Vibrating diaphragm

Abstract

The embodiment of the utility model provides a vibrating diaphragm, and the vibrating diaphragm comprises a middle layer which is used for providing a supporting force for the vibrating diaphragm; the metal film is attached to the surface of the middle layer and covers the front face and the back face of the middle layer at the same time; wherein the metal film is provided with a circuit structure, and the circuit structure is bent at the edge of the middle layer and continuously extends from the front surface of the middle layer to the back surface of the middle layer. In the technical scheme provided by the embodiment of the invention, the metal film is folded and then arranged on the surface of the middle layer, and the circuit structure is bent from the front surface of the middle layer and continuously extends to the back surface of the middle layer, so that the welding times of the circuit structure on the front surface of the middle layer and the circuit structure on the back surface are effectively reduced, and the weight of the vibrating diaphragm can be reduced; and the efficiency and the high pitch quality of the vibrating diaphragm are better.

Description

Technical Field

[0001] The present application relates to the technical field of loudspeakers, and in particular to a diaphragm. Background Art

[0002] With the continuous development of audio technology, a planar diaphragm speaker has become popular among users because of its more realistic and pure treble and less distortion. Its main principle is to place a planar diaphragm with a conductive circuit in a magnetic field, and pass audio current through the circuit. The conductive circuit is affected by the Ampere force in the magnetic field, thereby driving the planar diaphragm to vibrate and make sound.

[0003] Normally, in order to increase the efficiency of the diaphragm and balance the resistance, circuit structures are provided on the front and back of the planar diaphragm. The circuits on the front and back sides often need to be connected by welding or using additional cables, which makes the weight of the planar diaphragm extra heavy, and the efficiency and treble quality of the planar diaphragm will be affected. Utility Model Content

[0004] In view of the above problems, the present application is proposed to provide a diaphragm.

[0005] In one embodiment of the present application, a diaphragm is provided, comprising:

[0006] The middle layer is used to provide support for the diaphragm;

[0007] A metal film is attached to the surface of the intermediate layer and covers both the front and back surfaces of the intermediate layer;

[0008] Wherein, a circuit structure is provided on the metal film, and the circuit structure is bent at the edge of the middle layer and extends continuously from the front side of the middle layer to the back side of the middle layer.

[0009] Optionally, after the metal film is bent at the first side of the intermediate layer, the circuit structure extends from the front surface of the intermediate layer to the back surface of the intermediate layer.

[0010] Optionally, the circuit structure located at the head end of the metal film and the circuit structure located at the tail end of the metal film are connected by welding.

[0011] Optionally, the metal film is a closed end structure, and the circuit structure extends from the front side of the middle layer to the back side of the middle layer after the metal film is bent from the first side and the second side of the middle layer.

[0012] Optionally, along the width direction of the metal film, a plurality of sections of the circuit structure are arranged end to end on the metal film in a U-shaped structure;

[0013] Projections of the circuit structure on the front surface of the intermediate layer and the circuit structure on the back surface of the intermediate layer on the plane of the intermediate layer are the same or staggered.

[0014] Optionally, the circuit structure includes a plurality of parallel conductive lines.

[0015] Optionally, it further includes a rib structure, wherein the rib structure is connected to the diaphragm;

[0016] The reinforcement structure includes transverse reinforcement and / or longitudinal reinforcement.

[0017] Optionally, the force rib structure is provided on the intermediate layer, or the force rib structure is bonded to the front or back surface of the diaphragm.

[0018] Optionally, it further comprises an elastic suspension component, wherein the elastic suspension component is provided at the edge of the diaphragm;

[0019] Alternatively, the elastic suspension component is connected to the middle layer.

[0020] Optionally, the elastic suspension component is an elastic strip, which is provided on both sides or four sides of the diaphragm, with one side of the elastic strip connected to the middle layer and the other side extending outward.

