Wafer bearing device and semiconductor film forming device

Abstract

The utility model discloses a wafer bearing device and a semiconductor film forming device, the wafer bearing device comprises a rotating cylinder body, and the rotating cylinder body comprises a bearing surface and an extension surface surrounding the bearing surface. And the tray is arranged on the bearing surface and is used for bearing the wafer. And the rotating cylinder upper cover is arranged around the tray, and the rotating cylinder upper cover and the tray are separated from each other in space. The rotating cylinder upper cover comprises an upper cover plate part and a side edge part connected with the upper cover plate part, and the upper cover plate part at least partially covers the extension surface; the side edge part is arranged on the outer side of the rotating cylinder body in a surrounding mode and extends in the axial direction of the rotating cylinder body. According to the utility model, the maintenance period of the semiconductor film forming device can be prolonged, the equipment use cost is reduced, and the wafer preparation efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor processing equipment, in particular to a wafer carrying device and a semiconductor film forming device. Background Art

[0002] In recent years, market demand for semiconductor devices, including integrated circuits and microelectronic components, has shown a strong preference for lower costs, higher efficiency, and superior performance. This trend places dual demands on film deposition processes: achieving large-scale, high-throughput production while ensuring that the resulting thin films possess superior electrical, optical, and mechanical properties, while also ensuring uniform thickness and absence of defects.

[0003] Traditional semiconductor film-forming equipment, such as the reaction chamber in the SiC (silicon carbide) crystal growth furnace, has a built-in wafer carrier, such as a rotating drum, to drive the wafer to rotate, so as to achieve efficient and uniform growth of SiC. However, the existing rotating drum design is directly facing the process gas environment, resulting in a particularly serious deposition of reaction byproducts (Coating) on the outer ring at the top of the rotating drum. According to statistics, polishing is required approximately every 11 hours of operation, which not only increases the additional polishing cost, but also significantly increases the consumption of spare parts. Moreover, once a new spare part is replaced, the SiC crystal growth furnace needs to be shut down for a one-hour baking process, which undoubtedly further increases the equipment cost and time loss. Utility Model Content

[0004] The purpose of the utility model is to provide a wafer carrying device and a semiconductor film forming device, so as to extend the maintenance period of the semiconductor film forming device, reduce the equipment use cost, and improve the wafer preparation efficiency.

[0005] In order to achieve the above objectives, the present invention is implemented through the following technical solutions:

[0006] A wafer carrying device comprises: a rotating cylinder body, the rotating cylinder body comprising a carrying surface and an extension surface surrounding the carrying surface. A tray is arranged on the carrying surface and is used to carry wafers. A rotating cylinder upper cover is arranged around the tray, and the rotating cylinder upper cover and the tray are spatially separated from each other. The rotating cylinder upper cover comprises an upper cover plate portion and a side edge portion connected to the upper cover plate portion, the upper cover plate portion at least partially covers the extension surface; the side edge portion is arranged around the outer side of the rotating cylinder body, and the side edge portion extends along the axial direction of the rotating cylinder body.

[0007] Optionally, a positioning protrusion is provided on the lower surface of the tray, and an opening matching the positioning protrusion is provided on the upper surface of the rotating cylinder body; the tray is positioned by the cooperation between the positioning protrusion and the opening; in the horizontal direction, there is a first gap between the outer side surface of the positioning protrusion and the side wall of the opening; there is a second gap between the inner side surface of the upper cover portion and the outer side surface of the tray; the second gap is larger than the first gap.

[0008] Optionally, the tray includes a heat spreader and a support ring, the support ring is used to support the wafer, the upper surface of the heat spreader includes a limiting structure, the limiting structure surrounds a recessed portion, and the support ring is at least partially located in the recessed portion.

[0009] Optionally, the support ring includes an extension portion extending radially outward, and an outer diameter of the extension portion is larger than an outer diameter of the limiting structure.

