Charging circuit board lead-free reflow soldering positioning tool

Abstract

The utility model relates to the field of reflow soldering, in particular to a charging circuit board lead-free reflow soldering positioning tool which comprises a fixed plate and a movable plate, a fixed rod is installed on the fixed plate, the fixed rod penetrates through the movable plate and is in sliding connection with the movable plate, a spring is arranged on the outer side of the fixed rod in a sleeved mode, and the spring is connected with the movable plate. The two ends of the spring are fixedly connected with the fixed plate and the movable plate respectively, the inner side of the fixed plate and the inner side of the movable plate are each provided with a belt conveying device, and the inner side of the fixed plate and the inner side of the movable plate are each provided with a circuit board substrate positioning and clamping device. One circuit board substrate is used as a distance adjusting reference of the two belt conveying devices, the two ends of the circuit board substrate are in contact with the convex parts on the fixed plate and the movable plate respectively under the action of the traction force of the spring, and after a circuit board to be subjected to reflow soldering is placed on the belt, the end parts can be limited by the fixed plate and the movable plate to form positioning, so that the circuit board can be subjected to reflow soldering. Positioning is accurate and reliable, and only one-time positioning is needed.

Description

Technical Field

[0001] The utility model relates to the field of reflow soldering, in particular to a lead-free reflow soldering positioning tool for a charging circuit board. Background Art

[0002] During the reflow soldering process, the temperature curve must be controlled to achieve the best soldering results. This temperature curve includes preheating, soaking, reflow, and cooling zones, each with specific temperature and time requirements. Belt conveyors are typically used to move circuit boards through these zones. For lead-free reflow soldering of different circuit board models, the spacing between the two conveyor belts must be adjusted.

[0003] Generally, it is necessary to understand the width of the circuit board in order to accurately adjust the spacing of the belt mechanism. If the width of the circuit board is not known in advance, it is necessary to continuously adjust the spacing of the belt mechanism multiple times to meet the actual positioning and conveying requirements.

[0004] Therefore, it is necessary to provide a new lead-free reflow soldering positioning tool for charging circuit boards to solve the above technical problems. Utility Model Content

[0005] In order to solve the above technical problems, the utility model provides a lead-free reflow soldering positioning tool for a charging circuit board, comprising a fixed plate and a movable plate, wherein a fixed rod is mounted on the fixed plate, the fixed rod passes through the movable plate and is slidably connected thereto, a spring is sleeved on the outer side of the fixed rod, and the two ends of the spring are respectively fixedly connected to the fixed plate and the movable plate, a belt conveyor is provided on the inner side of the fixed plate and the movable plate, and a circuit board substrate positioning clamping device is provided on the inner side of the fixed plate and the movable plate;

[0006] The circuit board substrate positioning and clamping device comprises a support plate fixed on a fixed plate and a movable plate for supporting the end portion of the circuit board substrate.

[0007] Preferably, the circuit board substrate positioning and clamping device further comprises a mounting plate fixed on the fixed plate and the movable plate, the mounting plate being threadedly connected with a screw, and the end of the screw being rotatably connected with a pressure plate.

[0008] Preferably, the inner walls of the fixed plate and the movable plate are both provided with protrusions that contact the end of the circuit board substrate.

[0009] Preferably, the thickness of the convex portion is 0.5 mm.

[0010] Preferably, the belt conveyor includes a driving pulley and a driven pulley rotatably connected to a fixed plate and a movable plate, the driving pulley and the driven pulley are connected by a belt transmission, an electric motor is fixed to one side of the fixed plate, the output shaft of the electric motor is fixedly connected to the driving pulley on the fixed plate, and a rotating shaft is provided at the axis center of the driving pulley and the driven pulley on the fixed plate, and the rotating shaft is slidably connected to the driving pulley and the driven pulley on the fixed plate and the movable plate.

[0011] Compared with related technologies, the lead-free reflow soldering positioning tool for charging circuit boards provided by the present invention has the following beneficial effects:

[0012] By using one of the circuit board substrates as the spacing adjustment reference of the two belt conveyor devices, under the pulling force of the spring, the two ends of the circuit board substrate contact the protrusions on the fixed plate and the movable plate respectively. After the reflow-welded circuit board is placed on the belt, the end will be restricted by the fixed plate and the movable plate to form a position. The positioning is relatively accurate and reliable, and only one positioning is required. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 A schematic diagram of the overall structure provided by the utility model;

[0014] Figure 2 This is a schematic diagram of the relative positions of the circuit board substrate positioning and clamping device provided by the utility model.

[0015] Numbers in the figure: 1. Fixed plate; 2. Movable plate; 3. Fixed rod; 4. Spring; 5. Belt conveyor; 6. Circuit board substrate positioning and clamping device; 7. Support plate; 8. Mounting plate; 9. Screw; 10. Pressing plate; 11. Protrusion; 12. Driving pulley; 13. Driven pulley; 14. Motor; 15. Rotating shaft. DETAILED DESCRIPTION

[0016] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0017] The specific implementation of the present invention is described in detail below with reference to specific embodiments.

