Miniaturized acousto-optic device

By setting up a matching circuit for acousto-optical crystals, piezoelectric transducers and horizontally placed in the acousto-optical device, the problem of excessive size of the acousto-optical device is solved, and the device is miniaturized and integrated design is realized.

CN223205731UActive Publication Date: 2025-08-08FUJIAN CASTECH CRYSTALS
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Patent Information

Application Number
CN202422573844.7
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-10-24
Publication Date
2025-08-08
Estimated Expiration
2034-10-24

AI Technical Summary

Technical Problem

The existing acousto-optical device products are large in size, which is not conducive to miniaturized design.

Method used

A miniaturized acousto-optical device is designed. By providing acousto-optical crystals, piezoelectric transducers and matching circuits in the housing, the piezoelectric transducers excite ultrasonic waves to modulate the beam, and the matching circuit is placed horizontally along its thickness direction to shorten the device size.

Benefits of technology

The compact structure and miniaturized design of acousto-optical devices are realized, and the degree of integration is improved.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to a miniaturized acousto-optic device which comprises a shell, an acousto-optic crystal, a piezoelectric transducer and a matching circuit, a containing cavity is defined by the shell, and an input optical fiber and an output optical fiber are arranged at the two ends of the shell in the first direction respectively. The acousto-optic crystal is arranged in the containing cavity, light emitted by the input optical fiber can pass through the acousto-optic crystal and then is collected by the output optical fiber, the piezoelectric transducer is arranged on one side of the acousto-optic crystal, and the matching circuit is arranged on the side, away from the acousto-optic crystal, of the piezoelectric transducer and electrically connected to the piezoelectric transducer. The matching circuit is used for applying a radio frequency electric signal to the piezoelectric transducer to enable the piezoelectric transducer to excite ultrasonic waves, the matching circuit is arranged towards the bottom wall of the containing cavity along one side of the thickness direction of the matching circuit, and the first direction intersects with the direction, pointing to the bottom wall, of the top wall of the containing cavity. The miniaturized acousto-optic device is more compact in structure and smaller in size, and the integration and miniaturization design of the miniaturized acousto-optic device can be improved.
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Description

Technical Field

[0001] The present application relates to the technical field of acousto-optic devices, and in particular to a miniaturized acousto-optic device. Background Art

[0002] An acousto-optic device uses the acousto-optic effect to control a light beam, changing its intensity, direction, frequency, and other characteristics. The device operates by causing periodic changes in the refractive index of a medium through ultrasonic waves propagating through it, thereby causing the light waves passing through the medium to diffract.

[0003] The size of the acousto-optic device products in the related art is large, which is not conducive to miniaturization design. Utility Model Content

[0004] Based on this, it is necessary to provide a miniaturized acousto-optic device to address the problem that the acousto-optic device products in the related art are large in size and not conducive to miniaturized design.

[0005] A miniaturized acousto-optic device, comprising:

[0006] A housing defines a receiving cavity, wherein the housing is provided with an input optical fiber and an output optical fiber at two ends along a first direction respectively;

[0007] an acousto-optic crystal disposed in the accommodating cavity, and light emitted from the input optical fiber can be collected by the output optical fiber after passing through the acousto-optic crystal;

[0008] a piezoelectric transducer pointing from the top wall of the accommodating cavity to the bottom wall of the accommodating cavity, the piezoelectric transducer being disposed on one side of the acousto-optic crystal; and

[0009] a matching circuit, extending along the top wall of the accommodating cavity toward the bottom wall of the accommodating cavity, the matching circuit being disposed on a side of the piezoelectric transducer facing away from the acousto-optic crystal and electrically connected to the piezoelectric transducer, the matching circuit being configured to apply a radio frequency electrical signal to the piezoelectric transducer to cause the piezoelectric transducer to excite ultrasonic waves;

[0010] Wherein, the matching circuit is arranged with one side along the thickness direction thereof facing the top wall of the accommodating cavity, and the other side along the thickness direction thereof facing the bottom wall of the accommodating cavity;

[0011] The first direction and a direction from the top wall of the accommodating cavity to the bottom wall of the accommodating cavity intersect with each other.