[0010] Optionally, a height difference between a lower surface of the extension portion and an upper surface of the upper cover portion is not less than 1.5 mm.

[0011] Optionally, the inner diameter of the rotating drum cover is not greater than the outer diameter of the extension part; or the inner diameter of the rotating drum cover is greater than the outer diameter of the extension part, and the difference between the inner diameter of the rotating drum cover and the outer diameter of the extension part is not greater than 1 mm.

[0012] Optionally, the rotating drum body includes: a drum portion and a support portion, wherein the support portion is arranged above the drum portion and connected to the drum portion; and the outer side of the support portion protrudes outwardly along the radial direction of the drum portion.

[0013] Optionally, the longitudinal section of the rotating drum upper cover is L-shaped.

[0014] Optionally, the bearing surface is lower than the extension surface.

[0015] Optionally, a through hole penetrating the support portion is provided on the extension surface, and the through hole is located below the upper cover portion.

[0016] Optionally, the rotating cylinder body includes a cylinder portion and a support portion, the support portion is arranged above the cylinder portion and connected to the cylinder portion, the cylinder portion includes an inwardly concave step portion, the step portion includes a step surface and a side surface, and the step portion is arranged around the extension surface; the bottom surface of the side edge portion of the rotating cylinder upper cover is mounted on the step surface.

[0017] Optionally, the outer diameter of the side edge portion is the same as the outer diameter of the cylindrical portion located below the step surface.

[0018] Optionally, the upper cover portion is spaced apart from the extension surface.

[0019] Optionally, a through hole penetrating the support portion is provided on the extension surface, and the through hole is located below the upper cover portion.

[0020] Optionally, the inner diameter of the side edge portion is greater than the outer diameter of the side surface of the step portion.

[0021] Optionally, a limiting assembly is provided between the step portion and the side edge portion.

[0022] Optionally, at least three groups of limiting components evenly arranged along the circumferential direction are provided between the step surface and the bottom surface of the side edge portion, and the limiting components are matching protrusions and recesses.

[0023] Optionally, it further includes: an outer ring, which is mounted on the outer edge of the tray; the outer ring at least partially covers the upper cover of the rotating drum.

[0024] Optionally, the outer diameter of the outer ring is not less than the outer diameter of the upper cover of the rotating drum.

[0025] Optionally, a stress release structure is provided on the upper surface of the upper cover plate portion.

[0026] Optionally, the stress release structure includes a first stress release groove and / or a second stress release groove; the first stress release grooves are arranged at circumferential intervals along the upper cover plate portion and extend radially along the upper cover plate portion; the second stress release grooves are annular and are arranged coaxially with the upper cover plate portion.

[0027] Optionally, the rotating drum body and the rotating drum upper cover are made of the same material.

[0028] On the other hand, the utility model also provides a semiconductor film forming device, comprising: a reaction chamber; a gas supply device, arranged at the top of the reaction chamber; a wafer carrier as described above, the wafer carrier is arranged at the bottom of the reaction chamber, opposite to the gas supply device; the gas supply device is used to provide the process gas required for film formation to the wafer carried by the wafer carrier.

[0029] Optionally, the semiconductor film forming device further includes an air intake device for supplying a purge gas into the rotating cylinder; the upper cover portion is spaced apart from the extension surface, and a through hole is provided on the extension surface.

[0030] Optionally, the semiconductor film forming apparatus further comprises a lift mechanism that can be raised and lowered, and when the lift mechanism is raised, it contacts the bottom of the tray to lift the tray so as to separate the tray from the carrying surface.

