Routing structure of IC (integrated circuit) with primary side and secondary side sealed, electronic equipment and electric appliance system

Abstract

The utility model discloses a routing structure of primary and secondary edge sealed ICs, an electronic device and an electrical system. The structure comprises a basic PCB, a planar transformer, a sealed IC and an additional PCB layer. The basic PCB comprises a primary side element area, a transformer wiring area and a secondary side element area; the planar transformer is assembled on the basic PCB, the planar transformer comprises a transformer magnetic core and a transformer coil, and the transformer coil is integrated in a transformer wiring area; the sealed IC is electrically connected with elements in the primary side element area and the secondary side element area; the additional PCB layer is arranged above and / or below the basic PCB, and the signal line of the sealed IC is arranged on the additional PCB layer. The additional PCB layer is additionally arranged above and / or below the basic PCB, and the signal line of the sealed IC is arranged by using the additional PCB layer, so that the sealed IC can receive the signals of the primary side element area and the secondary side element area and send the signals while the width of the basic PCB is not increased.

Description

Technical Field

[0001] The utility model relates to the technical field of switching power supplies, in particular to a wiring structure of a primary-secondary-side sealed IC, an electronic device and an electrical system. Background Art

[0002] With the development of science and technology, the power density requirements of switching power supplies are getting higher and higher, resulting in a gradual increase in ultra-thin chargers in recent years. However, due to the use of many special-specification components, there is no cost advantage. With the emergence of integrated circuit chips (ICs) with integrated circuits (ICs), the number of components on the primary and secondary sides has been reduced, the circuits have been simplified, and the application prospects are relatively optimistic. However, the length and width of such ICs are relatively large, and they have control signals for both the primary and secondary sides. They need to sample the voltage and current signals of the primary and secondary sides and output the drive of the primary and secondary sides. Since the width of the PCB (Printed Circuit Board) of the ultra-thin charger is relatively limited, sometimes the coil and core of the planar transformer occupy the entire PCB board in the width direction, such as Figure 1 As shown in the figure, the solid line part is the outline of the PCB board, the dotted line part is the outline of the transformer core, and the solid line part surrounded by the dotted line is the coil of the planar transformer. It can be seen that the width of the core and coil of the planar transformer is almost the same as the width of the entire PCB. The existing solutions are as follows Figure 2 As shown in the figure, if the packaged IC is placed on the primary or secondary side, the control signals and drive lines on the other side can only be increased by increasing the width of the PCB board in the planar transformer area. However, this method increases the volume of the PCB board and does not meet the high power density requirements of ultra-thin chargers. Utility Model Content

[0003] The utility model provides a wiring structure for a primary-secondary-side sealed IC, which aims to solve the problem in the prior art of needing to increase the width of a PCB in a planar transformer area.

[0004] In a first aspect, the present invention discloses a wiring structure for a primary-secondary-side sealed IC. The wiring structure for the primary-secondary-side sealed IC includes:

[0005] A basic PCB board includes a primary component area, a transformer routing area, and a secondary component area, wherein the transformer routing area is arranged between the primary component area and the secondary component area;

[0006] A planar transformer is mounted on the basic PCB board, the planar transformer includes a transformer core and a transformer coil, the transformer coil is integrated in the transformer routing area, and the transformer core and the transformer coil are correspondingly arranged;

[0007] A packaged IC electrically connected to the components of the primary component area and the secondary component area; and

[0008] The additional PCB layer is arranged above and / or below the basic PCB board, and the signal lines of the packaged IC are arranged on the additional PCB layer.

[0009] In some embodiments, the packaged IC is mounted in the primary component area.

[0010] In some embodiments, the packaged IC is mounted in the secondary device region.

[0011] In some embodiments, the basic PCB board includes a multi-layer PCB board, and the planar size of the additional PCB layer is the same as the planar size of the basic PCB board.

[0012] In some embodiments, the secondary coil of the transformer coil is arranged on the top and bottom PCB boards, and the primary coil of the transformer coil is arranged on the middle PCB board.

