Radiator

Abstract

The utility model provides a heat radiator. The heat radiator comprises heat radiating fins and a plurality of heat radiating fins, one side of the base plate is connected with the cooling fins, and the other side of the base plate is used for installing a heat source needing heat dissipation; a heat conduction cavity is formed in the base plate and comprises an evaporation cavity, a condensation cavity, a first channel and a second channel, one end of the evaporation cavity is communicated with one end of the condensation cavity through the first channel, and the other end of the evaporation cavity is communicated with the other end of the condensation cavity through the second channel; the evaporation cavity corresponds to the heat source; wherein the first channel is higher than the second channel; a heat conduction medium in the heat conduction cavity circulates in the direction of the evaporation cavity, the first channel, the condensation cavity, the second channel and the evaporation cavity. According to the utility model, the problems that the processing difficulty of the radiator is large and better heat-conducting property is difficult to realize under the condition of low cost are solved.

Description

Technical Field

[0001] The utility model relates to the technical field of radiators, and in particular to a radiator. Background Art

[0002] At present, the more common types of radiators in the air-conditioning market are mainly extruded radiators, heat pipe radiators, phase change radiators, etc. In order to meet the heat dissipation requirements of larger components, extruded radiators are usually larger in size, with higher fin heights, and are difficult to process and have higher costs. Heat pipe radiators usually have heat pipes embedded in the upper surface of the radiator substrate. The heat pipe is a sealed copper tube with a liquid medium with a low boiling point filled inside. The heat source surface is attached to the heat pipe. The temperature of the liquid medium in the heat pipe rises, and it changes from liquid to gas, bringing heat energy to both ends of the heat pipe, and the local heating on the heat pipe is turned into heating of the entire heat pipe. Usually, in order to improve the heat dissipation performance of the radiator, multiple heat pipes are embedded, resulting in a thicker radiator substrate and a higher price for heat pipes, so the cost of heat pipe radiators is very high. The phase change radiator consists of three parts: a base plate, an inflation plate, and a heat sink. The heat source is installed on the upper surface of the base plate. A low-boiling-point liquid medium is injected into the inflation plate. The heat source transfers heat energy to the inflation plate through the base plate. After the liquid medium inside the inflation plate absorbs the heat energy, its temperature rises and it changes from liquid to gas, bringing the heat to the other end of the inflation plate, making the entire inflation plate a heat source with a small temperature difference. The heat is then transferred to the heat sink and dissipated through the heat sink. Since the inflation plate is provided with a flow channel and has an uneven surface, and the base plate and the inflation plate are fixed to the surface of the inflation plate by welding, the two are only partially in contact, resulting in poor heat conduction performance and large thermal resistance of the radiator.

[0003] Therefore, the current heat sink processing is difficult and it is difficult to achieve good thermal conductivity at a low cost. Utility Model Content

[0004] The problem solved by the utility model is that the radiator is difficult to manufacture and it is difficult to achieve good thermal conductivity at a low cost.

[0005] To solve the above problems, the present invention provides a radiator, which comprises: a heat sink; a substrate, one side of the substrate is connected to the heat sink, and the other side of the substrate is used to install a heat source that needs to dissipate heat; a heat conduction chamber is provided in the substrate, and the heat conduction chamber comprises: an evaporation chamber, a condensation chamber, a first channel and a second channel, one end of the evaporation chamber and the condensation chamber are connected through the first channel, and the other end of the evaporation chamber and the condensation chamber are connected through the second channel; the evaporation chamber corresponds to the heat source; wherein the first channel is higher than the second channel; the heat conduction medium in the heat conduction chamber circulates along the direction of the evaporation chamber, the first channel, the condensation chamber, the second channel, and the evaporation chamber.

[0006] The technical effect achieved after adopting this technical solution is as follows: the heat source is set at the position of the substrate corresponding to the evaporation chamber, which can transfer heat to the evaporation chamber, and then conduct the heat to the liquid heat-conducting medium. After being heated in the evaporation chamber, the heat-conducting medium changes from liquid to gas through the first channel, bringing the heat to the condensation chamber. After being cooled by the heat sink in the condensation chamber, the heat-conducting medium changes from gas to liquid again, and then returns to the evaporation chamber through the second channel, realizing a reciprocating cycle, so that the heat generated by the heat source is quickly dispersed to the entire substrate through the medium, and then the heat sink in contact is used to achieve the effect of efficient heat dissipation; and the structure of directly setting the heat-conducting chamber is more convenient to process and has lower cost than setting an embedded heat pipe.