[0031] The utility model has the following technical effects:

[0032] The utility model provides a wafer carrying device that protects the rotating cylinder body from deposition by means of a rotating cylinder cover. And because the rotating cylinder cover does not need to be transferred when the disc is transferred, there is no need to worry about the generation of particulate matter when there is too much sediment on the rotating cylinder cover. The rotating cylinder cover does not need to undergo repeated thermal shock from process temperature to room temperature, and its service life is greatly improved. It is only necessary to replace the rotating cylinder cover when the machine is periodically maintained. The frequency of replacement of the rotating cylinder cover in this embodiment is significantly reduced, thereby extending the maintenance cycle of the semiconductor film forming device, reducing the cost of equipment use, and improving wafer preparation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 A schematic structural diagram of a wafer carrying device provided in one embodiment of the present invention;

[0034] Figure 2 A partially enlarged structural schematic diagram of a wafer carrying device provided in one embodiment of the present utility model;

[0035] Figure 3 A partially enlarged structural schematic diagram of a wafer carrying device provided in another embodiment of the present invention;

[0036] Figure 4 A partially enlarged structural schematic diagram of a wafer carrying device provided in another embodiment of the present invention;

[0037] Figure 5 A schematic structural diagram of a wafer carrier with a through hole provided in one embodiment of the present invention;

[0038] Figure 6 This is a schematic structural diagram of a semiconductor film forming device provided in one embodiment of the present invention. DETAILED DESCRIPTION

[0039] The following is a further detailed description of a wafer carrier device and a semiconductor film forming device proposed by the present invention in conjunction with the accompanying drawings and specific embodiments. According to the following description, the advantages and features of the present invention will be clearer. It should be noted that the drawings are in a very simplified form and use non-precise proportions, which are only used to conveniently and clearly assist in explaining the purpose of the implementation of the present invention. In order to make the purpose, features and advantages of the present invention more obvious and easy to understand, please refer to the drawings. It should be noted that the structure, proportion, size, etc. illustrated in the drawings of this specification are only used to match the content disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the implementation conditions of the present invention, so they have no technical substantive significance. Any structural modification, change in proportional relationship or adjustment of size, without affecting the efficacy and purpose that can be achieved by the present invention, should still fall within the scope of the technical content disclosed by the present invention.

[0040] like Figure 1 and Figure 2 As shown, this embodiment provides a wafer carrying device, including: a rotating cylinder body 100, the rotating cylinder body 100 including a carrying surface 1022 and an extension surface 1021 surrounding the carrying surface 1022. A tray 20 is arranged on the carrying surface 1022, for carrying a wafer 300. A rotating cylinder upper cover 101 is arranged around the tray 20, and the rotating cylinder upper cover 101 and the tray 20 are spatially separated from each other. The rotating cylinder upper cover 101 includes an upper cover plate portion 1004 and a side edge portion 1003 connected to the upper cover plate portion 1004, the upper cover plate portion 1004 at least partially covers the extension surface 1021; the side edge portion 1003 is arranged around the outer side of the rotating cylinder body 100, and the side edge portion 1003 extends along the axial direction of the rotating cylinder body 100.

[0041] In this embodiment, when the wafer 300 is processed and needs to be transferred to replace the tray 20, the rotating cylinder cover 101 remains on the rotating cylinder body 100 and does not move with the tray 20. This can prevent particles on the rotating cylinder cover 101 from falling onto the wafer 300, the process chamber, or the transfer chamber where the tray 20 passes or is located.

[0042] The arrangement of the upper cover plate portion 1004 of the rotating drum upper cover 101 can prevent the formation of deposits on at least a portion of the extension surface 1021 of the rotating drum body 100 .

[0043] The side edge portion 1003 of the rotating drum upper cover 101 can prevent sediment from forming on the outer side surface of the rotating drum body 100 .

