Ceramic substrate and packaging structure

Abstract

The utility model provides a ceramic substrate and a packaging structure, and relates to the technical field of semiconductors. The ceramic substrate comprises a first surface and a second surface which are oppositely arranged, the first surface and / or the second surface are / is provided with an installation groove used for installing a component, the side wall of the installation groove is provided with an exhaust channel, one end of the exhaust channel extends to the groove bottom of the installation groove, and the other end of the exhaust channel extends to the surface of the ceramic substrate. According to the ceramic substrate, gas and volatile matters in the baking and curing process can be discharged, the phenomena of cavities and layering at the bonding part of the ceramic substrate and a component are avoided, and the structural reliability is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to a ceramic substrate and a packaging structure. Background Art

[0002] With the rapid development of the semiconductor industry, wire bonding is often used to achieve electrical connections between substrates and chips. During surface mount chip mounting, glue is used to secure the chip to the substrate's surface. As the spacing between wire bonding pads on the substrate decreases, glue overflow from the bottom of the chip can easily contaminate the pads, affecting their performance or causing electrical connection failure.

[0003] In traditional designs, grooves are typically created on the substrate surface to accommodate the chip, preventing glue overflow from contaminating the bonding pads. However, this process requires first filling the bottom of the groove with colloid before mounting the chip in the groove. After mounting the chip, the filled colloid remains within the sealed groove space. During baking and curing, the gas in the groove space and the volatiles in the colloid are difficult to release, which can easily lead to bubbles in the colloid in the groove and the formation of voids at the bottom of the chip, thus affecting the bonding strength between the chip and the substrate, and ultimately causing structural delamination and connection failure. Utility Model Content

[0004] The purpose of the present invention includes providing a ceramic substrate and a packaging structure, which can improve the bonding force between components and the ceramic substrate and improve the packaging reliability.

[0005] The embodiment of the present utility model can be implemented as follows:

[0006] In a first aspect, the present invention provides a ceramic substrate, comprising a first surface and a second surface arranged opposite to each other, wherein a mounting groove for mounting components is provided on the first surface and / or the second surface, and an exhaust channel is provided on the side wall of the mounting groove, wherein one end of the exhaust channel extends to the bottom of the mounting groove, and the other end extends to the surface of the ceramic substrate.

[0007] In an optional embodiment, the exhaust channel is a groove opened on the side wall of the mounting groove, one end of the groove extends to the bottom of the mounting groove, and the other end extends to a side surface of the ceramic substrate where the mounting groove is opened.

[0008] In an optional embodiment, the groove is an arc-shaped groove.

[0009] In an optional embodiment, the side wall of the installation groove includes four wall surfaces connected end to end, and a plurality of grooves are evenly spaced on each wall surface.

[0010] In an optional embodiment, a plurality of wire bonding pads spaced apart from the mounting grooves are provided on the ceramic substrate, and the wire bonding pads are used to be electrically connected to the components.

[0011] In an optional embodiment, a heat dissipation through hole is formed on the ceramic substrate and passes through the ceramic substrate, and the heat dissipation through hole is located between the first surface and the second surface.

[0012] In an optional embodiment, a cutting path is reserved on the ceramic substrate, and a projection of the heat dissipation through hole on the first surface or the second surface is located on the cutting path.

[0013] In an optional embodiment, a positioning portion is provided on the ceramic substrate, and the positioning portion includes at least one of a positioning protrusion and a positioning hole.

[0014] In an optional embodiment, the ceramic substrate is made of any one of aluminum oxide, aluminum nitride and silicon nitride.

[0015] In a second aspect, the present invention provides a packaging structure, comprising a component and a ceramic substrate as described in any one of the aforementioned embodiments, wherein the component is installed in the installation groove and is electrically connected to the ceramic substrate.

[0016] The ceramic substrate and packaging structure provided by the present invention have the following beneficial effects:

[0017] The ceramic substrate provided by the embodiment of the present invention has a mounting groove for accommodating components, which can prevent overflow of glue from contaminating the wire bonding pads of the ceramic substrate. An exhaust channel is provided on the side wall of the mounting groove, and the gas enclosed in the mounting groove after the components are mounted can be discharged through the exhaust channel. In addition, volatiles generated by the colloid during the baking and curing process can be discharged through the exhaust channel. This can prevent the formation of bubbles and cavities in the colloid at the bottom of the component, prevent structural delamination, and improve the bonding strength between the component and the ceramic substrate.