[0021] In the technical solution provided in the embodiments of the present application, by providing a continuous metal film on the intermediate layer, the circuit structure extends continuously from the front side of the intermediate layer to the back side of the intermediate layer. The circuit structure on the front side of the intermediate layer and the circuit structure on the back side of the intermediate layer do not need to be connected by welding. While ensuring the integrity of the circuit structure, it effectively reduces the number of circuit welding operations, improves processing efficiency, and improves the quality of the diaphragm. In addition, it can also reduce the weight of the diaphragm, and improve the efficiency of the diaphragm and the quality of the treble. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, a brief introduction will be given below to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0023] Figure 1 A simplified structural diagram of a diaphragm provided in an embodiment of the present application;

[0024] Figure 2 A simplified structural diagram of another diaphragm provided in an embodiment of the present application;

[0025] Figure 3An expanded diagram of a metal film and circuit structure provided in an embodiment of the present application;

[0026] Figure 4 An expanded view of another metal film and circuit structure provided in an embodiment of the present application;

[0027] Figure 5 A front view of a diaphragm provided in an embodiment of the present application;

[0028] Figure 6 A front view of another diaphragm provided in an embodiment of the present application;

[0029] Figure 7 A schematic structural diagram of a diaphragm and rib structure provided in an embodiment of the present application;

[0030] Figure 8 A cross-sectional view of a sound unit provided in an embodiment of the present application. DETAILED DESCRIPTION

[0031] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the embodiments described are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative work are within the scope of protection of this application. The "including" mentioned throughout the specification and claims is an open term and should be interpreted as "including but not limited to". "Approximately" means that within an acceptable error range, those skilled in the art can solve the technical problem within a certain error range and basically achieve the technical effect. In addition, in the embodiments of the present application, a plurality refers to two or more. Unless there is any contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.

[0032] See also Figure 1 and Figure 2 In one embodiment of the present application, a diaphragm is provided, which includes: an intermediate layer 1 and a metal film 2. The intermediate layer 1 is used to provide support for the diaphragm, and the metal film 2 is attached to the surface of the intermediate layer 1 and covers both the front and back surfaces of the intermediate layer 1. It can be understood that the length of the metal film 2 is roughly equal to twice the length of the intermediate layer 1. After the metal film 2 is folded in half, the intermediate layer 1 is located in the middle position, with half of the metal film 2 located on the front surface of the intermediate layer 1 and the other half of the metal film 2 located on the back surface of the intermediate layer 1. The metal film 2 is bent at the edge of the intermediate layer 1, so that it can cross from the front surface of the intermediate layer 1 to the back surface of the intermediate layer 1.

[0033] A circuit structure 4 is provided on the metal film 2. The circuit structure 4 bends at the edge of the intermediate layer 1 and extends continuously from the front side of the intermediate layer 1 to the back side of the intermediate layer 1. It can be understood that the circuit structure 4 on the front side of the intermediate layer 1 is continuously connected to the circuit structure 4 on the back side, and the circuits on both sides are connected in series to form a complete circuit.

[0034] Normally, when the front and back sides of the middle layer 1 are both provided with a circuit structure 4, the edges on both sides of the middle layer 1 need to be welded one by one so that the circuit on the front and the circuit on the back are connected together. However, when the number of circuit structures 4 is too large, welding will be a huge workload. As long as one circuit structure 4 is not welded well, it may seriously affect the performance of the entire circuit structure 4. This welding method not only requires a huge workload, but also cannot effectively guarantee the quality. In addition, connecting the circuits by welding will bring a more serious problem, which is that it will increase the weight of the diaphragm. When the weight of the diaphragm increases, the vibration efficiency of the diaphragm will be significantly reduced. In addition, increasing the weight of the diaphragm will also affect the high-frequency response and transient characteristics. Therefore, it is particularly important to design a circuit structure that can fully utilize the magnetic field vibration to produce sound without adding extra weight to the diaphragm.

[0035] In the technical solution provided in the present application, the metal film 2 is folded in half and arranged on the surface of the intermediate layer 1, and the circuit structure 4 is bent from the front side of the intermediate layer 1 and extends continuously to the back side of the intermediate layer 1. The number of welding times of the circuit structure 4 on the front side of the intermediate layer 1 and the circuit structure 4 on the back side can be reduced. While ensuring the integrity of the circuit structure 4, the processing efficiency is improved and the weight of the diaphragm is also lighter.