[0013] In some embodiments, the primary coil of the transformer coil is electrically connected to the components of the primary component area, and the secondary coil of the transformer coil is electrically connected to the components of the secondary component area.

[0014] In some embodiments, the width of the transformer core is equal to the width of the basic PCB board, and the transformer coil is arranged inside the transformer core.

[0015] In some embodiments, the transformer core has a shape of a planar E-type, an EQ-type, or an ER-type.

[0016] In a second aspect, the present invention further discloses an electronic device, comprising the wiring structure of the primary and secondary edge-sealed IC described in the first aspect.

[0017] In a third aspect, the present invention further discloses an electrical system, comprising a power supply device, a load device, and the electronic device described in the second aspect, wherein the primary coil of the transformer coil is electrically connected to the power supply device, and the secondary coil of the transformer coil is electrically connected to the load device.

[0018] Beneficial effects of the present invention: The present invention discloses a wiring structure for a primary-secondary packaged IC, comprising a basic PCB board, including a primary component area, a transformer wiring area, and a secondary component area, wherein the transformer wiring area is arranged between the primary component area and the secondary component area; a planar transformer, mounted on the basic PCB board, comprising a transformer core and a transformer coil, wherein the transformer coil is integrated in the transformer wiring area, and the transformer core and the transformer coil are arranged correspondingly; a packaged IC, electrically connected to the components of the primary component area and the secondary component area; an additional PCB layer, arranged above and / or below the basic PCB board, wherein the signal lines of the packaged IC are arranged on the additional PCB layer. By adding an additional PCB layer above and / or below the basic PCB board and utilizing the additional PCB layer to arrange the signal lines of the packaged IC, the packaged IC can receive signals from the primary component area and the secondary component area, and send signals, without increasing the width of the basic PCB board. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0020] Figure 1 Schematic diagram of the structure of an ultra-thin charger in the background art;

[0021] Figure 2 is a schematic structural diagram of another ultra-thin charger in the background art;

[0022] Figure 3 This is a schematic diagram of the wiring structure of the primary and secondary side sealed IC provided by an embodiment of the present utility model.

[0023] Figure numbers: 10, basic PCB board; 11, primary component area; 12, secondary component area; 20, planar transformer; 21, transformer core; 22, transformer coil; 30, packaged IC; 31, primary pin; 32, secondary pin. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0025] It will be understood that when used in this specification and the appended claims, the terms "comprises" and "comprising" indicate the presence of described features, integers, steps, operations, elements and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or combinations thereof.

[0026] It should also be noted that, unless otherwise clearly specified and limited, terms such as "installed", "connected", "connected", "fixed", and "set" should be understood in a broad sense. For example, they can be fixedly connected, detachably connected, or integrated; they can be mechanically connected or electrically connected; they can be directly connected or indirectly connected through an intermediate medium, and they can be internal connections between two elements or interactions between two elements. When an element is referred to as being "on" or "under" another element, the element can be "directly" or "indirectly" located on the other element, or there may be one or more intervening elements. The terms "first", "second", and "third" are only used to facilitate the description of the present technical solution and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, features defined as "first", "second", and "third" can explicitly or implicitly include one or more of these features. For those skilled in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0027] It should also be understood that the terms used in this specification are only for the purpose of describing specific embodiments and are not intended to limit the present invention. As used in this specification and the appended claims, the singular forms "a", "an" and "the" are intended to include plural forms unless the context clearly indicates otherwise.

[0028] It should be further understood that the terms “and” and “or” used in the present specification and the appended claims refer to any and all possible combinations of one or more of the associated listed items, and include these combinations.

[0029] See also Figures 1 to 3 , Figure 1 Schematic diagram of the structure of an ultra-thin charger in the background art; Figure 2 is a schematic structural diagram of another ultra-thin charger in the background art; Figure 3 This is a schematic diagram of the wiring structure of the primary and secondary side sealed IC provided by an embodiment of the present utility model.