[0012] In one embodiment, the miniaturized acousto-optic device further includes a mounting structure connected between the matching circuit and a cavity wall of the accommodating cavity;

[0013] The cavity wall of the accommodating cavity includes the top wall, the bottom wall, and a peripheral wall connected between the top wall and the bottom wall.

[0014] In one embodiment, the matching circuit includes a top side surface and a bottom side surface arranged opposite to each other along the thickness direction thereof, and a peripheral side surface connected between the top side surface and the bottom side surface; the top side surface is arranged toward the top wall of the accommodating cavity, the bottom side surface is arranged toward the bottom wall of the accommodating cavity; and the peripheral side surface is arranged toward the peripheral wall of the accommodating cavity;

[0015] The mounting structure is connected between the peripheral wall and the peripheral side surface of the matching circuit.

[0016] In one embodiment, the matching circuit includes a top side surface and a bottom side surface disposed opposite to each other along a thickness direction of the matching circuit;

[0017] The mounting structure is connected between the bottom wall and the bottom side surface of the matching circuit.

[0018] In one embodiment, along the direction from the top wall of the accommodating cavity to the bottom wall, the thickness x of the matching circuit satisfies: 1 mm ≤ x ≤ 2.5 mm.

[0019] In one embodiment, 1.5 mm ≤ x ≤ 2 mm.

[0020] In one embodiment, along the direction from the top wall of the accommodating cavity to the bottom wall, the distance h between the top wall and the bottom wall satisfies: 12 mm ≤ h ≤ 15 mm.

[0021] In one embodiment, the miniaturized acousto-optic device further includes a driving circuit, which is disposed outside the housing and electrically connected to the matching circuit through the bottom wall of the accommodating cavity.

[0022] In one embodiment, the miniaturized acousto-optic device further includes an electrode lead, wherein the electrode lead is electrically connected between the matching circuit and the piezoelectric transducer.

[0023] In one embodiment, the miniaturized acousto-optic device further includes an input collimator and an output collimator. The input collimator is disposed between the input optical fiber and the acousto-optic crystal along the propagation direction of the light emitted from the input optical fiber, and the output collimator is disposed between the output optical fiber and the acousto-optic crystal along the propagation direction of the first-order diffraction light emitted from the acousto-optic crystal.

[0024] The above-mentioned miniaturized acousto-optic device is arranged in sequence along the direction from the top wall to the bottom wall of the accommodating cavity, and the acousto-optic crystal, the piezoelectric transducer and the matching circuit are arranged. Compared with the matching circuit having one side along the thickness direction facing the peripheral wall of the accommodating cavity, the present application makes the matching circuit have one side along the thickness direction facing the bottom wall of the accommodating cavity. It can be understood that placing the matching circuit horizontally shortens the size of the miniaturized acousto-optic device along the direction from the top wall to the bottom wall of the accommodating cavity, making the miniaturized acousto-optic device more compact in structure and smaller in size, which is conducive to improving its integration and miniaturization design. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 Schematic diagram of the structure of a miniaturized acousto-optic device in one embodiment of the present application.

[0026] Figure 2 for Figure 1 A schematic structural diagram of the embodiment in which the matching circuit of the miniaturized acousto-optic device is arranged along one side of the thickness direction thereof toward the peripheral wall of the accommodation cavity.