[0018] The packaging structure provided by the embodiment of the present invention, including components and the above-mentioned ceramic substrate, can prevent bubbles from forming in the colloid at the bottom of the components, reduce the risk of structural delamination, and improve the bonding strength between the components and the ceramic substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only illustrate certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying any creative work.

[0020] Figure 1 A schematic structural diagram of the ceramic substrate provided in this embodiment from a first viewing angle;

[0021] Figure 2 for Figure 1 A partial enlarged schematic diagram of point A in the middle;

[0022] Figure 3 This is a structural schematic diagram of the ceramic substrate provided in this embodiment from a second viewing angle.

[0023] Icons: 100 - ceramic substrate; 111 - first surface; 112 - mounting groove; 113 - groove; 114 - wall; 120 - wire bonding pad; 130 - heat dissipation through hole; 140 - positioning hole. DETAILED DESCRIPTION

[0024] To make the purpose, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings herein can be arranged and designed in various different configurations.

[0025] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but rather merely represents selected embodiments of the present invention. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of the present invention without creative effort are intended to fall within the scope of protection of the present invention.

[0026] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0027] In the description of the present invention, it should be noted that if the terms "upper", "lower", "inside", "outside", etc. appear, the orientation or position relationship indicated is based on the orientation or position relationship shown in the accompanying drawings, or is the orientation or position relationship in which the utility model product is usually placed when in use. It is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it cannot be understood as a limitation on the present invention.

[0028] In addition, the terms "first", "second", etc., if used, are merely used to distinguish and describe, and should not be understood as indicating or implying relative importance.

[0029] It should be noted that, in the absence of conflict, the features in the embodiments of the present invention can be combined with each other.

[0030] In traditional designs, grooves are typically created on the substrate surface to accommodate the chip, preventing glue overflow from contaminating the bonding pads. However, this process requires first filling the bottom of the groove with colloid before mounting the chip in the groove. After mounting the chip, the filled colloid remains within the sealed groove space. During baking and curing, the gas in the groove space and the volatiles in the colloid are difficult to release, which can easily lead to bubbles in the colloid in the groove and the formation of voids at the bottom of the chip, thus affecting the bonding strength between the chip and the substrate, and ultimately causing structural delamination and connection failure.

[0031] To overcome at least one of the shortcomings of the prior art, embodiments of the present application provide a ceramic substrate for use in semiconductor packaging structures. The ceramic substrate, used for mounting components such as chips, prevents bubbles from forming in the colloid at the bottom of the component, preventing structural delamination and improving the bonding strength between the component and the ceramic substrate.

[0032] Combine Figures 1 to 3 The ceramic substrate 100 provided in the embodiment of the present application includes a first surface 111 and a second surface arranged opposite to each other, and a mounting groove 112 for mounting components is provided on the first surface 111 and / or the second surface, and an exhaust channel is provided on the side wall of the mounting groove 112, one end of the exhaust channel extends to the bottom of the mounting groove 112, and the other end extends to the surface of the ceramic substrate 100. By providing an exhaust channel on the side wall of the mounting groove 112, the gas enclosed in the mounting groove 112 after the components are mounted can be discharged through the exhaust channel. And the volatiles generated by the colloid during the baking and curing process can be discharged from the exhaust channel. In this way, bubbles in the colloid at the bottom of the component can be avoided to form cavities, structural stratification can be prevented, the bonding force between the component and the ceramic substrate 100 can be improved, and the structural reliability can be improved.

[0033] It will be appreciated that if the ceramic substrate 100 is used for single-sided mounting, it is sufficient to provide mounting grooves 112 on either the first surface 111 or the second surface. If the ceramic substrate 100 is used for double-sided mounting, mounting grooves 112 may be provided on both the first surface 111 and the second surface. In this embodiment, only the mounting grooves 112 are provided on the first surface 111. The components in this embodiment are described using chips as an example. Of course, the components may also be capacitors, resistors, or other elements, which are not specifically limited here.

[0034] Optionally, depending on actual mounting requirements, there may be multiple mounting slots 112, each of which is distributed in an array on the ceramic substrate 100. The shape and dimensions of each mounting slot 112 are adapted to the shape and dimensions of the component to be mounted. The number of mounting slots 112 is equal to the number of components to be mounted. One component is mounted in each mounting slot 112.

[0035] The exhaust channel is a groove 113 formed on the sidewall of mounting groove 112. One end of groove 113 extends to the bottom of mounting groove 112, and the other end extends to the side surface of ceramic substrate 100 where mounting groove 112 is formed. Of course, the end of groove 113 away from the bottom can also extend to any other surface of ceramic substrate 100, as long as the gas in mounting groove 112 can be smoothly exhausted.

