Laser tin soldering module

Abstract

The utility model relates to a laser tin soldering module which comprises a base, an installation frame is vertically arranged on the top face of the base, a three-axis moving mechanism is arranged on the installation frame, an installation base is arranged on the three-axis moving mechanism, a laser is vertically arranged on the installation base, a material storage tank is further arranged on one side of the installation frame, and a tin ball is placed in the material storage tank. A conveying pipe is arranged at the bottom of the storage tank and communicates with the interior of the laser, and a feeding assembly is arranged at the joint of the conveying pipe and the laser. The feeding assembly is additionally arranged in the laser of the tin soldering machine, so that tin soldering materials are more accurate, the phenomenon that a spraying hole is blocked due to solidification of welding flux is avoided, the valve is arranged at the feeding position, when high-pressure spraying is conducted on the welding flux in the molten state subsequently, it is ensured that the internal air pressure is stable, pressure relief is prevented, and the welding quality is improved. The stability in the tin soldering process is ensured, and the machining effect is improved; and a rotary conveying material disc is further arranged, continuous and uninterrupted work can be achieved, and the working efficiency is greatly improved.

Description

Technical Field

[0001] The utility model relates to the technical field of laser soldering equipment, in particular to a laser soldering module. Background Art

[0002] A soldering machine is a mechanical device used to solder various electronic components onto circuit boards. It can be broadly categorized as automatic soldering machines, hot air soldering machines, and lead-free reflow soldering machines. Automatic soldering machines offer full three-dimensional adjustment, eliminating the need for operator assistance with the soldering iron and solder wire. Driven by an automated control system, the robotic arm automatically adjusts to any desired soldering position.

[0003] The automatic soldering machine mainly uses a stage to place the fixture, and then uses the fixture to fix the mold of the electronic components. After that, the electronic components are placed on the mold to start working. In order to ensure the consistency of the soldering parts, the solder delivery amount needs to be strictly controlled. The existing laser lacks a single feeding control structure. Especially when delivering some larger solder balls, too many solder balls can easily cause them to melt untimely, resulting in nozzle blockage or unsmooth material feeding. In addition, since the internal feeding structure of the existing laser is connected to the storage tank, the high-pressure gas used for injection will be depressurized through the delivery channel, thereby affecting its soldering effect. Utility Model Content

[0004] Based on the above description, the utility model provides a laser soldering module to solve the shortcomings of existing automatic soldering machines, such as the lack of a single-feed control structure, untimely melting causing blockage, and the sprayed gas will be depressurized through the solder ball delivery channel, thereby affecting the processing effect.

[0005] The utility model is realized through the following technical solutions:

[0006] A laser soldering module includes a base, a mounting frame vertically arranged on the top surface of the base, a three-axis moving mechanism provided on the mounting frame, and a mounting seat provided on the three-axis moving mechanism, a laser vertically arranged on the mounting seat, a storage tank provided on one side of the mounting frame, solder balls placed inside the storage tank, a feed pipe provided at the bottom of the storage tank, the feed pipe being connected to the inside of the laser and a feeding assembly provided at the connection.

[0007] On the basis of the above technical solution, the present invention can also be improved as follows.

[0008] Furthermore, the lower half of the storage tank is configured as an inverted bucket shape and has a through hole at the center of the top surface, and the feed pipe is configured as a hose and the top end is connected to the through hole, and the solder balls are arranged in sequence inside the hose.

[0009] Furthermore, a feed port is provided on one side of the laser, and the feed port extends outward at an angle to form a rectangular connecting portion. The top surface of the connecting portion is provided with an interface, and the bottom end of the feed pipe is connected to the interface, and the solder balls are transported to the inside of the connecting portion in sequence along the hose.

[0010] Furthermore, the feeding assembly includes a transmission shaft rotatably installed inside the connecting part, the transmission shaft is provided with spiral blades, and the spacing between the spiral blades is greater than the diameter of the solder ball. A servo motor is also provided on the end face of the connecting part, and the output end of the servo motor is just connected to the end of the transmission shaft.

[0011] Furthermore, a valve is provided at the connection between the interface and the feed pipe.

[0012] Furthermore, a material tray is provided at the center of the top surface of the base, and a plurality of mold bases are arranged on the top surface of the material tray, one of the mold bases is arranged just below the laser.

[0013] Furthermore, a circular mounting groove is provided at the center of the top surface of each mold base, an electromagnetic chuck is embedded in the mounting groove, and a workpiece to be processed is fixed on the surface of the electromagnetic chuck.