[0030] like Figure 3As shown, an embodiment of the present invention discloses a wiring structure for a primary-secondary packaged IC, which can be applied in the field of chargers and may include a basic PCB board 10, a planar transformer 20, a packaged IC 30, and an additional PCB layer. The basic PCB board 10 may include a primary component area 11, a transformer wiring area, and a secondary component area 12, wherein the transformer wiring area is arranged between the primary component area 11 and the secondary component area 12. The planar transformer 20 is assembled on the basic PCB board. The planar transformer 20 includes a transformer core 21 and a transformer coil 22; the transformer coil 22 is integrated in the transformer wiring area, and the transformer core 21 and the transformer coil 22 are arranged correspondingly. The packaged IC 30 is electrically connected to the components of the primary component area 11 and the secondary component area 12. The additional PCB layer is arranged above and / or below the basic PCB board 10, and the signal lines of the packaged IC 30 are arranged on the additional PCB layer.

[0031] In this embodiment, a base PCB 10 serves as a mounting platform for other electronic components. Its planar area is divided into a primary component area 11, a transformer routing area, and a secondary component area 12. The primary component area 11 is used to mount electronic components related to voltage input, while the secondary component area 12 is used to mount electronic components related to voltage output. The transformer routing area, located between the primary and secondary component areas 11 and 12, is used to mount a planar transformer 20. The planar transformer 20 is mounted on the base PCB and is used to convert the input voltage into the required output voltage, ensuring that the mobile device receives the correct power supply. The planar transformer 20 includes a transformer core 21 and a transformer coil 22. The transformer coil 22 is integrated into the transformer routing area of ​​the base PCB, with the transformer core 21 and transformer coil 22 correspondingly positioned. Specifically, the base PCB 10 can be constructed by stacking multiple PCBs. The transformer core 21 can be embedded into the base PCB 10 by opening a hole in the base PCB 10. The on-package IC 30 is electrically connected to the components in the primary component area 11 and the secondary component area 12. It uses internal analog and digital circuitry to establish a connection between the components in the primary and secondary component areas 11, 12 and the battery and power supply in the mobile device. It monitors the current and voltage during charging to ensure safety and efficiency. If an abnormality is detected, such as a short circuit or charger overload, the on-package IC 30 controls the circuitry to stop charging to protect the mobile device and charger. Furthermore, the on-package IC 30 monitors the battery's charge level, temperature, and status, using this information to optimize charging performance. When the battery level is low, the on-package IC 30 controls the circuitry to provide more charging current for faster charging. When the battery is nearly full, the on-package IC 30 automatically reduces the charging current to prevent overcharging and extend battery life. Additional PCB layers are provided above and / or below the base PCB 10. This involves adding a PCB layer above or below the base PCB 10, or adding a PCB layer above and below the base PCB 10. The signal lines of the packaged IC 30 are arranged on an additional PCB layer. That is, the packaged IC 30 itself is arranged in the primary component area 11 or the secondary component area 12. The signal lines arranged on the additional PCB layer connect the packaged IC 30 to the components in the other component area, allowing the packaged IC 30 to receive and send signals. By providing an additional PCB layer above and / or below the base PCB board 10 and arranging the signal lines of the packaged IC 30 on this additional PCB layer, a routing area can be provided for the packaged IC 30 without increasing the width of the PCB board. The additional PCB layer itself is very thin and does not significantly increase the volume of the PCB board compared to increasing the width of the PCB board, thereby reducing the volume of the charger.

[0032] In some embodiments, the packaged IC 30 is mounted in the primary device region 11 .

[0033] In this embodiment, the packaged IC 30 is assembled in the primary component area 11, the primary pin 31 of the packaged IC 30 is connected to the primary component area 11, and the secondary pin 32 of the packaged IC 30 is connected to the components of the secondary component area 12 at the other end of the basic PCB board 10 through a signal line arranged on the additional PCB layer.

[0034] In some embodiments, the packaged IC 30 is mounted in the secondary device region 12 .

