Circuit board layout structure of three-phase passive circuit, circuit board, controller and air conditioner

Abstract

The utility model discloses a circuit board layout structure of a three-phase passive circuit, a circuit board, a controller and an air conditioner. The three-phase passive circuit comprises a power supply access port, an EMC module electrically connected with the power supply access port, a three-phase bridge pile electrically connected with the EMC module, an electrolytic capacitor module electrically connected with the three-phase bridge pile, an IPM module electrically connected with the electrolytic capacitor module, and a flyback switching power supply module connected with the electrolytic capacitor module. The circuit board comprises a left side area, a middle area and a right side area which are located on the same board face. The power access port is located at the lower part of the left area, and the EMC module is located at the middle part of the left area; the three-phase bridge rectifier and the IPM module are located on the upper portion of the middle area, the IPM module is located on the right side of the three-phase bridge rectifier, and the electrolytic capacitor module is located in the middle of the middle area. The flyback switching power supply module is located in the right area; the size of the circuit board can be effectively reduced, miniaturized electric control layout is realized, the electric control cost is effectively reduced, and the EMC performance and the heat dissipation effect are considered at the same time.

Description

Technical Field

[0001] The utility model relates to the technical field of air-conditioning circuits, in particular to a circuit board layout structure of a three-phase passive circuit, a circuit board, a controller and an air conditioner. Background Art

[0002] The three-phase air conditioning circuit involves not only the rectifier circuit module, but also the IPM module of the compressor or AC fan and components such as inductors. Because three-phase air conditioners have higher power and more components, the electronic control circuit board is large in size and high in cost. It cannot be installed vertically in relatively small box models and can only be installed upside down, which makes it inconvenient to connect the wires during installation and after-sales maintenance, especially in high-altitude operations.

[0003] Therefore, reducing the size of the electronic control circuit board and achieving a miniaturized electronic control layout has become a pressing technical challenge. Furthermore, reducing the size of the electronic control circuit board can lead to severe interference in the control signals, degrade EMC performance, and more concentrated heat generation in the components. Achieving the same heat dissipation effect requires higher heat dissipation requirements. Existing electronic control circuit board layout solutions cannot achieve the required miniaturization, EMC performance, and heat dissipation simultaneously. Utility Model Content

[0004] The purpose of the present utility model is to solve at least one of the technical problems existing in the prior art and to provide a circuit board layout structure for a three-phase passive circuit, a circuit board, a controller, and an air conditioner, which can effectively reduce the size of the circuit board, realize a miniaturized electronic control layout, and effectively reduce the cost of the electronic control, while taking into account EMC performance and heat dissipation effects.

[0005] In a first aspect, an embodiment of the present invention provides a circuit board layout structure for a three-phase passive circuit, wherein the three-phase passive circuit includes a power access port, an EMC module electrically connected to the power access port, a three-phase bridge stack electrically connected to the EMC module, an electrolytic capacitor module electrically connected to the three-phase bridge stack, an IPM module electrically connected to the electrolytic capacitor module, and a flyback switching power supply module connected to the electrolytic capacitor module; the circuit board includes a left area, a middle area, and a right area located on the same board surface;

[0006] The power access port is located at the lower part of the left area, and the EMC module is located in the middle of the left area;

[0007] The three-phase bridge stack and the IPM module are located in the upper part of the middle area, the IPM module is located on the right side of the three-phase bridge stack, and the electrolytic capacitor module is located in the middle of the middle area;

[0008] The flyback switching power supply module is located in the right area.

[0009] The circuit board layout structure of the three-phase passive circuit provided by the embodiment of the present invention has at least the following beneficial effects: by adopting a flyback switching power supply module and directly obtaining power from the electrolytic capacitor module connected to the DC output end of the three-phase bridge stack, there is no need to set up a rectifier device and an electrolytic capacitor separately for the switching power supply, which greatly reduces the number of devices on the circuit board and thus reduces the board area; the main current on the circuit board flows as follows: from the power access port at the bottom of the left area of the circuit board upward to the EMC module in the middle of the left area, then flows to the upper right to the three-phase bridge stack at the top of the middle area, and then flows downward to the electrolytic capacitor module in the middle of the middle area, and finally is divided into two paths by the electrolytic capacitor module , one path flows upward to the IPM module in the upper part of the middle area to supply AC loads such as compressors or AC fans, and the other path flows rightward to the flyback switching power supply module in the right area to supply the main control module or other DC loads. The main current loop does not cross, which can improve EMC performance and system stability under a compact circuit board layout; the three-phase bridge stack and IPM module are arranged together in the upper part of the middle area of the circuit board, and a heat sink can be used to dissipate heat for power devices with high heat generation at the same time; the circuit board layout structure of the three-phase passive circuit can effectively reduce the size of the circuit board, realize a miniaturized electronic control layout, effectively reduce the cost of the electronic control, and at the same time take into account EMC performance and heat dissipation effects.

