Multi-layer circuit board structure convenient for heat dissipation

Abstract

The utility model relates to the technical field of circuit boards, in particular to a multilayer circuit board structure convenient for heat dissipation, which comprises a circuit board. A plurality of electronic devices are mounted on the surface of the circuit board; the surface of the circuit board is also provided with a plurality of plug hole structures; the top of the circuit board is fixedly connected with a heat dissipation structure; the heat dissipation structure comprises a mounting plate, a connecting shaft and a rotating frame, the connecting shaft is rotatably connected to the interior of the mounting plate, and the other end of the connecting shaft is communicated with the rotating frame. According to the air flowing direction driven by the fan, the rotating frame can be rotated, at the moment, the opening part of the rotating frame faces the air flowing direction; and through the cooperation of the first central magnet and the second central magnet or the cooperation of the first side magnet and the second side magnet, the direction of the rotating frame is changed, air can directly flow into the rotating frame, enters the mounting plate through the connecting shaft and then is exhausted through the exhaust pipe, effective heat dissipation is realized, and the heat dissipation quality of the circuit board is ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, in particular to a multi-layer circuit board structure which is convenient for heat dissipation. Background Art

[0002] The PCB resin plugging process includes drilling, electroplating, plugging, baking, and grinding. After drilling, the hole is plated through, then plugged with resin and baked, and then ground flat. Since the resin after grinding does not contain copper, another layer of copper is added to turn it into a PAD. These processes are done before the original PCB drilling process, that is, the holes to be plugged are processed first, and then the base holes are drilled and the original normal process is carried out.

[0003] Currently, there are more and more electronic devices, the quality of internal devices is getting better and better, and the devices are becoming more and more sophisticated. In the production process of circuit boards, more and more customers choose to use resin plug holes when making HDI boards to adapt to the development trend of dense circuits. However, in actual use, the components inside the circuit boards either have no heat dissipation structure or are equipped with fans for heat dissipation. Since many different components are installed above the circuit boards, they block each other, and the fans are generally not directly facing the circuit boards for heat dissipation. They take away some heat through air flow, and the heat dissipation effect of the circuit boards is not good at this time. Therefore, a multi-layer circuit board structure that facilitates heat dissipation is proposed to address the above problems. Utility Model Content

[0004] The purpose of the present invention is to provide a multi-layer circuit board structure that is convenient for heat dissipation, so as to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned object, the present invention provides the following technical solutions: a multi-layer circuit board structure that is convenient for heat dissipation, comprising a circuit board, electronic components and a plug hole structure;

[0006] A plurality of electronic components are mounted on the surface of the circuit board;

[0007] The surface of the circuit board is also provided with a plurality of plug hole structures;

[0008] A heat dissipation structure is fixedly connected to the top of the circuit board;

[0009] The heat dissipation structure includes a mounting plate, a connecting shaft, and a rotating frame. The bottom of the mounting plate is fixedly connected to the circuit board. The interior of the mounting plate is rotatably connected to the connecting shaft, and the other end of the connecting shaft is connected to the rotating frame. The bottom of the mounting plate is connected to evenly distributed exhaust pipes, and the exhaust pipes are internally installed with sealing plugs.

[0010] The outer side of the exhaust pipe is spirally connected with a rotating ring, and the other end of the rotating ring is rotatably connected with the air guide pipe.

[0011] Currently, there are more and more electronic devices, and the quality of the internal components is getting better and better. The devices are becoming more and more sophisticated. In the production process of circuit boards, more and more customers choose to use resin plug holes when making HDI boards to adapt to the development trend of dense circuits. However, in actual use, the components of the circuit boards either have no heat dissipation structure or are equipped with fans for heat dissipation. Because various different components are installed above the circuit board, they block each other, and the fans generally do not directly blow air to dissipate heat from the circuit board. Some heat is carried away by the air flow, which in turn does not achieve good heat dissipation effect on the circuit board. During use, according to the direction of air flow driven by the fan, the rotating frame can be rotated. At this time, the open part of the rotating frame faces the direction of the air flow. The first central magnet and the second central magnet cooperate, or the first side magnet and the second side magnet cooperate, to change the orientation of the rotating frame, ensuring that air can flow directly into it, enter the mounting plate through the connecting shaft, and then be discharged through the exhaust duct, achieving effective heat dissipation and ensuring the heat dissipation quality of the circuit board.

[0012] Furthermore, evenly distributed through holes are provided on the side surface of the air guide pipe.

