Resistance-capacitance packaging structure compatible with SMT and PTH

Abstract

The utility model discloses a resistance-capacitance packaging structure compatible with SMT and PTH, which comprises a compatible unit arranged on a circuit board, the compatible unit comprises at least one pair of PTH packaging bonding pads and at least one pair of SMD packaging bonding pads, the overlapping part of the orthographic projection of one PTH packaging bonding pad and the orthographic projection of one SMD packaging bonding pad is not less than one third of the SMD packaging bonding pad, and the thickness of the compatible unit is smaller than the thickness of the compatible unit. And the overlapping part of the orthographic projection of one PTH packaging bonding pad and the orthographic projection of one SMD packaging bonding pad is not greater than one half of the SMD packaging bonding pad. According to the utility model, advantages of SMT and PTH packaging can be fully utilized, more choices are provided for resistance-capacitance devices, rework caused by material replacement during circuit board design is avoided, and efficiency is improved. When the limit height meets the requirement and the requirement on the stability is not high, some PTH resistance-capacitance devices with lower cost can be inserted; when the height of the structure is limited, only short devices can be used, and SMT resistance-capacitance devices can be mounted.

Description

Technical Field

[0001] The utility model relates to the technical field of PCB packaging, and more specifically, to a resistor-capacitor packaging structure compatible with SMT and PTH. Background Art

[0002] PCB stands for Printed Circuit Board, and its Chinese name is printed circuit board, also known as printed circuit board. It is an important electronic component, a support for electronic components, and a carrier for the electrical connection of electronic components. Packaging is an important production and processing step in its application. The original definition of packaging is to protect circuit chips from the influence of the surrounding environment, including physical and chemical influences. With the development of integrated circuit technology, the function of packaging is constantly changing. At this stage, it mainly has four major functions, namely power distribution, signal distribution, heat dissipation and packaging protection. The types of electronic packaging can be divided according to different classification standards. For example, according to the way the first-level connection is connected to the second-level connection, it can be divided into PTH (pin-through-hole) packaging and SMT (surface-mount-technology) packaging, which are commonly called socket packaging and surface mount packaging. Among them, surface mount devices (SMD) use surface mount packaging to package PCBs.

[0003] When working with high-power power supply circuits, PTH resistors and capacitors are often required. These components offer the advantages of simple structure, easy installation, and relatively low cost. However, they are generally large and tall, making them incompatible with height restrictions. Compared to PTH resistors and capacitors, SMT resistors and capacitors offer miniaturization, high performance, and stable capacitance. They also utilize high-precision automated production and high installation accuracy. However, when laying out components, choosing only SMT resistors and capacitors can result in higher costs, while choosing only PTH resistors and capacitors will not meet height restrictions. Existing packaging structures are incompatible with both SMT and PTH resistors and capacitors. Utility Model Content

[0004] In order to overcome the problem that the existing packaging structure is not compatible with SMT and PTH resistor and capacitor components, the utility model provides a SMT and PTH compatible resistor and capacitor packaging structure.

[0005] The technical solution of this utility model is as follows:

[0006] A resistor-capacitor packaging structure compatible with SMT and PTH includes a compatible unit provided on a circuit board, the compatible unit including at least one pair of PTH packaging pads and at least one pair of SMD packaging pads, the overlapping portion of the orthographic projection of one of the PTH packaging pads and the orthographic projection of one of the SMD packaging pads being no less than one-third of the SMD packaging pad, and the overlapping portion of the orthographic projection of one of the PTH packaging pads and the orthographic projection of one of the SMD packaging pads being no more than one-half of the SMD packaging pad.

[0007] According to the above solution of the present invention, the pair of SMD packaging pads is located between the pair of PTH packaging pads.

[0008] According to the above solution of the present invention, the distance between a pair of SMD package pads is 3.16 mm.

[0009] According to the above solution of the present invention, the distance between a pair of PTH package pads is 5.08 mm.

[0010] According to the above solution of the present invention, the pair of SMD packaging pads are located outside the pair of PTH packaging pads.

[0011] According to the above solution of the present invention, the SMD package pad is square in shape, the PTH package pad is circular in shape, and the side length of the SMD package pad is equal to the diameter of the PTH package pad.

[0012] According to the above solution of the present invention, the diameter of the PTH package pad is 1.524 mm.

[0013] According to the above solution of the present invention, the centers of the pair of SMD package pads and the centers of the pair of PTH package pads are on the same straight line.

[0014] According to the above solution of the present invention, one of the SMD package pads and one of the PTH package pads overlapping therewith are provided with circular marks formed by silk-screen printing with white paint, and the circular marks are used to identify the positive and negative poles.

