RGBW-LED lamp bead with built-in IC

Abstract

The utility model discloses an RGBW-LED lamp bead with a built-in IC, and relates to the technical field of LED lamp bead structures. The RGBW-LED lamp bead comprises an insulating base, a conductive pin assembly, an IC chip, an IC bonding pad assembly and a light-emitting assembly, the IC bonding pad assembly and the light-emitting assembly are embedded in the insulating base, the IC chip is welded to the top of the IC bonding pad assembly, the light-emitting assembly is located above the IC chip, and the conductive pin assembly is connected with the IC bonding pad assembly. The light-emitting assembly comprises a solid crystal bonding pad, an RGB light-emitting chip, a white light-emitting chip and a light-emitting positive electrode bonding pad. The RGB light-emitting chip and the white light-emitting chip are both installed on the solid crystal bonding pad. According to the utility model, the IC is embedded in the lamp bead, and the control circuit is integrated on the lamp bead, so that the circuit is simpler, the display screen is simpler and more convenient to manufacture and install, and the high-definition picture of the display screen is more favorably realized; the problems that wiring of traditional Mini RGB LED lamp beads on a client side PCB is complex, and process limitation exists when a high-definition picture of a display screen needs to be achieved are solved.

Description

Technical Field

[0001] The utility model relates to the technical field of LED lamp bead structures, in particular to an RGBW-LED lamp bead with a built-in IC. Background Art

[0002] As a key component of display technology, Mini RGB LEDs are leading the charge in display innovation with their superior performance and broad application prospects. The core principle of Mini RGB LEDs lies in the use of miniature RGB (red, green, and blue) primary color LEDs as pixels or backlight sources. These LEDs are typically small in size and can significantly improve screen brightness and contrast. By independently controlling the brightness of each RGB bead, Mini RGB LED technology enables more refined local dimming and a wider dynamic range, providing superior image quality and color accuracy.

[0003] While current Mini RGB LEDs have demonstrated numerous advantages, they still face certain limitations amidst the growing demand for high definition, rich colors, and brightness. Existing Mini RGB LEDs typically utilize a flat BT substrate as a base. This substrate is a single-layer board consisting of front and back circuits. The front circuit is used to bond the light-emitting chip and achieve electrical interconnection, while the back circuit is used for soldering to the LED display module PCB, providing electrical continuity between the front and back circuits. The front circuit of the substrate is divided into a die-bonding area, a wire bonding area, and an insulation isolation area. Silver glue is used to secure the red light chip to the red die-bonding area, while insulating glue or silver glue is used to secure the blue and green light chips to their respective die-bonding areas. After packaging and cutting, the resulting LEDs emit the three primary colors of RGB light. The RGB chips in the Mini RGB LED lamp beads with this lamp bead structure are usually controlled separately, and independent circuits and control signals need to be provided for each color of the light-emitting chip. This will lead to a significant increase in the number of wirings on the client's PCB board, making the wiring more complicated. This not only increases the difficulty of lamp bead layout, but also the complex PCB board wiring may limit the resolution, response speed and refresh rate of the display, and may affect the color accuracy and stability, which will pose process limitations for achieving high-definition images on the display. Utility Model Content

[0004] In view of the above-mentioned deficiencies in the prior art, the purpose of the present invention is to propose an RGBW-LED lamp bead with a built-in IC. The IC is embedded in the lamp bead and the control circuit is integrated into the lamp bead, making the circuit simpler, thereby making it easier to manufacture and install the display screen, and more conducive to achieving high-definition images on the display screen. It solves the problems of complex wiring of traditional Mini RGB LED lamp beads on the client PCB board and the process limitations of achieving high-definition images on the display screen.

[0005] In order to solve the above technical problems, the utility model provides an RGBW-LED lamp bead with a built-in IC, which is characterized by comprising an insulating seat, a conductive pin assembly, an IC chip, an IC pad assembly and a light-emitting assembly;

[0006] The IC pad assembly and the light emitting assembly are both embedded in the insulating seat, the IC chip is soldered to the top of the IC pad assembly, the light emitting assembly is located above the IC chip, and the light emitting assembly and the IC chip are electrically connected;

[0007] The conductive pin assembly is arranged at the bottom of the insulating seat, and the conductive pin assembly is electrically connected to the IC pad assembly;

[0008] The light-emitting component includes a die-bonding pad, an RGB light-emitting chip, a white light-emitting chip, and a positive light-emitting pad. The RGB light-emitting chip and the white light-emitting chip are both mounted on the die-bonding pad. The RGB light-emitting chip and the white light-emitting chip are respectively provided with corresponding positive light-emitting pads. The IC chip is electrically connected to the positive light-emitting pads, and the RGB light-emitting chip and the white light-emitting chip are respectively electrically connected to the corresponding positive light-emitting pads.

[0009] The conductive pin assembly includes a negative power pin, and the die-bonding pad is electrically connected to the negative power pin.

