Ceramic substrate breaking mechanism

Abstract

The utility model provides a ceramic substrate breaking mechanism which comprises a breaking assembly, a cleaning assembly, a breaking jig used for bearing a ceramic substrate and a conveying assembly used for conveying the breaking jig to the breaking assembly and the cleaning assembly, and the breaking assembly comprises a liftable pressing strip arranged above the conveying assembly. The cleaning assembly comprises a liftable brush transversely arranged above the conveying assembly, and the cleaning assembly is located behind the piece breaking assembly. According to the utility model, through effective sheet breaking and timely cleaning, flaws are reduced, the overall quality of the ceramic substrate is improved, automatic sheet breaking and cleaning processes can be realized, manual intervention is reduced, and the cost is reduced.

Description

Technical Field

[0001] The utility model relates to the field of electronic technology, in particular to a ceramic substrate breaking mechanism. Background Art

[0002] Ceramic substrates are widely used in electronics, electricity, communications and other fields due to their excellent performance. In the production process of ceramic substrates, molding is a key link, which affects the quality and cost of the substrate. In order to improve production efficiency, ceramic copper-clad substrates are usually produced in large sheets, and then broken into small pieces after laser cutting. Therefore, breaking is an indispensable process flow in ceramic substrates and related products. Traditional breaking methods are generally manual breaking, which has problems such as low efficiency, unstable breaking quality, and easy generation of debris, which affects product quality and production efficiency. In addition, in some application fields with high requirements for product quality, such as high-end electronic equipment, automotive electronics, etc., it is necessary to ensure the dimensional accuracy and surface quality of the ceramic substrate after breaking, and the traditional breaking method cannot achieve the required accuracy and quality.

[0003] Therefore, it is necessary to design a ceramic substrate breaking mechanism to solve the above problems. Utility Model Content

[0004] The utility model aims to provide a ceramic substrate breaking mechanism with high breaking efficiency and high precision.

[0005] To achieve the above-mentioned purpose, the present invention adopts the following technical solution: a ceramic substrate breaking mechanism, which includes a breaking assembly, a cleaning assembly, a breaking jig for carrying the ceramic substrate, and a conveying assembly for conveying the breaking jig to the breaking assembly and the cleaning assembly, the breaking assembly includes a liftable pressure bar arranged above the conveying assembly, the cleaning assembly includes a liftable brush arranged horizontally above the conveying assembly, and the cleaning assembly is located behind the breaking assembly.

[0006] As a further improved technical solution of the present invention, the sheet breaking assembly includes a first bracket, the pressure strip is arranged on the first bracket through a first lifting motor, a guide rod is provided on the pressure strip, and a sleeve is provided on the first bracket for cooperating with the guide rod. When the first lifting motor drives the pressure strip to rise and fall, the guide rod slides along the sleeve.

[0007] As a further improved technical solution of the present invention, the cleaning component includes a second bracket horizontally arranged above the conveying component, and the brush is installed on the second bracket through a lifting motor.

[0008] As a further improved technical solution of the present invention, the cleaning component also includes a third bracket and a dust-sticky roller. Mounting arms are provided at both ends of the dust-sticky roller. The dust-sticky roller can be rotatably mounted on one end of the mounting arm, and the other end of the mounting arm can be rotatably mounted on the third bracket. The third bracket is arranged on the second bracket through a lifting motor, and the third bracket moves up and down relative to the second bracket under the drive of the lifting motor.

[0009] As a further improved technical solution of the present invention, the cleaning component also includes a sinking box, which is arranged on the chip breaking jig, and the opening height of the sinking box is lower than the upper surface height of the ceramic substrate on the chip breaking jig.

[0010] As a further improved technical solution of the present invention, it further includes a positioning component, which includes a positioning camera arranged in front of the breaking component for collecting image information of the ceramic substrate.

[0011] As a further improved technical solution of the present invention, the positioning component also includes a first rotating motor arranged between the sheet-breaking jig and the conveying component. The sheet-breaking jig is installed on the conveying component through the first rotating motor. The first rotating motor drives the sheet-breaking jig to rotate in the horizontal direction according to the image data collected by the positioning camera, so that the laser engraving line of the ceramic substrate is parallel to the direction of the pressure strip.

[0012] As a further improved technical solution of the present invention, the positioning assembly also includes a second rotating motor arranged between the first lifting motor and the pressure strip. The first rotating motor drives the pressure strip to rotate in the horizontal direction according to the image data collected by the positioning camera, so that the laser engraving line of the ceramic substrate is parallel to the direction of the pressure strip.

[0013] As a further improved technical solution of the present invention, the conveying component is a linear slide.

