Ultrafast ESD (Electro-Static Discharge) device processed by bombarding silicon wafer by using neutron source

Abstract

The utility model discloses an ultra-fast ESD (Electro-Static Discharge) device processed by bombarding a silicon wafer by using a neutron source, and relates to the technical field of ESD devices. The ultra-fast ESD device comprises a packaging main body and a packaging upper cover, a placement groove is formed in the upper side surface of the packaging main body, pins are arranged in the placement groove, two grooves are formed in the upper side surface of the packaging main body, springs are fixedly connected to the bottom walls of the two grooves, and the pins are arranged in the placement groove. The upper ends of the two springs are fixedly connected with a U-shaped fixing frame, the lower side surface of the U-shaped fixing frame makes contact with the upper side surface of the pin, the inner wall of the packaging body is fixedly connected with a mounting plate, the upper side surface of the packaging body is provided with a positioning groove, and the bottom wall of the positioning groove is provided with a locking groove. And the lower side surface of the packaging upper cover is fixedly connected with a locking plate matched with the locking groove, so that no extra separated small component exists in the assembling and fixing process, and the problem that part of small components are lost and cannot be installed in the subsequent disassembling process is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of ESD devices, in particular to an ultra-fast ESD device processed by bombarding silicon wafers with a neutron source. Background Art

[0002] ESD means electrostatic discharge. ESD devices protect circuits from pulses, power transients, surges and other phenomena that may damage chips. Commonly used ESD devices include TVS diodes and varistors.

[0003] Existing ESD devices require packaging to protect their internal structures. However, since packaging is typically performed using adhesives such as glue, disassembly after connection is difficult. Damage requires complete replacement, increasing repair costs and presenting certain drawbacks. For example, the Chinese utility model patent with patent publication number CN216354166U includes a packaging body, a packaging cover disposed at the top of the packaging body, clamping posts disposed at the front and rear ends of the packaging body, a number of pins disposed on both sides of the packaging body, and positioning posts fixedly mounted at the four corners of the interior of the packaging body. The present utility model utilizes a connecting plate, clamping posts, a connecting slot, and a spring.

[0004] This patent allows the use of a tool to insert into the groove at one end of the card column, rotate the card column, and thread the card column to the package body, so that one end of the card column is disengaged from the first through hole of the connecting plate, releasing the limit on the connecting plate. At this time, the spring inside the positioning column will push the positioning rod upward, driving the package cover to disengage from the package body, and then the package cover is removed to facilitate the maintenance of the internal devices. However, since the fixing rod and the card column are both separate designs and small in size, they are easily lost during the disassembly process. At the same time, the pin slot is located on the package cover. When connecting the pins, special attention should be paid to the angle of the pins, which increases the difficulty of installation. Utility Model Content

[0005] The purpose of the present invention is to solve at least one of the technical problems existing in the prior art and to provide an ultra-fast ESD device processed by bombarding silicon wafers with a neutron source, which can solve the problem that its fixing rod and the clamping column are both separately designed and have a small size, and are easily lost during the disassembly process.

[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: an ultra-fast ESD device processed by bombarding silicon wafers with a neutron source, comprising a packaging body and a packaging cover, the upper surface of the packaging body being provided with a placement groove, a pin being provided inside the placement groove, the upper surface of the packaging body being provided with two grooves, the bottom walls of the two grooves being fixedly connected with springs, the upper ends of the two springs being fixedly connected with a U-shaped fixing frame, the lower surface of the U-shaped fixing frame being in contact with the upper surface of the pins, the inner wall of the packaging body being fixedly connected with a mounting plate, the upper surface of the packaging body being provided with a positioning groove, the bottom wall of the positioning groove being provided with a locking groove, the lower surface of the packaging cover being fixedly connected with a locking plate adapted to the locking groove, the front surface of the locking plate being provided with a through groove extending from its rear surface, the interior of the mounting plate being provided with a hollow interior, and a locking assembly being provided inside the mounting plate.

