Semiconductor chip processing and cutting tool

Abstract

A semiconductor chip processing and cutting tool comprises a machine body, an electric sliding rail is fixedly connected to the upper side wall of the machine body, a placing base is fixedly connected to a sliding base of the electric sliding rail, an L-shaped supporting plate is fixedly connected to the rear portion of the upper side wall of the machine body, and an electric telescopic rod is fixedly connected to the outer wall of the upper side of the L-shaped supporting plate; the telescopic end of the electric telescopic rod penetrates through the upper side wall of the L-shaped supporting plate in a sliding mode and is fixedly connected with a fixing base, and a moving block is arranged in the fixing base in a sliding mode. Compared with the prior art, the wafer slitting device has the advantages that in the wafer slitting process, under the action of the first draught fan, air is blown out of the air exhaust hollow plate, dust generated during slitting is blown to the air suction hollow plate, under the action of the second draught fan, negative pressure is generated in the air suction hollow plate, and the dust enters the dust removal box and is filtered by the dust removal filter element; the cleanliness of the production environment is guaranteed, the product quality is improved, and practicability is higher.

Description

Technical Field

[0001] The utility model relates to the technical field of chip processing, in particular to a semiconductor chip processing and cutting tool. Background Art

[0002] Wafer dicing, sometimes also called "slicing," involves separating each individual IC on a wafer using a high-speed rotating diamond blade. The number of individual ICs (chips) produced on a single wafer can range from hundreds to thousands, or even tens of thousands. This process is called dicing, and its purpose is to separate each IC using a high-speed rotating diamond blade, preparing them for subsequent processing steps.

[0003] After searching, the Chinese patent with announcement number CN220179781U discloses a cutting mechanism for semiconductor chip processing, including: a base plate; a connecting plate, the connecting plate is installed on the left side of the top of the base plate; a cylinder, the cylinder is installed on the top of the connecting plate, and the bottom end of the cylinder passes through the connecting plate and extends to the outside thereof; a movable plate, the movable plate is installed at the bottom of the cylinder; a vertical plate, the number of the vertical plates is two and they are respectively installed on the left and right sides of the bottom of the movable plate; a protective clamping mechanism, the protective clamping mechanism is arranged at the bottom of the movable plate, the protective clamping mechanism includes a protective frame, the protective frame is arranged at the bottom of the movable plate, mounting blocks are installed on the left and right sides of the protective frame, connecting blocks are installed on the left and right sides of the movable plate, two fixing rods are provided at the end of the connecting block away from the protective frame, the end of the fixing rod close to the protective frame passes through the connecting block and extends to the outside thereof, and the two fixing rods on the same side and the end close to the protective frame are fixedly connected by the movable block; an anti-splashing mechanism, the anti-splashing mechanism is arranged on the connecting plate.

[0004] The above-mentioned existing technical solutions have the following deficiencies: a large amount of dust is generated during slitting, which will affect the cutting quality if not cleaned in time and will pollute the working environment. Utility Model Content

[0005] In view of the above-mentioned deficiencies in the prior art, the present invention provides a semiconductor chip processing and cutting tool to solve the problems raised in the above-mentioned background technology.

[0006] In order to achieve the above-mentioned purpose of the utility model, the technical solution adopted by the present utility model is a semiconductor chip processing and cutting tool, including a body, an electric slide rail is fixedly connected to the upper side wall of the body, a placement seat is fixedly connected to the slide seat of the electric slide rail, an L-shaped support plate is fixedly connected to the rear of the upper side wall of the body, an electric telescopic rod is fixedly connected to the upper outer wall of the L-shaped support plate, the telescopic end of the electric telescopic rod slides through the upper side wall of the L-shaped support plate and is fixedly connected to the fixed seat, a moving block is slidably provided in the fixed seat, a driving motor is fixedly connected to the front outer wall of the fixed seat, the output shaft of the driving motor extends into the fixed seat and is fixedly connected to the screw, the other end of the screw threadedly passes through the moving block and is rotatably connected to the rear inner wall of the fixed seat, a mounting frame is fixedly connected to the bottom wall of the moving block, a cutting wheel is rotatably provided between the front and rear inner walls of the mounting frame, a cutting motor is fixedly connected to the rear outer wall of the mounting frame, the output shaft end of the cutting motor passes through the rear side wall of the mounting frame and is fixedly connected to one end of the cutting wheel, and a dustproof component is also provided on the body.