[0027] Description of Figure Numbers:

[0028] 10. Miniaturized acousto-optic devices;

[0029] 100, housing; 110, accommodating chamber; 111, top wall; 112, bottom wall; 113, peripheral wall;

[0030] 210, input optical fiber; 220, output optical fiber; 211, input collimator; 221, output collimator;

[0031] 300, Acousto-optic crystal;

[0032] 400, piezoelectric transducer;

[0033] 500, matching circuit; 510, top side; 520, bottom side; 530, peripheral side;

[0034] 600, driving circuit connection terminal;

[0035] F1, first direction. DETAILED DESCRIPTION

[0036] To make the above-mentioned objects, features, and advantages of the present application more clearly understood, the specific embodiments of the present application are described in detail below with reference to the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways than those described herein, and those skilled in the art can make similar improvements without violating the scope of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.

[0037] In the description of this application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0038] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of technical features indicated. Therefore, a feature specified as "first" or "second" may explicitly or implicitly include at least one of such features. In the description of this application, if the term "plurality" appears, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0039] In this application, unless otherwise specified or limited, the terms "mounted," "connected," "connected," "fixed," etc., should be interpreted broadly. For example, these terms may refer to fixed connections, removable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediary; and internal communication between two components or interaction between two components, unless otherwise specified. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0040] In this application, unless otherwise expressly specified or limited, if a first feature is described as being "above" or "below" a second feature, or similar descriptions, this may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Furthermore, when a first feature is described as being "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is described as being "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0041] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only embodiment.

[0042] The operating principle of acousto-optic devices is based on the acousto-optic effect, which utilizes the principle of acousto-optic interaction. In other words, its operating principle is that ultrasound propagating through a medium causes periodic changes in the medium's refractive index, thereby causing the light waves passing through the medium to diffract.

[0043] Acousto-optic devices have a wide range of applications, including laser technology, network communications, radar spectrum analysis, optical signal processing, light detection technology, and medical imaging. With advances in acousto-optic material preparation technology and innovations in device design, the performance of acousto-optic devices continues to improve, and their application areas are also expanding.

[0044] Acousto-optic devices have the advantages of fast response, precise control, high diffraction efficiency and high signal-to-noise ratio. However, the acousto-optic devices in related technologies have the problem of large product size, which is not conducive to miniaturization design.

[0045] Based on this, the present application provides a miniaturized acousto-optic device 10. Compared with the acousto-optic devices in the related art, the overall size of the miniaturized acousto-optic device 10 of the present application is greatly reduced, which is conducive to the miniaturized design of the acousto-optic device.

[0046] See Figure 1 As shown, Figure 1 Schematic diagram of the structure of a miniaturized acousto-optic device in one embodiment of the present application. The miniaturized acousto-optic device 10 provided in the present application includes a housing 100, which defines a housing 110. The miniaturized acousto-optic device 10 also includes an acousto-optic crystal 300, a piezoelectric transducer 400, and a matching circuit 500 disposed within the housing 110. An input optical fiber 210 and an output optical fiber 220 are provided at both ends of the housing 100 along a first direction F1. The input optical fiber 210 is used to emit laser light, or in other words, to input light into the acousto-optic crystal 300 within the housing 110. The acousto-optic crystal 300 is disposed between the input optical fiber 210 and the output optical fiber 220. The light emitted by the input optical fiber 210 can pass through the acousto-optic crystal 300 and be collected by the output optical fiber 220.

[0047] The piezoelectric transducer 400 is disposed on one side of the acousto-optic crystal 300, along a direction from the top wall 111 of the accommodating chamber 110 toward the bottom wall 112. The matching circuit 500 is disposed on a side of the piezoelectric transducer 400 facing away from the acousto-optic crystal 300 and is electrically connected to the piezoelectric transducer 400. The matching circuit 500 is configured to apply a radio frequency electrical signal to the piezoelectric transducer 400, causing the piezoelectric transducer 400 to excite ultrasonic waves. The first direction F1 intersects with the direction from the top wall 111 of the accommodating chamber 110 toward the bottom wall 112.