[0007] Preferably, the locking assembly includes a displacement plate, which is slidably connected to the inner wall of the mounting plate, and a locking column is fixedly connected to a surface of one side of the displacement plate close to the locking groove.

[0008] Preferably, the locking column slides through the interior of the locking groove, and the locking column is adapted to the through groove.

[0009] Preferably, the inner wall of the mounting plate is rotatably connected to a threaded rod, and the front end of the threaded rod rotates and penetrates the front side surface of the packaging body.

[0010] Preferably, the displacement plate is threadedly sleeved on the outer surface of the threaded rod, and the upper surface of the packaging cover is provided with a pressing groove adapted to the U-shaped fixing frame.

[0011] Preferably, a second positioning groove is provided on the upper surface of the packaging body.

[0012] Preferably, a limiting groove is provided on the bottom wall of the second positioning groove, and a conical block is fixedly connected to the lower surface of the packaging cover.

[0013] Preferably, a limiting rod adapted to the limiting groove is fixedly connected to the lower surface of the conical block.

[0014] Compared with the prior art, the beneficial effects of the present invention are:

[0015] (1) When assembling the ultra-fast ESD device processed by bombarding silicon wafers with a neutron source, the U-shaped fixing frame is first slightly pulled upwards. When the U-shaped fixing frame moves, the spring is stretched synchronously. Then, the pin is placed inside the placement groove. At this time, the pin is initially fixed with the help of the spring and the U-shaped fixing frame. Then, the locking plate on the package cover is aligned with the locking groove and inserted. The locking plate is locked with the locking assembly, and the pin can be fixed with the help of the package cover. Through the above structure, there are no additional small components to be separated during assembly and fixation, which avoids the problem of some small components being lost and unable to be installed during the subsequent disassembly process.

[0016] (2) When the ultra-fast ESD device processed by bombarding silicon wafers with a neutron source is placed on the package cover, the limit rod will also enter the inner wall of the limit groove simultaneously, and the conical block will enter the interior of the second positioning groove, thereby improving the overall connection stability. At this time, the rotating threaded rod will synchronously drive the displacement plate to move, and the displacement plate will synchronously drive the locking column to move after the movement. After the movement, the locking column will successively enter the interior of the locking groove and the through groove, thereby completing the locking of the locking plate with the help of the locking column. Through the above structure, the stability of the connection can be improved by the limit rod and the limit groove when the package cover is placed, and the second positioning groove can also be used to reduce the difficulty of inserting the limit rod into the limit groove. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The present invention is further described below with reference to the accompanying drawings and embodiments:

[0018] Figure 1 This is a schematic structural diagram of an ultra-fast ESD device processed by using a neutron source to bombard silicon wafers in the present invention;

[0019] Figure 2 This is a schematic diagram of separating the upper cover of the package of the utility model;

[0020] Figure 3 This is a schematic diagram of the locking groove of the utility model;

[0021] Figure 4 This is a cross-sectional schematic diagram of the mounting plate of the utility model;

[0022] Figure 5 for Figure 3 Enlarged view of point A in the middle;

[0023] Figure 6 This is a schematic diagram of the package cover of the utility model.

[0024] Figure numerals: 1. Package body; 2. Placement groove; 3. Pin; 4. Groove; 5. Spring; 6. U-shaped fixing frame; 7. Mounting plate; 8. Positioning groove; 9. Locking groove; 10. Package cover; 11. Locking plate; 12. Through groove; 13. Displacement plate; 14. Locking column; 15. Threaded rod; 16. Limit rod; 17. Press groove; 18. Second positioning groove; 19. Limit groove; 20. Conical block. DETAILED DESCRIPTION

[0025] This section will describe in detail the specific embodiments of the present invention. The preferred embodiments of the present invention are shown in the accompanying drawings. The purpose of the accompanying drawings is to supplement the description of the text part of the specification with graphics, so that people can intuitively and vividly understand each technical feature and overall technical solution of the present invention, but it cannot be understood as a limitation on the scope of protection of the present invention.