[0007] Furthermore, the substrate includes a sealing plate and a base, the heat conduction cavity is provided on the base, and the substrate covers the heat conduction cavity and is connected to the base.

[0008] The technical effect achieved after adopting this technical solution is: the base is first processed into a heat conduction cavity, and then the heat conduction cavity is sealed by a sealing plate, which makes processing more convenient.

[0009] Furthermore, the heat sink is located on a side of the sealing plate away from the base.

[0010] The technical effect achieved after adopting this technical solution is: the connection between the base and the heat source is more stable, and the heat exchange between the heat source and the heat conduction cavity is facilitated, thereby improving the heat conduction efficiency.

[0011] Furthermore, the substrate further includes: a flow guide member, which is arranged in the heat conduction cavity.

[0012] The technical effect achieved after adopting this technical solution is: the flow guide is used to control the flow direction of the heat-conducting medium in the heat-conducting cavity, which facilitates the uniform distribution of the heat-conducting medium, evenly and effectively transfers heat to the heat sink, and improves the heat dissipation efficiency of the heat sink. The flow guide increases the heat exchange area of ​​the heat-conducting medium in the heat-conducting cavity, further improving the heat exchange efficiency.

[0013] Furthermore, the guide member includes a first guide member, which is arranged in the evaporation chamber and / or the condensation chamber; the length direction of the first guide member is the same as the flow direction of the heat transfer medium along the first channel to the second channel.

[0014] The technical effect achieved after adopting this technical solution is: the first guide member is used to control the flow direction of the heat-conducting medium in the evaporation chamber and the condensation chamber, guiding the heat-conducting medium to flow from the evaporation chamber into the first channel, and then flow from the first channel through the condensation chamber and the second channel back to the evaporation chamber, thereby realizing the circulation of the heat-conducting medium.

[0015] Furthermore, the guide member includes: a second guide member and a third guide member, the second guide member and the third guide member are arranged in parallel in the evaporation chamber, and a heat conduction channel is formed between the second guide member and the third guide member; wherein, in the direction from the second channel to the first channel, the second guide member and the third guide member are arranged alternately on the left and right, and the heat conduction channel is also arranged alternately on the left and right.

[0016] The technical effect achieved by adopting this technical solution is that the heat-conducting medium is guided by the second guide member and the third guide member and flows alternately left and right along the heat-conducting channel, thereby increasing the flow distance and fully performing heat exchange.

[0017] Furthermore, the area of ​​the third flow guide member is larger than that of the second flow guide member; the base is provided with a mounting hole, and the mounting hole passes through to the third flow guide member.

[0018] The technical effect achieved after adopting this technical solution is: the mounting hole is used to install fasteners, thereby fixing the heat source to the mounting position; the guide member itself protrudes from the heat conduction cavity, increasing the thickness of the substrate, and the third guide member has a larger area, so fixing the fastener to the third guide member is more stable, thereby achieving stable installation of the heat source.

[0019] Furthermore, the base plate further includes at least two opposite mounting bosses, and the mounting position is formed between the two mounting bosses.

[0020] The technical effect achieved after adopting this technical solution is: the mounting boss is used to position and install the installed heat source, for example, to fix the IGBT and the rectifier bridge.

[0021] Furthermore, the radiator includes a clip and a locking block, the clip and the locking block are connected to the side of the heat sink away from the substrate, the clip has a clipping groove, and the locking block is located in the clipping groove; wherein, the clipping groove of the clip is clipped to the locking block of the adjacent heat sink.

[0022] The technical effect achieved after adopting this technical solution is: the buckle and the locking block cooperate to lock the heat sink in its stacking direction; all heat sinks are equipped with buckles and locking blocks, and are an integrated structure, so only the heat sink needs to be produced to achieve assembly, and the production and installation efficiency is higher.

[0023] Furthermore, one end of the clip away from the clip slot abuts against a locking block of the adjacent second heat sink.