[0010] According to the circuit board layout structure provided by an embodiment of the present invention, the three-phase passive circuit also includes a power-on buffer module electrically connected between the EMC module and the three-phase bridge stack, and the power-on buffer module includes several push-rod relays located in the upper part of the left area.

[0011] According to the circuit board layout structure provided by an embodiment of the present invention, the three-phase passive circuit further includes a compressor plug-in port module electrically connected to the IPM module, and the compressor plug-in port module is located between the IPM module and the electrolytic capacitor module.

[0012] According to the circuit board layout structure provided by an embodiment of the present invention, the three-phase passive circuit further includes a main control module powered by the flyback switching power supply module, and the main control module is located at the upper part of the right area.

[0013] According to the circuit board layout structure provided by an embodiment of the present invention, the three-phase passive circuit also includes a functional interface module that is electrically connected to the power access port, the EMC module, and the flyback switching power supply module, respectively, and the functional interface module is located in the lower part of the middle area.

[0014] According to the circuit board layout structure provided by an embodiment of the present invention, the three-phase passive circuit further includes a sampling module, and the sampling module is located between the EMC module and the electrolytic capacitor module.

[0015] According to the circuit board layout structure provided by the embodiment of the present invention, the area where the three-phase bridge stack and the IPM module are located constitutes a refrigerant heat dissipation area.

[0016] According to the circuit board layout structure provided by the embodiment of the present invention, the EMC module adopts an amorphous common-mode inductor.

[0017] According to the circuit board layout structure provided by the embodiment of the present invention, the electrolytic capacitor module includes two high ripple-resistant electrolytic capacitors.

[0018] In a second aspect, an embodiment of the present invention provides a circuit board, comprising the circuit board layout structure as described in the embodiment of the first aspect above.

[0019] In a third aspect, an embodiment of the present invention provides a controller comprising the circuit board as described in the embodiment of the second aspect above.

[0020] In a fourth aspect, an embodiment of the present invention provides an air conditioner, comprising the controller as described in the embodiment of the third aspect above.

[0021] Other features and advantages of the present invention will be described in the following description, and in part will become apparent from the description, or understood by practicing the present invention. The objectives and other advantages of the present invention can be achieved and obtained through the structures particularly pointed out in the description, claims and drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The accompanying drawings are used to provide a further understanding of the technical solution of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the technical solution of the present invention and do not constitute a limitation on the technical solution of the present invention.

[0023] The present invention will be further described below with reference to the accompanying drawings and embodiments;

[0024] Figure 1 This is a schematic diagram of the circuit board layout structure provided by an embodiment of the present utility model;

[0025] Figure 2 This is a schematic diagram of the current loop flow direction of the circuit board layout structure provided by an embodiment of the present utility model;

[0026] Figure 3 This is a circuit principle diagram of a three-phase passive circuit provided by an embodiment of the utility model. DETAILED DESCRIPTION

[0027] This section will describe in detail the specific embodiments of the present invention. The preferred embodiments of the present invention are shown in the accompanying drawings. The purpose of the accompanying drawings is to supplement the description of the text part of the specification with graphics, so that people can intuitively and vividly understand each technical feature and overall technical solution of the present invention, but it cannot be understood as a limitation on the scope of protection of the present invention.

[0028] In the description of the embodiments of the present invention, "several" means one or more, "more" means more than two, "greater than," "less than," and "exceed" are understood to exclude the number itself, and "above," "below," and "within" are understood to include the number itself. "At least one" means one or more, "at least one of the following" and similar expressions refer to any combination of these items, including any combination of single or plural items. If "first," "second," or the like is used in the description, it is only for the purpose of distinguishing technical features and is not to be understood as indicating or implying relative importance, or implicitly indicating the number of the indicated technical features, or implicitly indicating the order of the indicated technical features.