[0010] Preferably, the conductive pin assembly further includes a positive power pin, a data input pin, and a data output pin, and the negative power pin, the positive power pin, the data input pin, and the data output pin are respectively arranged at the four corners of the bottom of the insulating seat;

[0011] The IC pad assembly includes an IC positive pad, an IC negative pad, an IC data input pad and an IC data output pad. The IC positive pad is electrically connected to the positive power pin, the IC negative pad is electrically connected to the negative power pin, the IC data input pad is electrically connected to the data input pin, and the IC data output pad is electrically connected to the data output pin.

[0012] Preferably, the RGBW-LED lamp bead with built-in IC further includes a connecting pad, which is embedded in the interior of the insulating seat, and the installation height of the connecting pad is flush with the installation height of the IC pad assembly;

[0013] The IC chip is electrically connected to the light-emitting positive electrode pad through the connecting pad.

[0014] Preferably, there are four connecting pads, namely a red light connecting pad, a green light connecting pad, a blue light connecting pad and a white light connecting pad, and the four connecting pads are independent of each other;

[0015] There are eight solder joints on the IC chip, namely GND solder joint, VDD solder joint, DI solder joint, DO solder joint, R solder joint, G solder joint, B solder joint and W solder joint. The GND solder joint is connected to the negative pad of the IC, the VDD solder joint is connected to the positive pad of the IC, the DI solder joint is connected to the IC data input pad, the DO solder joint is connected to the IC data output pad, the R solder joint is connected to the red light connection pad, the G solder joint is connected to the green light connection pad, the B solder joint is connected to the blue light connection pad, and the W solder joint is connected to the white light connection pad.

[0016] Preferably, the RGB light-emitting chip includes a red light chip, a blue light chip and a green light chip, and one side of the red light chip, the blue light chip, the green light chip and the white light-emitting chip is respectively provided with the light-emitting positive electrode pad, namely a red light positive electrode pad, a blue light positive electrode pad, a green light positive electrode pad and a white light positive electrode pad;

[0017] The red light positive electrode pad is electrically connected to the red light connection pad, the blue light positive electrode pad is electrically connected to the blue light connection pad, the green light positive electrode pad is electrically connected to the green light connection pad, and the white light positive electrode pad is electrically connected to the white light connection pad;

[0018] The positive electrode of the red light chip is connected to the red light positive electrode pad via a bonding wire, the positive electrode of the blue light chip is connected to the blue light positive electrode pad via a bonding wire, the positive electrode of the green light chip is connected to the green light positive electrode pad via a bonding wire, and the positive electrode of the white light emitting chip is connected to the white light positive electrode pad via a bonding wire;

[0019] Preferably, the RGBW-LED lamp bead with built-in IC further includes five conductive pillars, each of which is vertically embedded in the insulating seat, and each of which is located between the IC pad assembly and the die-bonding pad;

[0020] The red light positive electrode pad is electrically connected to the red light connecting pad through the conductive column, the blue light positive electrode pad is electrically connected to the blue light connecting pad through the conductive column, the green light positive electrode pad is electrically connected to the green light connecting pad through the conductive column, the white light positive electrode pad is electrically connected to the white light connecting pad through the conductive column, and the die-bonding pad is electrically connected to the negative power supply pin through the conductive column.

[0021] Preferably, the top surface of the insulating seat has two recesses forming a first packaging groove and a second packaging groove, the depths of the first packaging groove and the second packaging groove respectively extend to the die-bonding pad, the white light-emitting chip is located in the first packaging groove, and the RGB light-emitting chip is located in the second packaging groove;

[0022] The interior of the first packaging groove is filled with white light packaging glue, and the interior of the second packaging groove is filled with RGB packaging glue.

[0023] Preferably, the RGBW-LED lamp bead with built-in IC further includes a conductive metal wire, and the conductive pin assembly is electrically connected to the IC pad assembly via the conductive metal wire;

[0024] The ratio of the width of the conductive metal wire to the width of the RGBW-LED lamp bead is (0.035-0.07):1.

[0025] Preferably, the ratio of the area of the upper surface of the die-bonding pad to the area of the cross section of the insulating seat is (0.3-0.6):1.

[0026] Preferably, the RGBW-LED lamp bead with built-in IC has a length of 2.0 to 4.0 mm, a width of 2.0 to 4.0 mm, and a height of 1.2 to 3.5 mm.

[0027] The implementation of this utility model has the following beneficial effects:

[0028] 1. This technical solution redesigns the structure of the LED lamp beads, embedding the IC within the traditional RGBW-LED lamp bead structure and integrating the control circuit into the LED lamp bead. On the one hand, this greatly reduces the number of external circuits and connecting wires, making the circuit more simple and thus easier to manufacture and install the display screen. On the other hand, by placing the IC chip inside the RGBW-LED lamp bead and integrating the control circuit into the lamp bead, this technical solution can reduce display screen failures caused by poor external circuit connections or component failures, thereby improving overall reliability and stability. Furthermore, the embedded IC design allows each lamp bead to be independently controlled, providing great flexibility and convenience, and making the display screen more colorful.

