the QR code, a removable, durable QR code insert is required. Utility Model Content

[0003] The utility model provides a two-dimensional code inlay for semiconductor silicon wafer cassettes, which can solve the problems of existing silicon wafer cassette identification using a two-dimensional code directly printed on the bottom of the cassette, which causes reflection, cracking points, easy wear and difficulty in reading of the two-dimensional code.

[0004] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a QR code inlay for a semiconductor silicon wafer box, comprising a box, the bottom of which is detachably provided with a QR code inlay; the QR code inlay comprises a mounting plate arranged at the bottom of the box, the upper side of the mounting plate is provided with at least one clip, the clip is detachably plugged into the bottom of the box, and the lower surface of the mounting plate is provided with a QR code.

[0005] Preferably, the bottom of the film box is provided with a positioning hole adapted to the clamping foot, which is convenient for processing.

[0006] Preferably, the clamping foot includes a vertically arranged support column, a guide portion is fixedly provided on the upper part of the support column, and a plurality of spaced-apart clamping portions are symmetrically provided on the outer side wall of the support column, and the clamping portions are inclined downward from the relative inner side to the outside.

[0007] Preferably, the clamping foot and the mounting plate are integrally formed, and the integrally formed design has better structural integrity and improves the overall strength and durability.

[0008] Preferably, the two-dimensional code inlay is made of PVDF. The two-dimensional code inlay made of PVDF material has good high temperature resistance and corrosion resistance, making the two-dimensional code more durable and less prone to damage during the production and transportation of semiconductor silicon wafers.

[0009] Compared with the prior art, the beneficial effects of the present invention are:

[0010] The structure is simple and easy to operate. Because the QR code insert is removable, it can be quickly and easily replaced when the QR code wears out or needs updating, without having to replace the entire cassette, thus reducing maintenance costs and time. By placing the QR code on the lower surface of the mounting plate and using durable materials, the clarity and readability of the QR code are ensured, reducing scanning and recognition difficulties caused by material problems. This solves the existing silicon wafer cassette recognition problems of directly printing the QR code on the bottom of the cassette, which can cause reflections, cracks, easy wear, and difficulty in reading. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 It is a three-dimensional structural diagram of the utility model;

[0012] Figure 2 This is a three-dimensional structural diagram of the two-dimensional code inlay of the utility model;

[0013] Figure 3 This is a schematic structural diagram of the clamping foot of the present utility model;

[0014] Figure 4 It is a structural schematic diagram of the film box of the present utility model.

[0015] Reference numerals:

[0016] 1. Chip box, 11. Positioning hole, 12. Cavity, 13. Silicon wafer slot, 2. QR code insert, 21. Mounting plate, 22. Clamping foot, 221. Support column, 222. Clamping part, 223. Guide part. DETAILED DESCRIPTION

[0017] The technical solutions in the embodiments of the present invention will be described clearly and completely below with reference to the accompanying drawings in the embodiments of the present invention.

[0018] like Figure 1-4 As shown, the present invention solves the problems of existing silicon wafer box identification that the QR code is directly printed on the bottom of the box, such as reflection, explosion points, easy wear and difficulty in reading. The utility model provides the following technical solutions: a QR code inlay for a semiconductor silicon wafer box, comprising a box 1, the bottom of which is detachably provided with a QR code inlay 2; the QR code inlay 2 comprises a mounting plate 21 arranged at the bottom of the box 1, at least one clip 22 being provided on the upper side of the mounting plate 21, the clip 22 being detachably plugged into the bottom of the box 1, the lower surface of the mounting plate 21 being provided with a QR code, and using the QR code inlay 2 to inlay on the box 1 saves time and effort, and the device is simple in structure and easy to operate, thereby achieving the purpose of improving the efficiency and accuracy of box circulation records without the need for manual copying of box information.

[0019] In this embodiment, if Figure 4As shown, the chip box 1 includes a hollow cavity 12, and two side walls of the cavity 12 are provided with a plurality of silicon chip slots 13. The bottom of the cavity 12 is provided with positioning holes 11 adapted to the clamping feet 22, which is convenient for processing.