[0007] As an improvement: the dust-proof component includes an L-shaped connecting rod, an exhaust hollow plate, an air suction hollow plate, a first fan, a dust collection box, a second fan and a dust collection filter element, two symmetrically distributed L-shaped connecting rods are fixedly connected to the outer peripheral wall of the placement seat, the other end of one of the L-shaped connecting rods is fixedly connected to the exhaust hollow plate and the other end of the other L-shaped connecting rod is fixedly connected to the air suction hollow plate, the first fan is fixedly connected to one side wall of the machine body and the dust collection box and the second fan are fixedly connected to the other side wall, a dust collection filter element is provided in the dust collection box, the air outlet end of the first fan is connected to the exhaust hollow plate by a hose, the upper side wall of the dust collection box is connected to the air suction hollow plate by a hose, and the bottom wall of the dust collection box is connected to the air inlet end of the second fan by a hose.

[0008] As an improvement: a sliding groove is provided on the upper side wall of the placement seat, and a bidirectional screw is rotatably provided between the front and rear side walls of the sliding groove. The front end of the bidirectional screw extends to the outside of the placement seat and is fixedly connected to an adjustment knob. Two sliders are provided on the threaded sleeve of the bidirectional screw, and a clamping block is fixedly connected to the upper wall of the slider. The slider is slidably connected to the sliding groove.

[0009] As an improvement: a socket for inserting a dust filter element is provided on the front side wall of the dust removal box.

[0010] As an improvement: T-shaped support grooves are provided on both side inner walls of the dust removal box, and T-shaped slide rails are fixedly connected to both side walls of the dust removal filter element.

[0011] As an improvement: a magnet is embedded and installed on the rear inner wall of the dust removal box, and an iron plate that matches the magnet is embedded and installed on the rear side wall of the dust removal filter element.

[0012] Compared with the prior art, the present invention has the following beneficial effects:

[0013] 1. During the wafer slitting process, under the action of the first fan, air is blown out from the exhaust hollow plate, blowing the dust generated during slitting to the suction hollow plate. Under the action of the second fan, negative pressure is generated in the suction hollow plate, causing the dust to enter the dust removal box and be filtered by the dust removal filter element, ensuring the cleanliness of the production environment, improving product quality, and being more practical. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a schematic diagram of the overall structure of a semiconductor chip processing and cutting tool of the present invention;

[0015] Figure 2 This is a schematic diagram of the structure of a fixing seat for a semiconductor chip processing and cutting tool according to the present invention;

[0016] Figure 3 This is a schematic diagram of the structure of a dust removal filter element for semiconductor chip processing and cutting tooling of the utility model;

[0017] Figure 4 This is a schematic diagram of the structure of a placement seat for a semiconductor chip processing and cutting tool according to the present invention;

[0018] As shown in the figure:

[0019] 100. Machine body; 110. Electric slide rail; 120. Placement seat; 130. L-shaped support plate; 140. Electric telescopic rod; 150. Fixed seat; 160. Moving block; 170. Driving motor; 180. Screw; 190. Mounting frame; 191. Cutting wheel; 192. Cutting motor; 200. Dustproof component; 210. L-shaped connecting rod; 220. Exhaust hollow plate; 230. Suction hollow plate; 240. First fan; 250. Dust removal box; 260. Second fan; 270. Dust filter element; 121. Slide groove; 122. Bidirectional screw; 123. Adjustment knob; 124. Slider; 125. Clamp; 251. T-shaped support groove; 271. T-shaped slide rail; 252. Magnet. DETAILED DESCRIPTION

[0020] In order to make the technical means, creative features and purpose effects achieved by the present invention easier to understand, the present invention is further described below in conjunction with specific implementation methods.

[0021] In the description of this utility model, it should be noted that the terms "upper," "lower," "inner," "outer," "front," "back," "both sides," "one side," "the other side," and the like, indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate the description of this utility model and simplify the description. They do not indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0022] In the description of this utility model, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "provided with," "connected," etc. should be understood in a broad sense. For example, "connected" can mean a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be internal communication between two components. Those skilled in the art will be able to understand the specific meanings of the above terms in this utility model based on the specific circumstances.