[0026] See also Figure 1-6 The utility model provides a technical solution: an ultra-fast ESD device processed by bombarding silicon wafers with a neutron source, comprising a package body 1 and a package cover 10, a placement groove 2 is provided on the upper surface of the package body 1, a pin 3 is provided inside the placement groove 2, two grooves 4 are provided on the upper surface of the package body 1, the bottom walls of the two grooves 4 are fixedly connected with springs 5, the upper ends of the two springs 5 are fixedly connected with U-shaped fixing frames 6, the lower side surfaces of the U-shaped fixing frames 6 are in contact with the upper side surfaces of the pins 3, a mounting plate 7 is fixedly connected to the inner wall of the package body 1, a positioning groove 8 is provided on the upper surface of the package body 1, a locking groove 9 is provided on the bottom wall of the positioning groove 8, a locking plate 11 adapted to the locking groove 9 is fixedly connected to the lower surface of the package cover 10, and the front surface of the locking plate 11 is fixedly connected to the locking plate 11. The surface is provided with a through groove 12 extending from its rear surface, the interior of the mounting plate 7 is set to be hollow, and a locking component is provided inside the mounting plate 7. When assembling, first pull the U-shaped fixing frame 6 slightly upwards, and the spring 5 will be stretched synchronously when the U-shaped fixing frame 6 moves, and then the pin 3 is placed inside the placement groove 2. At this time, the pin 3 is preliminarily fixed with the help of the spring 5 and the U-shaped fixing frame 6, and then the locking plate 11 on the package cover 10 is aligned with the locking groove 9 and inserted, and then the locking plate 11 is locked with the locking component, and the pin 3 can be fixed with the help of the package cover 10. Through the above structure, there are no additional separated small components during assembly and fixation, which avoids the problem of some small components being lost and unable to be installed during the subsequent disassembly process.

[0027] Furthermore, the locking assembly includes a displacement plate 13, which is slidably connected to the inner wall of the mounting plate 7, and a locking column 14 is fixedly connected to the side surface of the displacement plate 13 close to the locking groove 9. The locking column 14 slides into the interior of the locking groove 9, and the locking column 14 is adapted to the through groove 12. The inner wall of the mounting plate 7 is rotatably connected to a threaded rod 15, and the front end of the threaded rod 15 rotates and passes through the front surface of the package body 1. The displacement plate 13 is threadedly sleeved on the outer surface of the threaded rod 15. A pressing groove 17 adapted to the U-shaped fixing frame 6 is provided on the upper surface of the package cover 10, a second positioning groove 18 is provided on the upper surface of the package body 1, and a limiting groove 19 is provided on the bottom wall of the second positioning groove 18. A conical block 20 is fixedly connected to the lower surface of the package cover 10. The conical block The lower surface of 20 is fixedly connected with a limit rod 16 that is compatible with the limit groove 19. When the package cover 10 is placed, the limit rod 16 will also synchronously enter the inner wall of the limit groove 19, and the conical block 20 enters the inside of the second positioning groove 18, thereby improving the overall connection stability. At this time, the rotating threaded rod 15 synchronously drives the displacement plate 13 to move, and after the displacement plate 13 moves, it synchronously drives the locking column 14 to move. After the locking column 14 moves, it enters the inside of the locking groove 9 and the through groove 12 in turn, thereby completing the locking of the locking plate 11 with the help of the locking column 14. Through the above structure, the stability of the connection can be improved by the limit rod 16 and the limit groove 19 when the package cover 10 is placed, and the second positioning groove 18 can also be used to reduce the difficulty of inserting the limit rod 16 into the limit groove 19.

