Independent anode bin and electroplating bath device

Abstract

The utility model provides an independent anode bin and an electroplating bath device. The independent anode bin comprises an anode bin body and an anode plate assembly, the anode bin body is of a flat structure, a flat inner cavity used for containing the anode plate assembly and containing anode electroplating liquid is formed in the anode bin body, and an ionic membrane is installed at a lateral opening of the anode bin body; the anode plate assembly comprises an anode plate, a bottom plate and a conducting strip, the bottom plate is vertically mounted in the flat inner cavity of the anode bin body, and the anode plate faces one side of the ionic membrane. Compared with the volume of an anode cavity of an integrated electroplating bath in the prior art, the volume of the inner cavity of the anode bin is obviously reduced, so that the usage amount of anode electroplating liquid can be saved. And the anode bin adopts an independent structure and is detachably arranged with the electroplating bath, so that the maintenance operation of the anode bin is facilitated, and non-stop maintenance can be realized when an anode bin spare part is adopted.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor packaging wet process, in particular to an independent anode bin and electroplating tank device. Background Art

[0002] Existing wafer electroplating tanks are generally one-piece structures, including an anode chamber and a cathode chamber. An ion membrane is installed between the anode chamber and the cathode chamber to prevent direct mixing of the plating solution. The anode assembly usually includes a circulation pipe connected to the anode chamber and an anode plate inserted in the anode chamber and connected to the positive pole of the power supply to ensure a stable supply of metal ions. The anode assembly of the electroplating tank is susceptible to oxidation and requires regular maintenance. The various chambers of the electroplating tank must have sufficient space to allow for disassembly and cleaning. The existing one-piece electroplating tank structure is large in size, consumes a large amount of plating solution, takes a long time to disassemble and maintain, and is inconvenient to maintain. Utility Model Content

[0003] In order to overcome the above-mentioned deficiencies of the prior art, the purpose of the present invention is to provide an independent anode bin and electroplating tank device.

[0004] In order to achieve the above-mentioned purpose, the technical solution adopted by the present invention to solve the technical problem is: an independent anode bin, comprising:

[0005] The anode bin body is a flat structure with an opening at the top. The anode bin body is provided with a flat inner cavity for accommodating the anode plate assembly and the anode plating solution. A lateral opening is provided on one side of the anode bin body, and an ion membrane is installed at the lateral opening.

[0006] The anode plate assembly includes an anode plate, a base plate and a conductive sheet. The anode plate and the conductive sheet are fixedly mounted on the base plate. The anode plate and the conductive sheet are in contact and conductive with each other. The base plate is vertically mounted in the flat inner cavity of the anode tank body, and the anode plate faces the ion membrane side.

[0007] The flat inner cavity of the anode bin of this utility model is significantly smaller than the anode cavity of the existing integrated electroplating tank, which can save the amount of anode plating solution used. The anode bin adopts a standalone structure and can be detached from the electroplating tank, which facilitates maintenance of the anode bin and allows maintenance without stopping the machine when using anode bin spare parts.

[0008] Furthermore, the bottom plate of the anode plate assembly is installed in the flat inner cavity of the anode bin body by vertical plug-in.

[0009] The adoption of the above preferred solution facilitates the rapid installation of the anode plate assembly on the anode bin body.

[0010] Furthermore, the bottom of the anode bin body is provided with a lower circulation port communicating with the flat inner cavity, and the upper part of the anode bin body is provided with an upper circulation port communicating with the flat inner cavity.

[0011] The above preferred solution is adopted to promote the circulation of the anode plating solution in the inner cavity of the anode chamber, thereby improving the fluidity and uniformity of the cations.

[0012] Furthermore, the lower circulation port extends downward from the bottom surface of the anode chamber body, a sealing ring is provided on the outer periphery of the lower circulation port, and a socket matching the lower circulation port is provided at the bottom of the electroplating tank.

[0013] The above preferred solution facilitates docking of the lower circulation port of the anode bin below the electroplating tank, thereby preventing the cathode plating solution in the electroplating tank from overflowing from the lower circulation port.

[0014] Furthermore, an annular sealing gasket and a titanium ring are sequentially installed above the ion membrane at the lateral opening of the anode compartment body.

[0015] The above preferred solution is adopted to improve the sealing effect at the ion membrane.

[0016] Furthermore, a circle of concave mounting surface is provided at the lateral opening of the anode chamber body, and a plurality of convex positioning posts are provided on the mounting surface. Positioning holes matching the outer periphery of the positioning posts are provided on the ion membrane, annular sealing gasket and titanium ring, and locking screws pass through the positioning holes on the titanium ring, annular sealing gasket and ion membrane in turn and are connected to the center hole of the positioning post.

[0017] By adopting the above preferred solution, the stability of the installation position of the ion membrane is improved.

[0018] Furthermore, an annular shielding plate is provided above the titanium ring.

