Polishing device for semiconductor processing and capable of preventing polishing solution from splashing

Abstract

The utility model discloses a polishing device for semiconductor processing and capable of preventing polishing liquid from splashing. The polishing device comprises a working table, a liquid storage box playing a role in storage is fixedly connected to the lower end of the working table, and electric telescopic rods are connected to the upper end of the working table in a bilateral symmetry mode through bolts. A collecting structure and a limiting structure are arranged in the liquid storage box and on the upper side of the liquid storage box correspondingly, the collecting structure comprises a supporting plate, a filter screen, a sealing plate and a liquid inlet hole, and the limiting structure comprises a connecting plate, a limiting groove, a connecting opening, a cavity, an air suction pipe and an air suction pump; the upper ends of the electric telescopic rods are fixedly connected to the left end and the right end of a second protection frame correspondingly, and connecting shafts are rotationally connected to the interior of the second protection frame at equal intervals. According to the semiconductor processing polishing device capable of preventing the polishing solution from splashing, the polishing solution is prevented from splashing, the polishing solution can be conveniently collected and recycled, semiconductors can be conveniently limited, and meanwhile, the semiconductors can be conveniently polished in batches.

Description

Technical Field

[0001] The utility model relates to the technical field related to semiconductor processing, in particular to a polishing device for semiconductor processing which can prevent polishing liquid from splashing. Background Art

[0002] Semiconductors are widely used in radios, televisions, and temperature measurement. Polishing devices are used in the processing of semiconductors to smooth the surface of the semiconductor, thereby achieving a higher level of surface quality.

[0003] However, the utility model patent with authorization announcement number CN216883295U discloses a polishing device for semiconductor processing, including a base, side plates are fixedly installed on the left and right sides of the upper end of the base, a top plate is fixedly installed on the upper end of the side plate, a slide groove is provided on the top plate, a slider slides in the slide groove, the slider is connected to one end of the transmission rod by rotating through a rotating shaft near one end of the side plate, the other end of the transmission rod is connected to the driven shaft by rotating through the rotating shaft, the driven shaft slides in the slide rail, the slide rail is provided in the rotating circle, the rotating circle is connected to the driving shaft by rotation, and the driving shaft is connected to the first rotating gear by rotation; the utility model drives the rotating circle to rotate through the driving shaft, and at the same time uses the first rotating gear to drive the second rotating gear to rotate around the driving shaft while rotating, thereby driving the slider to move left and right periodically in the slide groove, so that the polishing head can fully polish the semiconductor and improve the polishing efficiency; in addition, the sliding column is extended and retracted by the connection between the screw and the thread groove, thereby driving the clamping block to clamp and release the semiconductor.

[0004] The above-mentioned existing technical solutions have the following defects: it is not convenient for batch polishing of semiconductors, and can only polish a group of semiconductors. The structure for lifting and lowering the polishing head is relatively complicated, and the structure for limiting the semiconductors is relatively complicated, which makes it inconvenient to quickly limit the semiconductors. The polishing liquid is easy to splash, and it is not convenient to collect the polishing liquid for recycling.

[0005] Therefore, we propose a polishing device for semiconductor processing that prevents splashing of polishing liquid in order to solve the above-mentioned problems. Utility Model Content

[0006] The purpose of the present utility model is to provide a polishing device for semiconductor processing that prevents splashing of polishing liquid, so as to solve the problems raised in the above-mentioned background technology that in actual use, the polishing liquid is easy to splash, it is inconvenient to collect the polishing liquid for recycling, it is inconvenient to limit the semiconductor, and it is not convenient to polish semiconductors in batches.