[0029] It should be noted that the terms "set," "install," and "connect" in the embodiments of the present invention should be interpreted broadly. Those skilled in the art can reasonably determine the specific meanings of these terms in the embodiments of the present invention based on the specific content of the technical solution. For example, the term "connect" can refer to mechanical connection, electrical connection, or communication; it can refer to direct connection or indirect connection through an intermediary.

[0030] It should be noted that the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0031] The circuit of a three-phase air conditioner not only involves the rectifier circuit module, but also includes the IPM module of the compressor or AC fan, as well as components such as inductors. Because three-phase air conditioners have higher power and more components, the electronic control circuit board is large in size and expensive. It cannot be installed vertically in relatively small cabinets and can only be installed upside down, making it inconvenient to connect cables during installation and after-sales maintenance, especially when working at height. Therefore, how to reduce the size of the electronic control circuit board and achieve a miniaturized electronic control layout has become a technical problem that needs to be solved urgently. Moreover, reducing the size of the electronic control circuit board will lead to serious interference with the control electrical signals of the electronic control circuit board, reduced EMC performance, and more concentrated heat generation of the components. Achieving the same heat dissipation effect also requires higher heat dissipation requirements. The existing layout scheme of the electronic control circuit board cannot take into account the requirements of miniaturization, EMC performance, and heat dissipation effect.

[0032] Based on this, the embodiments of the present invention provide a circuit board layout structure, a circuit board, a controller and an air conditioner for a three-phase passive circuit, which can effectively reduce the size of the circuit board, realize a miniaturized electronic control layout, effectively reduce the cost of the electronic control, and at the same time take into account EMC performance and heat dissipation effects.

[0033] The following is a further description of the embodiments of the present invention with reference to the accompanying drawings.

[0034] Reference Figures 1 to 3 , Figure 1 This is a schematic diagram of the circuit board layout structure provided by an embodiment of the present utility model; Figure 2 This is a schematic diagram of the current loop flow direction of the circuit board layout structure provided by an embodiment of the present utility model; Figure 3 It is a circuit schematic diagram of a three-phase passive circuit provided by an embodiment of the present invention. The first aspect of the embodiment of the present invention provides a circuit board layout structure of a three-phase passive circuit, and the three-phase passive circuit includes a power access port 100, an EMC module 200 electrically connected to the power access port 100, a three-phase bridge stack 400 electrically connected to the EMC module 200, an electrolytic capacitor module 500 electrically connected to the three-phase bridge stack 400, an IPM module 600 electrically connected to the electrolytic capacitor module 500, and a flyback switching power supply module 700 connected to the electrolytic capacitor module 500; illustratively, the power access port 100 is used to access the A-phase power supply, the B-phase power supply, and the C-phase power supply in the three-phase AC power supply; the EMC module The block 200 includes a first inductor L1, a second inductor L2 and a third inductor L3, one end of the first inductor L1 is connected to the port of the power access port 100 connected to the A-phase power supply, one end of the second inductor L2 is connected to the port of the power access port 100 connected to the B-phase power supply, one end of the third inductor L3 is connected to the port of the power access port 100 connected to the C-phase power supply, and the other end of the first inductor L1, the other end of the second inductor L2 and the other end of the third inductor L3 are directly or indirectly electrically connected to the input end of the three-phase bridge stack 400; it can be understood that the EMC module 200 may also include other filtering elements, for example, including a filter capacitor connected to the first inductor L1, the second inductor L2 and the third inductor L3; Figure 3As shown, the three-phase bridge stack 400 includes six diodes, namely diode D1, diode D2, diode D3, diode D4, diode D5 and diode D6; the anode of diode D1 and the cathode of diode D2 are connected together and connected to the other end of the first inductor L1 as one input end of the three-phase bridge stack 400, the anode of diode D3 and the cathode of diode D4 are connected together and connected to the other end of the second inductor L2 as another input end of the three-phase bridge stack 400, and the anode of diode D5 and the cathode of diode D6 are connected together and connected to another input end of the three-phase bridge stack 400. The cathode of the diode D1, the cathode of the diode D3 and the cathode of the diode D5 are connected together as one output end of the three-phase bridge stack 400 and connected to the electrolytic capacitor module 500. The anode of the diode D2, the anode of the diode D4 and the anode of the diode D6 are connected together as another output end of the three-phase bridge stack 400 and connected to the electrolytic capacitor module 500. The electrolytic capacitor module 500 includes a first capacitor C1 and a second capacitor C2 connected in series. The IPM module 600 and the flyback switching power supply module 700 both obtain electrical energy from the electrolytic capacitor module 500.

