Photoetching mask plate

Abstract

The utility model discloses a photoetching mask plate, which belongs to the technical field of microelectronics and comprises optical glass and a film layer arranged on the surface of the optical glass, and circuit patterns are arranged on the film layer. The photoetching mask plate comprises the optical glass and the film layer, the circuit pattern is arranged on the film layer, when the circuit pattern needs to be changed, the film layer can be taken down for replacement, and the flexibility is high; besides, the photoetching mask plate disclosed by the utility model is simple in manufacturing process, does not need precise equipment and materials, and is obviously reduced in manufacturing cost compared with a photoetching chromium plate. Therefore, the photoetching chromium plate can solve the problems of low flexibility and high cost of the existing photoetching chromium plate.

Description

Technical Field

[0001] The utility model relates to the technical field of microelectronics, in particular to a photolithography mask plate. Background Art

[0002] In the circuit board manufacturing process, hard board exposure refers to the process of transferring the circuit pattern to the circuit board by exposing a hard board as a mask. The hard board commonly used in this process is a photolithographic chrome board, which is a glass board with a chrome coating and a layer of photosensitive resist (photoresist) on its surface. The circuit pattern is engraved on the chrome coating, and this pattern is transferred to the circuit board during the exposure process.

[0003] The photolithographic chrome plate is formed by plating chrome on a glass plate, but has problems of low flexibility and high production cost. Utility Model Content

[0004] The main purpose of the utility model is to provide a photolithography mask plate, aiming to solve the problems of low flexibility and high cost of photolithography chrome plates.

[0005] To achieve the above-mentioned purpose, the photolithography mask provided by the present invention comprises optical glass and a film layer provided on the surface of the optical glass, wherein a circuit pattern is provided on the film layer.

[0006] In one embodiment, the film layer is a polyester film or a polyimide film.

[0007] In one embodiment, the thickness of the film layer is 50 μm-300 μm.

[0008] In one embodiment, the optical glass is selected from quartz glass, borosilicate glass, silicate glass, and fluoride glass.

[0009] In one embodiment, the thickness of the optical glass is 0.5 mm to 3.0 mm.

[0010] In one embodiment, an adhesive layer is further provided between the optical glass and the film layer, and the adhesive layer comprises optically transparent adhesive.

[0011] In one embodiment, the adhesive layer is arranged in spots or on a surface.

[0012] In one embodiment, the adhesive layer is arranged in a multi-layer manner, and the thickness of the adhesive layer is 20 μm-100 μm.

[0013] In one embodiment, the optical glass and the outer periphery of the film layer are bonded and fixed by transparent tape.

[0014] The photolithography mask of the present invention comprises optical glass and a film layer. The film layer is disposed on the surface of the optical glass, and a circuit pattern is disposed on the film layer. When the circuit pattern needs to be changed, the film layer can be removed and replaced, providing high flexibility. Furthermore, the photolithography mask of the present invention has a simple manufacturing process, requiring no sophisticated equipment or materials, and significantly reduces manufacturing costs compared to photolithography chrome plates. Therefore, the present invention can address the problems of poor durability, low flexibility, and high cost associated with existing photolithography chrome plates. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0016] Figure 1 This is a front cross-sectional view of a photolithography mask in one embodiment of the present invention;

[0017] Figure 2 This is a front cross-sectional view of a photolithography mask in another embodiment of the present invention;

[0018] Figure 3 This is a front cross-sectional view of a photolithography mask in another embodiment of the present invention;

[0019] Figure 4 This is a front cross-sectional view of a photolithography mask in yet another embodiment of the present invention.

[0020] Explanation of Figure Numbers

[0021] 100, optical glass; 200, film layer; 300, adhesive layer; 400, transparent tape. DETAILED DESCRIPTION

[0022] It should be noted that if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or suggesting their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features specified as "first" and "second" may explicitly or implicitly include at least one of such features. In addition, if "and / or" or "and / or" appears in the full text, its meaning includes three parallel schemes. Taking "A and / or B" as an example, it includes scheme A, or scheme B, or a scheme in which A and B are satisfied at the same time. "At least one" appearing in the embodiments of the present invention refers to one or more, and "more" refers to two or more.