[0007] To achieve the above-mentioned object, the present invention provides the following technical solution: a polishing device for semiconductor processing that prevents splashing of polishing liquid, comprising a workbench, a liquid storage tank fixedly connected to the lower end of the workbench for storing liquid, and an electric telescopic rod symmetrically bolted to the upper end of the workbench;

[0008] Also includes:

[0009] The interior and upper side of the liquid storage tank are respectively provided with a collecting structure and a limiting structure, wherein the collecting structure includes a support plate, a filter screen, a sealing plate and a liquid inlet hole, and the limiting structure includes a connecting plate, a limiting groove, a connecting port, a cavity, an exhaust pipe and an exhaust pump;

[0010] The upper ends of the electric telescopic rods are respectively fixedly connected to the left and right ends of the second protective frame, and the interior of the second protective frame is rotatably connected with connecting shafts at equal intervals, and the upper ends of the connecting shafts are fixedly connected to worm gears.

[0011] Preferably, a first protective frame is embedded in the upper end of the workbench, and a connecting plate is fixedly connected to the inner wall of the first protective frame, and limiting grooves are provided on the connecting plate at equal intervals, and the diameter of the limiting grooves is equal to the diameter of the semiconductor.

[0012] Preferably, the position of the limiting groove corresponds to the position of the connecting port one by one, and the connecting port is arranged at the upper end of the workbench, and the connecting port has a porous structure;

[0013] A cavity is provided inside the middle of the workbench, and an exhaust pipe is installed at the front end of the cavity. The front end of the exhaust pipe is bolted to an exhaust pump, and the connecting port is connected to the exhaust pipe through the cavity.

[0014] Preferably, the lower end of the connecting shaft is bolted to a polishing disk, and the rear end of the worm wheel on the upper side of the connecting shaft is meshedly connected to a worm, and the worm is rotatably connected to the rear upper end of the second protective frame.

[0015] Preferably, a motor is installed at the right end of the worm, and the polishing disc is in a rotating structure inside the second protective frame through the worm and the worm wheel, wherein the cross-sectional area of the second protective frame is equal to that of the first protective frame.

[0016] Preferably, the workbench is evenly provided with liquid inlet holes, and a support plate is symmetrically inlaid and connected to the upper end of the liquid storage tank below the liquid inlet holes, and a filter screen is placed on the upper end of the support plate;

[0017] Among them, the right end of the liquid storage tank is snap-connected with a sealing plate with a "convex"-shaped structure in a front cross-section, and the rear end of the liquid storage tank is fixedly connected to a first connecting pipe, and the rear end of the first connecting pipe is bolted to a water pump.

[0018] Preferably, the upper end of the water pump is bolted to a second connecting pipe, and the upper end of the second connecting pipe is fixedly connected to the lower end of the cross pipe, and the cross pipe is bolted to the rear end of the workbench;

[0019] The front end of the transverse tube is connected to a nozzle with threads at equal intervals, and the positions of the nozzle and the limiting groove correspond one to one, and the liquid storage tank forms a communication structure with the nozzle through the first connecting pipe and the transverse tube.

[0020] Compared with the prior art, the beneficial effects of the present invention are as follows: the semiconductor processing polishing device that prevents the polishing liquid from splashing prevents the polishing liquid from splashing, facilitates the collection and recycling of the polishing liquid, and is convenient for limiting the semiconductor and facilitating batch polishing of semiconductors;

[0021] 1. A first protective frame and a liquid inlet hole are provided. The cross-sectional area of the second protective frame is equal to that of the first protective frame, so that the second protective frame descends and covers the first protective frame. Liquid inlet holes are evenly opened on the workbench, so that the polishing liquid inside the first protective frame falls onto the filter net through the liquid inlet holes for filtration. The filtered polishing liquid enters the lower end of the liquid storage tank for collection, thereby preventing the polishing liquid from splashing and facilitating the collection and recycling of the polishing liquid.