[0035] The circuit board includes a left area, a middle area and a right area located on the same board surface; the power access port 100 is located at the lower part of the left area, and the EMC module 200 is located in the middle of the left area; the three-phase bridge stack 400 and the IPM module 600 are located in the upper part of the middle area, the IPM module 600 is located on the right side of the three-phase bridge stack 400, and the electrolytic capacitor module 500 is located in the middle of the middle area; the flyback switching power supply module 700 is located in the right area.

[0036] According to the circuit board layout structure of the three-phase passive circuit provided by the embodiment of the present invention, by adopting a flyback switching power supply module 700 and directly obtaining power from the electrolytic capacitor module 500 connected to the DC output end of the three-phase bridge stack 400, there is no need to separately set a rectifier device and an electrolytic capacitor for the switching power supply, which greatly reduces the number of devices on the circuit board and thus reduces the board area; the main current flow on the circuit board is: from the power access port 100 at the lower part of the left area of the circuit board upward to the EMC module 200 in the middle of the left area, then to the upper right to the three-phase bridge stack 400 at the upper part of the middle area, and then downward to the electrolytic capacitor module 500 in the middle of the middle area, and finally divided into two paths by the electrolytic capacitor module 500, One path flows upward to the IPM module 600 in the upper part of the middle area to supply AC loads such as compressors or AC fans, and the other path flows rightward to the flyback switching power supply module 700 in the right area to supply the main control module 800 or other DC loads. The main current loop does not cross, which can improve the EMC performance and system stability under a compact circuit board layout; the three-phase bridge stack 400 and the IPM module 600 are arranged together in the upper part of the middle area of the circuit board, and a heat sink can be used to dissipate heat for power devices with high heat generation at the same time; the circuit board layout structure of the three-phase passive circuit can effectively reduce the size of the circuit board, realize a miniaturized electronic control layout, effectively reduce the cost of the electronic control, and take into account both EMC performance and heat dissipation effects.

[0037] It is understandable that Figure 2 The solid arrows shown indicate the direction of current outflow, and the dotted arrows indicate the direction of current inflow.

[0038] Reference Figure 1 and Figure 2 In the circuit board layout structure provided by the embodiment of the present invention, the three-phase passive circuit further includes a power-on buffer module 300 electrically connected between the EMC module 200 and the three-phase bridge stack 400. The power-on buffer module 300 includes a plurality of push-rod relays 310 located at the upper portion of the left area. Specifically, referring to Figure 3 As shown, the power-on buffer module 300 includes power-on buffer units on two-phase branches, for example Figure 3The power-on buffer unit on the B-phase branch and the C-phase branch in the circuit includes a thermistor PTC1 and a switching device SW1, the other end of the second inductor L2 is connected to one end of the thermistor PTC1 and one end of the switching device SW1, and the other end of the thermistor PTC1 and the other end of the switching device SW1 are connected to the connection point of the anode of the diode D3 and the cathode of the diode D4 in the three-phase bridge stack 400; the power-on buffer unit on the C-phase branch includes a thermistor PTC2 and a switching device SW2, the other end of the third inductor L3 is connected to one end of the thermistor PTC2 and one end of the switching device SW2, and the other end of the thermistor PTC2 and the other end of the switching device SW2 are connected to the connection point of the anode of the diode D5 and the cathode of the diode D6 in the three-phase bridge stack 400.

[0039] In this embodiment, the switch devices SW1 and SW2 are push-rod relays 310 and are arranged on the upper left side of the circuit board, which can reduce the board area occupied by the power-on buffer module 300 on the circuit board by about 8 square centimeters.

[0040] Reference Figure 1 and Figure 2 In the circuit board layout structure provided in the embodiment of the present invention, the three-phase passive circuit further includes a compressor plug-in port module 610 electrically connected to the IPM module 600 , and the compressor plug-in port module 610 is located between the IPM module 600 and the electrolytic capacitor module 500 .