[0023] like Figure 1 and Figure 2As shown, a semiconductor chip processing and cutting tool comprises a body 100, an electric slide rail 110 is fixedly connected to the upper side wall of the body 100, a placement seat 120 is fixedly connected to the slide seat of the electric slide rail 110, an L-shaped support plate 130 is fixedly connected to the rear of the upper side wall of the body 100, an electric telescopic rod 140 is fixedly connected to the upper outer wall of the L-shaped support plate 130, the telescopic end of the electric telescopic rod 140 slides through the upper side wall of the L-shaped support plate 130 and is fixedly connected to the fixed seat 150, and a movable member is provided in the fixed seat 150 for sliding. The movable block 160 is fixedly connected to the front outer wall of the fixed seat 150 with a driving motor 170. The output shaft of the driving motor 170 extends into the fixed seat 150 and is fixedly connected to a screw 180. The other end of the screw 180 passes through the movable block 160 and is rotatably connected to the rear inner wall of the fixed seat 150. The bottom wall of the movable block 160 is fixedly connected to a mounting frame 190. A cutting wheel 191 is rotatably provided between the front and rear inner walls of the mounting frame 190. A cutting motor 192 is fixedly connected to the rear outer wall of the mounting frame 190. The output shaft end of the motor 192 passes through the rear side wall of the mounting frame 190 and is fixedly connected to one end of the cutting wheel 191. A dustproof component 200 is also provided on the body 100. The telescopic end of the electric telescopic rod 140 can push the fixing seat 150 downward so that the cutting wheel 191 contacts the wafer. The output shaft of the cutting motor 192 can drive the cutting wheel 191 to rotate at high speed to cut the wafer. During cutting, the slide on the electric slide rail 110 can drive the placement seat 120 to move back and forth left and right, so that the cutting wheel 191 completes the horizontal rotation of the wafer. Cutting. After the horizontal cutting is completed, the telescopic end of the electric telescopic rod 140 drives the fixed seat 150 to rise a certain distance so that the cutting wheel 191 does not contact the wafer. Then, the output shaft of the drive motor 170 can drive the screw 180 to rotate. When the screw 180 rotates, the movable block 160 can drive the mounting frame 190 to move back and forth, so that the cutting wheel 191 moves back a certain distance. Then, the telescopic end of the electric telescopic rod 140 pushes the fixed seat 150 to move downward, and cooperates with the electric slide rail 110 to complete the horizontal cutting again. Repeat this several times to complete the cutting.

[0024] Specifically, such as Figure 1As shown, the semiconductor chip processing and cutting tooling, the dust-proof component 200 includes an L-shaped connecting rod 210, an exhaust hollow plate 220, an air suction hollow plate 230, a first fan 240, a dust removal box 250, a second fan 260 and a dust removal filter element 270, and two symmetrically distributed L-shaped connecting rods 210 are fixedly connected to the outer peripheral wall of the placement seat 120, the other end of one L-shaped connecting rod 210 is fixedly connected to the exhaust hollow plate 220 and the other end of the other L-shaped connecting rod 210 is fixedly connected to the air suction hollow plate 230, the first fan 240 is fixedly connected to one side wall of the machine body 100 and the dust removal box 250 and the second fan 260 are fixedly connected to the other side wall, and the dust removal box 250 is fixedly connected to the dust removal box 250. A dust removal filter 270 is provided. The air outlet end of the first fan 240 is connected to the exhaust hollow plate 220 through a hose, the upper side wall of the dust removal box 250 is connected to the suction hollow plate 230 through a hose, and the bottom wall of the dust removal box 250 is connected to the air inlet end of the second fan 260 through a hose. During the cutting process, under the action of the first fan 240, air is blown out from the exhaust hollow plate 220, and the dust generated during cutting is blown to the suction hollow plate 230. Under the action of the second fan 260, negative pressure is generated in the suction hollow plate 230, so that the dust enters the dust removal box 250 and is filtered by the dust removal filter 270, thereby ensuring the cleanliness of the production environment, improving product quality, and being more practical.