[0022] 2. A limiting groove and a connecting port are provided, and the connecting port is connected to the exhaust pipe through the cavity, so that after the semiconductor is engaged in the limiting groove, the gas between the semiconductor and the workbench enters the cavity through the connecting port with a porous structure, and is then discharged through the exhaust pipe, so that the semiconductor is tightly adsorbed on the upper end of the workbench, thereby facilitating the limiting of the semiconductor;

[0023] 3. A connecting shaft and a worm gear are provided, and the polishing disc is structurally designed inside the second protective frame so that when the worm rotates, it engages with the worm gear set at equal intervals, allowing the worm gear and the connecting shaft to drive the polishing disc to rotate. When the polishing disc set at equal intervals rotates, the semiconductor in the limit groove is polished, thereby facilitating batch polishing of semiconductors. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 This is a schematic diagram of the front cross-sectional structure of the utility model;

[0025] Figure 2 This is a schematic diagram of the right side cross-sectional structure of the connection between the cavity and the exhaust pipe of the utility model;

[0026] Figure 3 This is a schematic diagram of the cross-sectional structure of the connection between the horizontal pipe and the nozzle of the utility model;

[0027] Figure 4 This is a schematic diagram of the top cross-sectional structure of the connection between the connecting port and the workbench of the utility model;

[0028] Figure 5 This is a schematic diagram of the top cross-sectional structure of the worm wheel and worm connection of the utility model.

[0029] In the figure: 1. Workbench; 2. Liquid storage tank; 3. First protective frame; 4. Connecting plate; 5. Limiting groove; 6. Connecting port; 7. Cavity; 8. Exhaust pipe; 9. Exhaust pump; 10. Second protective frame; 11. Electric telescopic rod; 12. Connecting shaft; 13. Polishing disc; 14. Worm gear; 15. Worm; 16. Motor; 17. Support plate; 18. Filter; 19. Sealing plate; 20. Liquid inlet hole; 21. First connecting pipe; 22. Water pump; 23. Second connecting pipe; 24. Horizontal pipe; 25. Nozzle. DETAILED DESCRIPTION

[0030] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.

[0031] See also Figure 1-5 The utility model provides a technical solution: a semiconductor processing polishing device for preventing polishing liquid from splashing, comprising a workbench 1, a liquid storage tank 2, a first protective frame 3, a connecting plate 4, a limiting groove 5, a connecting port 6, a cavity 7, an exhaust pipe 8, an exhaust pump 9, a second protective frame 10, an electric telescopic rod 11, a connecting shaft 12, a polishing disc 13, a worm gear 14, a worm 15, a motor 16, a support plate 17, a filter 18, a sealing plate 19, a liquid inlet 20, a first connecting pipe 21, a water pump 22, a second connecting pipe 23, a horizontal pipe 24 and a nozzle 25. When using the semiconductor processing polishing device for preventing polishing liquid from splashing, as shown in FIG. Figure 1 、 Figure 2 、 Figure 3 and Figure 4 The limiting structure includes a connecting plate 4, a limiting groove 5, a connecting port 6, a cavity 7, an exhaust pipe 8 and an exhaust pump 9. Since the limiting grooves 5 are evenly spaced on the connecting plate 4 and the diameter of the limiting grooves 5 is equal to the diameter of the semiconductor, the position of the limiting grooves 5 corresponds to the position of the connecting port 6 in an upper and lower direction. The connecting port 6 has a porous structure and is connected to the exhaust pipe 8 through the cavity 7.

[0032] Therefore, the semiconductors are respectively snap-fitted and connected in the limiting grooves 5 arranged at equal intervals, so that the lower end of the semiconductor is attached to the upper end of the workbench 1. When the vacuum pump 9 is working, the gas in the cavity 7 is extracted through the vacuum pipe 8, and the gas between the semiconductor and the upper end of the workbench 1 enters the cavity 7 through the connection port 6 provided with a porous structure and is then discharged through the vacuum pipe 8 and the vacuum pump 9, so that the semiconductor is adsorbed on the upper end surface of the workbench 1, thereby facilitating the positioning of the semiconductor;