[0041] In this embodiment, the IPM module 600 inverts the high-voltage direct current obtained from the electrolytic capacitor module 500 and transmits it to the compressor from the compressor plug-in port module 610. The compressor plug-in port module 610 is set between the IPM module 600 and the electrolytic capacitor module 500, which can effectively shorten the main current loop.

[0042] Reference Figure 1 and Figure 2 In the circuit board layout structure provided by the embodiment of the present invention, the three-phase passive circuit further includes a main control module 800 powered by a flyback switching power supply module 700. The main control module 800 is located in the upper part of the right area; the flyback switching power supply module 700 is located in the lower middle part of the right area.

[0043] In this embodiment, the flyback switching power supply module 700 steps down the high-voltage DC power obtained from the electrolytic capacitor module 500 and outputs low-voltage DC power to the main control module 800. The main control module 800 is adjacent to the flyback switching power supply module 700, which can effectively shorten the main current loop.

[0044] Reference Figure 1 and Figure 2In the circuit board layout structure provided in the embodiment of the present invention, the three-phase passive circuit further includes a functional interface module 900 electrically connected to the power access port 100, the EMC module 200, and the flyback switching power supply module 700, respectively. The functional interface module 900 is located in the lower part of the middle area.

[0045] In this embodiment, the functional interface module 900 is used to supply power to the four-way valve, fan and other loads of the air conditioner or their driving relays. The functional interface module 900 can obtain AC power from the power access port 100 or the EMC module 200, or obtain low-voltage DC power from the flyback switching power supply module 700.

[0046] Reference Figure 1 and Figure 2 In the circuit board layout structure provided in the embodiment of the present invention, the three-phase passive circuit further includes a sampling module 1000 , which is located between the EMC module 200 and the electrolytic capacitor module 500 .

[0047] In this embodiment, the sampling module 1000 may include a current sampling device and a line sequence detection device, such as a current transformer, arranged between the EMC module 200 and the three-phase bridge stack 400; the sampling module 1000 may also include a voltage sampling device arranged on the DC bus at the output end of the three-phase bridge stack 400, etc.

[0048] Reference Figure 1 and Figure 2 In the circuit board layout structure provided by the embodiment of the present invention, the area where the three-phase bridge stack 400 and the IPM module 600 are located constitutes a refrigerant heat dissipation area 1100 .

[0049] In this embodiment, refrigerant heat dissipation is used to dissipate heat from power devices with relatively high heat generation, such as the three-phase bridge stack 400 and the IPM module 600 , which can effectively improve the heat dissipation effect.

[0050] Reference Figure 1 and Figure 2 In the circuit board layout structure provided by the embodiment of the present utility model, the EMC module 200 adopts an amorphous common-mode inductor.

[0051] In this embodiment, the EMC module 200 uses an amorphous common-mode inductor, which can reduce the size by about 50% compared to a ferrite common-mode inductor, reducing the circuit board area by about 15 square centimeters.

[0052] Reference Figure 1 and Figure 2 In the circuit board layout structure provided by the embodiment of the present utility model, the electrolytic capacitor module 500 includes two high ripple-resistant electrolytic capacitors 510 .

[0053] In this embodiment, the first capacitor C1 and the second capacitor C2 in the electrolytic capacitor module 500 are high-ripple electrolytic capacitors, which can reduce the circuit board area by about 20 square centimeters compared to conventional electrolytic capacitors.

[0054] The circuit board layout structure provided by the embodiment of the present invention has a reduced size of the electric control circuit board, which reduces costs, increases rigidity, reduces deformation, and enhances reliability. The box model can realize vertical placement of the electric control circuit board. The advantage of vertical placement of the electric control circuit board is that after-sales maintenance of the electric control only requires disassembling the top cover of the box, then plugging and unplugging wires and removing screws, without the various inconveniences of high-altitude maintenance of the electric control like the existing inverted installation method; after the size of the electric control circuit board is reduced, the box can be made smaller, and after the size of the electric control circuit board is reduced, under the condition that the box body remains unchanged, the free space is increased, the cavity temperature will be reduced at the same heat generation, the temperature of the electric control device will be reduced, and the life of the electric control will be extended.

