Tooth pushing device for assembling and disassembling solar silicon wafer

Abstract

The utility model relates to the technical field of top tooth devices, in particular to a top tooth device for assembling and disassembling a solar silicon wafer, which comprises a top tooth main body, a groove for clamping the silicon wafer is arranged in the top tooth main body, and a cushion block for positioning the silicon wafer is arranged in the groove; a V-shaped groove is formed in the cushion block, and the length of the cushion block is larger than that of the groove; an arc-shaped chamfer is arranged on the side surface of the top tooth main body; the beneficial effects of the utility model are that in actual use, when a silicon wafer is clamped into the groove inside the top tooth main body, the silicon wafer is clamped on the cushion block, the silicon wafer is positioned through the V-shaped groove on the cushion block, and the length of the cushion block is greater than that of the groove, so that the contact area with the silicon wafer is increased, the positioning effect of the silicon wafer is improved, and the service life of the silicon wafer is prolonged. The silicon wafers are prevented from being inclined or disordered, so that unnecessary scraping between the silicon wafers and the top tooth main body and between the silicon wafers is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of a top tooth device, in particular to a top tooth device for loading and unloading solar wafers. Background Art

[0002] In the solar photovoltaic industry, as the core material of solar panels, every link in the processing, transportation and installation of solar wafers is crucial. Especially during the loading and unloading of wafers, how to ensure the safety, accuracy and efficiency of wafers has always been the focus of the industry. Traditional solar wafer loading and unloading methods often have devices, and these methods have exposed many deficiencies in practical applications, especially in the positioning and fixing of wafers.

[0003] A common solar wafer loading and unloading device adopts a top tooth groove design, aiming to achieve the positioning and fixing of wafers through the contact between the top teeth and the wafers. However, this design has exposed the defect of poor positioning effect in the actual use process. Due to the limited contact area between the top tooth groove and the wafer, and the bottom of the top tooth groove is usually U-shaped, the positioning effect of the top tooth groove on the wafer is poor during the loading and unloading process, and the wafer is prone to side tilt or disorder, which in turn causes unnecessary scratching between the top teeth and the wafer, damaging the surface of the wafer. In addition, when the wafer is side tilted or disordered, its stability during the moving process will also be greatly reduced. During transportation or handling, the side-tilted wafers are prone to collide or scratch with other wafers, further increasing the risk of wafer damage.

[0004] Therefore, a top tooth device for loading and unloading solar wafers is needed to overcome the occurrence of the above problems. Content of the Utility Model

[0005] In order to solve the above problems, the embodiment of the utility model provides a top tooth device for loading and unloading solar wafers, achieving the purpose of solving the problems proposed in the background art.

[0006] The embodiment of the utility model specifically adopts the following technical solutions to achieve the above purpose: A top tooth device for loading and unloading solar wafers, including a top tooth main body, a groove for clamping a wafer is opened inside the top tooth main body, and a cushion block for positioning the wafer is arranged inside the groove; a V-shaped groove is opened inside the cushion block, and the length of the cushion block is greater than the length of the groove; an arc chamfer is arranged on the side of the top tooth main body.

[0007] As a further improvement of the above technical solution:

[0008] A "匚"-shaped card slot adapted to the shape and size of the bottom of the groove of the top tooth main body is opened in the middle of the cushion block, so that the horizontal height of the bottom of the cushion block is lower than the horizontal height of the bottom of the groove, and the thickness of the cushion block is greater than the width of the groove.

[0009] The top of the top tooth body is provided with an oblique groove which is connected with the groove.

[0010] The opening width of the V-shaped groove is greater than the width of the groove.

[0011] The beneficial effects of the embodiments of the present utility model are:

[0012] In actual use, when the silicon wafer is inserted into the groove inside the top tooth body, the silicon wafer is clamped on the pad and positioned by the V-shaped groove on the pad. At the same time, the length of the pad is greater than the length of the groove, which increases the contact area with the silicon wafer, improves the positioning effect of the silicon wafer, and prevents the silicon wafer from tilting or being misaligned. At the same time, the top tooth body is chamfered in an arc shape, and the side of the top tooth body is coated with Al2O3 film, so as to avoid unnecessary scratches between the silicon wafer and the top tooth body, and between the silicon wafers, thereby minimizing damage to the silicon wafer surface. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a structural diagram of the utility model;

[0014] Figure 2 This is a structural diagram of the main body of the top gear of the utility model;

[0015] Figure 3 This is a structural diagram of the pad of the utility model;

[0016] Figure 4 It is a structural schematic diagram of the arc chamfer of the utility model.

[0017] In the figure: 1. Top tooth body; 2. Groove; 3. Pad; 4. V-shaped groove; 5. Arc chamfer; 6. Clamping groove; 7. Bevel groove. DETAILED DESCRIPTION

[0018] The preferred embodiments of the present invention are described below with reference to the accompanying drawings. Those skilled in the art should understand that these embodiments are only used to explain the technical principles of the present invention and are not intended to limit the scope of protection of the present invention.