[0044] That is, the wafer carrying device provided in this embodiment protects the outer side of the rotating cylinder body from being deposited by means of the rotating cylinder upper cover. And since the rotating cylinder upper cover does not need to be transferred when the disc is transferred, there is no need to worry about it generating particulate matter when the disc is transferred when there are too many deposits on the rotating cylinder upper cover. In addition, the temperature of the SiC epitaxial process is usually higher than 1500°C, and the temperature of the transfer chamber is generally room temperature. Therefore, leaving the upper cover inside the cavity of the semiconductor film forming device can avoid the rotating cylinder upper cover from experiencing repeated thermal shocks from process temperature to room temperature, thereby greatly improving its service life. It is only necessary to replace the rotating cylinder upper cover when the machine undergoes periodic maintenance (PM). The frequency of replacing the rotating cylinder upper cover in this embodiment is significantly reduced, so as to extend the maintenance cycle of the semiconductor film forming device, reduce the cost of equipment use, and improve wafer preparation efficiency.

[0045] Please continue to refer to Figure 2As shown, in this embodiment, the longitudinal cross-section of the rotating drum upper cover 101 is L-shaped. A positioning protrusion 2011 is provided on the lower surface of the tray 20, and an opening is provided on the upper surface of the rotating drum body 100 to match the positioning protrusion 2011. The positioning protrusion 2011 cooperates with the opening to position the tray 20. In some embodiments, the positioning protrusion 2011 is annular. Horizontally, a first gap d1 is defined between the outer side of the positioning protrusion 2011 and the sidewall of the opening. A second gap d2 is defined between the inner side of the upper cover portion 1004 and the outer side of the tray 20. The second gap d2 is greater than the first gap d1.

[0046] In this embodiment, since sediment may form within the second gap d2 during the epitaxial deposition process, the second gap d2 will continue to decrease. If the initial value of the second gap d2 is set too small, interference may occur between the inner side of the upper cover portion 1004 and the outer side of the tray 20 when placing and removing the tray 20. Furthermore, since the first gap d1 does not change, positioning using the first gap d1 is more effective than positioning using the second gap d2.

[0047] Please continue to refer to Figure 1 and Figure 2 As shown, in this embodiment, the tray 20 includes a uniform heating plate 201 and a support ring 202, the support ring 202 is used to support the wafer 300, the upper surface of the uniform heating plate 201 includes a limiting structure 2012, the limiting structure 2012 surrounds a recessed portion 2013, and the support ring 202 is at least partially located in the recessed portion 2013.

[0048] Please continue to refer to Figure 2 As shown, in this embodiment, the support ring 202 includes an extension portion 2021 extending radially outward, and the outer diameter of the extension portion 2021 is larger than the outer diameter of the limiting structure 2012. This can reduce the deposits formed on the outer side of the limiting structure 2012.

[0049] Please continue to refer to Figure 2 As shown, in this embodiment or some other embodiments, the inner diameter of the rotating drum upper cover 101 is not larger than the outer diameter of the extension portion 2021; thereby, the process gas entering the second gap d2 can be reduced, and the sediment formed in the second gap d2 can be reduced, which will not affect the operation of the robot conveying tray 20.

[0050] Alternatively, the inner diameter of the rotating drum cover 101 is larger than the outer diameter of the extension 2021, and the difference between the inner diameter of the rotating drum cover 101 and the outer diameter of the extension 2021 is no greater than 1 mm. This prevents deposits from growing on the rotating drum cover 101 from contacting the support ring 202. Consequently, the support ring 202 can maintain the circumferential height of the wafer 300, thereby maintaining the thickness uniformity of the thin film grown on the wafer and improving the wafer yield.

[0051] Please continue to refer to Figure 1 As shown, in this embodiment, the rotating cylinder body 100 includes: a cylinder portion 1001 and a support portion 1002, wherein the support portion 1002 is arranged above the cylinder portion 1001 and connected to the cylinder portion 1001; the outer side of the support portion 1002 protrudes outward radially along the cylinder portion 1001.

[0052] As can be seen, this structure can guide the purge gas located on the outer side of the cylindrical portion 1001, preventing the purge gas from diffusing toward the wafer 300 and affecting the main flow of process gas used in the diffusion process. In addition, this structure can further reduce the formation of reaction byproducts on the outer wall of the cylindrical portion 1001.