[0036] In a specific embodiment, the middle layer 1 is an EVA (Ethylene Vinyl Acetate Copolymer) layer, which has a certain degree of rigidity and toughness and can effectively support the diaphragm. On both sides of the EVA layer are metal layers such as aluminum foil. Usually, glue can be brushed on both sides of the EVA layer, and then the aluminum foil layer is bonded to the surface of the EVA layer. The surface of the aluminum foil layer forms a circuit structure 4. When the circuit structure 4 placed in the magnetic field is energized, it can drive the entire diaphragm to vibrate. This application does not specifically limit the specific material of the diaphragm middle layer 1. For example, the material of the middle layer 1 includes but is not limited to: plastic sheet, thin wood board, carbon fiber sheet, cardboard, metal sheet, polymer material board, composite material board, etc. In addition, to ensure that the diaphragm has certain energy absorption properties, the middle layer 1 can also be some lightweight energy-absorbing materials, such as: nylon mesh covered with an adhesive layer, thin rubber, thin silicone, polymer glue layer, fiberglass tape, etc.

[0037] In addition, the material of the metal film 2 includes but is not limited to: aluminum, gold, silver, aluminum-magnesium alloy, copper, etc.

[0038] See also Figure 1 In one embodiment provided in the present application, the circuit structure 4 extends from the front side of the intermediate layer 1 to the back side of the intermediate layer 1 after the metal film 2 is bent at the first side edge of the intermediate layer 1. The breakpoint of the circuit structure 4 located at the head end of the metal film 2 and the breakpoint of the circuit structure 4 located at the tail end of the metal film 2 are connected by welding. Typically, multiple circuit structures 4 are provided on the front and back sides of the intermediate layer 1. The multiple circuit structures 4 extend from the front side to the back side, and then from the back side to the front side. The circuit structure 4 is a circularly wound structure. However, since the head end and the tail end of the metal film 2 are disconnected, welding is required to connect the circuit into a complete loop.

[0039] In addition, in one embodiment provided in this application, see Figure 2 The metal film 2 forms a closed structure, connected end to end. The circuit structure 4, following the metal film 2, bends from the first and second sides of the intermediate layer 1, extending from the front side of the intermediate layer 1 to the back side. The metal film 2 is connected end to end to form a structure similar to a circular track, with the intermediate layer 1 positioned between the metal diaphragms. The circuit structures 4 on the metal diaphragms are also interconnected to form a complete circuit. This design further reduces the need for soldering, requiring only the positive and negative terminals to be soldered.

[0040] See also Figure 2 and Figure 3 In a specific embodiment, a metal film 2 of suitable length can be cut first, then folded in half along the fold line H and adhered to the intermediate layer 1 through the glue layer 3. The entire edges of the leading and trailing ends of the metal film 2 are connected together by welding (for example, ultrasonic welding, laser welding, brazing, etc.), and then circuit structures 4 are processed on the front and back surfaces of the metal film 2 respectively. The circuit structures 4 on the front and back surfaces are connected to form a complete loop.

[0041] For each of the above technical solutions, the circuit structure 4 may be first processed on the metal film 2 and then bonded to the intermediate layer 1, or the metal film 2 may be first bonded to the intermediate layer 1 and then the circuit structure 4 may be processed. Processing of the circuit structure 4 includes, but is not limited to, etching, machining, laser engraving, and the like.

[0042] See also Figure 3 In one embodiment provided in the present application, along the width direction of the metal film 2, multiple circuit structures 4 are arranged end to end in a U-shaped structure on the metal film 2. Figure 3A section of the circuit structure 4 in the dotted box A can be considered as a section of the circuit structure 4 of the U-shaped structure. The circuit structure 4 of multiple sections of the U-shaped structure is connected end to end along the length direction of the diaphragm (the direction of the arrow X in the figure), and the extension direction of the circuit structure 4 of each section of the U-shaped structure (the direction of the arrow Y in the figure) is in the same direction as the width direction of the diaphragm. In addition, the circuit structure 4 can also be an S-shaped or Z-shaped structure, etc. It should be noted that this application does not specifically limit the number of sections of the circuit structure 4, which can be as follows. Figure 3 A few sections of the U-shaped circuit structure 4 are connected, or it can be as follows Figure 4 The circuit structure 4 of the multi-segment U-shaped structure is connected, and the circuit structure strictly corresponds to the magnetic system arrangement.

[0043] Furthermore, in one embodiment of the present application, the projections of the circuit structure 4 on the front surface of the intermediate layer 1 and the circuit structure 4 on the back surface of the intermediate layer 1 on the plane of the intermediate layer 1 are the same. It can be understood that the circuit structure 4 on the front surface of the intermediate layer 1 and the circuit structure 4 on the back surface of the intermediate layer 1 are in a mirror-symmetrical relationship. In addition, in another embodiment of the present application, in order to optimize the force on the diaphragm and ensure that the force on each area of ​​the diaphragm is uniform, see Figure 4 The projections of the circuit structure 4 on the front surface of the intermediate layer 1 and the circuit structure 4 on the back surface of the intermediate layer 1 on the plane of the intermediate layer 1 may also be different.