[0028] Working principle: During assembly, first pull the U-shaped fixing frame 6 slightly upwards. When the U-shaped fixing frame 6 moves, the spring 5 will be stretched synchronously. Then, the pin 3 is placed inside the placement groove 2. At this time, the pin 3 is preliminarily fixed with the help of the spring 5 and the U-shaped fixing frame 6. Then, the locking plate 11 on the package cover 10 is aligned with the locking groove 9 and inserted, and then the locking assembly is used to lock the locking plate 11. The pin 3 can be fixed with the help of the package cover 10. When the package cover 10 is placed, the limit rod 16 will also enter the inner wall of the limit groove 19 synchronously, and the conical block 20 enters the inside of the second positioning groove 18 to improve the overall connection stability. At this time, the threaded rod 15 is rotated to synchronously drive the displacement plate 13 to move. After the displacement plate 13 moves, the locking column 14 is synchronously driven to move. After the locking column 14 moves, it enters the inside of the locking groove 9 and the through groove 12 in turn, thereby completing the locking of the locking plate 11 with the help of the locking column 14.

[0029] The embodiments of the present invention are described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Various changes can be made within the scope of knowledge possessed by ordinary technicians in the technical field without departing from the purpose of the present invention.

Claims

1. An ultrafast ESD device processed by bombarding a silicon wafer with a neutron source, comprising a package body (1) and a package cover (10), characterized in that: The upper surface of the package body (1) is provided with a placement groove (2), and a pin (3) is provided inside the placement groove (2). The upper surface of the package body (1) is provided with two grooves (4), and the bottom walls of the two grooves (4) are fixedly connected with springs (5). The upper ends of the two springs (5) are fixedly connected with U-shaped fixing frames (6), and the lower surface of the U-shaped fixing frame (6) contacts the upper surface of the pin (3). The inner wall of the package body (1) is fixedly connected with a mounting plate (7). The upper surface of the package body (1) is provided with a positioning groove (8), and the bottom wall of the positioning groove (8) is provided with a locking groove (9). The lower surface of the package cover (10) is fixedly connected with a locking plate (11) adapted to the locking groove (9), and the front surface of the locking plate (11) is provided with a through groove (12) extending from its rear surface. The interior of the mounting plate (7) is set to be hollow, and a locking component is provided inside the mounting plate (7).

2. The ultrafast ESD device processed by neutron source bombardment of silicon wafers according to claim 1, characterized in that: The locking assembly comprises a displacement plate (13) which is slidably connected to the inner wall of the mounting plate (7), and a locking column (14) is fixedly connected to a surface of one side of the displacement plate (13) close to the locking groove (9).

3. The ultrafast ESD device processed by neutron source bombardment of silicon wafers according to claim 2, characterized in that: The locking column (14) slides through the interior of the locking groove (9), and the locking column (14) is adapted to the through groove (12).

4. The ultrafast ESD device processed by neutron source bombardment of silicon wafers according to claim 2, characterized in that: The inner wall of the mounting plate (7) is rotatably connected to a threaded rod (15), and the front end of the threaded rod (15) rotates through the front side surface of the packaging body (1).

5. The ultrafast ESD device processed by using a neutron source to bombard silicon wafers according to claim 2, characterized in that: The displacement plate (13) is threadedly sleeved on the outer surface of the threaded rod (15), and a pressing groove (17) adapted to the U-shaped fixing frame (6) is provided on the upper surface of the packaging upper cover (10).

6. The ultrafast ESD device processed by using a neutron source to bombard silicon wafers according to claim 1, characterized in that: A second positioning groove (18) is provided on the upper surface of the packaging body (1).

7. The ultrafast ESD device processed by neutron source bombardment of silicon wafers according to claim 6, characterized in that: A limiting groove (19) is provided on the bottom wall of the second positioning groove (18), and a conical block (20) is fixedly connected to the lower surface of the packaging upper cover (10).

8. The ultrafast ESD device processed by neutron source bombardment of silicon wafers according to claim 7, characterized in that: A limiting rod (16) adapted to the limiting groove (19) is fixedly connected to the lower side surface of the conical block (20).

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