MINI-LED integrated backlight module

Abstract

The utility model discloses a MINI-LED integrated backlight module, which comprises a back plate, a circuit unit and an LED unit, the surface of the back plate is coated with an insulation isolation layer, the circuit unit is arranged on the surface of the insulation isolation layer, the LED unit is arranged on the circuit unit and is conducted with the circuit unit, and the LED unit is arranged on the surface of the insulation isolation layer. The circuit unit comprises a white ink layer and a copper circuit, the white ink layer is formed by coating white ink on the surface of the insulating isolation layer, and the copper circuit is arranged in the white ink layer. According to the utility model, a Mini-LED scheme with an integrated back plate is adopted, the back plate is directly coated with the insulating isolation layer, and the circuit, the LED and other components are sequentially mounted on the insulating isolation layer, so that a backlight semi-finished product is formed, a lamp panel base material is omitted, the thickness of the whole product can be reduced, a lighter and thinner backlight product can be realized, and the production cost is reduced. And meanwhile, the process of mounting the base material is reduced, and the overall assembly time and cost can be shortened.

Description

Technical Field

[0001] The utility model belongs to the technical field of MINI-LED display, in particular to a MINI-LED integrated backlight module. Background Art

[0002] At present, with the pursuit of high color gamut, high contrast and ultra-thin appearance, MINI-LED panel technology has become a focus of attention in the display field due to its light and thin characteristics.

[0003] Currently, the common architecture of traditional Mini-LED backlight products is a backplane + tape + Mini-LED light board. The light board's structure, from bottom to top, consists of: light board substrate, insulation isolation layer, LED components, reflector, and supporter. The light board is attached to the backplane with tape. The light board substrate is generally made of aluminum, PCB, or glass. It is prone to cracking and deformation during environmental testing such as mechanical shock, high temperature, and high humidity, resulting in damage to the light board. Furthermore, due to the influence of the substrate, traditional MimiLED light boards have difficulty achieving ultra-thinness and easy assembly, resulting in an increase in the overall module thickness. Furthermore, assembly requires high precision and is time-consuming.

[0004] In view of this, a MINI-LED integrated backlight module is proposed. Utility Model Content

[0005] The purpose of the present invention is to provide a MINI-LED integrated backlight module in order to solve the above-mentioned problems.

[0006] The technical solution adopted by the present invention is as follows: a MINI-LED integrated backlight module, including a backplane, a circuit unit and an LED unit, the surface of the backplane is coated with an insulating isolation layer, the circuit unit is arranged on the surface of the insulating isolation layer, and the LED unit is arranged on the circuit unit and is conductively connected to the circuit unit.

[0007] In a preferred embodiment, the circuit unit includes a white ink layer and a copper circuit. The white ink layer is formed by coating white ink on the surface of the insulating isolation layer, and is disposed on the insulating isolation layer and within the white ink layer.

[0008] In a preferred embodiment, the LED unit includes a plurality of LEDs, an IC, and a resistor, and the circuit unit is provided with a corresponding die-bonding window for mounting the plurality of LEDs, the IC, and the resistor.

[0009] In a preferred embodiment, the insulating isolation layer is made of insulating material.

[0010] In a preferred embodiment, it further includes a support column, which is fixed to the surface of the back plate.

[0011] In a preferred embodiment, a reflective sheet is further included, and the reflective sheet is covered on the LED unit.

[0012] In a preferred embodiment, the back plate is made of SECC or SGCC material.

[0013] In summary, due to the adoption of the above technical solution, the beneficial effects of the present invention are:

[0014] 1. This utility model adopts a Mini-LED solution with an integrated backplane. An insulating layer is directly applied to the backplane, and circuits, LEDs and other components are sequentially installed on the insulating layer to form a semi-finished backlight product. This eliminates the assembly of light panels and light strips, saving manpower and time.

[0015] 2. In this utility model, the LED part is directly integrated into the back panel, and the design eliminates the light board substrate, which can reduce the thickness of the overall product, achieve a lighter and thinner backlight product, and also reduce the overall manufacturing cost;

[0016] 3. In the present invention, the back plate is used as the substrate of the LED. Since the back plate material is relatively stable, substrate defects such as deformation and cracking are avoided. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the overall layered structure of the utility model.