[0029] 2. In this technical solution, the light-emitting component of the RGBW-LED lamp bead with a built-in IC is located above the IC chip, forming a two-layer functional structure from bottom to top: the IC functional layer and the RGBW chip functional layer. This not only improves the heat dissipation performance of the lamp bead, but also facilitates the layout of the RGBW chip, making the lamp bead brighter and improving the clarity of the display screen. Furthermore, the two-layer functional structure of the lamp bead can reduce the overall size of the lamp bead, further improving the clarity of the display screen.

[0030] 3. This technical solution sets a white light-emitting chip on the RGBW-LED lamp bead, so that the RGBW-LED lamp bead of this technical solution can light up a separate white light-emitting chip, which can further improve the brightness of the lamp bead, making the display screen brighter, clearer, and brighter. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 This is a schematic diagram of the structure of an RGBW-LED lamp bead with a built-in IC in one embodiment of the present invention;

[0032] Figure 2 yes Figure 1 The front view of the RGBW-LED lamp bead with built-in IC is shown;

[0033] Figure 3 yes Figure 1 The longitudinal cross-sectional view of the RGBW-LED lamp bead with built-in IC at the conductive column;

[0034] Figure 4 yes Figure 1 A cross-sectional view of an RGBW-LED lamp bead with a built-in IC at the IC pad assembly is shown;

[0035] Figure 5 yes Figure 4 The schematic diagram of the structure of the RGBW-LED lamp bead with built-in IC after installing the IC chip;

[0036] Figure 6 yes Figure 1 The cross-sectional view of the RGBW-LED lamp bead with built-in IC at the die-bonding pad is shown;

[0037] Figure 7 yes Figure 1 The back view of the RGBW-LED lamp bead with built-in IC is shown;

[0038] Figure 8 yes Figure 1 Schematic diagram of the structure of the IC chip shown;

[0039] In the figure: insulating seat 1, conductive pin assembly 2, IC chip 3, IC pad assembly 4, connecting pad 6, conductive column 7, conductive metal wire 8, negative connecting pad 9, first packaging groove 11, second packaging groove 12, power negative pin 21, power positive pin 22, data input pin 23, data output pin 24, IC positive pad 41, IC negative pad 42, IC data input pad 43, IC data output pad 44, die bonding pad 51, RGB light emitting chip 52, white light emitting chip 53, light positive Positive electrode pad 54, white light packaging glue 55, RGB packaging glue 56, red light connection pad 61, green light connection pad 62, blue light connection pad 63, white light connection pad 64, GND solder point 31, VDD solder point 32, DI solder point 33, DO solder point 34, R solder point 35, G solder point 36, B solder point 37, W solder point 38, red light chip 521, blue light chip 522, green light chip 523, red light positive electrode pad 541, blue light positive electrode pad 542, green light positive electrode pad 543, white light positive electrode pad 544. DETAILED DESCRIPTION

[0040] To make the objectives, technical solutions, and advantages of the present invention more apparent, the present invention will be described in further detail below with reference to the accompanying drawings. The present invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to facilitate a more thorough and comprehensive understanding of the disclosure of the present invention.

[0041] In the description of the present invention, it should be understood that the terms "up", "down", "left", "right", "top", "bottom", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present invention.

[0042] In the description of this utility model, it should be noted that, unless otherwise specified or limited, the terms "mounted" and "connected" should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integral connection; they can refer to direct connection, indirect connection through an intermediate medium, or internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on the specific circumstances.

[0043] like Figures 1 to 8 As shown, an RGBW-LED lamp bead with a built-in IC includes an insulating base 1, a conductive pin assembly 2, an IC chip 3, an IC pad assembly 4 and a light-emitting assembly;

[0044] The IC pad assembly 4 and the light emitting assembly are both embedded in the insulating base 1, the IC chip 3 is soldered to the top of the IC pad assembly 4, the light emitting assembly is located above the IC chip 3, and the light emitting assembly and the IC chip 3 are electrically connected;

[0045] The conductive pin assembly 2 is arranged at the bottom of the insulating seat 1, and the conductive pin assembly 2 is electrically connected to the IC pad assembly 4;

[0046] The light-emitting component includes a die-bonding pad 51, an RGB light-emitting chip 52, a white light-emitting chip 53, and a positive light-emitting pad 54. The RGB light-emitting chip 52 and the white light-emitting chip 53 are both mounted on the die-bonding pad 51. The RGB light-emitting chip 52 and the white light-emitting chip 53 are respectively provided with corresponding positive light-emitting pads 54. The IC chip 3 is electrically connected to the positive light-emitting pads 54. The RGB light-emitting chip 52 and the white light-emitting chip 53 are respectively electrically connected to the corresponding positive light-emitting pads 54.