[0025] Specifically, such as Figure 4 As shown, a semiconductor chip processing and cutting tool is provided, a slide groove 121 is provided on the upper side wall of the placement seat 120, and a bidirectional screw 122 is rotatably provided between the front and rear side walls of the slide groove 121, and the front end of the bidirectional screw 122 extends to the outside of the placement seat 120 and is fixedly connected to an adjusting knob 123, and two sliders 124 are threadedly sleeved on the bidirectional screw 122, and a clamping block 125 is fixedly connected to the upper wall of the slider 124, and the slider 124 is slidably connected to the slide groove 121. Rotating the adjusting knob 123 can drive the bidirectional screw 122 to rotate. When the bidirectional screw 122 rotates, the two sliders 124 can drive the clamping blocks 125 to approach each other, and the two clamping blocks 125 can clamp the wafer.

[0026] Specifically, such as Figure 3 As shown, a semiconductor chip processing and cutting tool is provided, and a socket for inserting a dust filter element 270 is provided on the front side wall of the dust removal box 250, and the dust filter element 270 is inserted into the interior of the dust removal box 250 through the socket.

[0027] Specifically, such as Figure 3 As shown, the semiconductor chip processing and cutting tooling has T-shaped support grooves 251 on both sides of the inner walls of the dust removal box 250, and T-shaped slide rails 271 are fixedly connected to both side walls of the dust removal filter element 270. After the T-shaped slide rails 271 on the dust removal filter element 270 are inserted into the T-shaped support grooves 251, the T-shaped support grooves 251 cooperate with the T-shaped slide rails 271 to support the dust removal filter element 270.

[0028] Specifically, such as Figure 3 As shown, a semiconductor chip processing and cutting tool is provided, and a magnet 252 is embedded on the inner wall of the rear side of the dust removal box 250, and an iron plate that cooperates with the magnet 252 is embedded on the rear side wall of the dust removal filter element 270. The magnet 252 can absorb the iron plate, thereby fixing the dust removal filter element 270, making it convenient to disassemble and assemble the dust removal filter element 270.

[0029] During the specific implementation of the present invention, the wafer is placed on the placement seat 120, and then the adjusting knob 123 is rotated to drive the bidirectional screw 122 to rotate. When the bidirectional screw 122 rotates, the two sliders 124 drive the clamping blocks 125 to approach each other. The two clamping blocks 125 can clamp the wafer and fix it. Then the telescopic end of the electric telescopic rod 140 pushes the fixing seat 150 downward so that the cutting wheel 191 contacts the wafer. The output shaft of the cutting motor 192 can drive the cutting wheel 191 to rotate at a high speed to cut the wafer. When cutting, the electric slider 124 drives the clamping blocks 125 to move closer to each other. The two clamping blocks 125 can clamp the wafer and fix it. The slide on the rail 110 can drive the placement seat 120 to move back and forth, so that the cutting wheel 191 completes the horizontal cutting of the wafer. After the horizontal cutting is completed, the telescopic end of the electric telescopic rod 140 drives the fixed seat 150 to rise a certain distance so that the cutting wheel 191 does not contact the wafer. Then, the output shaft of the drive motor 170 can drive the screw 180 to rotate. When the screw 180 rotates, the moving block 160 drives the mounting frame 190 to move forward and backward, so that the cutting wheel 191 moves back a certain distance. Then, the telescopic end of the electric telescopic rod 140 pushes the fixed seat 150 to move back and forth. The seat 150 moves down and cooperates with the electric slide rail 110 to complete the horizontal cutting again. Repeating it several times can complete the slitting. During the slitting process, under the action of the first fan 240, air is blown out from the exhaust hollow plate 220, and the dust generated during the slitting is blown to the suction hollow plate 230. Under the action of the second fan 260, a negative pressure is generated in the suction hollow plate 230, so that the dust enters the dust removal box 250 and is filtered by the dust removal filter element 270, thereby ensuring the cleanliness of the production environment, improving product quality, and being more practical. When the dust removal filter element 270 needs to be purged, the dust removal filter element 270 is purged. When cleaning, pull the pull ring on the dust filter element 270, and after overcoming the suction force of the magnet 252, the dust filter element 270 can be pulled out of the dust box 250. After cleaning, insert the dust filter element 270 into the dust box 250 from the socket, and the T-shaped slide rail 271 on the dust filter element 270 will be inserted into the T-shaped support groove 251. The T-shaped support groove 251 cooperates with the T-shaped slide rail 271 to support the dust filter element 270. Continue to push the dust filter element 270 inward until the magnet 252 sucks the iron plate on the dust filter element 270, and the installation is completed.