[0018] See also Figures 1 to 2The embodiment of the utility model provides a lead-free reflow soldering positioning tool for a charging circuit board, comprising a fixed plate 1 and a movable plate 2. A fixed rod 3 is mounted on the fixed plate 1, and the fixed rod 3 passes through the movable plate 2 and is slidably connected thereto. A spring 4 is sleeved on the outer side of the fixed rod 3, and the two ends of the spring 4 are fixedly connected to the fixed plate 1 and the movable plate 2 respectively. A belt conveyor 5 is provided on the inner side of the fixed plate 1 and the movable plate 2, and a circuit board substrate positioning clamping device 6 is provided on the inner side of the fixed plate 1 and the movable plate 2.

[0019] The circuit board substrate positioning and clamping device 6 includes a support plate 7 fixed on the fixed plate 1 and the movable plate 2 for supporting the end of the circuit board substrate.

[0020] The circuit board substrate positioning and clamping device 6 also includes a mounting plate 8 fixed on the fixed plate 1 and the movable plate 2, and the mounting plate 8 is connected to a screw 9 by a thread, and the end of the screw 9 is rotatably connected to a pressure plate 10. The pressure plate 10 brought by the rotating screw 9 presses the circuit board substrate to prevent the circuit board substrate from tilting.

[0021] The inner walls of the fixed plate 1 and the movable plate 2 are both provided with a protrusion 11 that contacts the end of the circuit board substrate. The thickness of the protrusion 11 is 0.5 mm, which prevents the circuit board to be reflowed from being clamped too tightly by the fixed plate 1 and the movable plate 2 under the action of the spring 4, causing the belt to be unable to transport the circuit board.

[0022] The belt conveyor 5 includes a driving pulley 12 and a driven pulley 13 rotatably connected to the fixed plate 1 and the movable plate 2, and the driving pulley 12 and the driven pulley 13 are connected by belt transmission. A motor 14 is fixed to one side of the fixed plate 1, and the output shaft of the motor 14 is fixedly connected to the driving pulley 12 on the fixed plate 1. The driving pulley 12 and the driven pulley 13 on the fixed plate 1 are both provided with a rotating shaft 15 at the axis center, and the rotating shaft 15 is slidingly connected to the driving pulley 12 and the driven pulley 13 on the fixed plate 1 and the movable plate 2. The driving pulley 12 on the fixed plate 1 is driven to rotate by the motor 14. Combined with the arrangement of the rotating shaft 15, the belt and the driven pulley 13, the two belts rotate synchronously.

[0023] The above description is merely an embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the description and drawings of the present invention, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A lead-free reflow soldering positioning tool for a charging circuit board, characterized by: The invention comprises a fixed plate (1) and a movable plate (2), wherein a fixed rod (3) is installed on the fixed plate (1), the fixed rod (3) passes through the movable plate (2) and is slidably connected thereto, a spring (4) is sleeved on the outer side of the fixed rod (3), and the two ends of the spring (4) are respectively fixedly connected to the fixed plate (1) and the movable plate (2), a belt conveyor (5) is provided on the inner side of the fixed plate (1) and the movable plate (2), and a circuit board substrate positioning clamping device (6) is provided on the inner side of the fixed plate (1) and the movable plate (2); The circuit board substrate positioning and clamping device (6) comprises a support plate (7) fixed on a fixed plate (1) and a movable plate (2) for supporting the end of the circuit board substrate.

2. The lead-free reflow soldering positioning tool for a charging circuit board according to claim 1, characterized in that: The circuit board substrate positioning and clamping device (6) further comprises a mounting plate (8) fixed on the fixed plate (1) and the movable plate (2); a screw (9) is threadedly connected to the mounting plate (8); and the end of the screw (9) is rotatably connected to a pressure plate (10).

3. The lead-free reflow soldering positioning tool for a charging circuit board according to claim 2, characterized in that: The inner walls of the fixed plate (1) and the movable plate (2) are both provided with convex portions (11) that contact the end of the circuit board substrate.

4. The lead-free reflow soldering positioning tool for a charging circuit board according to claim 3, characterized in that: The thickness of the convex portion (11) is 0.5 mm.

5. The lead-free reflow soldering positioning tool for a charging circuit board according to claim 1, characterized in that: The belt conveyor (5) comprises a driving pulley (12) and a driven pulley (13) rotatably connected to a fixed plate (1) and a movable plate (2); the driving pulley (12) and the driven pulley (13) are connected via a belt transmission; a motor (14) is fixed on one side of the fixed plate (1); the output shaft of the motor (14) is fixedly connected to the driving pulley (12) on the fixed plate (1); a rotating shaft (15) is provided at the axis center of the driving pulley (12) and the driven pulley (13) on the fixed plate (1); the rotating shaft (15) is slidably connected to the driving pulley (12) and the driven pulley (13) on the fixed plate (1) and the movable plate (2).

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