[0047] The conductive pin assembly 2 includes a negative power pin 21 , and the die-bonding pad 51 is electrically connected to the negative power pin 21 .

[0048] It's worth noting that this technical solution redesigns the structure of the lamp beads, embedding an IC within the traditional RGBW-LED lamp bead structure and integrating the control circuitry into the LED bead itself. This significantly reduces the number of external circuits and connecting wires, simplifying the circuit and thus making the display screen easier to manufacture and install. Furthermore, by placing an IC chip within the RGBW-LED lamp bead and integrating the control circuitry within the bead itself, this solution can reduce display screen failures caused by poor external circuit connections or component failures, thereby improving overall reliability and stability. Furthermore, the embedded IC design allows each lamp bead to be independently controlled, providing significant flexibility and convenience, and resulting in a richer display screen.

[0049] Due to the significant size difference between the IC chip and the RGBW chip, with the IC chip being significantly larger than the RGBW chip, placing the IC chip and the RGBW chip on the same layer, similar to placing them on the same horizontal plane, can lead to positioning limitations. This limitation increases with decreasing LED size, leading to irregular functional area layouts and difficulty centering the RGBW chip, which can result in unclear display screen images. In the RGBW-LED lamp bead of this technical solution, the light-emitting component is located above the IC chip 3. Specifically, the die bonding pad 51, RGB light-emitting chip 52, white light-emitting chip 53, and positive electrode pad 54 are all located above the IC chip 3. This places the light-emitting component and the IC chip 3 in separate layers, forming a two-layer functional structure, from bottom to top: the IC functional layer and the RGBW chip functional layer. The upper layer has ample space for the four RGBW chips, facilitating the layout of the RGBW chips and enabling them to be centered, resulting in higher lamp brightness and improved display screen clarity. Furthermore, thanks to the two-layer functional structure of the lamp beads, the area occupied by the RGBW-LED lamp beads can be effectively reduced, allowing the LED display screen to accommodate more lamp beads, thereby further improving the clarity of the LED display screen. Furthermore, because the RGBW-LED lamp beads of this technical solution adopt a two-layer functional structure and the IC chip 3 is located below the insulating base 1, the distance between the IC chip 3 and the bottom surface of the insulating base 1 is closer, which is more conducive to the heat dissipation of the IC chip 3, thereby improving the overall heat dissipation performance of the RGBW-LED lamp beads and extending the life of the RGBW-LED lamp beads.

[0050] To further illustrate, the light-emitting assembly of this technical solution includes a die-bonding pad 51, an RGB light-emitting chip 52, a white light-emitting chip 53, and a positive light-emitting pad 54. Both the RGB light-emitting chip 52 and the white light-emitting chip 53 are mounted on the die-bonding pad 51 and controlled by the IC chip 3. This technical solution sets the white light-emitting chip 53 on the RGBW-LED lamp bead, allowing the RGBW-LED lamp bead of this technical solution to illuminate the individual white light-emitting chip 53, making the display brighter.

[0051] Further explanation, the conductive pin assembly 2 also includes a positive power pin 22, a data input pin 23 and a data output pin 24, and the negative power pin 21, the positive power pin 22, the data input pin 23 and the data output pin 24 are respectively arranged at the four corners of the bottom of the insulating base 1;

[0052] The IC pad assembly 4 includes an IC positive pad 41, an IC negative pad 42, an IC data input pad 43 and an IC data output pad 44. The IC positive pad 41 is electrically connected to the positive power pin 22, the IC negative pad 42 is electrically connected to the negative power pin 21, the IC data input pad 43 is electrically connected to the data input pin 23, and the IC data output pad 44 is electrically connected to the data output pin 24.

[0053] Further explanation, the RGBW-LED lamp bead with built-in IC also includes a connecting pad 6, which is embedded in the inside of the insulating seat 1, and the installation height of the connecting pad 6 is flush with the installation height of the IC pad assembly 4; that is, in this technical solution, the connecting pad 6 and the IC pad assembly 4 are located on the same horizontal plane.

[0054] The IC chip 3 is electrically connected to the light-emitting positive electrode pad 54 through the connecting pad 6 .

[0055] Further explanation, there are four connecting pads 6, namely a red light connecting pad 61, a green light connecting pad 62, a blue light connecting pad 63 and a white light connecting pad 64, and the four connecting pads 6 are independent of each other;

[0056] The IC chip 3 is provided with eight solder joints, namely a GND solder joint 31, a VDD solder joint 32, a DI solder joint 33, a DO solder joint 34, an R solder joint 35, a G solder joint 36, a B solder joint 37 and a W solder joint 38. The GND solder joint 31 is connected to the IC negative electrode pad 42, the VDD solder joint 32 is connected to the IC positive electrode pad 41, the DI solder joint 33 is connected to the IC data input pad 43, the DO solder joint 34 is connected to the IC data output pad 44, the R solder joint 35 is connected to the red light connection pad 61, the G solder joint 36 is connected to the green light connection pad 62, the B solder joint 37 is connected to the blue light connection pad 63, and the W solder joint 38 is connected to the white light connection pad 64.

