Multi-shaft grabbing mechanism of solder paste machine

By designing a multi-axis gripping mechanism for the solder paste machine and utilizing X-axis, Y-axis, and Z-axis sliding mechanisms to achieve automated circulation and storage and retrieval of solder paste cans, the problems of low efficiency and high labor intensity in existing technologies are solved, and the solder paste processing speed and production efficiency are improved.

CN223325612UActive Publication Date: 2025-09-12SHENZHEN TONGTIAN TECH CO LTD
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Patent Information

Application Number
CN202421978047.0
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-08-15
Publication Date
2025-09-12
Estimated Expiration
2034-08-15

AI Technical Summary

Technical Problem

The existing solder paste storage and use process has low efficiency, high labor intensity, and great management risks, which can easily lead to product quality problems.

Method used

A multi-axis gripping mechanism for a solder paste machine is designed, including X-axis, Y-axis, and Z-axis sliding mechanisms. Combined with clamping components, it realizes the automated flow and storage and retrieval of solder paste cans, reducing manual intervention.

Benefits of technology

It improves the circulation efficiency of solder paste cans, shortens the production cycle, is suitable for precision operations in limited spaces, increases processing speed, and reduces manual intervention.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a multi-shaft grabbing mechanism of a solder paste machine. The multi-shaft grabbing mechanism comprises a base, the X-axis sliding mechanism is arranged on the base; the Z-axis sliding mechanism is arranged on the X-axis sliding mechanism in a sliding manner and can slide along the X-axis sliding mechanism; the Y-axis sliding mechanism is arranged on the Z-axis sliding mechanism in a sliding manner and can slide along the Z-axis sliding mechanism; and the clamping component comprises a driving assembly and a clamping assembly which are connected, the driving assembly is arranged on the Y-axis sliding mechanism in a sliding mode and can slide along the Y-axis sliding mechanism, the driving assembly is provided with a rotating shaft, the end of the clamping assembly is provided with a clamping cavity used for clamping the solder paste tank, and the driving assembly is used for driving the clamping assembly to rotate around the rotating shaft. According to the solder paste tank circulation system, through the combined action of the X-axis sliding mechanism, the Y-axis sliding mechanism and the Z-axis sliding mechanism, the solder paste tank can be driven to circulate through the clamping component, circulation, storage and taking of the solder paste tank in the system are facilitated, and the circulation efficiency of the solder paste tank is improved.
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Description

Technical Field

[0001] The utility model relates to a multi-axis grabbing mechanism for a solder paste machine. Background Art

[0002] Surface mount technology (SMT) is currently the most commonly used process in the electronics packaging industry. The solder paste used in this process requires refrigeration during storage and must be warmed before use. The typical storage temperature for solder paste is around 5°C. Before use, it must be removed from the refrigerator and allowed to warm to room temperature for 3-4 hours. Before use, the solder paste must be stirred in a solder paste mixer to evenly mix the tin powder and flux before being sent to the production line.

[0003] The current way the industry stores solder paste is to use civilian cold storage cabinets for storage, manually record the time and quantity of materials in and out, which has low efficiency in loading and unloading materials, high labor intensity, and the risk of omissions and incorrect retrieval, resulting in product quality problems. Utility Model Content

[0004] The main purpose of the utility model is to provide a multi-axis gripping mechanism for a solder paste machine, aiming to solve the above technical problems.

[0005] To achieve the above objectives, the present invention proposes a multi-axis gripping mechanism for a solder paste machine, comprising:

[0006] base;

[0007] An X-axis sliding mechanism is provided on the base;

[0008] A Z-axis sliding mechanism, slidably disposed on the X-axis sliding mechanism and capable of sliding along the X-axis sliding mechanism;

[0009] A Y-axis sliding mechanism, slidably disposed on the Z-axis sliding mechanism and capable of sliding along the Z-axis sliding mechanism;

[0010] The clamping component includes a connected drive component and a clamping component, the drive component is slidably arranged on the Y-axis sliding mechanism and can slide along the Y-axis sliding mechanism, the drive component has a rotating shaft, and the end of the clamping component has a clamping cavity for clamping the solder paste can, and the drive component is used to drive the clamping component to rotate around the rotating shaft.