[0055] In a second aspect, an embodiment of the present invention provides a circuit board, comprising the circuit board layout structure of the embodiment of the first aspect above.

[0056] According to the circuit board provided by the embodiment of the present invention, a flyback switching power supply module 700 is adopted, and power is directly obtained from the electrolytic capacitor module 500 connected to the DC output end of the three-phase bridge stack 400. There is no need to set up a rectifier device and an electrolytic capacitor for the switching power supply separately, which greatly reduces the number of devices on the circuit board and thus reduces the board area. The main current flow direction on the circuit board is: from the power access port 100 at the lower part of the left area of the circuit board upward to the EMC module 200 in the middle of the left area, then flows to the upper right to the three-phase bridge stack 400 at the upper part of the middle area, and then flows downward to the electrolytic capacitor module 500 in the middle of the middle area, and finally is divided into two paths by the electrolytic capacitor module 500, one path flows upward to The IPM module 600 in the upper part of the middle area supplies AC loads such as compressors or AC fans, and the other path flows to the right to the flyback switching power supply module 700 in the right area to supply the main control module 800 or other DC loads. The main current loop does not cross, which can improve the EMC performance and system stability under a compact circuit board layout; the three-phase bridge stack 400 and the IPM module 600 are arranged together in the upper part of the middle area of the circuit board, and a heat sink can be used to dissipate heat for power devices with high heat generation at the same time; the circuit board layout structure of the three-phase passive circuit can effectively reduce the size of the circuit board, realize a miniaturized electronic control layout, effectively reduce the cost of the electronic control, and take into account EMC performance and heat dissipation effects.

[0057] In a third aspect, an embodiment of the present invention provides a controller comprising the circuit board of the embodiment of the second aspect above.

[0058] According to the controller provided by the embodiment of the present invention, a flyback switching power supply module 700 is adopted, and power is obtained directly from the electrolytic capacitor module 500 connected to the DC output end of the three-phase bridge stack 400. There is no need to set up a rectifier device and an electrolytic capacitor for the switching power supply separately, which greatly reduces the number of devices on the circuit board and thus reduces the board area. The main current flow direction on the circuit board is: from the power access port 100 at the bottom of the left area of the circuit board to the EMC module 200 in the middle of the left area, and then to the upper right to the three-phase bridge stack 400 at the top of the middle area, and then to the electrolytic capacitor module 500 in the middle of the middle area, and finally divided into two paths by the electrolytic capacitor module 500, one path flows upward to The IPM module 600 in the upper part of the middle area supplies AC loads such as compressors or AC fans, and the other path flows to the right to the flyback switching power supply module 700 in the right area to supply the main control module 800 or other DC loads. The main current loop does not cross, which can improve the EMC performance and system stability under a compact circuit board layout; the three-phase bridge stack 400 and the IPM module 600 are arranged together in the upper part of the middle area of the circuit board, and a heat sink can be used to dissipate heat for power devices with high heat generation at the same time; the circuit board layout structure of the three-phase passive circuit can effectively reduce the size of the circuit board, realize a miniaturized electronic control layout, effectively reduce the cost of the electronic control, and take into account EMC performance and heat dissipation effects.

[0059] In a fourth aspect, an embodiment of the present invention provides an air conditioner, comprising the controller of the embodiment of the third aspect above.

[0060] According to the air conditioner provided by the embodiment of the present invention, a flyback switching power supply module 700 is adopted, and power is directly obtained from the electrolytic capacitor module 500 connected to the DC output end of the three-phase bridge stack 400. There is no need to set up a rectifier device and an electrolytic capacitor for the switching power supply separately, which greatly reduces the number of devices on the circuit board and thus reduces the board area. The main current flow direction on the circuit board is: from the power access port 100 at the lower part of the left area of the circuit board to the EMC module 200 in the middle of the left area, then to the upper right to the three-phase bridge stack 400 at the upper part of the middle area, and then to the electrolytic capacitor module 500 in the middle of the middle area, and finally divided into two paths by the electrolytic capacitor module 500, one path flows upward to The IPM module 600 in the upper part of the middle area supplies AC loads such as compressors or AC fans, and the other path flows to the right to the flyback switching power supply module 700 in the right area to supply the main control module 800 or other DC loads. The main current loop does not cross, which can improve the EMC performance and system stability under a compact circuit board layout; the three-phase bridge stack 400 and the IPM module 600 are arranged together in the upper part of the middle area of the circuit board, and a heat sink can be used to dissipate heat for power devices with high heat generation at the same time; the circuit board layout structure of the three-phase passive circuit can effectively reduce the size of the circuit board, realize a miniaturized electronic control layout, effectively reduce the cost of the electronic control, and take into account EMC performance and heat dissipation effects.