[0048] It can be understood that the operating principle of the miniaturized acousto-optic device 10 of the present application is as follows: the matching circuit 500 outputs a radio frequency electrical signal to the piezoelectric transducer 400. The radio frequency electrical signal is applied to the piezoelectric transducer 400, exciting the piezoelectric transducer 400 to generate ultrasonic waves of the same frequency, which then enter the acousto-optic crystal 300. The ultrasonic waves periodically modulate the optical refractive index of the acousto-optic crystal 300, causing the acousto-optic crystal 300 to form an equivalent phase grating. The grating spacing is equal to the wavelength of the ultrasonic wave. When light, or a laser beam, emitted from the input optical fiber 210 enters the acousto-optic crystal 300 at the Bragg angle, the laser beam diffracts. The first-order diffracted light is collected by the output optical fiber 220, thereby achieving modulation of the laser beam. The excitation of ultrasonic waves by the piezoelectric transducer 400 is based on the piezoelectric effect. That is, when an electric field is applied to a piezoelectric material, the material deforms, generating mechanical vibrations. These vibrations propagate through a medium (such as air or water), generating ultrasonic waves. When the laser beam enters the acousto-optic crystal 300 at an incident angle of the Bragg angle, the intensity of the diffracted laser beam can be controlled by adjusting the radio frequency power of the radio frequency electrical signal.

[0049] Continue reading Figure 1 The matching circuit 500 is disposed with one side thereof in the thickness direction facing the top wall 111 of the accommodating cavity 110, and the other side thereof in the thickness direction facing the bottom wall 112 of the accommodating cavity 110. Figure 2 As shown, Figure 2 for Figure 1 The structural diagram of the matching circuit of the miniaturized acousto-optic device in the embodiment shown is arranged along one side of its thickness direction toward the peripheral wall of the accommodating cavity. Figure 2 In the embodiment, the matching circuit 500 is disposed with one side of its thickness direction facing the peripheral wall 113 of the accommodating cavity 110. In the present application, the matching circuit 500 is disposed with one side of its thickness direction facing the bottom wall 112 of the accommodating cavity 110, which can effectively shorten the dimension of the miniaturized acousto-optic device 10 along the direction from the top wall 111 to the bottom wall 112 of the accommodating cavity 110. Shortening the dimension of the matching circuit 500 along the direction from the top wall 111 to the bottom wall 112 of the accommodating cavity 110 facilitates the miniaturized design of the miniaturized acousto-optic device 10.

[0050] The miniaturized acousto-optic device 10 of the present application is sequentially arranged with an acousto-optic crystal 300, a piezoelectric transducer 400, and a matching circuit 500 along the direction from the top wall 111 of the accommodating cavity 110 to the bottom wall 112. In contrast to the arrangement in which one side of the matching circuit 500 along its thickness direction faces the peripheral wall 113 of the accommodating cavity 110, the present application arranges one side of the matching circuit 500 along its thickness direction toward the bottom wall 112 of the accommodating cavity 110. It can be understood that placing the matching circuit 500 horizontally shortens the dimension of the miniaturized acousto-optic device 10 along the direction from the top wall 111 of the accommodating cavity 110 to the bottom wall 112, making the miniaturized acousto-optic device 10 more compact and smaller in size, thereby improving its integration and miniaturization design.

[0051] In some embodiments, the miniaturized acousto-optic device 10 further includes a mounting structure connected between the matching circuit 500 and the wall of the accommodating cavity 110. Specifically, the mounting structure is used to secure the matching circuit 500 within the accommodating cavity 110. The wall of the accommodating cavity 110 includes a top wall 111, a bottom wall 112, and a peripheral wall 113 connected between the top wall 111 and the bottom wall 112. The mounting structure secures the matching circuit 500 to the wall of the accommodating cavity 110, ensuring a secure fixation of the matching circuit 500. This prevents shaking of the matching circuit 500 from affecting the modulation of the laser beam by the acousto-optic crystal 300, thereby improving the modulation effect of the miniaturized acousto-optic device 10 on the laser beam.