[0033] like Figure 1、 Figure 2 、 Figure 3 and Figure 5 Since the interior of the second protective frame 10 is rotatably connected to the connecting shaft 12 at equal intervals, the rear end of the worm wheel 14 is meshedly connected to the worm 15, and the polishing disc 13 is rotated inside the second protective frame 10 through the worm 15 and the worm wheel 14, the cross-sectional area of the second protective frame 10 is equal to the cross-sectional area of the first protective frame 3;

[0034] Therefore, when the electric telescopic rod 11, which is symmetrically arranged on the left and right, is working, it drives the second protective frame 10 to descend, so that the lower end of the second protective frame 10 is attached to the upper end of the first protective frame 3. The second protective frame 10 and the first protective frame 3 surround the semiconductor and the polishing disk 13, and the lower end of the polishing disk 13, which is arranged at equal intervals, is against the upper end of the semiconductor at the corresponding position. When the water pump 22 is working, the polishing liquid inside the liquid storage tank 2 is transported to the inside of the transverse pipe 24 through the first connecting pipe 21 through the second connecting pipe 23. The polishing liquid in the transverse pipe 24 is sprayed onto the semiconductor at the corresponding position through the nozzles 25 arranged at equal intervals. When the motor 16 is working, it drives the worm 15 to rotate. When the worm 15 rotates, it engages with the worm gear 14 arranged at equal intervals, so that the worm gear 14 drives the connecting shaft 12 to rotate, so that the connecting shaft 12 drives the polishing disk 13 to rotate. When the polishing disks 13 arranged at equal intervals rotate, the semiconductor is polished, thereby preventing the polishing liquid from splashing, which is convenient for batch polishing of semiconductors.

[0035] like Figure 1 、 Figure 2 and Figure 4 The collection structure includes a support plate 17, a filter screen 18, a sealing plate 19 and a liquid inlet 20. Since the liquid inlet 20 is evenly opened on the workbench 1, the positions of the nozzle 25 and the limiting groove 5 correspond to each other front to back, and the liquid storage tank 2 is connected to the nozzle 25 through the first connecting pipe 21 and the horizontal pipe 24.

[0036] Therefore, excess polishing liquid at the upper end of the workbench 1 enters the interior of the liquid storage tank 2 through the evenly arranged liquid inlet holes 20 and falls on the filter 18. The polishing liquid is filtered by the filter 18, and impurities are retained at the upper end of the filter 18. The filtered polishing liquid passes through the filter 18 and falls into the lower end of the liquid storage tank 2 for collection. The polishing liquid collected in the liquid storage tank 2 is re-sprayed onto the semiconductor through the first connecting pipe 21, the second connecting pipe 23, the cross pipe 24 and the nozzle 25. The sealing plate 19 is pulled rightward to remove it from the interior of the upper right end of the workbench 1.

[0037] Pull the filter 18 to the right to remove it from the interior of the liquid storage tank 2, process the impurities on the filter 18, and then put the filter 18 back into the upper end of the liquid storage tank 2. Let the support plates 17 symmetrically arranged on the left and right support the filter 18, and snap-connect the sealing plate 19 with a "convex"-shaped structure in the longitudinal section to the upper right end of the liquid storage tank 2, so as to facilitate the collection of polishing liquid for recycling. The electrical components contained above are all existing technologies and will not be described in detail here.

[0038] The contents not described in detail in this specification belong to the existing technology known to professional and technical personnel in this field. The standard parts used in this utility model can be purchased from the market. Special-shaped parts can be customized according to the description in the specification and the drawings. The specific connection methods of each part adopt mature conventional means such as bolts, rivets, welding, etc. in the existing technology. The machinery, parts and equipment all adopt conventional models in the existing technology, and the circuit connections adopt conventional connection methods in the existing technology, which will not be described in detail here.