[0057] The present technical solution optimizes and improves the structure and layout of the conductive pin assembly 2, the IC pad assembly 4, and the connecting pad 6, making the layout of the IC functional layer and the conductive pins more compact, which is conducive to reducing the volume of the entire RGBW-LED lamp bead; and can enable the IC chip 3 to be flipped, which not only shortens the signal transmission path, helps to reduce delay, and improves the signal transmission speed and stability, but also helps the IC chip 3 dissipate heat, which can further improve the stability and reliability of the lamp bead; at the same time, the flip-chip IC chip 3 can simplify the packaging process and reduce production costs to a certain extent. The present technical solution has the negative power pin 21, the positive power pin 22, the data input pin 23, and the data output pin 24 respectively arranged at the four corners of the bottom of the insulating seat 1, which is not only conducive to wiring on the external PCB board, avoiding interference and conflict between pins, making the wiring clearer and more standardized, but also separates the pins with different functions, which can reduce electrical interference between them and improve the transmission quality of the signal.

[0058] Preferably, a first identification portion (not shown) is provided at the bottom of the insulating seat. Since the negative power pin 21, the positive power pin 22, the data input pin 23, and the data output pin 24 are respectively provided at the four corners of the bottom of the insulating seat 1, and the structures and shapes of these four pins are consistent, it is difficult to distinguish the negative power pin 21 from the positive power pin 22. Therefore, providing the first identification portion at the bottom of the insulating seat is conducive to identifying the negative power pin 21 and the positive power pin 22. Preferably, the first identification portion is provided at the bottom of the IC chip 3 to identify the solder joints of the IC chip 3.

[0059] Further explanation, the RGB light-emitting chip 52 includes a red light chip 521, a blue light chip 522, and a green light chip 523. The red light chip 521, the blue light chip 522, the green light chip 523, and the white light-emitting chip 53 are respectively provided with the light-emitting positive electrode pads 54 on one side, namely, a red light positive electrode pad 541, a blue light positive electrode pad 542, a green light positive electrode pad 543, and a white light positive electrode pad 544.

[0060] The red light positive electrode pad 541 is electrically connected to the red light connection pad 61, the blue light positive electrode pad 542 is electrically connected to the blue light connection pad 63, the green light positive electrode pad 543 is electrically connected to the green light connection pad 62, and the white light positive electrode pad 544 is electrically connected to the white light connection pad 64;

[0061] The positive electrode of the red light chip 521 is connected to the red light positive electrode pad 541 through a bonding wire, the positive electrode of the blue light chip 522 is connected to the blue light positive electrode pad 542 through a bonding wire, the positive electrode of the green light chip 523 is connected to the green light positive electrode pad 543 through a bonding wire, and the positive electrode of the white light-emitting chip 53 is connected to the white light positive electrode pad 544 through a bonding wire; and the negative electrode of the red light chip 521 is electrically connected to the die-bonding pad 51, the negative electrode of the green light chip 523 is electrically connected to the die-bonding pad 51 through a bonding wire, the negative electrode of the blue light chip 522 is electrically connected to the die-bonding pad 51 through a bonding wire, and the negative electrode of the white light-emitting chip 53 is electrically connected to the die-bonding pad 51 through a bonding wire, thereby achieving electrical connection.

[0062] Further explanation, the RGBW-LED lamp bead with built-in IC also includes five conductive pillars 7, and the five conductive pillars 7 are vertically embedded in the interior of the insulating base 1, and the five conductive pillars 7 are located between the IC pad assembly 4 and the die-bonding pad 51;

[0063] The red light positive electrode pad 541 is electrically connected to the red light connecting pad 61 through the conductive column 7, the blue light positive electrode pad 542 is electrically connected to the blue light connecting pad 63 through the conductive column 7, the green light positive electrode pad 543 is electrically connected to the green light connecting pad 62 through the conductive column 7, the white light positive electrode pad 544 is electrically connected to the white light connecting pad 64 through the conductive column 7, and the die-bonding pad 51 is electrically connected to the negative power supply pin 21 through the conductive column 7, so that the IC functional layer and the RGBW chip functional layer of this technical solution are conductively connected through the conductive column 7.

[0064] Preferably, the conductive pillar 7 is made of copper, which has better conductivity.

[0065] Further explanation, the top surface of the insulating base 1 has two concave portions forming a first packaging groove 11 and a second packaging groove 12. The depths of the first packaging groove 11 and the second packaging groove 12 extend to the die bonding pad 51, respectively. The white light-emitting chip 53 is located in the first packaging groove 11, and the RGB light-emitting chip 52 is located in the second packaging groove 12.