[0053] In this embodiment, the bearing surface 1022 may be lower than the extension surface 1021. In other embodiments, the bearing surface 1022 may be coplanar with the extension surface 1021.

[0054] like Figure 3 As shown, in some other embodiments, the rotating drum body 100 includes a drum portion 1001 and a support portion 1002. The support portion 1002 is disposed above and connected to the drum portion 1001. The drum portion 1001 includes an inwardly concave step portion, which includes a step surface 1024 and a side surface 1023. The step portion is disposed around the extension surface 1021. The bottom surface of the side edge portion 1003 of the rotating drum upper cover 101 rests on the step surface 1024. This increases the distance between the lower surface of the extension portion 2021 and the upper surface of the upper cover plate 1004.

[0055] Preferably, the height difference between the lower surface of the extension portion 2021 and the upper surface of the upper cover portion 1004 is not less than 1.5 mm.

[0056] As can be seen, the increased distance between the lower surface of the extension 2021 and the upper surface of the upper cover 1004 allows for thicker sediment to be accommodated, thereby extending the processing cycle of the rotating drum upper cover 101. Furthermore, in this embodiment, the height difference between the lower surface of the extension 2021 and the upper surface of the upper cover 1004 is no less than 1.5 mm, allowing the rotating drum upper cover 101 to be grown 100 times before replacement, thus reducing the frequency of maintenance for the rotating drum upper cover 101.

[0057] Please continue to refer to Figure 3 As shown, the bearing surface 1022 is coplanar with the extension surface 1021 , and the outer diameter of the side edge portion 1003 is the same as the outer diameter of the cylindrical portion 1001 located below the step surface 1024 .

[0058] It is understood that in this embodiment, the integrated rotating drum 10 can be considered to be divided into a separate rotating drum cover 101 and a rotating drum body 100. That is, the rotating drum cover 101 is equivalent to the rotating drum body 100 interlocking with each other to form a rotating drum 10 structure. The arrangement of this structure can reasonably occupy the space of the reaction chamber and does not affect the airflow path of the purge gas on the outer wall of the rotating drum 10. In other words, it does not affect the purge gas from reaching the edge of the upper cover plate portion 1004 and the side of the side edge portion 1003, thereby suppressing the formation of deposits.

[0059] In this embodiment, the upper cover plate portion 1004 and the extension surface 1021 can be spaced apart. As can be seen, since heat radiation is applied between the upper cover plate portion 1004 and the extension surface 1021, the temperature of the upper cover plate portion 1004 is relatively uniform, and thus the thickness of the deposits grown on the upper cover plate portion 1004 is relatively uniform. The stress on the upper cover plate portion 1004 is also relatively uniform, and thus the upper cover 101 is not likely to crack.

[0060] In this embodiment, please continue to refer to Figure 3 As shown, the inner diameter of the side edge portion 1003 is larger than the outer diameter of the side surface 1023 of the step portion, thereby preventing the cylinder body 1001 from expanding due to heat and cracking the upper cover 101 of the rotating cylinder.

[0061] In this embodiment or some other embodiments, a limiting component ( Figure 3 (not shown in the figure), used for positioning between the rotating drum upper cover 101 and the side surface 1023 of the step portion.

[0062] In this embodiment or some other embodiments, at least three groups of limiting components evenly arranged along the circumference are provided between the step surface 1024 and the bottom surface of the side edge portion 1003 , and the limiting components are matching protrusions and recesses.

[0063] Please continue to refer to Figure 3As shown, in this embodiment or some other embodiments, the outer wall of the upper cover plate portion 1004 adopts a rounded corner α transition, so that the thickness of the deposits formed on the upper cover plate portion 1004 is relatively uniform, and the stress on the upper cover plate portion 1004 is also relatively uniform. If a right-angle transition is adopted, deposits will quickly accumulate at the right angle, resulting in uneven stress on the upper cover plate portion 1004 and affecting airflow.