[0019] Furthermore, the conductive sheet of the anode plate assembly includes an annular connecting portion connected to the edge of the anode plate and an upward extending portion extending upward from the annular connecting portion.

[0020] By adopting the above preferred solution, the electrical conductivity between the anode plate and the power supply anode is improved.

[0021] Furthermore, the thickness of the anode bin body is less than 80 mm.

[0022] An electroplating tank device, comprising:

[0023] an electroplating tank for containing cathode plating solution;

[0024] A hanger, used for loading the substrate to be electroplated, the hanger being vertically inserted into the electroplating tank;

[0025] The above-mentioned independent anode bin is vertically inserted into the electroplating tank, and the independent anode bin is arranged parallel to the hanger.

[0026] The above technical solution has a compact structure, reduces the amount of anode plating solution used, saves electroplating costs, and reduces the space occupied by the electroplating tank. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0028] Figure 1 It is a structural schematic diagram of the independent anode bin of the utility model.

[0029] Figure 2 It is a cross-sectional view of the independent anode bin of the utility model.

[0030] Figure 3 This is a schematic diagram of the ion membrane installation structure on the anode tank body.

[0031] Figure 4 It is a schematic diagram of the ion membrane installation surface of the side opening of the anode tank body.

[0032] Figure 5 It is a structural diagram of the anode plate assembly.

[0033] Figure 6 It is a schematic diagram of the back structure of the anode plate assembly.

[0034] Figure 7 It is a structural schematic diagram of the electroplating tank device of the present utility model.

[0035] Figure 8 It is a cross-sectional view of the electroplating tank device of the present invention.

[0036] The numbers and letters in the figure represent the names of the corresponding parts:

[0037] 10-Independent anode bin; 11-Anode bin body; 111-Flat inner cavity; 112-Lower circulation port; 1121-Sealing ring; 113-Upper circulation port; 114-Mounting surface; 1141-Positioning column; 12-Ion membrane; 121-Annular sealing gasket; 122-Titanium ring; 123-Annular shielding plate; 13-Anode plate assembly, 131-Anode plate; 132-Bottom plate; 133-Conductive sheet; 1331-Annular connecting portion; 1332-Upper extension portion; 20-Electroplating tank; 30-Hanging fixture. DETAILED DESCRIPTION

[0038] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0039] like Figure 1-6 As shown, one embodiment of the present invention is: the independent anode bin 10 includes:

[0040] The anode tank body 11 is a flat structure with an opening at the top. A flat inner cavity 111 is provided in the anode tank body 11 for accommodating the anode plate assembly 13 and the anode plating solution. A lateral opening is provided on one side of the anode tank body 11, and an ion membrane 12 is installed at the lateral opening.

[0041] The anode plate assembly 13 includes an anode plate 131, a base plate 132 and a conductive sheet 133. The anode plate 131 and the conductive sheet 133 are fixedly mounted on the base plate 132. The anode plate 131 and the conductive sheet 133 are in contact and conductive. The base plate 132 is vertically mounted in the flat inner cavity 111 of the anode tank body 11, and the anode plate 131 faces the side of the ion membrane 12.

[0042] The beneficial effects of this technical solution are: the flat inner cavity of the anode hopper is significantly smaller than that of the anode cavity of existing integrated electroplating tanks, which can save anode plating solution. The anode hopper adopts a standalone structure and can be detached from the electroplating tank, which facilitates maintenance of the anode hopper and allows maintenance without stopping the machine when using anode hopper spares.

[0043] In other embodiments of the present invention, the bottom plate 132 of the anode plate assembly is mounted vertically within the flat inner cavity 111 of the anode silo body. The specific mating structure employed by the bottom plate within the anode silo body is not limited and can be selected from existing techniques. For example, guide ribs may be provided on both sides of the bottom plate, and vertical slots may be provided in the flat inner cavity of the anode silo body, into which the guide ribs of the bottom plate are inserted. The above-described technical solution advantageously facilitates the rapid installation of the anode plate assembly within the anode silo body.

[0044] In other embodiments of the present invention, a lower circulation port 112 communicating with the flat inner cavity 111 is provided at the bottom of the anode bin body 11, and an upper circulation port 113 communicating with the flat inner cavity 111 is provided at the upper portion of the anode bin body 11. The lower circulation port 112 extends downward from the bottom surface of the anode bin body 11, and a sealing ring 1121 is sleeved on the outer periphery of the lower circulation port 112. A socket matching the outer periphery of the lower circulation port 112 is provided at the bottom of the electroplating tank 20. The beneficial effect of adopting the above technical solution is that it is convenient to connect the lower circulation port of the anode bin below the electroplating tank, thereby preventing the cathode plating solution in the electroplating tank from overflowing from the lower circulation port.