[0035] In this embodiment, the packaged IC 30 is assembled in the secondary component area 12, the secondary pin 32 of the packaged IC 30 is connected to the secondary component area 12, and the primary pin 31 of the packaged IC 30 is connected to the components of the primary component area 11 at the other end of the basic PCB board 10 through the signal line arranged on the additional PCB layer.

[0036] In other embodiments, the packaged IC 30 may also be assembled on an additional PCB layer, specifically, in any area corresponding to the additional PCB layer and the primary component area 11 or the secondary component area 12 of the basic PCB board 10. For example, when the packaged IC 30 is assembled on the additional PCB layer in the area corresponding to the primary component area 11 of the basic PCB board 10, the primary pin 31 of the packaged IC 30 is connected to the components of the primary component area 11, and the secondary pin 32 of the packaged IC 30 is connected to the components of the secondary component area 12 at the other end of the basic PCB board 10 through the signal line arranged on the additional PCB layer. Alternatively, the primary component area 11 and the secondary component area 12 may be set on the additional PCB layer, and the packaged IC 30 may be assembled on the primary component area 11 or the secondary component area 12 on the additional PCB layer.

[0037] In some embodiments, the basic PCB board 10 includes a multi-layer PCB board, and the planar size of the additional PCB layer is the same as the planar size of the basic PCB board 10 .

[0038] In this embodiment, the basic PCB board 10 is formed by stacking multiple layers of PCB boards. The primary component area 11 and the secondary component area 12 are arranged on either the top or bottom PCB board, or on both the top and bottom PCB boards. When the primary component area 11 and the secondary component area 12 are arranged on the top PCB board, the additional PCB layer is arranged above the basic PCB board 10. When the primary component area 11 and the secondary component area 12 are arranged on the bottom PCB board, the additional PCB layer is arranged below the basic PCB board 10. When the primary component area 11 and the secondary component area 12 are arranged on both the top and bottom PCB boards, the additional PCB layer is arranged above and below the basic PCB board 10. The planar dimensions of the additional PCB layer are the same as those of the basic PCB board 10, and the planar dimensions of the additional PCB layer and the basic PCB board 10 are aligned. This prevents the additional PCB layer and the basic PCB board 10 from offsetting, thereby preventing an increase in the PCB board area and, consequently, the PCB board volume.

[0039] In some embodiments, the secondary coils of the transformer coil 22 are disposed on the top and bottom PCB boards, and the primary coils of the transformer coil 22 are disposed on the middle PCB board.

[0040] For example, the basic PCB board 10 includes 6 layers of PCB boards, the secondary coils of the transformer coil 22 are arranged on the 1st and 6th layers, and the primary coils of the transformer coil 22 are arranged on the middle 2nd, 3rd, 4th and 5th layers. At this time, if the packaged IC 30 is placed in the primary component area 11 of the basic PCB board 10, since the 1st to 6th layers of the basic PCB board 10 are all covered with coils, the secondary pin 32 of the packaged IC 30 cannot be routed to the secondary component area 12 for sampling and control, so an additional PCB layer is added above the 1st layer, which can be understood as the 0th layer PCB board. At this time, the 0th layer PCB board can be used as the wiring layer of the packaged IC 30, such as Figure 3 As shown, the control signal for the secondary side of the packaged IC 30 can be routed from layer 0, directly above the transformer coil 22, to the secondary side component area 12. This allows for the use of the packaged IC 30 and reduces the number of related components without increasing the area and volume of the basic PCB 10. This is merely an example, and the present invention does not limit the number of additional PCB layers.

[0041] In some embodiments, the primary coil of the transformer coil 22 is electrically connected to the components of the primary component area 11 , and the secondary coil of the transformer coil 22 is electrically connected to the components of the secondary component area 12 .

[0042] In this example, the primary coil of transformer coil 22 is electrically connected to the components in primary component area 11, which can be ports for connecting to an external power source. The secondary coil of transformer coil 22 is electrically connected to the components in secondary component area 12, which can be ports for connecting to a mobile device. This converts the input voltage into the required output voltage, ensuring that the mobile device receives the correct power.