[0066] The first packaging groove 11 is filled with white light packaging glue 55 , and the second packaging groove 12 is filled with RGB packaging glue 56 .

[0067] It is worth noting that the top surface of the insulating seat 1 of the present technical solution has two concave places to form a first packaging groove 11 and a second packaging groove 12, that is, the first packaging groove 11 and the second packaging groove 12 are similar to a bowl-cup structure, and the white light-emitting chip 53 is located inside the first packaging groove 11, and the three RGB light-emitting chips, the red light chip 521, the blue light chip 522 and the green light chip 523, are located inside the second packaging groove 12. Then, the white light-emitting chip 53 is encapsulated in the first packaging groove 11 by the white light encapsulation glue 55, and the RGB light-emitting chip is encapsulated in the second packaging groove 12 by the RGB encapsulation glue 56, so that the white light-emitting chip 53 and the RGB light-emitting chip 52 are tightly wrapped, which can improve the airtightness of the RGBW-LED lamp beads.

[0068] Preferably, the top surfaces of the white light encapsulation glue 55 and the RGB encapsulation glue 56 are flush with the top surface of the insulating seat 1, which can ensure the integrity of the packaging structure, improve packaging reliability, optimize optical performance and simplify the production process, which helps to improve the overall performance and quality of RGBW-LED lamp beads and meet the needs of various application scenarios.

[0069] Specifically, the white light encapsulation glue 55 is filled in the first packaging groove 11 of the present technical solution, which can make the white light-emitting chip 53 emit white light, further improving the brightness of the RGBW-LED lamp beads of the present technical solution, thereby making the display screen brighter. The material of the white light encapsulation glue 55 of the present technical solution is well known and can be purchased directly from the market, or the required materials can be purchased and simply mixed to obtain it. For example, in one embodiment of the present technical solution, the white light-emitting chip 53 is a blue light chip, and a mixture of silicone glue and phosphor can be used as the white light encapsulation glue, so that it will emit white light after emitting light, thereby increasing the brightness of the display screen.

[0070] Specifically, in this technical solution, the second packaging groove 12 is filled with RGB encapsulation glue 56. The material of RGB encapsulation glue 56 is well-known and can be purchased directly from the market, or the required materials can be purchased and simply mixed using existing processes. For example, the material of RGB encapsulation glue 56 is epoxy resin glue, or a mixture of epoxy resin glue and diffusion powder. Both have good refractive index and light transmittance, as well as good water vapor barrier, shock absorption and impact resistance.

[0071] Further explanation, the RGBW-LED lamp bead with built-in IC also includes a conductive metal wire 8, and the conductive pin component 2 is electrically connected to the IC pad component 4 through the conductive metal wire 8;

[0072] The ratio of the width of the conductive metal wire 8 to the width of the RGBW-LED lamp bead is (0.035-0.07):1.

[0073] It is worth noting that the soldering pads of traditional RGBW-LED lamp beads are usually directly connected to the conductive pins. Due to the large area of the soldering pads, the deformation of the soldering pads due to thermal expansion and contraction is also large when the RGBW-LED lamp beads are working for a long time, which can easily lead to small gaps or voids between the soldering pads and the insulating seat, reducing the airtightness of the RGBW-LED lamp beads. In this technical solution, the IC soldering pad assembly 4 includes an IC positive soldering pad 41, an IC negative soldering pad 42, an IC data input soldering pad 43 and an IC data output soldering pad 44. The IC positive soldering pad 41, the IC negative soldering pad 42, the IC data input soldering pad 43 and the IC data output soldering pad 44 are respectively connected to the corresponding conductive pins through the conductive metal wire 8, so that the area of the four soldering pads of the IC positive soldering pad 41, the IC negative soldering pad 42, the IC data input soldering pad 43 and the IC data output soldering pad 44 of the technical solution can be designed to be smaller, much smaller than the traditional IC soldering pad, and the width of the conductive metal wire 8 is also very small (such as Figure 4 As shown), it can effectively reduce the deformation amplitude of the IC pad assembly 4 and the conductive metal wire 8 during thermal expansion and contraction, thereby ensuring that the RGBW-LED lamp beads of this technical solution can maintain good airtightness for a long time, thereby ensuring the reliability and durability of the RGBW-LED lamp beads.

[0074] Further explanation, a negative electrode connecting pad 9 connected to the conductive metal wire 8 is provided on one side of the conductive metal wire 8 connecting the IC negative electrode pad 42 and the negative power supply pin 21, and the solid crystal pad 51 is connected to the negative electrode connecting pad 9 through the conductive column 7, thereby electrically connecting the solid crystal pad 51 to the negative power supply pin 21.