[0011] In one embodiment, the X-axis sliding mechanism includes an X-axis slide rail provided on the base, an X-axis slider slidably provided on the X-axis slide rail, and an X-axis driver connected to the X-axis slider, and the Z-axis sliding mechanism is provided on the X-axis slider.

[0012] In one embodiment, the Z-axis sliding mechanism includes a Z-axis column, a Z-axis slide rail arranged on the Z-axis column, a Z-axis slider slidably arranged on the Z-axis slide rail, and a Z-axis driver connected to the Z-axis slider, the column is arranged on the X-axis slider, and the Y-axis sliding mechanism is arranged on the Z-axis slider.

[0013] In one embodiment, the Y-axis sliding mechanism includes a Y-axis slide rail provided on the Z-axis slider, a Y-axis slider slidably provided on the Y-axis slide rail, and a Y-axis driver connected to the Y-axis slider, and the clamping component is provided on the Y-axis slider.

[0014] In one embodiment, the driving assembly includes a mounting plate, a rotary driver provided on the mounting plate, and a telescopic unit, the two ends of the telescopic unit being connected to the rotary driver and the clamping assembly respectively, and the rotary driver and the telescopic unit being connected to drive the clamping claw to rotate.

[0015] In one embodiment, the rotary drive has a rotating shaft, the rotary drive is connected to the rotating shaft, and the telescopic unit is rotationally connected to the rotating shaft.

[0016] In one embodiment, the telescopic unit includes a fixed plate and a sliding plate, the fixed plate is connected to the rotating shaft, the fixed plate has a track, and the sliding plate is slidably mounted on the track.

[0017] In one embodiment, the telescopic unit further includes a fixing bracket, which is disposed on the sliding plate and connected to the clamping assembly.

[0018] In one embodiment, the clamping assembly has two clamping arms, and a clamping cavity for clamping the solder paste can is defined between the two clamping arms. The two clamping arms can move toward or away from each other to expand or shrink the clamping cavity.

[0019] In the technical solution of the present invention, the multi-axis gripping mechanism of the solder paste machine includes:

[0020] base;

[0021] An X-axis sliding mechanism is provided on the base;

[0022] A Z-axis sliding mechanism, slidably disposed on the X-axis sliding mechanism and capable of sliding along the X-axis sliding mechanism;

[0023] A Y-axis sliding mechanism, slidably disposed on the Z-axis sliding mechanism and capable of sliding along the Z-axis sliding mechanism;

[0024] The clamping component includes a connected drive component and a clamping component, the drive component is slidably arranged on the Y-axis sliding mechanism and can slide along the Y-axis sliding mechanism, the drive component has a rotating shaft, and the end of the clamping component has a clamping cavity for clamping the solder paste can, and the drive component is used to drive the clamping component to rotate around the rotating shaft.

[0025] Therefore, in this technical solution, through the joint action of the X-axis sliding mechanism, the Y-axis sliding mechanism, and the Z-axis sliding mechanism, the solder paste can can be driven to circulate through the clamping components, which facilitates the circulation and storage and retrieval of the solder paste can within the system and improves the circulation efficiency of the solder paste can. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0027] Figure 1 This is a structural diagram of a multi-axis gripping mechanism of a solder paste machine according to an embodiment of the present invention;

[0028] Figure 2 This is a structural diagram of the X-axis sliding mechanism of an embodiment of the present utility model;

[0029] Figure 3 This is a schematic structural diagram of the Z-axis sliding mechanism of an embodiment of the present utility model;

[0030] Figure 4 This is a schematic structural diagram of the Y-axis sliding mechanism of an embodiment of the present utility model;

[0031] Figure 5 This is a schematic structural diagram of the clamping component of an embodiment of the present utility model.

[0032] Explanation of the accompanying drawings: 10. Base; 20. X-axis sliding mechanism; 21. X-axis slide rail; 22. X-axis slider; 30. Z-axis sliding mechanism; 31. Z-axis column; 32. Z-axis slide rail; 33. Z-axis slider; 34. Z-axis driver; 40. Y-axis sliding mechanism; 41. Y-axis slide rail; 42. Y-axis slider; 43. Y-axis driver; 50. Clamping component; 51. Drive assembly; 511. Mounting plate; 512. Rotary drive; 513. Telescopic unit; 5131. Fixed plate; 5132. Sliding plate; 5133. Fixed bracket; 52. Clamping assembly; 521. Clamping arm; 53. Clamping cavity; 60. Solder paste can.