[0064] like Figure 4 As shown, in some other embodiments, the wafer carrier further includes an outer ring 103 mounted on the outer edge of the tray 20; the outer ring 103 at least partially covers the rotating drum cover 101. Specifically, the retaining structure 2012 on the heat spreader 201 includes an outer edge 2014, and the outer ring 103 is mounted on the outer edge 2014 of the retaining structure 2012. This can reduce the formation of deposits on the rotating drum cover 101 and extend the maintenance cycle of the rotating drum cover 101.

[0065] Please continue to refer to Figure 4 As shown, in some other embodiments, the outer diameter of the outer ring 103 is not less than the outer diameter of the rotating drum cover 101. This further reduces the sediment formed in the outer area of the rotating drum cover 101 and extends the maintenance cycle of the rotating drum cover 101.

[0066] Please continue to refer to Figure 2 As shown, in some other embodiments, a stress release structure 102 is provided on the upper surface of the upper cover portion 1004 to release stress.

[0067] Preferably, the stress release structure 102 includes a first stress release groove arranged at intervals along the circumference of the upper cover plate portion 1004, and the first stress release groove extends radially along the upper cover plate portion 1004. The second stress release groove is annular and is coaxially arranged with the upper cover plate portion 1004. The second stress release groove intersects with the first stress release groove, so that the deposits formed on the upper cover plate portion 1004 can be divided into multiple pieces by the stress release structure 102, rather than a whole film with a dense and compact structure, thereby releasing the stress applied to the upper cover plate portion 1004 without damaging the upper cover plate portion 1004, extending its service life, and reducing equipment costs. In some embodiments, the stress release structure 102 includes a first stress release groove and / or a second stress release groove. The stress release structure is not limited to applications such as Figure 2 In the embodiment shown, Figure 3 or Figure 4 The same applies to the above-described embodiments.

[0068] In this embodiment or some other embodiments, the rotating drum body 100 and the rotating drum cover 101 are made of the same material, for example, graphite. The rotating drum cover 101 and the rotating drum body 100 are made of the same material to avoid cracking caused by differences in thermal expansion coefficients.

[0069] like Figure 5 As shown, in some other embodiments, the extension surface 1021 is provided with a through hole 1007 penetrating the support portion 1002, and the through hole 1007 is located below the upper cover portion 1004. Thus, the purge gas introduced into the interior of the rotating cylinder 10 flows out from the through hole 1007, is homogenized in the gap between the upper cover portion 1004 and the extension surface 1021, and then flows out from the second gap d2, which can further reduce the formation of deposits in the second gap d2. Figure 3 or Figure 4 In the embodiment described above, a through hole 1007 penetrating the support portion 1002 may also be provided on the extension surface 1021 .

[0070] On the other hand, Figure 6 As shown, the present invention further provides a semiconductor film forming apparatus, comprising: a reaction chamber 40; and a gas supply device 41 disposed at the top of the reaction chamber 40. As described above, the wafer carrier is disposed at the bottom of the reaction chamber 40, opposite the gas supply device 41. The gas supply device 41 is configured to supply process gases required for film formation to the wafer 300 carried by the wafer carrier. For example, the thin film formed on the wafer is a SiC film.

[0071] Please continue to refer to Figure 6 As shown, in this embodiment, the semiconductor film forming device also includes an air intake device 43 for supplying a purge gas into the rotating cylinder 10; the purge gas introduced into the interior of the rotating cylinder 10 flows out from the through hole 1007, and after being uniformed in the gap between the upper cover plate portion 1004 and the extension surface 1021, flows out from the second gap d2, which can further reduce the formation of deposits in the second gap d2.