[0075] Preferably, the negative power pin 21, positive power pin 22, data input pin 23, and data output pin 24 of this technical solution have the same structure, each comprising an embedded portion and an external portion. The embedded portion is embedded within the insulating base 1 and connected to the conductive metal wire 8; the external portion is provided outside the insulating base 1 for connection to the client's PCB board. Preferably, the embedded portion is an arc-shaped sheet structure, with one side of the embedded portion being in contact with the insulating base 1 and the other side being filled with resin (such as epoxy resin), giving the lamp bead an overall square shape, which is more conducive to integration.

[0076] To further illustrate, the ratio of the area of the upper surface of the die-bonding pad 51 to the area of the cross section of the insulating base 1 is (0.3-0.6):1.

[0077] It is worth noting that the height difference between the IC chip 3 and the RGBW chip in this technical solution creates a two-layer functional structure, consisting of an IC functional layer and an RGBW chip functional layer, from bottom to top. Placing the IC chip 3 in the bottom IC functional layer facilitates heat dissipation, while placing the RGBW chip in the top RGBW chip functional layer prevents the IC chip 3 from interfering with the RGBW chip layout. This leaves ample space in the top RGBW chip functional layer for the four RGBW chips, allowing them to be centrally positioned. For example, in a preferred embodiment of this technical solution, the four RGBW chips are arranged in a spaced-apart arrangement, forming a "straight" shape in the center of the lamp bead. This not only increases the brightness of the lamp bead and, consequently, the clarity of the display, but also, because the RGBW chip functional layer is separately provided, more metal components, such as the die-bonding pad 51 and the positive electrode pad 54, can be retained, resulting in better heat dissipation. This facilitates heat dissipation from the four RGBW chips and the IC chip 3, further enhancing the heat dissipation performance of the RGBW-LED lamp bead.

[0078] As a preferred embodiment, the ratio of the area of the upper surface of the die-bonding pad 51 to the area of the cross section of the insulating seat 1 in this technical solution is (0.3-0.6): 1 (as Figure 6 , exemplarily 0.3:1, 0.35:1, 0.4:1, 0.45:1, 0.5:1, 0.55:1, and 0.6:1, but not limited thereto. The die-bonding pad 51 of this technical solution has a larger area and is made of metal, which is beneficial for heat dissipation and improving the overall performance of the RGBW-LED lamp beads.

[0079] To further illustrate, the length of the RGBW-LED lamp bead with built-in IC is 2.0-4.0 mm, the width is 2.0-4.0 mm, and the height is 1.2-3.5 mm.

[0080] Currently, IC-embedded lamp beads generally have the IC chip and the light-emitting chip arranged in the same layer structure. Due to the large size of the IC chip, this will result in a larger size of the IC-embedded lamp bead. Since the clarity of an LED display screen is directly proportional to the number of lamp beads, if larger lamp beads are used in a display screen of a certain size, the number of lamp beads that can be arranged on the LED display screen will be reduced, resulting in a decrease in the clarity of the LED display screen. This technical solution arranges the RGBW-LED lamp bead with an embedded IC into a two-layer functional structure, with the IC functional layer and the RGBW chip functional layer located in different vertical layer structures, making the overall size of the lamp bead smaller. The RGBW-LED lamp bead with an embedded IC in this technical solution has a length of 2.0 to 4.0 mm, a width of 2.0 to 4.0 mm, and a height of 1.2 to 3.5 mm, which is close to the size of a conventional Mini RGB LED without an embedded IC. This allows the RGBW-LED lamp bead with an embedded IC in this technical solution to provide higher resolution and more detailed display effects in a smaller space, ensuring that the LED display screen has better clarity.

[0081] The technical principles of the present invention have been described above with reference to specific embodiments. These descriptions are intended solely to illustrate the principles of the present invention and should not be construed in any way as limiting the scope of protection of the present invention. Based on the explanations herein, those skilled in the art will be able to devise other specific implementations of the present invention without inventive effort, and such implementations will fall within the scope of protection of the present invention.

Claims

1. An RGBW-LED lamp bead with built-in IC, characterized in that: Including an insulating seat, a conductive pin assembly, an IC chip, an IC pad assembly and a light-emitting assembly; The IC pad assembly and the light emitting assembly are both embedded in the insulating seat, the IC chip is soldered to the top of the IC pad assembly, the light emitting assembly is located above the IC chip, and the light emitting assembly and the IC chip are electrically connected; The conductive pin assembly is arranged at the bottom of the insulating seat, and the conductive pin assembly is electrically connected to the IC pad assembly; The light-emitting component includes a die-bonding pad, an RGB light-emitting chip, a white light-emitting chip, and a positive light-emitting pad. The RGB light-emitting chip and the white light-emitting chip are both mounted on the die-bonding pad. The RGB light-emitting chip and the white light-emitting chip are respectively provided with corresponding positive light-emitting pads. The IC chip is electrically connected to the positive light-emitting pads, and the RGB light-emitting chip and the white light-emitting chip are respectively electrically connected to the corresponding positive light-emitting pads. The conductive pin assembly includes a negative power pin, and the die-bonding pad is electrically connected to the negative power pin.