[0033] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0034] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0035] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative position relationship, movement status, etc. between the various components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0036] In addition, the terms "first," "second," and so on, used in this utility model are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, features specified as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of this utility model, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.

[0037] Moreover, the technical solutions between the various embodiments of the present invention may be combined with each other, but this must be based on the fact that ordinary technicians in this field can implement them. When the combination of technical solutions is mutually contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0038] The utility model provides a multi-axis grabbing mechanism for a solder paste machine.

[0039] like Figure 1 As shown, the multi-axis gripping mechanism of the solder paste machine provided by the embodiment of the present invention includes:

[0040] base;

[0041] An X-axis sliding mechanism is provided on the base;

[0042] A Z-axis sliding mechanism, slidably disposed on the X-axis sliding mechanism and capable of sliding along the X-axis sliding mechanism;

[0043] A Y-axis sliding mechanism, slidably disposed on the Z-axis sliding mechanism and capable of sliding along the Z-axis sliding mechanism;

[0044] The clamping component includes a connected drive component and a clamping component, the drive component is slidably arranged on the Y-axis sliding mechanism and can slide along the Y-axis sliding mechanism, the drive component has a rotating shaft, and the end of the clamping component has a clamping cavity for clamping the solder paste can, and the drive component is used to drive the clamping component to rotate around the rotating shaft.

[0045] In this embodiment, through the joint action of the X-axis sliding mechanism, the Y-axis sliding mechanism, and the Z-axis sliding mechanism, the solder paste can can be driven to circulate through the clamping components, which facilitates the circulation and storage and retrieval of the solder paste can within the system and improves the circulation efficiency of the solder paste can. Therefore, complex picking, placing, and handling actions can be flexibly completed in three-dimensional space, which is particularly suitable for precision operations in limited spaces. Through automated handling, manual intervention is reduced, the solder paste processing speed is significantly improved, and the production cycle is shortened.

[0046] Please refer to Figure 2-4 The X-axis sliding mechanism includes an X-axis slide rail provided on the base, an X-axis slider slidably provided on the X-axis slide rail, and an X-axis driver connected to the X-axis slider. The Z-axis sliding mechanism is provided on the X-axis slider. The Z-axis sliding mechanism includes a Z-axis column, a Z-axis slide rail provided on the Z-axis column, a Z-axis slider slidably provided on the Z-axis slide rail, and a Z-axis driver connected to the Z-axis slider. The column is provided on the X-axis slider, and the Y-axis sliding mechanism is provided on the Z-axis slider. The Y-axis sliding mechanism includes a Y-axis slide rail provided on the Z-axis slider, a Y-axis slider slidably provided on the Y-axis slide rail, and a Y-axis driver connected to the Y-axis slider. The clamping component is provided on the Y-axis slider.

[0047] That is, in this application, the X-axis sliding mechanism, the Y-axis sliding mechanism, and the Z-axis sliding mechanism can work independently, thereby moving the clamping part in multiple directions. This application uses a high-performance servo drive system, and each axis is equipped with a high-precision absolute encoder to ensure that every movement of the robot arm can be accurately synchronized and positioned, even complex path planning can be easily completed.

[0048] Please refer to Figure 5 The drive assembly includes a mounting plate, a rotary actuator mounted on the mounting plate, and a telescopic unit. The telescopic unit is connected at both ends to the rotary actuator and the clamping assembly, respectively. The rotary actuator and the telescopic unit are connected to drive the clamping claw to rotate. The rotary actuator has a rotating shaft, which is connected to the rotary actuator and the telescopic unit is rotatably connected to the rotating shaft. In this embodiment, the operation of the rotary actuator drives the telescopic unit to rotate about the rotating shaft, thereby driving the clamping assembly at the other end of the telescopic unit to rotate.

[0049] Specifically, the telescopic unit includes a fixed plate and a sliding plate, wherein the fixed plate is connected to the rotating shaft and has a track on which the sliding plate is slidably mounted. The telescopic unit also includes a fixed bracket, which is disposed on the sliding plate and connected to the clamping assembly. In this embodiment, the telescopic unit also includes a driver, which is connected to the sliding plate so that the sliding plate can slide on the fixed plate.