[0014] Furthermore, a bearing seat is provided at the connection between the material tray and the base, and a drive motor is provided at the center of the bearing seat. The bottom surface of the drive motor is fixedly connected to the top surface of the base, and the output end of the drive motor is fixedly connected to the center of the bottom surface of the material tray.

[0015] Compared with the prior art, the technical solution of this application has the following beneficial technical effects: BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 Schematic diagram of the structure of the base in this embodiment;

[0017] Figure 2 for Figure 1 Enlarged view of point A in the middle;

[0018] Figure 3 Schematic diagram of the internal structure of the laser in this embodiment;

[0019] Figure 4 Schematic diagram of the structure of the driving motor in this embodiment;

[0020] Among them: 1. Base; 2. Mounting frame; 3. Three-axis moving mechanism; 4. Laser; 41. Connecting part; 42. Interface; 43. Valve; 5. Storage tank; 51. Feed pipe; 6. Feeding assembly; 61. Drive shaft; 62. Spiral blade; 63. Servo motor; 7. Material tray; 71. Bearing seat; 72. Drive motor; 8. Mold base. DETAILED DESCRIPTION

[0021] To facilitate understanding of the present application, the present application will be described more fully below with reference to the accompanying drawings. The accompanying drawings provide embodiments of the present application. However, the present application may be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to make the disclosure of the present application more thorough and comprehensive.

[0022] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application pertains. The terms used herein in the specification of this application are for the purpose of describing specific embodiments only and are not intended to limit this application.

[0023] Combine Figure 1-4 As shown, a laser soldering module includes:

[0024] Base 1, the bottom support of the entire module, is rectangular and fixed to the workbench by bolts;

[0025] The mounting frame 2 is provided on the top surface of the base 1 and extends upward to assist in mounting the welding equipment;

[0026] The three-axis moving mechanism 3 is a three-coordinate moving structure of the x, y, and z axes, which adjusts the soldering position through this spatial movement;

[0027] The laser 4 is mounted on the three-axis moving mechanism 3 and uses laser to heat the solder (tin ball) to make it molten, and then sprays it onto the designated area through high-pressure gas jets.

[0028] The storage tank 5 is arranged above one side of the mounting frame 2 and contains a large number of solder balls for feeding the laser 4;

[0029] The feeding assembly 6 is arranged inside the laser 4 and controls the continuous feeding of the solder balls by rotating, so that the laser 4 can control the feeding quantity to the number of solder balls, making the soldering material more accurate;

[0030] The material tray 7 is arranged on the top surface of the base 1 to cooperate with the laser 4 to perform continuous processing and improve processing efficiency.

[0031] Specifically; in this embodiment, the lower half of the storage tank 5 should be set to a bucket shape, so a large number of solder balls are arranged in sequence along its inclined side walls, and a through hole is also provided at the center of its bottom surface. The size of the through hole is slightly larger than the solder balls (the solder balls mentioned in this embodiment are all about 15 mm in diameter), so the solder balls are arranged vertically inside the through hole.

[0032] A feeding pipe 51 is provided at the bottom of the through hole. The feeding pipe 51 is a silicone hose and is connected to the through hole. The solder balls inside the feeding pipe 51 are arranged inside the feeding pipe 51 along the feeding pipe 51 .

[0033] In addition, a feed port is provided on the side wall of the laser 4, and a rectangular connecting portion 41 is formed by extending outward around the feed port. The interior of the connecting portion 41 is hollow and an interface 42 is provided on the top. The bottom of the feed pipe 51 is connected to the interface 42, and the interface 42 is located in the middle position of the connecting portion 41, so that the solder ball can enter the interior of the connecting portion 41 along the interface 42.

[0034] The feeding assembly 6 includes a transmission shaft 61 arranged inside the connecting portion 41, and one end of the transmission shaft 61 is rotatably connected to the connecting portion 41. A spiral blade 62 is arranged on the surface of the transmission shaft 61, and the end face of the spiral blade 62 should be close to the inner wall of the connecting portion 41. At the same time, the spacing between the spiral blades 62 should be just larger than the diameter of the solder ball. Therefore, during transportation, the solder ball will fall between the spiral blades 62, and thereby be driven by the spiral blades 62 and transported toward the inside of the laser 4 in sequence.

[0035] A servo motor 63 is also fixedly mounted on the end face of the connecting portion 41. The output end of the servo motor 63 should be in transmission connection with the end of the transmission shaft 61. By controlling the rotation speed of the servo motor 63, the feeding amount of the solder balls can be controlled to ensure that each solder ball can be completely melted after entering the interior of the laser 4, thereby avoiding the occurrence of clogging of the nozzle.