[0043] In some embodiments, the width of the transformer core 21 is equal to the width of the base PCB board 10 , and the transformer coil 22 is disposed inside the transformer core 21 .

[0044] In some embodiments, the transformer core 21 has a shape of a planar E-type, an EQ-type, or an ER-type.

[0045] The present invention also discloses an electronic device that may include the wiring structure of the primary-secondary side-sealed IC 30 described in the above embodiment. Specifically, the electronic device may be an ultra-thin charger. By providing the additional PCB layer, the functionality of the sealed IC 30 can be achieved without increasing the size of the ultra-thin charger, thereby increasing the power density of the ultra-thin charger.

[0046] An embodiment of the present utility model further discloses an electrical system, which may include a power supply device, a load device and the electronic device described in the above embodiment. The primary coil of the transformer coil 22 is electrically connected to the power supply device through the electrical components of the primary component area, and the secondary coil of the transformer coil 22 is electrically connected to the load device through the electrical components of the secondary component area. The load device is a mobile device that consumes electrical energy, so that the input voltage of the power supply device is converted into the output voltage required by the load device through the electronic device, ensuring that the load device obtains correct power support, and by providing the above-mentioned additional PCB layer, the function of the sealed IC30 can be realized without increasing the volume of the electronic device, thereby achieving the purpose of increasing the power density of the electronic device while providing the user with a good usage experience.

[0047] The above are merely specific embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in the present invention, and such modifications or substitutions should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be based on the scope of protection of the claims.

Claims

1. A wiring structure for an IC with primary and secondary side seals, characterized in that: include: A basic PCB board includes a primary component area, a transformer routing area, and a secondary component area, wherein the transformer routing area is arranged between the primary component area and the secondary component area; A planar transformer is mounted on the basic PCB board, the planar transformer includes a transformer core and a transformer coil, the transformer coil is integrated in the transformer routing area, and the transformer core and the transformer coil are correspondingly arranged; A packaged IC electrically connected to the components of the primary component area and the secondary component area; as well as The additional PCB layer is arranged above and / or below the basic PCB board, and the signal lines of the packaged IC are arranged on the additional PCB layer.

2. The wiring structure of the primary and secondary side sealed IC according to claim 1, characterized in that: The packaged IC is mounted in the primary component area.

3. The wiring structure of the primary and secondary side sealed IC according to claim 1, characterized in that: The packaged IC is mounted in the secondary component area.

4. The wiring structure of the primary and secondary side sealed IC according to claim 1, characterized in that: The basic PCB board includes a multi-layer PCB board, and the plane size of the additional PCB layer is the same as the plane size of the basic PCB board.

5. The wiring structure of the primary and secondary side sealed IC according to claim 4, characterized in that: The secondary coil of the transformer coil is arranged on the top layer and the bottom layer of the PCB board, and the primary coil of the transformer coil is arranged on the middle layer of the PCB board.

6. The wiring structure of the primary and secondary side sealed IC according to claim 5, characterized in that: The primary coil of the transformer coil is electrically connected to the components of the primary component area, and the secondary coil of the transformer coil is electrically connected to the components of the secondary component area.

7. The wiring structure of the primary and secondary side sealed IC according to claim 1, characterized in that: The width of the transformer core is equal to the width of the basic PCB board, and the transformer coil is arranged on the inner side of the transformer core.

8. The wiring structure of the primary and secondary side sealed IC according to claim 1, characterized in that: The transformer core has a shape of a planar E type, an EQ type, or an ER type.

9. An electronic device, characterized in that: The invention comprises the wiring structure of the primary-secondary-edge packaged IC according to any one of claims 1 to 8.

10. An electrical system, characterized in that: The electronic device comprises a power supply device, a load device and the electronic device according to claim 9, wherein the primary coil of the transformer coil is electrically connected to the power supply device, and the secondary coil of the transformer coil is electrically connected to the load device.

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