[0014] From the above technical solutions, it can be seen that the ceramic substrate breaking mechanism of the present invention has the following effects: by setting a liftable pressure bar, the breaking operation of the ceramic substrate can be realized accurately and quickly, thereby improving the breaking efficiency; by setting a conveying component, it can be ensured that the ceramic substrate is accurately conveyed to the breaking component and the cleaning component, thereby ensuring the continuity and accuracy of the entire process; the setting of the cleaning component can promptly clean up debris and other sundries on the surface of the substrate after breaking, thereby maintaining the cleanliness of the substrate and facilitating subsequent processing. The present invention not only reduces the occurrence of defects and improves the overall quality of the ceramic substrate through effective breaking and timely cleaning, but also realizes an automated breaking and cleaning process, reduces manual intervention, and reduces costs. Furthermore, the liftable pressure bar and brush design can adapt to the breaking needs of ceramic substrates of different thicknesses and specifications, thereby improving the compatibility of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a ceramic substrate breaking mechanism according to an embodiment of the present invention.

[0016] Figure 2 for Figure 1 A three-dimensional view of the middle breaking assembly.

[0017] Figure 3 This is a three-dimensional diagram of a ceramic substrate breaking assembly of a ceramic substrate breaking mechanism according to another embodiment of the present invention.

[0018] Figure 4 for Figure 1 A perspective view of the cleaning component. DETAILED DESCRIPTION

[0019] In order to make the purpose, technical solutions and advantages of the present invention more clear, the present invention is described in detail below with reference to the accompanying drawings and specific embodiments.

[0020] Please refer to Figure 1 As shown, the present invention provides a ceramic substrate breaking mechanism, which includes a conveyor assembly 10, a breaking jig 20, a breaking assembly 30, and a cleaning assembly 40. The breaking jig 20 is used to support the ceramic substrate. The breaking jig 20 is mounted on the conveyor assembly 10 and is driven by the conveyor assembly 10 to move to the breaking assembly 30 and the cleaning assembly 40. The conveyor assembly 10 is preferably a linear slide.

[0021] Please refer to Figure 2As shown, the wafer breaking assembly 30 includes a first bracket 31, a first lifting motor 32 mounted on the first bracket 31, and a holding bar 33 mounted below the first lifting motor 32. The first lifting motor 32 drives the holding bar 33 up and down to press and break the ceramic substrate on the wafer breaking jig 20. A guide rod 34 is mounted on the holding bar 33, and a sleeve 35 is mounted on the first bracket 31 to engage the guide rod 34. When the first lifting motor 32 drives the holding bar 33 up and down, the guide rod 34 slides along the sleeve 35. Preferably, two sets of guide rods 34 and sleeves 35 are symmetrically positioned above and on either side of the holding bar 33 to ensure that the holding bar 33 remains stable during the lifting process.

[0022] In this embodiment, the ceramic substrate breaking mechanism further includes a positioning assembly, which includes a positioning camera (not shown) provided in front of the breaking assembly 30 for collecting image information of the ceramic substrate and a first rotating motor 50 (see FIG. Figure 1 ), the breaking jig 20 is installed on the conveying assembly 10 through the first rotating motor 50, and the first rotating motor 50 drives the breaking jig 20 to rotate in the horizontal direction according to the image data collected by the positioning camera, so that the laser engraving line of the ceramic substrate is parallel to the direction of the pressure strip 33.

[0023] Please refer to Figure 3 Figure 2 shows a perspective view of a wafer-breaking assembly in another embodiment. In this embodiment, the wafer-breaking assembly includes a bracket 31', a lifting motor 32', a fixed frame 34', a holding bar 33', and a rotating motor 35'. The rotating motor 35' is mounted on the fixed frame 34', and the holding bar 33' is mounted on the rotating motor 35'. The fixed frame 34' is in a power connection with the lifting motor 32' and is driven by the lifting motor 32' to move up and down. In this embodiment, the positioning assembly includes a positioning camera located in front of the wafer-breaking assembly for capturing image information of the ceramic substrate and the rotating motor 35'. The rotating motor 35' drives the holding bar to rotate horizontally based on the image data captured by the positioning camera, so that the laser-engraved lines on the ceramic substrate are parallel to the direction of the holding bar.

[0024] Please refer to Figure 1 and Figure 4 As shown, the cleaning assembly 40 is located behind the breaking assembly 30 and is used to clean the ceramic substrate after breaking. The cleaning assembly 40 includes a second bracket 41, a brush assembly 42 and a dust-binding assembly 43 provided on the second bracket 41. The second bracket 41 is arranged horizontally above the conveying assembly 10. The brush assembly 42 specifically includes a lifting motor 421, a brush 422 and a receiving box 423 provided on one side of the breaking jig 20. The opening height of the receiving box 423 is lower than the upper surface height of the ceramic substrate on the breaking jig. When the brush 422 sweeps across the upper surface of the ceramic substrate, it can sweep impurities into the receiving box 423 for collection.

[0025] The dust collecting assembly 43 includes a lifting motor 431, a third bracket 432, and a dust collecting roller 434. The third bracket 432 is mounted on the second bracket 41 via the lifting motor 431. Driven by the lifting motor 431, the third bracket 432 moves up and down relative to the second bracket 41. The dust collecting roller 434 is located on one side of the brush 422. Specifically, each end of the dust collecting roller 424 is provided with a mounting arm 423. The dust collecting roller 424 is rotatably mounted to one end of the mounting arm 423, and the other end of the mounting arm 423 is rotatably mounted to the third bracket 432. When breaking the sheets, the conveying component 10 and the breaking jig 20 first convey the ceramic substrate to the breaking component 30. After precise positioning, the pressure bar 33 descends to the ceramic substrate and applies a certain pressure to it. After the breaking is completed, the pressure bar 33 rises, and the breaking jig 20 moves to the brush component 42 to sweep the impurities generated by the breaking of the ceramic substrate into the receiving box 423; further, the breaking jig 20 moves to the bottom of the dust-sticking roller 434, and the dust-sticking roller 434 descends to contact the upper surface of the ceramic substrate. The breaking jig 20 drives the ceramic substrate to move to complete the surface dust removal.