[0018] Markings in the figure: 1-back plate, 2-LED unit, 3-support column, 4-line unit, 5-reflector, 6-insulation isolation layer. DETAILED DESCRIPTION

[0019] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0020] Reference Figure 1A MINI-LED integrated backlight module includes a backplane 1, a circuit unit 4 and an LED unit 2. The surface of the backplane 1 is coated with an insulating isolation layer 6, which is made of insulating material. The circuit unit 4 is arranged on the surface of the insulating isolation layer 6, and the LED unit 2 is arranged on the circuit unit 4 and is conductive with the circuit unit 4. A Mini-LED solution with an integrated backplane is adopted. The insulating isolation layer 6 is directly coated on the backplane 1, and the circuit unit 4, LED and other components are installed in sequence on the insulating isolation layer 6 to form a backlight semi-finished product. The above design eliminates the light board substrate, can reduce the thickness of the overall product, can achieve a lighter and thinner backlight product, and at the same time reduces the process of installing the substrate, which can shorten the overall assembly time and cost.

[0021] Furthermore, the circuit unit 4 includes a white ink layer and a copper circuit. The white ink layer is white ink coated on the surface of the insulating isolation layer 6. The copper circuit is arranged on the insulating isolation layer 6 and located in the white ink layer. The copper circuit is also provided with a solder pad corresponding to the LED unit 2. The white ink layer is preferably made of solder-resistant white oil, and other insulating ink materials can also be used, which is not limited here.

[0022] Furthermore, the LED unit 2 includes a plurality of LEDs, ICs and resistors, and the circuit unit 4 is provided with a corresponding die-bonding window that can accommodate the plurality of LEDs, ICs and resistors.

[0023] Furthermore, it also includes a support column 3, which is fixed on the surface of the backboard 1. The support column 3 is fixed on the backboard 1 by pasting or locking, but this is not limited here.

[0024] Furthermore, a reflective sheet 5 is included, which is covered on the LED unit 2. The designed reflective sheet 5 can increase the reflectivity of the backlight module light, thereby improving the light energy utilization efficiency of the backlight module.

[0025] Furthermore, the back plate 1 is made of SECC or SGCC material, and is used as the substrate part of the LED. Since the material of the back plate 1 is relatively stable, substrate defects such as deformation and cracking are avoided.

[0026] To summarize, the overall Mini-LED solution adopts an integrated backplane, directly coating the insulating isolation layer 6 on the backplane 1, and installing circuits, LEDs and other components in sequence on the insulating isolation layer 6 to form a backlight semi-finished product. The above design eliminates the light board substrate, which can reduce the thickness of the overall product and achieve a lighter and thinner backlight product. At the same time, it reduces the process of installing the substrate, which can shorten the overall assembly time and cost. In addition, the backplane 1 is used as the substrate part of the LED. Since the backplane material is relatively stable, substrate defects such as deformation and cracking are avoided.

[0027] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A MINI-LED integrated backlight module, characterized in that , including a backboard, a circuit unit and an LED unit. The surface of the backboard is coated with an insulating isolation layer, the circuit unit is arranged on the surface of the insulating isolation layer, and the LED unit is arranged on the circuit unit and is conductive with the circuit unit.

2. The MINI-LED integrated backlight module according to claim 1, wherein: The circuit unit includes a white ink layer and a copper circuit. The white ink layer is white ink coated on the surface of the insulating isolation layer. The copper circuit is arranged on the insulating isolation layer and located in the white ink layer.

3. The MINI-LED integrated backlight module according to claim 1, wherein: The LED unit includes a plurality of LEDs, ICs and resistors, and the circuit unit is provided with a corresponding die-bonding window that meets the requirements of installing the plurality of LEDs, ICs and resistors.

4. The MINI-LED integrated backlight module according to claim 1, wherein: The insulating isolation layer is made of insulating material.

5. The MINI-LED integrated backlight module according to claim 1, wherein: It also includes a support column, which is fixed on the surface of the back plate.

6. The MINI-LED integrated backlight module according to claim 1, wherein: The invention also includes a reflective sheet, wherein the reflective sheet is covered on the LED unit.

7. The MINI-LED integrated backlight module according to claim 1, wherein: The back plate is made of SECC or SGCC material.

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