[0072] Please continue to refer to Figure 6 As shown, in this embodiment, the semiconductor film forming apparatus further includes a lift mechanism 44 that can be raised and lowered. When the lift mechanism 44 is raised, it contacts the bottom of the tray 20 (specifically, the uniform heating plate 201 in the tray 20) to lift the tray 20 so that the tray 20 is aligned with the carrying surface ( Figure 2 The winning bid number is 1022) and the disk transfer operation is realized.

[0073] Please continue to refer to Figure 6As shown, the tray 20 in this embodiment further includes a center plate 203. The center of the heat-distributing plate 201 is provided with an opening, and the center plate 203 is disposed on the opening. When the plate is transferred, the wafer 300, the center plate 203, and the heat-distributing plate 201 are transferred in or out together. In this embodiment, the semiconductor film forming apparatus further includes an inner ring (liner) 42 disposed at the bottom of the reaction chamber 40 and surrounding the outer wall of the rotating drum 10. The gap between the inner wall of the inner ring 42 and the outer wall of the rotating drum 10 forms an airflow path for the purge gas.

[0074] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply the existence of any such actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of other identical elements in the process, method, article, or device comprising the element.

[0075] In the description of the present invention, it should be understood that the terms "center," "height," "thickness," "up," "down," "vertical," "horizontal," "top," "bottom," "inside," "outside," "axial," "radial," "circumferential," and the like, indicating positions or location relationships, are based on the positions or location relationships shown in the accompanying drawings and are intended solely to facilitate the description of the present invention and simplify the description. They do not indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the present invention. In the description of the present invention, unless otherwise specified, "plurality" means two or more.

[0076] In the description of this utility model, unless otherwise expressly specified or limited, the terms "installed," "connected," "connected," and "fixed" should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on the specific circumstances.

[0077] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0078] Although the present invention has been described in detail through the above preferred embodiments, it should be understood that the above description should not be considered as limiting the present invention. After reading the above description, various modifications and alternatives to the present invention will be readily apparent to those skilled in the art. Therefore, the scope of protection of the present invention shall be defined by the appended claims.

Claims

1. A wafer carrying device, characterized in that: include: A rotating drum body, the rotating drum body comprising a bearing surface and an extension surface surrounding the bearing surface; A tray, arranged on the carrying surface, for carrying wafers; A rotating drum cover is disposed around the tray, and the rotating drum cover and the tray are spatially separated from each other; The rotating drum upper cover includes an upper cover plate portion and a side edge portion connected to the upper cover plate portion, wherein the upper cover plate portion at least partially covers the extension surface; the side edge portion is arranged around the outer side of the rotating drum body and extends along the axial direction of the rotating drum body.

2. The wafer carrier device according to claim 1, wherein: The lower surface of the tray is provided with a positioning protrusion. The upper surface of the rotating drum body is provided with an opening that matches the positioning protrusion; the positioning protrusion cooperates with the opening to position the tray; In the horizontal direction, there is a first gap between the outer side surface of the positioning protrusion and the side wall of the opening; there is a second gap between the inner side surface of the upper cover portion and the outer side surface of the tray; and the second gap is larger than the first gap.

3. The wafer carrier device according to claim 1, wherein: The tray includes a heat spreader and a support ring, the support ring is used to carry the wafer, the upper surface of the heat spreader includes a limiting structure, the limiting structure surrounds a recessed portion, and the support ring is at least partially located in the recessed portion.

4. The wafer carrier device according to claim 3, wherein: The support ring includes an extending portion extending radially outward, and an outer diameter of the extending portion is greater than an outer diameter of the limiting structure.

5. The wafer carrier device according to claim 4, wherein: A height difference between a lower surface of the extension portion and an upper surface of the upper cover portion is not less than 1.5 mm.

6. The wafer carrier device according to claim 4, wherein: The inner diameter of the rotating drum cover is not greater than the outer diameter of the extension portion; or the inner diameter of the rotating drum cover is greater than the outer diameter of the extension portion, and the difference between the inner diameter of the rotating drum cover and the outer diameter of the extension portion is not greater than 1 mm.

