Device for detecting semiconductor chip before packaging

Abstract

The utility model discloses a device for detecting a semiconductor chip before packaging, which particularly relates to the field of chip detection and comprises a base, a workbench is fixedly mounted at the top of the base, a belt wheel is rotatably connected to the inner side of the workbench, a belt is sleeved on the outer side of the belt wheel, and a connecting shaft is fixedly mounted on one side of the belt wheel. A first motor is fixedly installed on one side of the workbench, the belt wheel is fixedly installed at the output end of the first motor, transmission teeth are fixedly installed on the outer side of the belt, a protruding rod is clamped to the outer side of the transmission teeth, and a chip fixing table is fixedly installed at one end of the protruding rod. According to the chip detection device, the chip fixing table is arranged, the chip fixing table is conveyed through the belt, a plurality of chips are placed on the top of the chip fixing table, and the chips can be detected in cooperation with vertical movement of the detection lens during detection, so that the chip detection efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of chip detection, and more specifically, to a semiconductor chip pre-packaging detection device. Background Art

[0002] Before semiconductor chips are packaged, they need to be inspected to ensure that they are qualified. The existing inspection devices have low inspection efficiency and require frequent manual loading and unloading of chips, which leads to high labor intensity for the staff. Therefore, in response to this problem, how to design a semiconductor chip pre-packaging inspection device has become a problem that we currently need to solve. Utility Model Content

[0003] In order to overcome the above-mentioned defects of the prior art, an embodiment of the present invention provides a semiconductor chip pre-packaging inspection device, which is provided by setting a chip fixing table, and transporting the chip fixing table by a belt. A plurality of chips are placed on the top of the chip fixing table. During inspection, the inspection lens can inspect the plurality of chips, thereby improving the efficiency of chip inspection to solve the problems raised in the above-mentioned background technology.

[0004] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a semiconductor chip pre-packaging inspection device, comprising a base, characterized in that a workbench is fixedly installed on the top of the base, a pulley is rotatably connected to the inner side of the workbench, a belt is sleeved on the outer side of the pulley, a connecting shaft is fixedly installed on one side of the pulley, a first motor is fixedly installed on one side of the workbench, the pulley is fixedly installed on the output end of the first motor, a transmission tooth is fixedly installed on the outer side of the belt, a convex rod is clamped on the outer side of the transmission tooth, and a chip fixing platform is fixedly installed on one end of the convex rod.

[0005] In a preferred embodiment, a gripping handle is fixedly mounted on one side of the chip fixing platform, and a mounting frame is fixedly mounted on the bottom of the chip fixing platform.

[0006] In a preferred embodiment, a pulley is rotatably connected to the inner bottom of the mounting frame, and a track plate that cooperates with the pulley is fixedly installed inside the workbench.

[0007] In a preferred embodiment, the pulley is slidably connected to the inner side of the track plate, and a support frame is fixedly installed on one side of the base.

[0008] In a preferred embodiment, the support frame is internally rotatably connected to an adjusting screw, the adjusting screw is located above the workbench and arranged along the width direction of the workbench, a second motor is fixedly mounted on one side of the support frame, and the adjusting screw is fixedly mounted on the output end of the second motor.

[0009] In a preferred embodiment, the outer side of the adjusting screw is threadedly connected to a detection device body, the detection device body is slidably connected to the inside of the support frame, and a detection lens is fixedly installed on the bottom of the detection device body.

[0010] In a preferred embodiment, a support plate is fixedly connected to the protruding rod. The support plate is arranged along the length direction of the belt, and the length of the support plate is greater than the distance between two adjacent transmission teeth.

[0011] In a preferred embodiment, a limit switch is provided on a side of the end of the workbench facing the chip fixing platform, and the limit switch is electrically connected to the first motor.

[0012] The technical effects and advantages of this utility model are:

[0013] The utility model sets a chip fixing platform, and the transmission teeth limit the convex rod. When the pulley rotates to move the belt, the chip fixing platform can be transported to the bottom of the detection lens to realize automatic loading. At the same time, the detection lens can perform appearance inspection on multiple chips, thereby improving the efficiency of chip inspection. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a partial structural cross-sectional view of the utility model;

[0015] Figure 2 For this utility model Figure 1 A magnified view of the structure of part A;

[0016] Figure 3 For this utility model Figure 1 Enlarged view of the B structure.