[0052] In some embodiments, the mounting structure may be a structure such as a bolt, and is not limited to a specific connection form of the mounting structure, which will not be described in detail here.

[0053] In some embodiments, the matching circuit 500 includes a top side surface 510 and a bottom side surface 520 that are opposite to each other along its thickness, and a peripheral side surface 530 connected between the top side surface 510 and the bottom side surface 520. The top side surface 510 is disposed toward the top wall 111 of the accommodating cavity 110, the bottom side surface 520 is disposed toward the bottom wall 112 of the accommodating cavity 110, and the peripheral side surface 530 is disposed toward the peripheral wall 113 of the accommodating cavity 110. Thus, if the direction from the top wall 111 to the bottom wall 112 of the accommodating cavity 110 is taken as the longitudinal direction, the matching circuit 500 can be placed horizontally within the accommodating cavity 110, thereby shortening the dimension of the miniaturized acousto-optic device 10 along the direction from the top wall 111 to the bottom wall 112 of the accommodating cavity 110, thereby making the miniaturized acousto-optic device 10 more compact and smaller in size.

[0054] In some embodiments, the mounting structure is connected between the bottom wall 112 and the bottom side 520 of the matching circuit 500. This allows the matching circuit 500 to be securely mounted relative to the housing 100, facilitates support for the matching circuit 500 by the bottom of the housing 100, improves mounting stability, and facilitates enhancing the laser beam modulation effect of the miniaturized acousto-optic device 10.

[0055] In some embodiments, the mounting structure is connected between the peripheral wall 113 and the peripheral side surface 530 of the matching circuit 500. It can be understood that, compared to providing the mounting structure between the bottom wall 112 and the bottom side surface 520 of the matching circuit 500, connecting the peripheral side surface 530 of the matching circuit 500 to the peripheral wall 113 of the accommodating cavity 110 can avoid the gap between the bottom side surface 520 of the matching circuit 500 and the bottom wall 112 of the accommodating cavity 110 due to the mounting structure, which would result in an increase in the size of the miniaturized acousto-optic device 10 along the direction from the top wall 111 of the accommodating cavity 110 to the bottom wall 112. In other words, the mounting structure is arranged between the peripheral wall 113 and the peripheral side surface 530 of the matching circuit 500, so that the bottom side surface 520 of the matching circuit 500 can be fitted with the bottom wall 112 of the accommodating cavity 110 without any gap between the two, thereby facilitating the shortening of the dimension of the miniaturized acousto-optic device 10 along the direction from the top wall 111 of the accommodating cavity 110 to the bottom wall 112, making the miniaturized acousto-optic device 10 more compact in structure and smaller in size.

[0056] In some embodiments, as Figure 1 As shown, along the direction from the top wall 111 to the bottom wall 112 of the accommodating cavity 110, the thickness x of the matching circuit 500 satisfies: 1mm≤x≤2.5mm. Figure 2 In the installation method of the matching circuit 500 in the embodiment, the width h of the matching circuit 500 along the direction from the top wall 111 of the accommodating cavity 110 to the bottom wall 112 is approximately 11 mm. Obviously, the size of the miniaturized acousto-optic device 10 of the present application is greatly reduced, which is conducive to the miniaturized design of the miniaturized acousto-optic device 10.

[0057] Preferably, the thickness x of the matching circuit 500 is within the range of 1.5 mm ≤ x ≤ 2 mm. Thus, it can be understood that the horizontal arrangement of the matching circuit 500 of the present application shortens the dimension of the miniaturized acousto-optic device 10 in the direction from the top wall 111 to the bottom wall 112 of the accommodating cavity 110 by 9 mm to 9.5 mm, equivalent to a 39% reduction, significantly reducing the size of the miniaturized acousto-optic device 10.