[0020] In this embodiment, if Figure 3 As shown, the clamping foot 22 includes a vertically arranged support column 221, a guide portion 223 is fixedly provided on the upper part of the support column 221, and a plurality of spaced clamping portions 222 are symmetrically provided on the outer wall of the support column 221, and the clamping portions 222 are inclined downward from the relative inner side to the outside.

[0021] In this embodiment, if Figure 2 As shown, the clamping foot 22 and the mounting plate 21 are integrally formed. The integrally formed design has better structural integrity and improves the overall strength and durability.

[0022] In this embodiment, if Figure 2 As shown, the two-dimensional code inlay 2 is made of PVDF. The two-dimensional code inlay 2 made of PVDF material has good high temperature resistance and corrosion resistance, which makes the two-dimensional code more durable and not easy to be damaged during the production and transportation of semiconductor silicon wafers.

[0023] In this embodiment, if Figure 1 As shown, a two-dimensional code pattern containing relevant information of the silicon wafer cassette is designed using professional software to ensure that the size and format of the two-dimensional code are suitable for subsequent printing and recognition. The designed two-dimensional code pattern is directly engraved on the mounting plate 21 of the PVDF material through laser engraving or printing technology to form a two-dimensional code pattern. Two card feet 22 are arranged side by side on one side of the mounting plate 21. The card feet 22 are integrally formed with the mounting plate 21. A guide portion 223 and a clamping portion 222 are provided on the card feet 22 to facilitate cooperation with the positioning hole 11 at the bottom of the cassette 1. The prepared two-dimensional code inlay 2 is inserted into the positioning hole 11 at the bottom of the cassette 1. The guide portion 223 of the card foot 22 guides the card foot 22 to smoothly insert into the positioning hole 11, and the clamping portion 222 ensures that the two-dimensional code inlay 2 is fixed on the cassette 1.

[0024] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative position relationship, movement status, etc. between the various components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0025] In addition, the terms "first," "second," and so on, used in this utility model are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, features specified as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of this utility model, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.

[0026] In this utility model, unless otherwise specified or limited, the terms "connection" and "fixation" should be understood in a broad sense. For example, "fixation" can mean fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two elements or interaction between two elements, unless otherwise specified. For those skilled in the art, the specific meanings of the above terms in this utility model can be understood according to specific circumstances.

[0027] In addition, the technical solutions between the various embodiments of the present invention can be combined with each other, but it must be based on the fact that ordinary technicians in this field can implement it. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by this utility model.

Claims

1. A two-dimensional code inlay for a semiconductor silicon wafer box, characterized in that: include: A film box (1), wherein the bottom of the film box (1) is detachably provided with a QR code inlay (2); The two-dimensional code insert (2) comprises a mounting plate (21) arranged at the bottom of the film box (1), at least one clamping foot (22) is provided on the upper side of the mounting plate (21), and the clamping foot (22) is detachably plugged into the bottom of the film box (1), and a two-dimensional code is provided on the lower surface of the mounting plate (21).

2. The two-dimensional code inlay for semiconductor silicon wafer cassette according to claim 1, characterized in that: The bottom of the film box (1) is provided with a positioning hole (11) adapted to the clamping foot (22).

3. The two-dimensional code inlay for semiconductor silicon wafer cassette according to claim 1, characterized in that: The clamping foot (22) comprises a vertically arranged support column (221), a guide portion (223) is fixedly provided on the upper portion of the support column (221), and a plurality of spaced clamping portions (222) are symmetrically provided on the outer side wall of the support column (221), and the clamping portions (222) are inclined downward from the relative inner side to the outside.

4. The two-dimensional code inlay for semiconductor silicon wafer cassette according to claim 1, characterized in that: The clamping foot (22) and the mounting plate (21) are integrally formed.

5. The two-dimensional code inlay for semiconductor silicon wafer box according to claim 1, characterized in that: The two-dimensional code inlay (2) is made of PVDF.

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