[0013] Furthermore, a first central magnet is fixedly connected to the bottom of the rotating frame, a second central magnet fixedly connected to the mounting plate is provided on the other side of the first central magnet, first side magnets fixedly connected to the rotating frame are provided on both sides of the first central magnet, and second side magnets fixedly connected to the mounting plate are provided on both sides of the second central magnet.

[0014] Furthermore, the interior of the mounting plate is hollow.

[0015] Furthermore, the top of the rotating frame is open, and the interior of the rotating frame is hollow.

[0016] Furthermore, the air duct is made of hollow deformable carbon steel.

[0017] When performing targeted heat dissipation on the components inside the circuit board, the shape of the air duct is changed by arranging the electronic components so that the air duct is laid inside the electronic components and connected to the exhaust duct through a rotating ring. This ensures that the heat inside the circuit board is dissipated in a timely manner, thereby ensuring the heat dissipation quality of the circuit board.

[0018] Compared with the prior art, the beneficial effects of the present invention are:

[0019] When the utility model is in use, the rotating frame can be rotated according to the direction of air flow driven by the fan. At this time, the open part of the rotating frame faces the direction of air flow, and the first central magnet and the second central magnet cooperate with each other, or the first side magnet and the second side magnet cooperate with each other, so as to change the orientation of the rotating frame, thereby ensuring that air can directly flow into it, enter the interior of the mounting plate through the connecting shaft, and then be discharged through the exhaust pipe, thereby achieving effective heat dissipation and ensuring the heat dissipation quality of the circuit board;

[0020] When performing targeted heat dissipation on the components inside the circuit board, the shape of the air duct is changed by arranging the electronic components so that the air duct is laid inside the electronic components and connected to the exhaust duct through a rotating ring. This ensures that the heat inside the circuit board is dissipated in a timely manner, thereby ensuring the heat dissipation quality of the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0022] Figure 2 This is a structural diagram of the heat dissipation structure of the utility model.

[0023] In the figure: 1. Circuit board; 2. Electronic device; 3. Plug hole structure; 4. Heat dissipation structure; 401. Mounting plate; 402. Connecting shaft; 403. Rotating frame; 404. First central magnet; 405. Second central magnet; 406. First side magnet; 407. Second side magnet; 408. Exhaust duct; 409. Sealing plug; 410. Rotating ring; 411. Air guide duct. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0025] Example 1: Please refer to Figure 1 and Figure 2 , the utility model provides a technical solution:

[0026] A multi-layer circuit board structure that facilitates heat dissipation includes a circuit board 1, an electronic device 2, and a plug hole structure 3;

[0027] A plurality of electronic devices 2 are mounted on the surface of the circuit board 1;

[0028] The surface of the circuit board 1 is also provided with a plurality of plug hole structures 3;

[0029] The top of the circuit board 1 is fixedly connected with a heat dissipation structure 4;

[0030] The heat dissipation structure 4 includes a mounting plate 401, a connecting shaft 402, and a rotating frame 403. The bottom of the mounting plate 401 is fixedly connected to the circuit board 1. The interior of the mounting plate 401 is rotatably connected to the connecting shaft 402, and the other end of the connecting shaft 402 is connected to the rotating frame 403. The bottom of the mounting plate 401 is connected to evenly distributed exhaust pipes 408, and the exhaust pipes 408 are installed with sealing plugs 409.

[0031] The outer side of the exhaust pipe 408 is spirally connected to a rotating ring 410 , and the other end of the rotating ring 410 is rotatably connected to an air guide pipe 411 .

[0032] Currently, there are more and more electronic devices, and the quality of internal devices is getting better and better. Devices are becoming more and more sophisticated. In the production process of circuit boards, more and more customers choose to use resin plug holes when making HDI boards to adapt to the development trend of dense circuits. However, in actual use, the components inside the circuit boards either have no heat dissipation structure or are equipped with fans for heat dissipation. Since a variety of different components are installed above the circuit boards, they block each other, and the fans are generally not directly facing the circuit boards to blow air for heat dissipation. Some heat is taken away by the air flow, and the heat dissipation effect of the circuit boards is not good. During use, according to the direction of the air flow driven by the fan, the rotating frame 403 can be rotated. At this time, the open part of the rotating frame 403 faces the direction of the air flow. The first central magnet 404 and the second central magnet 405 or the first side magnet 406 and the second side magnet 407 are used to change the orientation of the rotating frame 403 to ensure that air can directly flow into it and enter the interior of the mounting plate 401 through the connecting shaft 402, and then be discharged through the exhaust pipe 408, thereby achieving effective heat dissipation and ensuring the heat dissipation quality of the circuit board 1.