7. The wafer carrier device according to any one of claims 1 to 6, wherein: include The rotating drum body comprises: a drum portion and a support portion, wherein the support portion is arranged above the drum portion and connected to the drum portion; The outer side of the support portion protrudes outward in the radial direction of the cylindrical portion.

8. The wafer carrier device according to claim 7, wherein: The longitudinal section of the rotating drum upper cover is L-shaped.

9. The wafer carrying device according to claim 8, wherein: The bearing surface is lower than the extension surface.

10. The wafer carrier device according to claim 9, wherein: A through hole penetrating the support portion is provided on the extension surface, and the through hole is located below the upper cover portion.

11. The wafer carrier device according to any one of claims 1 to 6, wherein: The rotating cylinder body includes a cylinder portion and a support portion, wherein the support portion is arranged above the cylinder portion and connected to the cylinder portion, the cylinder portion includes an inwardly concave step portion, the step portion includes a step surface and a side surface, and the step portion is arranged around the extension surface; The bottom surface of the side edge portion of the rotating drum upper cover is placed on the stepped surface.

12. The wafer carrier device according to claim 11, wherein: The outer diameter of the side edge portion is the same as the outer diameter of the cylindrical portion located below the step surface.

13. The wafer carrier device according to claim 11, wherein: The upper cover portion is spaced apart from the extension surface.

14. The wafer carrying device according to claim 13, wherein: A through hole penetrating the support portion is provided on the extension surface, and the through hole is located below the upper cover portion.

15. The wafer carrying device according to claim 11, wherein: The inner diameter of the side edge portion is greater than the outer diameter of the side surface of the step portion.

16. The wafer carrying device according to claim 15, wherein: A limiting component is provided between the step portion and the side edge portion.

17. The wafer carrier device according to claim 16, wherein: At least three groups of limiting components evenly arranged along the circumferential direction are provided between the step surface and the bottom surface of the side edge portion, and the limiting components are matching protrusions and recesses.

18. The wafer carrier device according to claim 11, wherein: Also includes: The outer ring is mounted on the outer edge of the tray; the outer ring at least partially covers the upper cover of the rotating drum.

19. The wafer carrier device according to claim 18, wherein: The outer diameter of the outer ring is not less than the outer diameter of the upper cover of the rotating drum.

20. The wafer carrier device according to claim 1, wherein: The upper surface of the upper cover plate is provided with a stress release structure.

21. The wafer carrier device according to claim 20, wherein: The stress release structure includes a first stress release groove and / or a second stress release groove; the first stress release grooves are arranged at intervals along the circumference of the upper cover plate portion and extend along the radial direction of the upper cover plate portion; The second stress release groove is annular and is coaxially arranged with the upper cover plate portion.

22. The wafer carrier device according to claim 1, wherein: The rotating drum body and the rotating drum upper cover are made of the same material.

23. A semiconductor film forming device, characterized in that: include: reaction chamber; a gas supply device, arranged at the top of the reaction chamber; The wafer carrier device according to any one of claims 1 to 22, wherein the wafer carrier device is arranged at the bottom of the reaction chamber and is arranged opposite to the gas supply device; the gas supply device is used to provide the process gas required for film formation to the wafer carried by the wafer carrier device.

24. The semiconductor film forming apparatus according to claim 23, wherein: The semiconductor film forming device further includes an air intake device for supplying a purge gas into the rotating cylinder; the upper cover portion is spaced apart from the extension surface, and a through hole is provided on the extension surface.

25. The semiconductor film forming apparatus according to claim 24, wherein: The semiconductor film forming apparatus further includes a lifting mechanism that can be raised and lowered. When the lifting mechanism is raised, it contacts the bottom of the tray to lift the tray and separate the tray from the carrying surface.

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