[0044] In order to optimize the force on the diaphragm, in another embodiment of the present application, the projections of the circuit structure 4 on the front surface of the intermediate layer 1 and the circuit structure 4 on the back surface of the intermediate layer 1 on the plane of the intermediate layer 1 are staggered.

[0045] See also Figure 3 In one embodiment provided in the present application, the circuit structure 4 includes a plurality of parallel conductive circuits. Along the width direction of the diaphragm, the starting breakpoint and the tail breakpoint of each conductive circuit are staggered, and the breakpoints of adjacent conductive circuits on both sides of the diaphragm are aligned. Specifically, in one specific example, the circuit structure 4 includes six parallel conductive circuits, and the starting breakpoint a1 and the tail breakpoint a2 of the conductive circuit a are staggered in the width direction of the diaphragm. The height of the starting breakpoint a1 is greater than the tail breakpoint a2. The starting breakpoint a1 can serve as the positive terminal of the entire circuit structure 4.

[0046] Along the width of the diaphragm (arrow Y), the end breakpoint a2 of conductive trace a is aligned with the starting breakpoint b1 of conductive trace b. When the two sides of the metal film 2 are connected, the end breakpoint a2 will also align with the starting breakpoint b1. Similarly, the end breakpoint b2 of conductive trace b is aligned with the starting breakpoint c1 of conductive trace c. Finally, the end breakpoint f2 of conductive trace f serves as the negative terminal of the entire circuit structure 4.

[0047] Furthermore, when the diaphragm is placed in a group of magnets with opposite polarities, the magnetic field strengths at different areas on the diaphragm are different, so the widths of the multiple conductive lines in the circuit structure 4 are the same or different. Figure 3 As shown, the widths of conductive traces a and c are approximately the same, the width of conductive trace a is greater than the width of conductive trace b, and the width of conductive trace b is greater than the width of conductive trace e. In the technical solution of this application, it is necessary to simulate the magnetic field changes in each region during the vibration of the diaphragm, so as to design the widths of the conductive traces in each region, so that the diaphragm vibrates more smoothly in the final design.

[0048] See also Figure 5 In one embodiment provided in this application, the diaphragm further comprises an elastic suspension component 5, which is disposed at the edge of the diaphragm and is connected to the diaphragm. The elastic suspension component 5 includes, but is not limited to, a spring, an elastic cord, an elastic bracket, an elastic strip, and the like. In a specific embodiment, the elastic suspension component 5 is an elastic cord, and mounting structures are provided at the four corners of the diaphragm. The mounting structures are mounting holes. One end of the elastic cord is connected to the mounting hole, and the other end can be connected to the housing of the audio device, thereby allowing the diaphragm to be suspended in the audio device.

[0049] See also Figure 6 In another embodiment, the elastic suspension component 5 is an elastic strip disposed on both sides or all four sides of the diaphragm, with one side of the elastic strip connected to the diaphragm and the other side extending outward. The length of the elastic strip can be the same as or different from the side length of the diaphragm. The outwardly extending end of the elastic strip is connected to the housing of the audio device, thereby stably suspending the diaphragm within the audio device.

[0050] See also Figure 7 In one embodiment provided in the present application, a force rib structure 6 is further included, and the force rib structure 6 is provided on the intermediate layer 1, or on the outer surface of the diaphragm. The force rib structure 6 is connected to the intermediate layer 1. For example, the force rib structure 6 is located in the structure of the intermediate layer 1, similar to the skeleton of the intermediate layer 1, thereby enhancing the rigidity of the intermediate layer 1. In addition, the force rib structure 6 can also be bonded to the front or back surface of the diaphragm. Taking the example of the force rib structure 6 being provided on the surface of the diaphragm, the metal film 2 is bonded to the intermediate layer 1 to form the diaphragm, and then the force rib structure 6 is bonded to the surface of the diaphragm.

[0051] The reinforcement structure 6 includes but is not limited to carbon fiber rods, plastic tubes, wooden rods, etc. In addition, the reinforcement structure can also be an origami structure of some diaphragm materials, for example, the cross-sectional shape of the origami structure is V-shaped, T-shaped, M-shaped, etc.