[0015] The present invention, according to the above solution, has the beneficial effect of fully utilizing the advantages of both SMT and PTH packaging formats, providing more options for selecting resistor and capacitor components, while also avoiding rework due to material replacement during PCB design, thereby ensuring overall progress. When height restrictions are met and stability requirements are not high, lower-cost PTH resistor and capacitor components can be inserted, thereby saving some costs; when height restrictions limit the use of shorter components, SMT resistor and capacitor components can be mounted. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0017] Figure 1 It is a structural diagram of the present utility model.

[0018] In the drawings, the reference numerals are as follows:

[0019] 100. Circuit board; 10. Compatible unit; 11. PTH package pad; 12. SMD package pad; 13. Circular logo. DETAILED DESCRIPTION

[0020] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments.

[0021] It should be noted that the terms "including" and "having," as well as any variations thereof, in the specification and claims of the present invention are intended to cover non-exclusive inclusions. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units that are not listed, or may optionally include other steps or units that are inherent to the process, method, product, or device. Terms such as "disposed" should be interpreted broadly, for example, and may refer to fixed connections, detachable connections, or integration; mechanical connections, electrical connections; direct connections, indirect connections through an intermediate medium, internal connections between two elements, or interactions between two elements, unless otherwise expressly defined. Terms such as "upper," "lower," "left," "right," "front," "back," and "bottom" indicate directions or positions based on those shown in the accompanying drawings. These are for ease of description only and should not be construed as limitations on the present invention.

[0022] When working with high-power power supply circuits, PTH resistors and capacitors are often required. These components offer the advantages of simple structure, easy installation, and relatively low cost. However, they are generally large and tall, making them incompatible with height restrictions. Compared to PTH resistors and capacitors, SMT resistors and capacitors offer miniaturization, high performance, and stable capacitance. They also utilize high-precision automated production and high installation accuracy. However, when laying out components, choosing only SMT resistors and capacitors can result in higher costs, while choosing only PTH resistors and capacitors will not meet height restrictions. Existing packaging structures are incompatible with both SMT and PTH resistors and capacitors.

[0023] like Figure 1 As shown, this embodiment provides a resistor and capacitor packaging structure compatible with both SMT and PTH. This fully utilizes the advantages of both SMT and PTH packaging formats, providing more options for selecting resistor and capacitor components. It also avoids rework due to material replacement during PCB design, ensuring overall progress. When height restrictions are met and stability requirements are not high, lower-cost PTH resistor and capacitor components can be installed, thereby saving some costs. When the structure is height-restricted and only shorter components can be used, SMT resistor and capacitor components can be mounted.

[0024] Specifically, the resistor-capacitor packaging structure compatible with SMT and PTH includes a compatible unit 10 provided on a circuit board 100, wherein the compatible unit 10 includes at least one pair of PTH packaging pads 11 and at least one pair of SMD packaging pads 12, and the overlapping portion of the orthographic projection of one of the PTH packaging pads 11 and the orthographic projection of one of the SMD packaging pads 12 is not less than one-third of the SMD packaging pad 12, and the overlapping portion of the orthographic projection of one of the PTH packaging pads 11 and the orthographic projection of one of the SMD packaging pads 12 is not greater than one-half of the SMD packaging pad 12.

[0025] The SMT package pads overlap with the PTH package pads 11 to maintain connectivity and compatibility between the two. The overlap between the orthographic projection of a PTH package pad 11 and the orthographic projection of an SMD package pad 12 is no less than one-third of the SMD package pad 12, ensuring sufficient contact area between the SMD package pad 12 and the PTH package pad 11, which is beneficial for heat transfer and current conduction during the soldering process. The overlap between the orthographic projection of a PTH package pad 11 and the orthographic projection of an SMD package pad 12 is no more than one-half of the SMD package pad 12 to ensure that the soldering performance of the SMT package pads is not affected, such as problems such as thermal stress concentration or poor soldering during the soldering process.

[0026] In one embodiment, a pair of the SMD package pads 12 is located between a pair of the PTH package pads 11, which helps to reduce crosstalk and coupling effects between signal lines. By reasonably controlling the spacing and layout of the SMD package pads 12 and the PTH package pads 11, the signal transmission path can be optimized, signal attenuation and distortion can be reduced, and the overall performance of the circuit board 100 can be improved.

[0027] The spacing between the pair of SMD package pads 12 is 3.16mm. This 3.16mm spacing complies with the pin spacing specifications of many standard components, facilitating component placement and soldering. The spacing between the pair of PTH package pads 11 is 5.08mm. This larger spacing helps ensure that the pins of plug-in components can be accurately inserted into the pad holes and reduces the risk of misalignment during soldering.