[0017] Figure 4 This is an enlarged view of a portion of the structure of another embodiment.

[0018] The accompanying drawings are marked as follows: 1. base; 2. workbench; 3. pulley; 4. belt; 5. connecting shaft; 6. first motor; 7. transmission gear; 8. protruding rod; 9. chip fixing platform; 10. holding handle; 11. mounting frame; 12. pulley; 13. track plate; 14. support frame; 15. adjusting screw; 16. second motor; 17. detection device body; 18. detection lens, 19. support plate; 20. limit switch. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0020] Refer to the instruction manual Figure 1-3 ,like Figure 1 As shown, a semiconductor chip pre-packaging detection device according to an embodiment of the present invention comprises a base 1, a workbench 2 is fixedly mounted on the top of the base 1, as shown in FIG. Figure 2 As shown, the inner side of the workbench 2 is rotatably connected to a pulley 3, the outer side of the pulley 3 is sleeved with a belt 4, a connecting shaft 5 is fixedly installed on one side of the pulley 3, a first motor 6 is fixedly installed on one side of the workbench 2, and the pulley 3 is fixedly installed on the output end of the first motor 6, as shown in FIG. Figure 3 As shown, a transmission tooth 7 is fixedly installed on the outer side of the belt 4, and a convex rod 8 is clamped on the outer side of the transmission tooth 7. A chip fixing platform 9 is fixedly installed on one end of the convex rod 8, and a gripping handle 10 is fixedly installed on one side of the chip fixing platform 9. Figure 2 As shown, a mounting frame 11 is fixedly installed at the bottom of the chip fixing table 9, and a pulley 12 is rotatably connected to the bottom of the inner side of the mounting frame 11. A track plate 13 is fixedly installed inside the workbench 2, and the pulley 12 is slidably connected to the inner side of the track plate 13, as shown in FIG. Figure 1 As shown, a support frame 14 is fixedly installed on one side of the base 1, and an adjusting screw 15 is rotatably connected inside the support frame 14. The adjusting screw 15 is located above the workbench 2 and is arranged along the width direction of the workbench 2. A second motor 16 is fixedly installed on one side of the support frame 14, and the adjusting screw 15 is fixedly installed on the output end of the second motor 16. The outer side of the adjusting screw 15 is threadedly connected to a detection device body 17. The detection device body 17 is slidably connected to the inside of the support frame 14, and a detection lens 18 is fixedly installed on the bottom of the detection device body 17.

[0021] In some embodiments, as Figure 4 As shown, to improve the stability of the fit between the protruding rod 8 and the transmission teeth 7, a support plate 19 is fixedly connected to the protruding rod 8. The support plate 19 is arranged along the length of the belt 4 and is longer than the distance between two adjacent transmission teeth 7. The provision of the support plate 19 increases the contact area between the protruding rod 8 and the transmission teeth 7, making the chip holding platform 9 more stable during the transmission process.

[0022] In some embodiments, in order to avoid the chip fixing table 9 from colliding with the workbench 2 after the detection is completed, a limit switch 20 is provided on the side of the end of the workbench 2 facing the chip fixing table 9. The limit switch 20 is electrically connected to the first motor 6. When the chip fixing table 9 is conveyed to the end of the workbench 2, it will contact the limit switch 20. The limit switch 20 cuts off the power to the first motor 6 and stops further conveyance.