[0024] The technical effect achieved after adopting this technical solution is: in the stacking direction of the heat sink, the buckle can be locked by the front and rear locking blocks, so the heat sink will not tilt in any direction, and the installation effect is more stable.

[0025] In summary, the above-mentioned technical solutions of the present application can have one or more of the following advantages or beneficial effects: i) the heat source is arranged at the position of the substrate corresponding to the evaporation chamber, which can transfer heat to the evaporation chamber, and then conduct the heat to the liquid heat-conducting medium. After being heated in the evaporation chamber, the heat-conducting medium changes from liquid to gas through the first channel, bringing the heat to the condensation chamber. After being cooled by the heat sink in the condensation chamber, the heat-conducting medium changes from gas to liquid again, and then returns to the evaporation chamber through the second channel, realizing a reciprocating cycle, so as to achieve the effect of quickly dissipating the heat generated by the heat source through the medium to the entire substrate, and then achieving efficient heat dissipation through the contacting heat sink; ii) the structure of directly setting the heat-conducting cavity in the substrate is more convenient to process and has lower cost than setting an embedded heat pipe; iii) the guide is used to control the flow direction of the heat-conducting medium in the heat-conducting cavity, so as to evenly distribute the heat-conducting medium, evenly and effectively transfer the heat to the heat sink, thereby improving the heat dissipation efficiency of the heat sink, and the guide increases the heat exchange area of ​​the heat-conducting medium in the heat-conducting cavity, further improving the heat exchange efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 A schematic structural diagram of a radiator provided by the utility model;

[0027] Figure 2 for Figure 1 Schematic diagram of the structure of the middle base plate;

[0028] Figure 3 for Figure 2 Enlarged view of the middle II region;

[0029] Figure 4 for Figure 2 A schematic diagram of the structure of the middle substrate from another perspective;

[0030] Figure 5 for Figure 1 Magnified view of region I in the middle.

[0031] Description of reference numerals:

[0032] 100- radiator; 110- heat sink; 111- buckle; 112- locking block; 120- base plate; 130- sealing plate; 140- base; 141- mounting position; 142- evaporation chamber; 143- condensation chamber; 144- first channel; 145- second channel; 146- first flow guide; 147- second flow guide; 148- third flow guide; 149- mounting hole; 150- mounting boss. DETAILED DESCRIPTION

[0033] The purpose of the utility model is to provide a radiator which is convenient to manufacture and assemble and has good thermal conductivity at a low cost.

[0034] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0035] See also Figure 1-Figure 5 The embodiment of the present invention provides a heat sink 100, which includes: a heat sink 110; a substrate 120, one side of the substrate 120 is connected to the heat sink 110, and the other side of the substrate 120 is provided with a mounting position 141 for mounting a heat source that needs to dissipate heat; a heat conduction chamber is provided in the substrate 120, and the heat conduction chamber includes: an evaporation chamber 142, a condensation chamber 143, a first channel 144 and a second channel 145, one end of the evaporation chamber 142 and the condensation chamber 143 are connected through the first channel 144, and the other end of the evaporation chamber 142 and the condensation chamber 143 are connected through the second channel 145; the evaporation chamber 142 corresponds to the heat source; wherein the first channel 144 is higher than the second channel 145; the heat conduction medium in the heat conduction chamber circulates along the direction of the evaporation chamber 142, the first channel 144, the condensation chamber 143, the second channel 145, and the evaporation chamber 142.

[0036] In this embodiment, a heat source is positioned on the substrate 120 at a location corresponding to the evaporation chamber 142, capable of transferring heat to the evaporation chamber 142, which in turn conducts the heat to the liquid heat-conducting medium. After being heated in the evaporation chamber 142, the heat-conducting medium changes from liquid to gas, passing through the first channel 144 and carrying the heat to the condensation chamber 143. Within the condensation chamber 143, the heat-conducting medium is cooled by the heat sink 110, then changes from gas to liquid again, passing through the second channel 145 and returning to the evaporation chamber 142, completing a reciprocating cycle. This achieves the effect of rapidly dissipating the heat generated by the heat source through the medium to the entire substrate 120, and then achieving efficient heat dissipation through the contacting heat sink 110. Furthermore, the structure of directly providing a heat-conducting chamber is more convenient to manufacture and less costly than providing an embedded heat pipe.