[0030] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions are merely illustrative of the principles of the present invention. Various changes and improvements may be made to the present invention without departing from the spirit and scope of the present invention. Such changes and improvements are intended to fall within the scope of the present invention. The scope of protection claimed in this invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor chip processing and cutting tool, comprising a body (100), characterized in that: An electric slide rail (110) is fixedly connected to the upper side wall of the machine body (100), a placement seat (120) is fixedly connected to the slide seat of the electric slide rail (110), an L-shaped support plate (130) is fixedly connected to the rear of the upper side wall of the machine body (100), an electric telescopic rod (140) is fixedly connected to the upper outer wall of the L-shaped support plate (130), the telescopic end of the electric telescopic rod (140) slides through the upper side wall of the L-shaped support plate (130) and is fixedly connected to the fixed seat (150), a moving block (160) is slidably provided in the fixed seat (150), a driving motor (170) is fixedly connected to the front outer wall of the fixed seat (150), and the driving motor (170) The output shaft extends into the fixed seat (150) and is fixedly connected to a screw rod (180); the other end of the screw rod (180) is threadedly passed through the moving block (160) and is rotatably connected to the rear inner wall of the fixed seat (150); a mounting bracket (190) is fixedly connected to the bottom wall of the moving block (160); a cutting wheel (191) is rotatably provided between the front and rear inner walls of the mounting bracket (190); a cutting motor (192) is fixedly connected to the rear outer wall of the mounting bracket (190); an output shaft end of the cutting motor (192) passes through the rear wall of the mounting bracket (190) and is fixedly connected to one end of the cutting wheel (191); and a dustproof component (200) is also provided on the machine body (100).

2. The semiconductor chip processing and cutting tool according to claim 1, characterized in that: The dustproof assembly (200) comprises an L-shaped connecting rod (210), an exhaust hollow plate (220), an air suction hollow plate (230), a first fan (240), a dust removal box (250), a second fan (260) and a dust removal filter element (270), and two symmetrically distributed L-shaped connecting rods (210) are fixedly connected to the outer peripheral wall of the placement seat (120), wherein the other end of one of the L-shaped connecting rods (210) is fixedly connected to the exhaust hollow plate (220) and the other end of the other L-shaped connecting rod (210) is fixedly connected to the air suction hollow plate (230). 0), a first fan (240) is fixedly connected to one side wall of the machine body (100), and a dust removal box (250) and a second fan (260) are fixedly connected to the other side wall, a dust removal filter element (270) is provided in the dust removal box (250), an air outlet end of the first fan (240) is connected to the exhaust hollow plate (220) through a hose, an upper side wall of the dust removal box (250) is connected to the suction hollow plate (230) through a hose, and a bottom wall of the dust removal box (250) is connected to the air inlet end of the second fan (260) through a hose.

3. The semiconductor chip processing and cutting tool according to claim 1, characterized in that: A sliding groove (121) is provided on the upper side wall of the placement seat (120), and a bidirectional screw (122) is rotatably provided between the front and rear side walls of the sliding groove (121). The front end of the bidirectional screw (122) extends to the outside of the placement seat (120) and is fixedly connected to an adjusting knob (123). Two sliders (124) are threadedly sleeved on the bidirectional screw (122), and a clamping block (125) is fixedly connected to the upper wall of the slider (124). The slider (124) is slidably connected to the sliding groove (121).

4. The semiconductor chip processing and cutting tool according to claim 2, characterized in that: The front side wall of the dust removal box (250) is provided with a socket for inserting the dust removal filter element (270).

5. The semiconductor chip processing and cutting tool according to claim 4, characterized in that: T-shaped support grooves (251) are provided on both inner walls of the dust removal box (250), and T-shaped slide rails (271) are fixedly connected to both inner walls of the dust removal filter element (270).

6. The semiconductor chip processing and cutting tool according to claim 5, characterized in that: A magnet (252) is embedded and installed on the rear inner wall of the dust removal box (250), and an iron plate that matches the magnet (252) is embedded and installed on the rear side wall of the dust removal filter element (270).

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