[0036] Optionally, a mounting groove 112 is defined on the first surface 111 of the ceramic substrate 100. A groove 113 extends from the first surface 111 along the sidewalls of the mounting groove 112 to the bottom of the mounting groove 112. Groove 113 is an arc-shaped groove 113, which reduces structural stress and prevents scratches on the chip caused by sharp edges. Of course, the cross-sectional shape of groove 113 can also be V-shaped, U-shaped, or any other arbitrary shape, which is not specifically limited here.

[0037] Optionally, the sidewalls of mounting groove 112 include four end-to-end connected walls 114, each of which is evenly spaced with grooves 113. The design of grooves 113 allows gas generated at any location to be smoothly discharged along the grooves 113, resulting in smoother and more complete exhaust. Furthermore, the even distribution of grooves 113 ensures more uniform stress distribution on ceramic substrate 100, resulting in a more reliable structure.

[0038] In this embodiment, by providing a groove 113 on the side wall of the mounting groove 112, the glue capacity of the mounting groove 112 can be increased, which is beneficial to improving the bonding strength between the glue and the ceramic substrate 100 and the components, thereby improving the bonding strength between the ceramic substrate 100 and the components, preventing structural delamination, and making the structure more reliable.

[0039] Of course, in some other embodiments, the exhaust channel can be a through hole opened on the ceramic substrate 100, with one end of the through hole extending into the mounting groove 112 and the other end extending to the surface of the ceramic substrate 100. As long as the gas in the mounting groove can be smoothly discharged, it will be fine.

[0040] Optionally, a plurality of wire bonding pads 120 are provided on the first surface 111 of the ceramic substrate 100, spaced apart from the mounting slots 112. The wire bonding pads 120 are used to electrically connect to the components. In this embodiment, the chip and the wire bonding pads 120 of the ceramic substrate 100 are electrically connected using wire bonding. Depending on actual needs, the wire bonding pads 120 can be provided around or on opposite sides of each mounting slot 112.

[0041] Optionally, the material of the wire bonding pad 120 includes but is not limited to gold, silver, copper, tin, gold-tin, copper-tin, silver-tin and other metals.

[0042] Optionally, the ceramic substrate 100 is provided with a heat dissipation through-hole 130 that passes through the ceramic substrate 100, and the heat dissipation through-hole 130 is located between the first surface 111 and the second surface. It can be understood that the ceramic substrate 100 also includes a side surface for connecting the first surface 111 and the second surface. In this embodiment, the ceramic substrate 100 has four side surfaces connected end to end. The heat dissipation through-hole 130 passes through at least one group of oppositely arranged side surfaces. The provision of the heat dissipation through-hole 130 is conducive to heat dissipation and air permeability, and has the technical effect of releasing thermal stress and alleviating warping deformation in the semiconductor thermal process. It is conducive to reducing the warping deformation of the ceramic substrate 100 and improving the packaging quality.

[0043] Optionally, a cutting path is reserved on the ceramic substrate 100, and the projection of the heat dissipation via 130 on the first surface 111 or the second surface is located on the cutting path. The cutting path is located between adjacent mounting grooves 112. And the cutting path avoids the wire bonding pad 120 on the ceramic substrate 100. After the chip is mounted and plastic-sealed on the ceramic substrate 100, cutting is performed along the cutting path of the ceramic substrate 100, and the packaging structure on the entire ceramic substrate 100 can be divided into multiple single products. The positions of the heat dissipation via 130 and the cutting path in this embodiment are set correspondingly, which can reduce the impact on the structural strength of the ceramic substrate 100. And in the subsequent cutting and separation process, the heat dissipation via 130 is cut and removed together with the cutting path.

[0044] Optionally, a positioning portion is provided on the ceramic substrate 100, and the positioning portion includes at least one of a positioning protrusion, a positioning groove and a positioning hole 140. The ceramic substrate 100 can be provided with only a positioning protrusion, or only a positioning hole 140, or only a positioning groove. Alternatively, positioning protrusions and positioning holes 140 can be provided separately. The number and shape of the positioning portion are not limited and are not specifically limited here. In this embodiment, the positioning portion includes two positioning holes 140. The two positioning holes 140 are provided on a set of opposite corners of the ceramic substrate 100. The positioning holes 140 are used to achieve the positioning and installation of the ceramic substrate 100.

[0045] Optionally, the ceramic substrate 100 is made of ceramic. The material includes but is not limited to any one of aluminum oxide, aluminum nitride, and silicon nitride.