[0028] In one embodiment, the pair of SMD package pads 12 are located outside the pair of PTH package pads 11. This layout effectively utilizes the space on the circuit board 100. This layout can reduce the overall size of the circuit board 100 and improve integration.

[0029] In one embodiment, the side length of the SMD package pad 12 is equal to the diameter of the PTH package pad 11. The SMD package pad 12 and the PTH package pad 11 are equal in size and reasonably arranged. It can be expected that the thermal stress generated during the welding process will be relatively evenly distributed, reducing the risk of poor welding or component damage due to concentrated thermal stress.

[0030] The SMD package pad 12 is square in shape, with a side length of 1.524mm, which facilitates precise alignment and stable soldering of surface mount components. The square pad also provides a larger contact area, which helps to disperse thermal and mechanical stress during the soldering process and improve soldering quality. The PTH package pad 11 is circular in shape, with a diameter of 1.524mm. The circular pad facilitates the insertion of the pins of plug-in components and provides uniform heat distribution during the soldering process. The circular design also has a certain degree of fault tolerance, ensuring a good electrical connection even if the pin position deviates slightly.

[0031] In one embodiment, the centers of the pair of SMD package pads 12 and the centers of the pair of PTH package pads 11 are on the same straight line. This layout not only enhances visual symmetry but also simplifies the design and production process of the circuit board 100.

[0032] In one embodiment, one of the SMD package pads 12 and the overlapping PTH package pad 11 is provided with a circular marker 13 formed by silk screen printing with white paint. The circular marker 13 is used to identify the positive and negative poles. Without the need for additional tools or documentation, assemblers and maintenance personnel of the circuit board 100 can quickly and accurately identify the positive and negative polarity of the component, avoiding circuit failures caused by installation errors. The circular marker 13 can also be used to identify the size of the device frame. The diameter of the marker is proportional to the maximum size of the component, which helps to quickly locate the component on the circuit board 100 with a complex layout and ensure that it does not exceed the predetermined installation space.

[0033] It should be understood that those skilled in the art can make improvements or changes based on the above description, and all such improvements and changes should fall within the scope of protection of the claims attached to this utility model.

[0034] The above is an exemplary description of the present utility model patent in conjunction with the accompanying drawings. It is obvious that the implementation of the present utility model patent is not limited to the above-mentioned method. As long as various improvements are made using the method concept and technical solution of the present utility model patent, or the concept and technical solution of the present utility model patent are directly applied to other occasions without improvement, they are all within the scope of protection of the present utility model.

Claims

1. A resistor-capacitor package structure compatible with SMT and PTH, characterized in that: It includes a compatible unit arranged on a circuit board, the compatible unit includes at least one pair of PTH package pads and at least one pair of SMD package pads, the overlapping part of the orthographic projection of one of the PTH package pads and the orthographic projection of one of the SMD package pads is not less than one-third of the SMD package pad, and the overlapping part of the orthographic projection of one of the PTH package pads and the orthographic projection of one of the SMD package pads is not greater than one-half of the SMD package pad.

2. The SMT and PTH compatible resistor-capacitor packaging structure according to claim 1, characterized in that: The pair of SMD package pads is located between the pair of PTH package pads.

3. The SMT and PTH compatible resistor-capacitor packaging structure according to claim 2, characterized in that: The spacing between a pair of SMD package pads is 3.16 mm.

4. The SMT and PTH compatible resistor-capacitor packaging structure according to claim 3, characterized in that: The spacing between a pair of PTH package pads is 5.08 mm.

5. The SMT and PTH compatible resistor-capacitor packaging structure according to claim 1, characterized in that: The pair of SMD package pads is located outside the pair of PTH package pads.

6. The SMT and PTH compatible resistor-capacitor packaging structure according to claim 2 or 5, characterized in that: The SMD package pad is square-shaped, the PTH package pad is circular-shaped, and the side length of the SMD package pad is equal to the diameter of the PTH package pad.

7. The SMT and PTH compatible resistor-capacitor packaging structure according to claim 6, characterized in that: The diameter of the PTH package pad is 1.524 mm.

8. The SMT and PTH compatible resistor-capacitor packaging structure according to claim 4, characterized in that: The centers of the pair of SMD package pads and the centers of the pair of PTH package pads are on the same straight line.

9. The SMT and PTH compatible resistor-capacitor packaging structure according to claim 1, characterized in that: One of the SMD package pads and one of the PTH package pads overlapping therewith is provided with a circular mark formed by silk screen printing with white paint, and the circular mark is used to identify the positive and negative poles.

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