[0050] In the above embodiment, the clamping assembly includes two clamping arms, with a clamping cavity for clamping the solder paste can defined between the two clamping arms. The two clamping arms can move toward or away from each other to expand or contract the clamping cavity. In this embodiment, the two clamping arms can also be connected by a driver, with the driver controlling the distance between the two clamping arms (i.e., the size of the clamping cavity) to clamp or release the solder paste can.

[0051] It can be understood that in this application, each driver can be regulated by a control system to achieve automatic control. This control system belongs to the existing technology and this application will not describe it in detail. The control system in the existing technology can be directly used.

[0052] The above description is only a preferred embodiment of the present invention and does not limit the patent scope of the present invention. All equivalent structural transformations made based on the contents of the present invention specification and drawings, or direct / indirect application in other related technical fields, are included in the patent protection scope of the present invention.

Claims

1. A multi-axis gripping mechanism for a solder paste machine, characterized in that: The multi-axis grasping mechanism of the solder paste machine includes: base; An X-axis sliding mechanism is provided on the base; A Z-axis sliding mechanism, slidably disposed on the X-axis sliding mechanism and capable of sliding along the X-axis sliding mechanism; A Y-axis sliding mechanism, slidably disposed on the Z-axis sliding mechanism and capable of sliding along the Z-axis sliding mechanism; The clamping component includes a connected drive component and a clamping component, the drive component is slidably arranged on the Y-axis sliding mechanism and can slide along the Y-axis sliding mechanism, the drive component has a rotating shaft, and the end of the clamping component has a clamping cavity for clamping the solder paste can, and the drive component is used to drive the clamping component to rotate around the rotating shaft.

2. The multi-axis gripping mechanism of the solder paste machine according to claim 1, characterized in that: The X-axis sliding mechanism includes an X-axis slide rail provided on the base, an X-axis slider slidably provided on the X-axis slide rail, and an X-axis driver connected to the X-axis slider. The Z-axis sliding mechanism is provided on the X-axis slider.

3. The multi-axis gripping mechanism of the solder paste machine according to claim 2, characterized in that: The Z-axis sliding mechanism includes a Z-axis column, a Z-axis slide rail arranged on the Z-axis column, a Z-axis slider slidably arranged on the Z-axis slide rail, and a Z-axis driver connected to the Z-axis slider. The column is arranged on the X-axis slider, and the Y-axis sliding mechanism is arranged on the Z-axis slider.

4. The multi-axis gripping mechanism for solder paste machine according to claim 3, characterized in that: The Y-axis sliding mechanism includes a Y-axis slide rail provided on the Z-axis slider, a Y-axis slider slidably provided on the Y-axis slide rail, and a Y-axis driver connected to the Y-axis slider, and the clamping component is provided on the Y-axis slider.

5. The multi-axis gripping mechanism for solder paste machine according to claim 4, characterized in that: The driving assembly includes a mounting plate, a rotary driver and a telescopic unit arranged on the mounting plate. Both ends of the telescopic unit are respectively connected to the rotary driver and the clamping assembly. The rotary driver and the telescopic unit are connected to drive the clamping assembly to rotate.

6. The multi-axis gripping mechanism for solder paste machine according to claim 5, characterized in that: The rotary drive has a rotary shaft, the rotary drive is connected to the rotary shaft, and the telescopic unit is rotationally connected to the rotary shaft.

7. The multi-axis gripping mechanism for solder paste machine according to claim 6, characterized in that: The telescopic unit includes a fixed plate and a sliding plate, wherein the fixed plate is connected to the rotating shaft, the fixed plate has a track, and the sliding plate is slidably mounted on the track.

8. The multi-axis gripping mechanism for solder paste machine according to claim 7, characterized in that: The telescopic unit further includes a fixing bracket, which is disposed on the sliding plate and connected to the clamping assembly.

9. The multi-axis gripping mechanism for solder paste machine according to claim 8, characterized in that: The clamping assembly has two clamping arms, and a clamping cavity for clamping the solder paste can is defined between the two clamping arms. The two clamping arms can move toward or away from each other to expand or shrink the clamping cavity.