[0019] See also Figures 1 to 4 The embodiment of the utility model discloses a top gear device for loading and unloading solar silicon wafers, comprising a top gear body 1, a groove 2 for clamping the silicon wafer is provided inside the top gear body 1, and a pad 3 for positioning the silicon wafer is provided inside the groove 2;

[0020] A V-shaped groove 4 is provided inside the pad 3, and the length of the pad 3 is greater than the length of the groove 2;

[0021] The side surface of the top tooth body 1 is provided with an arc chamfer 5;

[0022] In actual use, when the silicon wafer is clamped into the groove 2 inside the top tooth body 1, the silicon wafer is clamped on the spacer block 3, and the silicon wafer is positioned through the V-shaped groove 4 on the spacer block 3. At the same time, the length of the spacer block 3 is greater than the length of the groove 2, increasing the contact area with the silicon wafer, improving the positioning effect on the silicon wafer, preventing the silicon wafer from tilting or being misplaced, and thus avoiding unnecessary scratches between the silicon wafer and the top tooth body 1 and between the silicon wafers.

[0023] When the top tooth body 1 jacks up part of the silicon wafers for movement, contact occurs between the top tooth body 1 and the remaining silicon wafers. The side surface of the traditional top tooth body 1 is a plane, with a large contact area with the silicon wafer, and the corners are right angles, which are likely to scratch the silicon wafer during contact. In this application, the side surface of the top tooth body 1 is subjected to an arc chamfer 5 treatment, so that the contact surface between the top tooth body 1 and the remaining silicon wafers is an arc surface, reducing the contact area by more than 50%. At the same time, the corners are arc angles, reducing the possibility of scratching the silicon wafer during contact, and increasing the overall yield by about 0.05%.

[0024] At the same time, an Al2O3 film is plated on the side surface of the top tooth body 1 to minimize damage to the surface of the silicon wafer.

[0025] As a further explanation of this application:

[0026] A "C"-shaped card slot 6 adapted to the shape and size of the bottom of the groove 2 of the top tooth body 1 is provided in the middle of the spacer block 3, so that the bottom horizontal height of the spacer block 3 is lower than the bottom horizontal height of the groove 2, and the thickness of the spacer block 3 is greater than the width of the groove 2.

[0027] In actual use, the spacer block 3 is clamped to the bottom of the groove 2 through the card slot 6, that is, the spacer block 3 and the top tooth body 1 are fixed by a clamping method, which is convenient for quick disassembly and is convenient for replacing the worn spacer block 3.

[0028] The bottom horizontal height of the spacer block 3 is lower than the bottom horizontal height of the groove 2, and the thickness of the spacer block 3 is greater than the width of the groove 2, so that the bottom and both sides of the spacer block 3 protrude from the groove 2, avoiding the spacer block 3 from shaking inside the groove 2 and improving the stability of the spacer block 3 after being installed inside the groove 2.

[0029] As a further explanation of this application:

[0030] An inclined groove 7 communicating with the groove 2 is provided at the top of the top tooth body 1, and the inclined groove 7 is provided to facilitate the top tooth body 1 to enter the groove 2.

[0031] As a further explanation of this application:

[0032] The opening width of the V-shaped groove 4 is greater than the width of the groove 2, facilitating the silicon wafer to enter the V-shaped groove 4.

[0033] It should be noted that in the description of this utility model, terms such as "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer" indicating directions or positional relationships are based on the directions or positional relationships shown in the accompanying drawings. This is merely for ease of description and does not indicate or imply that the device or element described must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0034] Furthermore, it should be noted that, in the description of this utility model, unless otherwise expressly specified or limited, the terms "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections, electrical connections; direct connections, indirect connections through an intermediate medium, and internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on specific circumstances.

[0035] The term "comprise" or any other similar term is intended to cover non-exclusive inclusion, such that a process, article, or apparatus / device that comprises a list of elements includes not only those elements but also other elements not expressly listed or inherent to such process, article, or apparatus / device.

[0036] Thus far, the technical solutions of the present invention have been described in conjunction with the preferred embodiments shown in the accompanying drawings. However, it is readily understood by those skilled in the art that the scope of protection of the present invention is obviously not limited to these specific embodiments. Without departing from the principles of the present invention, those skilled in the art may make equivalent changes or substitutions to the relevant technical features, and the technical solutions after such changes or substitutions will fall within the scope of protection of the present invention.

Claims

1. A top gear device for loading and unloading solar silicon wafers, characterized in that: It includes a top tooth body (1), and a groove (2) for clamping a silicon wafer is provided inside the top tooth body (1), and a cushion block (3) for positioning the silicon wafer is arranged inside the groove (2); A V-shaped groove (4) is provided inside the cushion block (3), and the length of the cushion block (3) is greater than the length of the groove (2); An arc chamfer (5) is provided on the side surface of the top tooth body (1).

2. The top gear device for loading and unloading solar silicon wafers according to claim 1, characterized in that: A "匚”-shaped clamping groove (6) that is adapted to the shape and size of the bottom of the groove (2) of the top tooth body (1) is provided in the middle of the cushion block (3), so that the bottom horizontal height of the cushion block (3) is lower than the bottom horizontal height of the groove (2), and the thickness of the cushion block (3) is greater than the width of the groove (2).

3. The top gear device for loading and unloading solar silicon wafers according to claim 1, characterized in that: An inclined groove (7) communicating with the groove (2) is provided at the top of the top tooth body (1).

4. The top gear device for loading and unloading solar silicon wafers according to claim 1, characterized in that: The opening width of the V-shaped groove (4) is greater than the width of the groove (2).

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