[0037] Preferably, a vertical partition is provided in the heat conduction chamber, which divides the heat conduction chamber into an evaporation chamber 142 and a condensation chamber 143 on the left and right sides. Figure 2 As shown, there is a gap between the top of the vertical partition and the top of the heat conduction cavity, forming a first channel 144 shown in the dotted box; there is a gap between the bottom of the vertical partition and the bottom of the heat conduction cavity, forming a second channel 145 shown in the dotted box.

[0038] In a specific embodiment, the substrate 120 includes a sealing plate 130 and a base 140 . The heat conduction cavity is provided in the base 140 . The substrate 120 covers the heat conduction cavity and is connected to the base 140 .

[0039] It should be noted that the heat conduction cavity has a groove-like structure, and the base 140 is first processed into a groove to form the heat conduction cavity, and then the heat conduction cavity is sealed by the sealing plate 130, which makes processing more convenient.

[0040] The sealing plate 130 and the base 140 are provided with a plurality of holes in a circumferential direction for installing fasteners for connection.

[0041] In a specific embodiment, the mounting position 141 is located on a side of the base 140 away from the sealing plate 130 ; and the heat sink 110 is located on a side of the sealing plate 130 away from the base 140 .

[0042] It should be noted that the connection between the base 140 and the heat source is more stable, and the heat exchange between the heat source and the heat conduction cavity is facilitated, thereby improving the heat conduction efficiency.

[0043] In a specific embodiment, the substrate 120 further includes: a flow guide member, which is disposed in the heat conduction cavity.

[0044] It should be noted that the flow guide is used to control the flow direction of the heat-conducting medium in the heat-conducting cavity, so as to evenly distribute the heat-conducting medium and transfer heat to the heat sink 110 evenly and effectively, thereby improving the heat dissipation efficiency of the heat sink 110. In addition, the flow guide increases the heat exchange area of ​​the heat-conducting medium in the heat-conducting cavity, thereby further improving the heat exchange efficiency.

[0045] In a specific embodiment, the guide member includes a first guide member 146, which is arranged in the evaporation chamber 142 and / or the condensation chamber 143; the length direction of the first guide member 146 is the same as the flow direction of the heat transfer medium along the first channel 144 to the second channel 145.

[0046] It should be noted that the first flow guide 146 is used to control the flow direction of the heat-conducting medium in the evaporation chamber 142 and the condensation chamber 143, guiding the heat-conducting medium to flow from the evaporation chamber 142 into the first channel 144, and then flow from the first channel 144 through the condensation chamber 143 and the second channel 145 back to the evaporation chamber 142, thereby realizing the circulation of the heat-conducting medium.

[0047] In a specific embodiment, the guide member includes: a second guide member 147 and a third guide member 148, the second guide member 147 and the third guide member 148 are arranged in parallel in the evaporation chamber 142, and a heat conduction channel is formed between the second guide member 147 and the third guide member 148; wherein, in the direction from the second channel 145 to the first channel 144, the second guide member 147 and the third guide member 148 are alternately arranged left and right, and the heat conduction channel is also alternately arranged left and right.

[0048] It should be noted that the heat-conducting medium is guided by the second flow guide 147 and the third flow guide 148 and flows alternately left and right along the heat-conducting channel, thereby increasing the flow distance and fully performing heat exchange.

[0049] In a specific embodiment, the area of ​​the third flow guide 148 is larger than that of the second flow guide 147 ; the base 140 is provided with a mounting hole 149 , and the mounting hole 149 passes through to the third flow guide 148 .

[0050] It should be noted that the mounting hole 149 is used to install fasteners to fix the heat source to the mounting position 141; the guide member itself protrudes from the heat conduction cavity, increasing the thickness of the substrate 120, and the third guide member 148 has a larger area, so fixing the fasteners to the third guide member 148 is more stable, thereby achieving stable installation of the heat source.

[0051] Preferably, the first channel 144 and the second channel 145 may also be provided with flow guides, which is not limited here.

[0052] In a specific embodiment, the base plate 120 further includes at least two opposing mounting bosses 150 , with a mounting position 141 formed between the two mounting bosses 150 .

[0053] It should be noted that the mounting boss 150 is used to position and mount the installed heat source, for example, to fix the IGBT and the rectifier bridge.