[0058] In some embodiments, as Figure 1 As shown, along the direction from the top wall 111 to the bottom wall 112 of the accommodating cavity 110, the dimension h of the accommodating cavity 110, or the distance h between the top wall 111 and the bottom wall 112, satisfies the following: 12 mm ≤ h ≤ 15 mm. This means that the dimension of the miniaturized acousto-optic device 10 of the present application along the direction from the top wall 111 to the bottom wall 112 of the accommodating cavity 110 can be reduced to 12 mm-15 mm. This significantly reduces the size of the miniaturized acousto-optic device 10 of the present application, making the product more compact.

[0059] In some embodiments, as Figure 1The miniaturized acousto-optic device 10 also includes a drive circuit, which is disposed outside the housing 100 and electrically connected to the matching circuit 500 through the bottom wall 112 of the accommodating cavity 110. A drive circuit connection terminal 600 is provided on the outer bottom surface of the housing 100, enabling the drive circuit to be electrically connected to the matching circuit 500 through the bottom wall 112 of the accommodating cavity 110. It will be understood that the drive circuit is used to provide a radio frequency (RF) electrical signal, and the matching circuit 500 primarily ensures impedance matching between the piezoelectric transducer 400 and the drive circuit, thereby maximizing energy transmission and reducing signal reflection and loss.

[0060] In some embodiments, the miniaturized acousto-optic device 10 further includes electrode leads electrically connected between the matching circuit 500 and the piezoelectric transducer 400 , thereby enabling the matching circuit 500 to output a radio frequency electrical signal to the piezoelectric transducer 400 .

[0061] In some embodiments, the miniaturized acousto-optic device 10 further includes an input collimator 211 and an output collimator 221. The input collimator 211 is disposed between the input optical fiber 210 and the acousto-optic crystal 300 along the propagation direction of the light emitted from the input optical fiber 210, and the output collimator 221 is disposed between the output optical fiber 220 and the acousto-optic crystal 300 along the propagation direction of the first-order diffracted light emitted from the acousto-optic crystal 300. In other words, the input collimator 211 is connected to the light-emitting side of the input optical fiber 210 facing the accommodating cavity 110, and allows the light emitted from the input optical fiber 210 to be incident on the acousto-optic crystal 300 at a Bragg angle. The output collimator 221 is connected to the light-entering side of the output optical fiber 220 facing the accommodating cavity 110, and is configured to receive the first-order diffracted light passing through the acousto-optic crystal 300 and direct it into the output optical fiber 220 for propagation.

[0062] In some embodiments, the input collimator 211 and the output collimator 221 are arranged on both sides of the shell 100 along the first direction F1, and are both located outside the shell 100. This facilitates the replacement of the input collimator 211 and the output collimator 221, reduces the required size of the accommodating cavity 110, and helps to reduce the size of the accommodating cavity 110 along the first direction F1. The input collimator 211 and the output collimator 221 can extend outside the shell 100, which helps to reduce the overall size of the miniaturized acousto-optic device 10.

[0063] The miniaturized acousto-optic device 10 of the present application is sequentially arranged with an acousto-optic crystal 300, a piezoelectric transducer 400, and a matching circuit 500 along the direction from the top wall 111 of the accommodating cavity 110 to the bottom wall 112. In contrast to the arrangement in which one side of the matching circuit 500 along its thickness direction faces the peripheral wall 113 of the accommodating cavity 110, the present application arranges one side of the matching circuit 500 along its thickness direction toward the bottom wall 112 of the accommodating cavity 110. It can be understood that placing the matching circuit 500 horizontally shortens the dimension of the miniaturized acousto-optic device 10 along the direction from the top wall 111 of the accommodating cavity 110 to the bottom wall 112, making the miniaturized acousto-optic device 10 more compact and smaller in size, thereby improving its integration and miniaturization design.

[0064] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0065] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, and these modifications and improvements fall within the scope of protection of the present application. Therefore, the scope of protection of the present patent application shall be determined by the appended claims.