[0023] In the description of the embodiments of the present invention, if the technical terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the embodiments of the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of the present application.

[0024] In the description of the embodiments of the present invention, unless otherwise expressly specified or limited, the technical terms "installed," "connected," "connected," "fixed," etc. should be understood in a broad sense. For example, it can mean fixed connection, detachable connection, or integration; it can mean mechanical connection or electrical connection; it can mean direct connection or indirect connection through an intermediate medium; it can mean internal communication between two components or interaction between two components. For those skilled in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0025] In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the fact that ordinary technicians in this field can implement them. When the combination of technical solutions is mutually contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by this utility model.

[0026] A photolithographic chrome plate is a glass plate with a chrome coating. Its surface is coated with a layer of photosensitive resist (photoresist). The chrome coating is engraved with a circuit pattern, which is transferred to the circuit board during the exposure process. Photolithographic chrome plates are formed by plating chrome on a glass plate. The production process is complex and requires sophisticated equipment and materials. Furthermore, the glass plate is easily broken by static electricity during the chrome plating process and cannot be reworked and reused, resulting in significant waste. Therefore, the production cost of photolithographic chrome plates is high. Furthermore, the circuit pattern of the photolithographic chrome plate is set on the chrome layer. Once the pattern is completed, it cannot be changed and can only be replaced as a whole, resulting in a low flexibility.

[0027] To this end, the present invention provides a photolithography mask plate, referring to Figure 1 As shown, the photolithography mask plate includes an optical glass 100 and a film layer 200 . The film layer 200 is disposed on the surface of the optical glass 100 , and a circuit pattern is provided on the film layer 200 .

[0028] by Figure 1For example, the film layer 200 is disposed on the upper surface of the optical glass 100, that is, the film layer 200 is disposed on a single surface. The film layer 200 disposed on a single surface is sufficient to meet the application requirements of most photolithography masks. However, in some special applications, the film layer 200 can also be disposed on both surfaces of the optical glass 100.

[0029] The circuit pattern on the film layer 200 can be formed by coating photoresist on the film layer 200, pre-baking, exposing, developing, post-baking, etching, cleaning, and the like.

[0030] The photolithography mask of the present invention comprises optical glass 100 and a film layer 200. A circuit pattern is disposed on the film layer 200. When the circuit pattern needs to be changed, the film layer 200 can be removed and replaced, providing high flexibility. Furthermore, the photolithography mask of the present invention has a simple manufacturing process, requiring no sophisticated equipment or materials, significantly reducing manufacturing costs compared to photolithography chrome plates. Therefore, the present invention addresses the issues of low flexibility and high cost associated with existing photolithography chrome plates.

[0031] In the embodiment of the present invention, the film layer 200 is a polyester film or a polyimide film.

[0032] Polyester film is a thin film material made from polyester resin (primarily polyethylene terephthalate, PET). It has high transparency and high gloss, and is low-cost and easy to process. Polyimide film is a thermoplastic film made from polyimide resin. It has excellent heat resistance and mechanical properties, making it suitable for photolithography processes in high-temperature environments.

[0033] PET film has higher transparency than polyimide film. PET film can be conventional PET film or BOPET (biaxially oriented PET) film. BOPET film has higher mechanical strength and toughness than PET film.

[0034] In the embodiment of the present invention, the thickness of the film layer 200 is 50 μm-300 μm.

[0035] In the embodiment of the present invention, the optical glass 100 is selected from one of quartz glass, borosilicate glass, silicate glass, and fluorite glass.

[0036] Quartz glass has extremely high transparency and good thermal stability, making it suitable for high-precision photolithography processes involving ultraviolet light exposure. Borosilicate glass has a low coefficient of thermal expansion and good thermal shock resistance. Silicate glass offers excellent transparency and high thermal stability. Fluoroate glass, a special glass containing fluorine and phosphorus, has a high refractive index and low light scattering, making it suitable for applications using extreme ultraviolet light lithography.