[0026] In summary, the ceramic substrate breaking mechanism of the present invention can accurately and quickly realize the breaking operation of the ceramic substrate by setting a liftable pressure bar, thereby improving the breaking efficiency; by setting a conveying component, it can ensure that the ceramic substrate is accurately conveyed to the breaking component and the cleaning component, thereby ensuring the continuity and accuracy of the entire process; the setting of the cleaning component can promptly clean up debris and other sundries on the surface of the substrate after breaking, thereby maintaining the cleanliness of the substrate and facilitating subsequent processing. The present invention not only reduces the occurrence of defects and improves the overall quality of the ceramic substrate through effective breaking and timely cleaning, but also realizes an automated breaking and cleaning process, reduces manual intervention, and reduces costs. Furthermore, the liftable pressure bar and brush design can adapt to the breaking needs of ceramic substrates of different thicknesses and specifications, thereby improving the compatibility of the equipment.

[0027] Terms such as "upper," "lower," "front," and "back" used herein to denote relative spatial positions are used for ease of explanation to describe the relationship of one feature relative to another, as shown in the accompanying drawings. It should be understood that, depending on the placement of the product, these terms may be intended to encompass orientations other than those depicted in the drawings and should not be construed as limitations on the claims.

[0028] In addition, the above embodiments are only used to illustrate the present invention and are not intended to limit the technical solutions described in the present invention. The understanding of this specification should be based on technical personnel in the relevant technical field. Although this specification has described the present invention in detail with reference to the above embodiments, ordinary technical personnel in this field should understand that technical personnel in the relevant technical field can still modify or replace the present invention with equivalents, and all technical solutions and improvements that do not depart from the spirit and scope of the present invention should be covered by the scope of the claims of the present invention.

Claims

1. A ceramic substrate breaking mechanism, characterized by: It includes a wafer breaking assembly, a cleaning assembly, a wafer breaking jig for carrying a ceramic substrate, and a conveying assembly for conveying the wafer breaking jig to the wafer breaking assembly and the cleaning assembly. The wafer breaking assembly includes a liftable pressure bar arranged above the conveying assembly, and the cleaning assembly includes a liftable brush arranged horizontally above the conveying assembly. The cleaning assembly is located behind the wafer breaking assembly.

2. The ceramic substrate breaking mechanism according to claim 1, wherein: The sheet breaking assembly includes a first bracket, the pressure strip is arranged on the first bracket through a first lifting motor, a guide rod is provided on the pressure strip, and a sleeve is provided on the first bracket to cooperate with the guide rod. When the first lifting motor drives the pressure strip to rise and fall, the guide rod slides along the sleeve.

3. The ceramic substrate breaking mechanism according to claim 1, wherein: The cleaning component comprises a second bracket horizontally arranged above the conveying component, and the brush is installed on the second bracket via a lifting motor.

4. The ceramic substrate breaking mechanism according to claim 3, wherein: The cleaning assembly also includes a third bracket and a dust-sticking roller. Both ends of the dust-sticking roller are provided with mounting arms. The dust-sticking roller can be rotatably mounted on one end of the mounting arm, and the other end of the mounting arm can be rotatably mounted on the third bracket. The third bracket is arranged on the second bracket through a lifting motor, and the third bracket moves up and down relative to the second bracket under the drive of the lifting motor.

5. The ceramic substrate breaking mechanism according to claim 1, wherein: The cleaning component further includes a sinking box, which is arranged on the chip breaking jig. The opening height of the sinking box is lower than the upper surface height of the ceramic substrate on the chip breaking jig.

6. The ceramic substrate breaking mechanism according to claim 2, wherein: It also includes a positioning component, which includes a positioning camera located in front of the chip breaking component and used to collect image information of the ceramic substrate.

7. The ceramic substrate breaking mechanism according to claim 6, wherein: The positioning assembly also includes a first rotating motor arranged between the breaking jig and the conveying assembly. The breaking jig is installed on the conveying assembly through the first rotating motor. The first rotating motor drives the breaking jig to rotate in the horizontal direction according to the image data collected by the positioning camera so that the laser engraving line of the ceramic substrate is parallel to the direction of the pressure strip.

8. The ceramic substrate breaking mechanism according to claim 7, wherein: The positioning assembly further includes a second rotating motor disposed between the first lifting motor and the pressure bar. The first rotating motor drives the pressure bar to rotate in a horizontal direction according to image data collected by the positioning camera.

9. The ceramic substrate breaking mechanism according to claim 1, wherein: The conveying component is a linear slide.

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