[0045] In other embodiments of the present invention, an annular sealing gasket 121 and a titanium ring 122 are sequentially installed above the ion membrane 12 at the lateral opening of the anode chamber body 11. An annular shielding plate 123 is also installed above the titanium ring 122. The beneficial effect of adopting this technical solution is to improve the sealing effect at the ion membrane.

[0046] In other embodiments of the present invention, a concave mounting surface 114 is provided at the lateral opening of the anode chamber body 11. Mounting surface 114 is provided with multiple protruding positioning posts 1141. Positioning holes matching the periphery of positioning posts 1141 are provided on the ion membrane 12, annular sealing gasket 121, and titanium ring 122. Locking screws pass through the positioning holes in the titanium ring 122, annular sealing gasket 121, and ion membrane 12, respectively, and engage with the center hole of positioning post 1141. The above-described technical solution has the beneficial effect of improving the stability of the ion membrane installation position.

[0047] In other embodiments of the present invention, the conductive sheet 133 of the anode plate assembly 13 includes an annular connecting portion 1331 connected to the edge of the anode plate and an upward extending portion 1332 extending upward from the annular connecting portion. The above technical solution has the beneficial effect of improving the electrical conductivity between the anode plate and the power supply anode.

[0048] In other embodiments of the present invention, the thickness of the anode bin body 11 is less than 80 mm.

[0049] like Figure 7 、 8 As shown, an electroplating tank device includes:

[0050] an electroplating tank 20 for containing a cathode plating solution;

[0051] The hanger 30 is used to load the substrate to be electroplated, and the hanger 30 is vertically inserted into the electroplating tank 20;

[0052] The independent anode bin 10 is vertically inserted into the electroplating tank 20 , and the independent anode bin 10 is arranged parallel to the hanger 30 .

[0053] The beneficial effects of adopting the above technical solution are: compact structure, reduced usage of anodic electroplating solution, saving electroplating costs, and reducing the space occupied by the electroplating tank.

[0054] The above embodiments are only for illustrating the technical concept and features of the present invention. Their purpose is to enable ordinary technicians in this field to understand the content of the present invention and implement it. They are not intended to limit the scope of protection of the present invention. Any equivalent changes or modifications made according to the spirit of the present invention should be included in the scope of protection of the present invention.

Claims

1. An independent anode bin, characterized in that: include: The anode bin body is a flat structure with an opening at the top. The anode bin body is provided with a flat inner cavity for accommodating the anode plate assembly and the anode plating solution. A lateral opening is provided on one side of the anode bin body, and an ion membrane is installed at the lateral opening. The anode plate assembly includes an anode plate, a base plate and a conductive sheet. The anode plate and the conductive sheet are fixedly mounted on the base plate, and the anode plate and the conductive sheet are conductively connected. The anode plate assembly is vertically mounted in the flat inner cavity of the anode tank body, and the anode plate faces the ion membrane side.

2. The independent anode bin according to claim 1, characterized in that: The bottom plate of the anode plate assembly is installed in the flat inner cavity of the anode bin body in a vertical plug-in manner.

3. The independent anode bin according to claim 1, characterized in that: The bottom of the anode bin body is provided with a lower circulation port communicating with the flat inner cavity, and the upper part of the anode bin body is provided with an upper circulation port communicating with the flat inner cavity.

4. The independent anode bin according to claim 3, characterized in that: The lower circulation port extends downward from the bottom surface of the anode bin body, a sealing ring is sleeved on the outer periphery of the lower circulation port, and a socket matching the lower circulation port is provided at the bottom of the electroplating tank.

5. The independent anode bin according to claim 1, characterized in that: An annular sealing gasket and a titanium ring are sequentially installed above the ion membrane at the lateral opening of the anode compartment body.

6. The independent anode bin according to claim 5, characterized in that: A concave mounting surface is provided at the lateral opening of the anode chamber body, and a plurality of convex positioning posts are provided on the mounting surface. Positioning holes matching the outer periphery of the positioning posts are provided on the ion membrane, annular sealing gasket and titanium ring, and locking screws pass through the positioning holes on the titanium ring, annular sealing gasket and ion membrane in sequence and are connected to the center hole of the positioning post.

7. The independent anode bin according to claim 5, characterized in that: An annular shielding plate is also provided above the titanium ring.

8. The independent anode bin according to claim 1, characterized in that: The conductive sheet of the anode plate assembly includes an annular connecting portion connected to the edge of the anode plate and an upper extending portion extending upward from the annular connecting portion.

9. The independent anode bin according to claim 1, characterized in that: The thickness of the anode bin body is less than 80 mm.

10. An electroplating tank device, characterized in that: include: an electroplating tank for containing cathode plating solution; A hanger, used for loading the substrate to be electroplated, the hanger being vertically inserted into the electroplating tank; The independent anode bin according to any one of claims 1 to 9 is vertically inserted into the electroplating tank, and the independent anode bin is arranged parallel to the hanger.

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