[0052] The diaphragm is mainly set in the opposing gap formed by the opposing magnets. The width of the opposing gap can be roughly considered as the maximum vibration space of the diaphragm. Since the rib structure 6 has a certain thickness, the rib structure 6 will increase the size of the diaphragm in the thickness direction, thereby reducing the vibration space of the diaphragm. To improve this problem, in one embodiment provided in this application, see Figure 7 When the diaphragm and the magnet unit are combined into a sound unit, the diaphragm has a projection corresponding to the magnet unit. Figure 8 See also Figure 8 As shown, the magnet units 9 are distributed above the front and back surfaces of the diaphragm. Figure 7 The dotted box in the middle represents the location where the magnet unit 9 is set (i.e. the projection of the magnet unit 9). Figure 8 ), the magnet units 9 on the front and back sides of the diaphragm are arranged with the same poles opposite to each other, which can be understood as the magnet units 9 on the front and back sides of the diaphragm have the same magnetic poles facing the diaphragm. Among the multiple magnet units 9 on the front or back side of the diaphragm, the adjacent magnet units 9 have opposite magnetic poles facing the diaphragm. The force rib structure 6 includes transverse force ribs and / or longitudinal force ribs 61. Figure 7-8 As shown, with transverse reinforcement 61 ( Figure 7 As an example, a plurality of transverse force ribs 61 are provided on the diaphragm. The transverse force ribs 61 are provided on the surface of the diaphragm, and each transverse force rib 61 is located between two adjacent projections. Figure 8 The vibration space of the transverse force rib 61 is in the gap between two adjacent magnets, so that the force rib structure does not occupy the vibrating space of the diaphragm when the diaphragm vibrates.

[0053] In summary, in the technical solution provided in the embodiments of the present application, by folding the metal film in half and placing it on the surface of the intermediate layer, the circuit structure extends continuously from the front side of the intermediate layer to the back side of the intermediate layer. This effectively reduces the number of times the circuit structure on the front side of the intermediate layer and the circuit structure on the back side of the intermediate layer need to be welded together. While ensuring the integrity of the circuit structure, it also improves processing efficiency and makes the diaphragm lighter. Even for highly complex circuit structures, it can be processed efficiently and quickly.

[0054] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A diaphragm, characterized in that: include: The middle layer is used to provide support for the diaphragm; A metal film is attached to the surface of the intermediate layer and covers both the front and back surfaces of the intermediate layer; Wherein, a circuit structure is provided on the metal film, and the circuit structure is bent at the edge of the middle layer and extends continuously from the front side of the middle layer to the back side of the middle layer.

2. The diaphragm according to claim 1, wherein The circuit structure extends from the front surface of the middle layer to the back surface of the middle layer after the metal film is bent at the first side of the middle layer.

3. The diaphragm according to claim 2, characterized in that The circuit structure located at the head end of the metal film and the circuit structure located at the tail end of the metal film are connected by welding.

4. The diaphragm according to claim 1, wherein The metal film is a closed structure. The circuit structure extends from the front side of the middle layer to the back side of the middle layer after the metal film is bent from the first side and the second side of the middle layer.

5. The diaphragm according to claim 1, wherein: Along the width direction of the metal film, multiple sections of the circuit structure are arranged on the metal film in a U-shaped structure, end to end; Projections of the circuit structure on the front surface of the intermediate layer and the circuit structure on the back surface of the intermediate layer on the plane of the intermediate layer are the same or staggered.

6. The diaphragm according to claim 5, characterized in that The circuit structure includes a plurality of parallel conductive lines.

7. The diaphragm according to any one of claims 1 to 6, characterized in that: It also includes a rib structure connected to the diaphragm; The reinforcement structure includes transverse reinforcement and / or longitudinal reinforcement.

8. The diaphragm according to claim 7, characterized in that The rib structure is provided on the intermediate layer, or the rib structure is bonded to the front or back surface of the diaphragm.

9. The diaphragm according to claim 1, wherein: Also included is an elastic suspension component, wherein the elastic suspension component is provided at the edge of the diaphragm; Alternatively, the elastic suspension component is connected to the middle layer.

10. The diaphragm according to claim 9, characterized in that The elastic suspension component is an elastic strip, which is arranged on both sides or four sides of the diaphragm. One side of the elastic strip is connected to the middle layer, and the other side extends outward.

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