2. The RGBW-LED lamp bead with built-in IC according to claim 1, characterized in that: The conductive pin assembly further includes a positive power pin, a data input pin, and a data output pin, wherein the negative power pin, the positive power pin, the data input pin, and the data output pin are respectively arranged at the four corners of the bottom of the insulating seat; The IC pad assembly includes an IC positive pad, an IC negative pad, an IC data input pad and an IC data output pad. The IC positive pad is electrically connected to the positive power pin, the IC negative pad is electrically connected to the negative power pin, the IC data input pad is electrically connected to the data input pin, and the IC data output pad is electrically connected to the data output pin.

3. The RGBW-LED lamp bead with built-in IC according to claim 2, characterized in that: The RGBW-LED lamp bead with built-in IC further includes a connecting pad, which is embedded in the interior of the insulating seat, and the installation height of the connecting pad is flush with the installation height of the IC pad assembly; The IC chip is electrically connected to the light-emitting positive electrode pad through the connecting pad.

4. The RGBW-LED lamp bead with built-in IC according to claim 3, characterized in that: There are four connecting pads, namely a red light connecting pad, a green light connecting pad, a blue light connecting pad and a white light connecting pad, and the four connecting pads are independent of each other; There are eight solder joints on the IC chip, namely GND solder joint, VDD solder joint, DI solder joint, DO solder joint, R solder joint, G solder joint, B solder joint and W solder joint. The GND solder joint is connected to the negative pad of the IC, the VDD solder joint is connected to the positive pad of the IC, the DI solder joint is connected to the IC data input pad, the DO solder joint is connected to the IC data output pad, the R solder joint is connected to the red light connection pad, the G solder joint is connected to the green light connection pad, the B solder joint is connected to the blue light connection pad, and the W solder joint is connected to the white light connection pad.

5. The RGBW-LED lamp bead with built-in IC according to claim 4, characterized in that: The RGB light-emitting chip includes a red light chip, a blue light chip and a green light chip, and one side of the red light chip, the blue light chip, the green light chip and the white light-emitting chip are respectively provided with the light-emitting positive electrode pad, which are a red light positive electrode pad, a blue light positive electrode pad, a green light positive electrode pad and a white light positive electrode pad; The red light positive electrode pad is electrically connected to the red light connection pad, the blue light positive electrode pad is electrically connected to the blue light connection pad, the green light positive electrode pad is electrically connected to the green light connection pad, and the white light positive electrode pad is electrically connected to the white light connection pad; The positive electrode of the red light chip is connected to the red light positive electrode pad through a bonding wire, the positive electrode of the blue light chip is connected to the blue light positive electrode pad through a bonding wire, the positive electrode of the green light chip is connected to the green light positive electrode pad through a bonding wire, and the positive electrode of the white light emitting chip is connected to the white light positive electrode pad through a bonding wire.

6. The RGBW-LED lamp bead with built-in IC according to claim 5, characterized in that: The RGBW-LED lamp bead with built-in IC further includes five conductive pillars, each of which is vertically embedded in the interior of the insulating seat, and each of which is located between the IC pad assembly and the die-bonding pad; The red light positive electrode pad is electrically connected to the red light connecting pad through the conductive column, the blue light positive electrode pad is electrically connected to the blue light connecting pad through the conductive column, the green light positive electrode pad is electrically connected to the green light connecting pad through the conductive column, the white light positive electrode pad is electrically connected to the white light connecting pad through the conductive column, and the die-bonding pad is electrically connected to the negative power supply pin through the conductive column.

7. The RGBW-LED lamp bead with built-in IC according to claim 1, characterized in that: The top surface of the insulating base has two recesses forming a first packaging groove and a second packaging groove. The depths of the first packaging groove and the second packaging groove respectively extend to the die-bonding pad. The white light-emitting chip is located in the first packaging groove, and the RGB light-emitting chip is located in the second packaging groove. The interior of the first packaging groove is filled with white light packaging glue, and the interior of the second packaging groove is filled with RGB packaging glue.

8. The RGBW-LED lamp bead with built-in IC according to claim 1, characterized in that: The RGBW-LED lamp bead with built-in IC further includes a conductive metal wire, and the conductive pin assembly is electrically connected to the IC pad assembly through the conductive metal wire; The ratio of the width of the conductive metal wire to the width of the RGBW-LED lamp bead is (0.035-0.07):

1.

9. The RGBW-LED lamp bead with built-in IC according to claim 1, characterized in that: The ratio of the area of the upper surface of the die-bonding pad to the area of the cross section of the insulating seat is (0.3-0.6):

1.

10. The RGBW-LED lamp bead with built-in IC according to claim 1, characterized in that: The RGBW-LED lamp bead with built-in IC has a length of 2.0 to 4.0 mm, a width of 2.0 to 4.0 mm, and a height of 1.2 to 3.5 mm.

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