[0037] In the embodiment of the present invention, the thickness of the optical glass 100 is 0.5 mm-3.0 mm.

[0038] In the embodiment of the present utility model, reference Figure 2 and 3 As shown, the optical glass 100 and the film layer 200 are further provided with an adhesive layer 300 , and the adhesive layer 300 includes an optically transparent adhesive.

[0039] Optically clear adhesive (OCA) is a highly transparent, low-refractive-index adhesive. In this embodiment, optical glass and film layers are secured together using OCA, ensuring near-lossless light transmission. The OCA can be either a solid adhesive, applied to film layer 200 and optical glass 100 using a laminating machine, or a liquid optical adhesive, applied to optical glass 100 or film layer 200 using a laminating machine and then cured using ultraviolet light.

[0040] In the embodiment of the present utility model, reference Figure 2 and 3 As shown, the adhesive layer 300 is arranged in dots or on a surface.

[0041] refer to Figure 2 As shown, the adhesive layer 300 is arranged in dots, that is, optically transparent adhesive is coated on some points on the surface of the optical glass 100. The adhesive layer 300 arranged in dots can save the amount of optically transparent adhesive; Figure 3 As shown, the adhesive layer 300 is arranged on the surface, that is, the entire surface of the optical glass 100 is coated with optical transparent glue. The adhesive layer 200 arranged on the surface can ensure the bonding strength between the optical glass 100 and the film layer 200.

[0042] In the embodiment of the present utility model, reference Figure 3 As shown, the adhesive layer 300 is arranged on a flat surface, and the thickness of the adhesive layer 300 is 20 μm-100 μm.

[0043] In the embodiment of the present utility model, reference Figure 4 As shown, the peripheries of the optical glass 100 and the film layer 200 are bonded and fixed by a transparent tape 400 .

[0044] In the embodiment of the present utility model, reference Figure 4As shown, the photolithography mask plate includes optical glass 100, a film layer 200, an adhesive layer 300, and a transparent tape 400. The optical glass 100 is quartz glass and has a thickness of . The adhesive layer 300 is provided on the upper surface of the optical glass 100. The adhesive layer 300 is arranged on the surface and has a thickness of . The film layer 200 is disposed on the adhesive layer 300, that is, the film layer 200 is bonded and fixed to the optical glass 100 via the adhesive layer 300. The film layer 200 is a PET film. The transparent tape 400 is disposed on the periphery of the optical glass 100, the film layer 200, and the adhesive layer 300 to further bond and fix them.

[0045] The above description is merely an exemplary embodiment of the present invention and does not limit the patent scope of the present invention. All equivalent structural transformations made using the contents of the present invention specification and drawings under the technical concept of the present invention, or direct / indirect application in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A photolithography mask, characterized in that: The optical glass comprises an optical glass and a film layer arranged on the surface of the optical glass, wherein the film layer is provided with a circuit pattern and the film layer is a polyester film or a polyimide film; an adhesive layer is further provided between the optical glass and the film layer, and the adhesive layer comprises an optically transparent adhesive.

2. The photolithography mask according to claim 1, wherein The thickness of the film layer is 50 μm-300 μm.

3. The photolithography mask according to claim 1, wherein The optical glass is selected from one of quartz glass, borosilicate glass, silicate glass and fluoride glass.

4. The photolithography mask according to claim 1 or 3, wherein: The thickness of the optical glass is 0.5 mm to 3.0 mm.

5. The photolithography mask according to claim 1, wherein: The adhesive layer is arranged in points or on a surface.

6. The photolithography mask according to claim 5, wherein: The adhesive layer is arranged in a plane, and the thickness of the adhesive layer is 20 μm-100 μm.

7. The photolithography mask according to claim 1, wherein: The optical glass and the outer periphery of the film layer are bonded and fixed by transparent tape.

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