[0046] The embodiment of the present invention further provides a packaging structure, including components and the aforementioned ceramic substrate 100 . The components are installed in the mounting groove 112 and are electrically connected to the ceramic substrate 100 .

[0047] Optionally, first secure the ceramic substrate 100 to the machine via the positioning holes 140, apply glue to the mounting groove 112 of the ceramic substrate 100, and then mount the chip within the mounting groove 112. Bake and cure the ceramic substrate 100, ensuring a more secure connection between the chip and the ceramic substrate. Grooves 113 are provided on the sidewalls of the mounting groove 112, allowing gases and volatiles from the colloid to escape smoothly during the baking and curing process, preventing voids and delamination at the junction of the chip and the ceramic substrate 100.

[0048] Wire bonding is then used to electrically connect the pads on the chip to the wire bonding pads 120 on the ceramic substrate 100. A plastic encapsulation process is used to form a plastic encapsulation body around the chip, protecting the chip and bonding wires. The encapsulated product is then cut along the cutting lines into individual pieces.

[0049] In summary, the ceramic substrate 100 and the packaging structure provided by the embodiment of the present invention have the following beneficial effects, including:

[0050] The ceramic substrate 100 provided by the embodiment of the present invention has a mounting groove 112 for accommodating components, which can prevent overflowing glue from contaminating the wire bonding pads 120 of the ceramic substrate 100. An exhaust channel is provided on the side wall of the mounting groove 112, and the gas enclosed in the mounting groove 112 after the components are mounted can be discharged through the exhaust channel. In addition, the volatiles generated by the colloid during the baking and curing process can be discharged from the exhaust channel. In this way, bubbles can be avoided in the colloid at the bottom of the component to form cavities, prevent structural stratification, and improve the bonding strength between the component and the ceramic substrate 100. In addition, the exhaust channel is designed as a groove 113 opened along the side wall of the mounting groove 112, which can increase the glue capacity of the mounting groove 112, which is beneficial to improve the bonding strength of the colloid with the components and the ceramic substrate 100, respectively, and the packaging structure is more reliable.

[0051] The packaging structure provided by the embodiment of the present invention includes components and the above-mentioned ceramic substrate 100. It can prevent bubbles from forming in the colloid at the bottom of the components, reduce the risk of structural delamination, improve the bonding strength between the components and the ceramic substrate 100, and improve the packaging reliability.

[0052] The above is only a specific implementation method of the present invention, but the scope of protection of the present invention is not limited to this. Any changes or replacements that can be easily thought of by any technician familiar with this technical field within the technical scope disclosed in the present invention should be included in the scope of protection of the present invention.

Claims

1. A ceramic substrate, characterized in that The ceramic substrate includes a first surface and a second surface arranged opposite to each other, a mounting groove for mounting components is formed on the first surface and / or the second surface, and an exhaust channel is formed on the side wall of the mounting groove, one end of the exhaust channel extends to the bottom of the mounting groove, and the other end extends to the surface of the ceramic substrate; A plurality of wire bonding pads spaced apart from the mounting grooves are provided on the first surface of the ceramic substrate, and the wire bonding pads are used to be electrically connected to the components by wire bonding; The ceramic substrate is provided with a heat dissipation through-hole that passes through the ceramic substrate, and the heat dissipation through-hole is located between the first surface and the second surface; a cutting path that avoids the wire bonding pad is reserved on the ceramic substrate, and the projection of the heat dissipation through-hole on the first surface or the second surface is located on the cutting path; the ceramic substrate has four side surfaces connected end to end, and the heat dissipation through-hole passes through at least one group of oppositely arranged side surfaces.

2. The ceramic substrate according to claim 1, wherein The exhaust channel is a groove formed on the side wall of the mounting groove. One end of the groove extends to the bottom of the mounting groove, and the other end extends to a side surface of the ceramic substrate where the mounting groove is formed.

3. The ceramic substrate according to claim 2, wherein: The groove is an arc-shaped groove.

4. The ceramic substrate according to claim 2, wherein: The side wall of the installation groove includes four wall surfaces connected end to end, and a plurality of grooves are evenly spaced on each wall surface.

5. The ceramic substrate according to claim 1, wherein A positioning portion is provided on the ceramic substrate, and the positioning portion includes at least one of a positioning protrusion and a positioning hole.

6. The ceramic substrate according to any one of claims 1 to 5, characterized in that The ceramic substrate is made of any one of aluminum oxide, aluminum nitride and silicon nitride.

7. A packaging structure, characterized in that: It comprises a component and a ceramic substrate according to any one of claims 1 to 6, wherein the component is installed in the installation groove and is electrically connected to the ceramic substrate.

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