[0036] During the actual soldering process, after the laser 4 melts the tin ball, it needs to use high-pressure airflow to squeeze it out so that it can be sprayed on the specified position of the workpiece. Then, considering the actual usage, the airflow may be transported in a certain direction through the feeding channel, which will eventually cause the air pressure used for spraying to leak, affecting the processing effect. Based on this situation, a valve 43 can be set at the interface 42 of the connecting part 41. The valve 43 can adopt a structure that can be remotely controlled, such as a solenoid valve. After a certain amount of material is transported, the valve 43 is closed so that the air pressure will not leak, thereby ensuring the stability of the sprayed tin material.

[0037] A material tray 7 is provided at the center of the top surface of the base 1. Six mold bases 8 are arranged on the top surface of the material tray 7 in a circular array. Each mold base 8 is provided with a mounting groove on the top surface. An electromagnetic suction cup is embedded in the mounting groove, so that the workpiece to be processed placed on the top surface of the mold base 8 can be fixed by electric control.

[0038] A bearing seat 71 is also provided on the bottom surface of the material tray 7. The bearing seat 71 is arranged in a ring shape and its bottom surface is fixedly connected to the top surface of the base 1. A drive motor 72 is provided at the center of the bearing seat 71. The bottom of the drive motor 72 is fixedly connected to the top surface of the base 1. The output end of the drive motor 72 is upward and fixedly connected to the center of the bottom surface of the material tray 7, and relies on driving the material tray 7 to rotate, so that the six mold seats 8 are aligned in sequence to the bottom of the laser 4, thereby completing continuous processing and transportation.

[0039] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the technical solutions of the embodiments of the present invention.

Claims

1. A laser soldering module, characterized in that: The invention comprises a base (1), a mounting frame (2) is vertically arranged on the top surface of the base (1), a three-axis moving mechanism (3) is provided on the mounting frame (2), and a mounting seat is provided on the three-axis moving mechanism (3), a laser (4) is vertically arranged on the mounting seat, a storage tank (5) is also provided on one side of the mounting frame (2), solder balls are placed inside the storage tank (5), a feeding pipe (51) is provided at the bottom of the storage tank (5), the feeding pipe (51) is communicated with the inside of the laser (4), and a feeding assembly (6) is provided at the connection.

2. A laser soldering module according to claim 1, characterized in that: The lower half of the storage tank (5) is configured as an inverted bucket and has a through hole at the center of the top surface, and the delivery pipe (51) is configured as a hose with the top end connected to the through hole, and the solder balls are sequentially arranged inside the hose.

3. A laser soldering module according to claim 2, characterized in that: A feed port is provided on one side of the laser (4), and the feed port extends outwardly and obliquely to form a rectangular connecting portion (41). The top surface of the connecting portion (41) is provided with an interface (42). The bottom end of the feed pipe (51) is connected to the interface (42), and the solder balls are sequentially transported along the hose to the interior of the connecting portion (41).

4. A laser soldering module according to claim 3, characterized in that: The feeding assembly (6) includes a transmission shaft (61) rotatably mounted inside the connecting portion (41), the transmission shaft (61) is provided with spiral blades (62), and the spacing between the spiral blades (62) is greater than the diameter of the solder ball. A servo motor (63) is also provided on the end face of the connecting portion (41), and the output end of the servo motor (63) is connected to the end of the transmission shaft (61) for transmission.

5. The laser soldering module according to claim 3, characterized in that: A valve (43) is also provided at the connection between the interface (42) and the feed pipe (51).

6. The laser soldering module according to claim 1, characterized in that: A material tray (7) is also provided at the center of the top surface of the base (1), and a plurality of mold bases (8) are arranged on the top surface of the material tray (7), one of the mold bases (8) being located directly below the laser (4).

7. The laser soldering module according to claim 6, characterized in that: A circular mounting groove is provided at the center of the top surface of each mold base (8), an electromagnetic chuck is embedded in the mounting groove, and a workpiece to be processed is fixed on the surface of the electromagnetic chuck.

8. The laser soldering module according to claim 7, characterized in that: A bearing seat (71) is further provided at the connection between the material tray (7) and the base (1), and a driving motor (72) is provided at the center of the bearing seat (71), the bottom surface of the driving motor (72) is fixedly connected to the top surface of the base (1), and the output end of the driving motor (72) is fixedly connected to the center of the bottom surface of the material tray (7).

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