[0023] It should be noted that, when testing semiconductor chips, the semiconductor chips are placed in a plurality of accommodating cavities on the top of the chip fixing table 9, and the chip fixing table 9 is placed on the inner side of the workbench 2, so that the pulleys 12 on both sides are placed on the inner side of the track plate 13, and the protruding rods 8 on both sides are clamped between two adjacent transmission teeth 7, thereby limiting the chip fixing table 9. At this time, the pulley 3 is driven to rotate by starting the first motor 6, and the pulley 3 on the other side is rotated synchronously under the drive of the connecting shaft 5, so that the belt 4 is displaced, and the protruding rod 8 is limited by the transmission teeth 7, thereby driving the chip fixing table 9 to slide, and the chip fixing table 9 is driven to the bottom of the detection lens 18. At this time, the chip is fixed by the detection lens 18 The chip on the top of the table 9 is photographed, detected and analyzed. At the same time, the adjusting screw 15 can be rotated by starting the second motor 16, thereby driving the vertical displacement of the detection device body 17, and cooperating with the lateral displacement of the chip fixing table 9, so that the detection lens 18 can detect the multiple chips on the top of the chip fixing table 9 one by one. After the detection is completed, the chip fixing table 9 is transported to one side. At this time, the staff can take out the chip fixing table 9 from the inner side of the workbench 2 by pulling the gripping handles 10 on both sides, and the chip fixing table 9 with the chip to be detected can be installed on the inner side of the workbench 2, so as to improve the efficiency of chip detection, and multiple chips can be detected at a time, thereby reducing the number of times the chip is unloaded and loaded, and thereby reducing the labor intensity of the staff.

[0024] Finally, a few points should be explained: First, in the description of this application, it should be noted that, unless otherwise specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense, and may refer to mechanical or electrical connections, internal communication between two components, or direct connection. "Up," "down," "left," and "right" are only used to indicate relative positional relationships. When the absolute positions of the objects being described change, the relative positional relationships may also change.

[0025] Secondly: The drawings of the embodiments disclosed in this utility model only involve structures related to the embodiments disclosed in this utility model. Other structures can refer to common designs. In the absence of conflicts, the same embodiment and different embodiments of the utility model can be combined with each other.

[0026] Finally: The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A semiconductor chip pre-packaging detection device, comprising a base (1), characterized in that: A workbench (2) is fixedly mounted on the top of the base (1); a pulley (3) is rotatably connected to the inner side of the workbench (2); a belt (4) is sleeved on the outer side of the pulley (3); a connecting shaft (5) is fixedly mounted on one side of the pulley (3); a first motor (6) is fixedly mounted on one side of the workbench (2); the pulley (3) is fixedly mounted on the output end of the first motor (6); a transmission tooth (7) is fixedly mounted on the outer side of the belt (4); a convex rod (8) is clamped on the outer side of the transmission tooth (7); and a chip fixing platform (9) is fixedly mounted on one end of the convex rod (8).

2. The semiconductor chip pre-packaging detection device according to claim 1, characterized in that: A gripping handle (10) is fixedly mounted on one side of the chip fixing platform (9), and a mounting frame (11) is fixedly mounted on the bottom of the chip fixing platform (9).

3. The semiconductor chip pre-packaging detection device according to claim 2, characterized in that: The inner bottom of the mounting frame (11) is rotatably connected to a pulley (12), and a track plate (13) that matches the pulley (12) is fixedly installed inside the workbench (2).

4. The semiconductor chip pre-packaging detection device according to claim 3, characterized in that: The pulley (12) is slidably connected to the inner side of the track plate (13), and a support frame (14) is fixedly installed on one side of the base (1).

5. The semiconductor chip pre-packaging detection device according to claim 4, characterized in that: An adjusting screw (15) is rotatably connected to the interior of the support frame (14), and the adjusting screw (15) is located above the workbench (2) and arranged along the width direction of the workbench (2). A second motor (16) is fixedly mounted on one side of the support frame (14), and the adjusting screw (15) is fixedly mounted on the output end of the second motor (16).

6. The semiconductor chip pre-packaging inspection device according to claim 5, characterized in that: The outer side of the adjusting screw (15) is threadedly connected to a detection device body (17), the detection device body (17) is slidably connected to the inside of the support frame (14), and a detection lens (18) is fixedly installed at the bottom of the detection device body (17).

7. The semiconductor chip pre-packaging inspection device according to claim 1, characterized in that: A support plate (19) is fixedly connected to the protruding rod (8), and the support plate (19) is arranged along the length direction of the belt (4), and its length is greater than the distance between two adjacent transmission teeth (7).

8. The semiconductor chip pre-packaging inspection device according to claim 1, characterized in that: A limit switch (20) is provided on the side of the end of the workbench (2) facing the chip fixing platform (9), and the limit switch (20) is electrically connected to the first motor (6).

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