[0061] It will be understood by those skilled in the art that all or some of the steps and systems in the methods disclosed above can be implemented as software, firmware, hardware, and appropriate combinations thereof. Some or all of the physical components can be implemented as software executed by a processor, such as a central processing unit, a digital signal processor, or a microprocessor, or as hardware, or as an integrated circuit, such as an application-specific integrated circuit. Such software can be distributed on computer-readable media, which can include computer storage media or non-transitory media and communication media or transient media. As is well known to those skilled in the art, the term computer storage media includes volatile and non-volatile, removable and non-removable media implemented in any method or technology for storing information such as computer-readable instructions, data structures, program modules, or other data. Computer storage media includes, but is not limited to, RAM, ROM, EEPROM, flash memory or other memory technology, CD-ROM, digital versatile disks (DVDs) or other optical disk storage, magnetic cassettes, magnetic tape, magnetic disk storage or other magnetic storage devices, or any other medium that can be used to store desired information and can be accessed by a computer. Furthermore, as is well known to those skilled in the art, communication media typically embodies computer-readable instructions, data structures, program modules, or other data in a modulated data signal such as a carrier wave or other transport mechanism, and may include any information delivery media.

[0062] The embodiments of the present invention are described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Various changes can be made within the scope of knowledge possessed by ordinary technicians in the technical field without departing from the purpose of the present invention.

Claims

1. A circuit board layout structure for a three-phase passive circuit, characterized in that: The three-phase passive circuit includes a power access port, an EMC module electrically connected to the power access port, a three-phase bridge stack electrically connected to the EMC module, an electrolytic capacitor module electrically connected to the three-phase bridge stack, an IPM module electrically connected to the electrolytic capacitor module, and a flyback switching power supply module connected to the electrolytic capacitor module; the circuit board includes a left area, a middle area, and a right area located on the same board surface; The power access port is located at the lower part of the left area, and the EMC module is located in the middle of the left area; The three-phase bridge stack and the IPM module are located in the upper part of the middle area, the IPM module is located on the right side of the three-phase bridge stack, and the electrolytic capacitor module is located in the middle of the middle area; The flyback switching power supply module is located in the right area.

2. The circuit board layout structure according to claim 1, characterized in that: The three-phase passive circuit further includes a power-on buffer module electrically connected between the EMC module and the three-phase bridge stack, and the power-on buffer module includes a plurality of push rod relays located at the upper portion of the left area.

3. The circuit board layout structure according to claim 1, wherein: The three-phase passive circuit further includes a compressor plug port module electrically connected to the IPM module, and the compressor plug port module is located between the IPM module and the electrolytic capacitor module.

4. The circuit board layout structure according to claim 1, characterized in that: The three-phase passive circuit further includes a main control module powered by the flyback switching power supply module, and the main control module is located at the upper part of the right area.

5. The circuit board layout structure according to claim 1, wherein: The three-phase passive circuit further includes a functional interface module electrically connected to the power access port, the EMC module, and the flyback switching power supply module respectively, and the functional interface module is located in the lower part of the middle area.

6. The circuit board layout structure according to claim 1, characterized in that: The three-phase passive circuit further includes a sampling module, and the sampling module is located between the EMC module and the electrolytic capacitor module.

7. The circuit board layout structure according to claim 1, characterized in that: The area where the three-phase bridge stack and the IPM module are located constitutes a refrigerant heat dissipation area.

8. The circuit board layout structure according to claim 1, wherein: The EMC module adopts amorphous common mode inductor.

9. The circuit board layout structure according to claim 1, characterized in that: The electrolytic capacitor module includes two high-ripple-resistant electrolytic capacitors.

10. A circuit board, characterized in that: A circuit board layout structure comprising any one of claims 1 to 9.

11. A controller, characterized in that: Including the circuit board according to claim 10.

12. An air conditioner, characterized in that: Including the controller according to claim 11.

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