[0033] In this embodiment, the multiple exhaust pipes 408 provided can be used to connect with the rotating ring 410 according to the position of the electronic device 2, so that the air guide pipe 411 can achieve targeted heat dissipation. The sealing plug 409 can block the exhaust pipe 408, so that the air is discharged through the exhaust pipes 408 in other parts, thereby realizing centralized collection and treatment of air.

[0034] Example 2: This example is an improvement on Example 1. Figure 2 Specifically, the side of the air duct 411 is provided with evenly distributed through holes.

[0035] A first central magnet 404 is fixedly connected to the bottom of the rotating frame 403, and a second central magnet 405 fixedly connected to the mounting plate 401 is provided on the other side of the first central magnet 404. First side magnets 406 fixedly connected to the rotating frame 403 are provided on both sides of the first central magnet 404, and second side magnets 407 fixedly connected to the mounting plate 401 are provided on both sides of the second central magnet 405.

[0036] The interior of the mounting plate 401 is hollow.

[0037] The top of the rotating frame 403 is open, and the interior of the rotating frame 403 is hollow.

[0038] The air duct 411 is made of hollow deformable carbon steel.

[0039] When performing targeted heat dissipation for components inside the circuit board, the shape of the air duct 411 is changed by arranging the electronic components 2, so that the air duct 411 is laid inside the electronic components 2 and connected to the exhaust duct 408 via the rotating ring 410. This ensures that the heat inside the circuit board is dissipated in a timely manner, thereby ensuring the heat dissipation quality of the circuit board 1.

[0040] In this embodiment, the exhaust pipe 408 with a small hole can accelerate the flow of air to ensure effective heat dissipation of the circuit board 1, and the first central magnet 404 and the second central magnet 405 are arranged at opposite poles. After the rotating frame 403 rotates, the first side magnet 406 and the second side magnet 407 are arranged at opposite poles, which serves the purpose of fixing the rotating frame 403. It can rotate according to the wind direction to effectively concentrate the air and achieve subsequent targeted heat dissipation.

[0041] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that includes a list of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus.

[0042] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A multi-layer circuit board structure that facilitates heat dissipation, characterized by: It comprises a circuit board (1), an electronic device (2) and a plug hole structure (3); A plurality of electronic devices (2) are mounted on the surface of the circuit board (1); The surface of the circuit board (1) is further provided with a plurality of plug hole structures (3); A heat dissipation structure (4) is fixedly connected to the top of the circuit board (1); The heat dissipation structure (4) comprises a mounting plate (401), a connecting shaft (402) and a rotating frame (403); the bottom of the mounting plate (401) is fixedly connected to the circuit board (1); the interior of the mounting plate (401) is rotatably connected to the connecting shaft (402), and the other end of the connecting shaft (402) is connected to the rotating frame (403); the bottom of the mounting plate (401) is connected to evenly distributed exhaust pipes (408), and a sealing plug (409) is installed inside the exhaust pipe (408); The outer side of the exhaust pipe (408) is spirally connected to a rotating ring (410), and the other end of the rotating ring (410) is rotatably connected to an air guide pipe (411).

2. A multi-layer circuit board structure for facilitating heat dissipation according to claim 1, characterized in that: The side surface of the air guide pipe (411) is provided with evenly distributed through holes.

3. The multi-layer circuit board structure for facilitating heat dissipation according to claim 1, characterized in that: A first central magnet (404) is fixedly connected to the bottom of the rotating frame (403); a second central magnet (405) fixedly connected to the mounting plate (401) is provided on the other side of the first central magnet (404); first side magnets (406) fixedly connected to the rotating frame (403) are provided on both sides of the first central magnet (404); and second side magnets (407) fixedly connected to the mounting plate (401) are provided on both sides of the second central magnet (405).

4. The multi-layer circuit board structure for facilitating heat dissipation according to claim 1, characterized in that: The interior of the mounting plate (401) is hollow.

5. The multi-layer circuit board structure for facilitating heat dissipation according to claim 1, characterized in that: The top of the rotating frame (403) is open, and the interior of the rotating frame (403) is hollow.

6. The multi-layer circuit board structure for facilitating heat dissipation according to claim 2, characterized in that: The air guide pipe (411) is made of hollow deformable carbon steel.

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