Claims

1. A miniaturized acousto-optic device, characterized in that: The miniaturized acousto-optic device comprises: A housing defines a receiving cavity, wherein the housing is provided with an input optical fiber and an output optical fiber at two ends along a first direction respectively; an acousto-optic crystal disposed in the accommodating cavity, and light emitted from the input optical fiber can be collected by the output optical fiber after passing through the acousto-optic crystal; a piezoelectric transducer pointing from the top wall of the accommodating cavity to the bottom wall of the accommodating cavity, the piezoelectric transducer being disposed on one side of the acousto-optic crystal; and a matching circuit, extending along the top wall of the accommodating cavity toward the bottom wall of the accommodating cavity, the matching circuit being disposed on a side of the piezoelectric transducer facing away from the acousto-optic crystal and electrically connected to the piezoelectric transducer, the matching circuit being configured to apply a radio frequency electrical signal to the piezoelectric transducer to cause the piezoelectric transducer to excite ultrasonic waves; Wherein, the matching circuit is arranged with one side along the thickness direction thereof facing the top wall of the accommodating cavity, and the other side along the thickness direction thereof facing the bottom wall of the accommodating cavity; The first direction and a direction from the top wall of the accommodating cavity to the bottom wall of the accommodating cavity intersect with each other.

2. The miniaturized acousto-optic device according to claim 1, wherein: The miniaturized acousto-optic device further includes a mounting structure connected between the matching circuit and a cavity wall of the accommodating cavity; The cavity wall of the accommodating cavity includes the top wall, the bottom wall, and a peripheral wall connected between the top wall and the bottom wall.

3. The miniaturized acousto-optic device according to claim 2, wherein: The matching circuit includes a top side surface and a bottom side surface arranged opposite to each other along the thickness direction thereof, and a peripheral side surface connected between the top side surface and the bottom side surface; the top side surface is arranged toward the top wall of the accommodating cavity, the bottom side surface is arranged toward the bottom wall of the accommodating cavity; and the peripheral side surface is arranged toward the peripheral wall of the accommodating cavity; The mounting structure is connected between the peripheral wall and the peripheral side surface of the matching circuit.

4. The miniaturized acousto-optic device according to claim 2, wherein: The matching circuit includes a top side surface and a bottom side surface that are arranged opposite to each other along the thickness direction of the matching circuit; The mounting structure is connected between the bottom wall and the bottom side surface of the matching circuit.

5. The miniaturized acousto-optic device according to claim 1, wherein: Along the direction from the top wall of the accommodating cavity to the bottom wall, the thickness x of the matching circuit satisfies: 1 mm ≤ x ≤ 2.5 mm.

6. The miniaturized acousto-optic device according to claim 5, characterized in that: 1.5mm≤x≤2mm.

7. The miniaturized acousto-optic device according to claim 1, wherein: Along the direction from the top wall of the accommodating cavity to the bottom wall, the distance h between the top wall and the bottom wall satisfies: 12 mm ≤ h ≤ 15 mm.

8. The miniaturized acousto-optic device according to claim 1, wherein: The miniaturized acousto-optic device further includes a driving circuit, which is disposed outside the housing and electrically connected to the matching circuit through the bottom wall of the accommodating cavity.

9. The miniaturized acousto-optic device according to claim 1, wherein: The miniaturized acousto-optic device further includes an electrode lead electrically connected between the matching circuit and the piezoelectric transducer.

10. The miniaturized acousto-optic device according to claim 1, wherein: The miniaturized acousto-optic device further includes an input collimator and an output collimator. The input collimator is disposed between the input optical fiber and the acousto-optic crystal along the propagation direction of the light emitted from the input optical fiber, and the output collimator is disposed between the output optical fiber and the acousto-optic crystal along the propagation direction of the first-order diffraction light emitted from the acousto-optic crystal.