[0054] In a specific embodiment, the heat sink 100 includes a clip 111 and a locking block 112, the clip 111 and the locking block 112 connecting the side of the heat sink 110 away from the substrate 120, the clip 111 has a clipping groove, and the locking block 112 is located in the clipping groove; wherein, the clipping groove of the clip 111 is clipped to the locking block 112 of the adjacent heat sink 110.

[0055] It should be noted that the buckle 111 and the locking block 112 cooperate to lock the heat sink 110 in its stacking direction; all heat sinks 110 are provided with the buckle 111 and the locking block 112, and are an integrated structure, so only the heat sink 110 needs to be produced to achieve assembly, and the production and installation efficiency is higher.

[0056] In a specific embodiment, one end of the buckle 111 away from the engaging groove abuts against the locking block 112 of the adjacent second heat sink 110 .

[0057] It should be noted that, in the stacking direction of the heat sink 110 , the buckle 111 can be locked by the front and rear locking blocks 112 , so the heat sink 110 will not tilt in any direction, and the installation effect is more stable.

[0058] Although the present invention is disclosed as above, it is not limited thereto. Any person skilled in the art may make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be subject to the scope defined by the claims.

Claims

1. A radiator, characterized in that: The radiator comprises: heat sink (110); A substrate (120), one side of the substrate (120) is connected to the heat sink (110), and the other side of the substrate (120) is used to install a heat source that needs to dissipate heat; a heat conduction cavity is provided in the substrate (120), and the heat conduction cavity includes: an evaporation cavity (142), a condensation cavity (143), a first channel (144), and a second channel (145); one end of the evaporation cavity (142) and the condensation cavity (143) are connected through the first channel (144), and the other end of the evaporation cavity (142) and the condensation cavity (143) are connected through the second channel (145); the evaporation cavity (142) corresponds to the heat source; The first channel (144) is higher than the second channel (145); and the heat-conducting medium in the heat-conducting cavity circulates along the direction of the evaporation cavity (142), the first channel (144), the condensation cavity (143), the second channel (145), and the evaporation cavity (142).

2. The radiator according to claim 1, characterized in that The substrate (120) comprises a sealing plate (130) and a base (140); the heat conduction cavity is provided on the base (140); the substrate (120) covers the heat conduction cavity and is connected to the base (140).

3. The radiator according to claim 2, characterized in that The heat sink (110) is located on a side of the sealing plate (130) away from the base (140).

4. The radiator according to claim 2, characterized in that The substrate (120) further comprises: a flow guide member, wherein the flow guide member is arranged in the heat conduction cavity.

5. The radiator according to claim 4, characterized in that The flow guide comprises a first flow guide (146), the first flow guide (146) being arranged in the evaporation chamber (142) and / or the condensation chamber (143); the length direction of the first flow guide (146) is the same as the flow direction of the heat transfer medium along the first channel (144) to the second channel (145).

6. The radiator according to claim 4, characterized in that The flow guide comprises: a second flow guide (147) and a third flow guide (148), wherein the second flow guide (147) and the third flow guide (148) are arranged in parallel in the evaporation chamber (142), and a heat conduction channel is formed between the second flow guide (147) and the third flow guide (148); Wherein, in the direction from the second channel (145) to the first channel (144), the second flow guide (147) and the third flow guide (148) are alternately arranged on the left and right, and the heat conduction channels are also alternately arranged on the left and right.

7. The radiator according to claim 6, characterized in that The third flow guide (148) has a larger area than the second flow guide (147); The base (140) is provided with a mounting hole (149), and the mounting hole (149) is connected to the third flow guide member (148).

8. The radiator according to claim 1, wherein The base plate (120) further comprises at least two opposing mounting bosses (150), with a mounting position (141) formed between the two mounting bosses (150).

9. The radiator according to claim 1, wherein: The heat sink comprises a buckle (111) and a locking block (112), the buckle (111) and the locking block (112) being connected to a side of the heat sink (110) away from the base plate (120), the buckle (111) having a snap-fitting groove, and the locking block (112) being located in the snap-fitting groove; The engaging groove of the buckle (111) is engaged with the locking block (112) of the adjacent heat sink (110).

10. The radiator according to claim 9, characterized in that One end of the buckle (111) away from the clamping slot abuts against a locking block (112) of the adjacent second heat sink (110).

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