[0039] Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments, or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A polishing device for semiconductor processing that prevents polishing liquid from splashing, comprising a workbench (1), a liquid storage tank (2) fixedly connected to the lower end of the workbench (1) for storing liquid, and an electric telescopic rod (11) connected to the upper end of the workbench (1) by bolts symmetrically on both sides; It is characterized in that Also includes: The interior and upper side of the liquid storage box (2) are respectively provided with a collecting structure and a limiting structure, wherein the collecting structure includes a supporting plate (17), a filter screen (18), a sealing plate (19) and a liquid inlet hole (20), and the limiting structure includes a connecting plate (4), a limiting groove (5), a connecting port (6), a cavity (7), an air extraction pipe (8) and an air extraction pump (9); The upper ends of the electric telescopic rod (11) are respectively fixedly connected to the left and right ends of the second protective frame (10), and the interior of the second protective frame (10) is rotatably connected with a connecting shaft (12) at equal intervals, and the upper end of the connecting shaft (12) is fixedly connected to a worm gear (14).

2. A semiconductor processing polishing device for preventing polishing liquid from splashing according to claim 1, characterized in that: The upper end of the workbench (1) is inlaid with a first protective frame (3), and a connecting plate (4) is fixedly connected to the inner wall of the first protective frame (3). The connecting plate (4) is provided with limiting grooves (5) at equal intervals, and the diameter of the limiting grooves (5) is equal to the diameter of the semiconductor.

3. A semiconductor processing polishing device for preventing polishing liquid from splashing according to claim 1, characterized in that: The position of the limiting groove (5) corresponds to the position of the connecting port (6) in a one-to-one manner, and the connecting port (6) is arranged at the upper end of the workbench (1), and the connecting port (6) has a porous structure; A cavity (7) is provided inside the middle of the workbench (1), and an exhaust pipe (8) is installed at the front end of the cavity (7), and an exhaust pump (9) is bolted to the front end of the exhaust pipe (8), and the connecting port (6) is connected to the exhaust pipe (8) through the cavity (7).

4. A semiconductor processing polishing device for preventing polishing liquid from splashing according to claim 1, characterized in that: The lower end of the connecting shaft (12) is bolted to a polishing disc (13), and the rear end of the worm wheel (14) on the upper side of the connecting shaft (12) is meshedly connected to a worm (15), and the worm (15) is rotatably connected to the rear upper end of the second protective frame (10).

5. A semiconductor processing polishing device for preventing polishing liquid from splashing according to claim 4, characterized in that: A motor (16) is installed at the right end of the worm (15), and the polishing disc (13) is in a rotating structure inside the second protective frame (10) through the worm (15) and the worm wheel (14), wherein the cross-sectional area of the second protective frame (10) is equal to the cross-sectional area of the first protective frame (3).

6. The semiconductor processing polishing device for preventing polishing liquid from splashing according to claim 1, characterized in that: Liquid inlet holes (20) are evenly opened on the workbench (1), and a support plate (17) is symmetrically embedded and connected to the upper end of the liquid storage box (2) below the liquid inlet hole (20), and a filter screen (18) is placed on the upper end of the support plate (17); The right end of the liquid storage tank (2) is snap-connected with a sealing plate (19) having a "convex"-shaped structure in a frontal longitudinal section, and the rear end of the liquid storage tank (2) is fixedly connected with a first connecting pipe (21), and the rear end of the first connecting pipe (21) is bolted to a water pump (22).

7. A semiconductor processing polishing device for preventing polishing liquid from splashing according to claim 6, characterized in that: The upper end of the water pump (22) is bolted to a second connecting pipe (23), and the upper end of the second connecting pipe (23) is fixedly connected to the lower end of a transverse pipe (24), and the transverse pipe (24) is bolted to the rear end of the workbench (1); The front end of the transverse pipe (24) is connected to a nozzle (25) by threads at equal intervals, and the positions of the nozzle (25) and the limiting groove (5) correspond one to one, and the liquid storage tank (2) forms a communication structure with the nozzle (25) through the first connecting pipe (21) and the transverse pipe (24).

Images