Wire bonding system and lead replacement system

Abstract

The utility model provides a wire welding system. The wire bonding system comprises a welding head assembly, wherein the welding head assembly is configured to carry a wire bonding tool; and a wire replacement system configured to (i) remove a wire portion engaged with the wire bonding tool, the wire portion being part of a wire supply on a wire bonding system, and (ii) replace a wire portion to be engaged with the wire bonding tool. The utility model also provides a lead replacement system used for replacing the lead part on the wire bonding system, the lead replacement system comprises a clamping mechanism, the clamping mechanism is configured to clamp the lead part, and the clamping mechanism comprises a threading part and a wire bonding tool used for threading the lead part through the wire bonding system.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to U.S. Provisional Application No. 63 / 601,299, filed on November 21, 2023, the contents of which are incorporated herein by reference. Technical Field

[0003] The utility model relates to a wire bonding system, and in particular to a wire bonding system comprising a wire replacement system and / or a wire bonding tool replacement system. Background Art

[0004] In the processing and packaging of semiconductor devices, wire bonding continues to be the primary method for providing electrical interconnection between two locations within a package (e.g., between a die pad of a semiconductor die and a wire of a lead frame). More specifically, a wire bonder (also known as a wire bonding system) is used to form a wire arc between the various locations to be electrically interconnected. The primary methods for forming a wire arc are ball bonding and wedge bonding. When forming a weld between (a) the end of the wire arc and (b) the welding location (e.g., a pad, a wire, etc.), different types of welding energy may be used, including, for example, ultrasonic energy, thermoacoustic energy, hot pressing energy, etc., among others. Wire bonding systems (e.g., stud punches) are also used to form conductive bumps from portions of the lead.

[0005] Replacing a portion of a wire bonder and / or replacing a wire bonder tool on a wire bonder often results in significant delays or machine downtime. Therefore, it would be desirable to provide an improved wire bonder system that addresses these issues. Utility Model Content

[0006] According to an exemplary embodiment of the present invention, a wire bonding system is provided. The wire bonding system includes a bonding head assembly configured to carry a wire bonding tool. The wire bonding system also includes a lead replacement system configured to: (i) remove a lead portion engaged with the wire bonding tool, the lead portion being part of a lead supply on the wire bonding system; and (ii) replace a lead portion to be engaged with the wire bonding tool.

[0007] According to another exemplary embodiment of the present invention, a lead replacement system for replacing a lead portion of a wire bonding system is provided. The lead replacement system includes a clamping mechanism configured to clamp the lead portion, the clamping mechanism including a threading portion for threading the lead portion through a wire bonding tool of the wire bonding system.

[0008] According to other embodiments of the present invention, the wire bonding system and / or lead replacement system described in the two preceding paragraphs may have any one or more of the following features: the lead replacement includes a clamping mechanism, the clamping mechanism being configured to clamp the lead; the clamping mechanism includes (i) a fixed clamping portion and (ii) a movable clamping portion arranged adjacent to the fixed clamping portion, the movable clamping portion being configured to move in at least one direction relative to the fixed clamping portion; the clamping mechanism includes a spring, the spring being configured to actuate the movable clamping portion relative to the fixed clamping portion; a movable arm assembly, the movable arm assembly being configured to move the clamping mechanism; the clamping mechanism is carried by the movable arm assembly; the clamping mechanism includes a threading portion for threading the wire; the clamping mechanism includes a gripping portion for grasping the lead, a cutting portion for partially cutting the lead, and a threading portion for threading the wire; the clamping mechanism includes a tool clamping portion for clamping a wire bonding tool a lead replacement system configured to remove a wire bonding tool from a bonding head assembly; a wire bonding tool source configured to provide a plurality of wire bonding tools, the lead replacement system configured to replace the wire bonding tool at the bonding head assembly with one of the plurality of wire bonding tools from the wire bonding tool source; the lead replacement system configured to replace a lead portion by reengaging the lead portion with the wire bonding tool; the lead replacement system configured to replace a lead portion by engaging another lead portion with the wire bonding tool; a receiving portion for receiving the lead portion after the lead portion is removed by the lead replacement system; the clamping mechanism including an image registration feature, the image registration feature providing a reference for determining a position of the clamping mechanism; the vision system configured to determine a position of the clamping mechanism by collecting an image of the image registration feature; an optical path between the vision system and the image registration feature including a reflective optical element; and the optical path between the vision system and the image registration feature including a refractive optical element.

[0009] According to another exemplary embodiment of the present invention, a method for replacing a lead portion on a wire bonding system is provided. The method includes the following steps: (a) providing a bonding head assembly configured to carry a wire bonding tool, a lead portion engaged with the wire bonding tool, the lead portion being part of a wire supply on the wire bonding system; (b) removing the lead portion from the wire bonding tool using a lead replacement system; and (c) replacing the lead portion with the wire bonding tool using the lead replacement system.

[0010] According to other embodiments of the present application, the method of the preceding paragraph can have any one or more of the following features: the lead replacement system includes a clamping mechanism configured to clamp the lead; the clamping mechanism includes (i) a stationary clamping portion and (ii) a movable clamping portion disposed adjacent the stationary clamping portion, the movable clamping portion configured to move relative to the stationary clamping portion in at least one direction; the clamping mechanism includes a spring configured to actuate the movable clamping portion relative to the stationary clamping portion; the clamping mechanism is carried by a movable arm assembly; the clamping mechanism includes a gripping portion for gripping the lead, a cutting portion for partially cutting the lead, and a threading portion for threading the lead; the clamping mechanism includes a tool clamping portion for clamping the bonding tool; the lead replacement system is configured to remove the bonding tool from the bonding head assembly; the lead replacement system includes a bonding tool supply configured to supply a plurality of bonding tools, the lead replacement system configured to replace the bonding tool at the bonding head assembly with one of the plurality of bonding tools from the bonding tool supply; the lead replacement system includes a receiving portion for receiving the lead portion after the lead portion is removed in step (b); step (b) includes a sub-step (bl) of partially cutting the lead supply with the clamping mechanism of the lead replacement system to create a cut, the cut defining an end of the lead portion on the bonding system to be replaced, the cut being formed at a location on the bonding system between the lead clamp and the bonding tool; step (b) includes a sub-step (b2) after sub-step (bl) of pulling the lead portion to move the cut location closer to the bonding tool; step (b) includes a sub-step (b3) after sub-step (b2) of severing the lead portion from the lead supply at the cut by pulling the lead with the clamping mechanism while the lead clamp is closed; the cutting portion of the clamping mechanism is used in association with sub-step (bl); between steps (b) and (c), the bonding tool is removed and another bonding tool is supplied to the bonding head assembly with the lead replacement system; step (c) includes a lead threading process; step (c) includes threading another lead portion through one of the bonding tool and another bonding tool associated with the lead threading process; step (c) includes threading the lead portion through one of the bonding tool and another bonding tool associated with the lead threading process; the lead threading process includes use of the threading portion of the clamping mechanism of the lead replacement system; the lead threading process includes the steps of: pulling an end portion of the lead supply through the bonding tool with the clamping mechanism; the clamping mechanism uses a plurality of movements of the clamping mechanism to pull the end portion of the lead supply through the bonding tool; the lead threading process includes sub-steps (i) gripping the end portion of the lead supply with the clamping mechanism; (ii) opening the lead clamp, (iii) moving the clamping mechanism so that the end portion of the lead supply is moved downward, and (iv) closing the lead clamp; each of sub-steps (i)-(iv) is repeated until the end portion of the lead supply is pulled through the bonding tool;and repeating each of sub-steps (i)-(iv) until the distal end of the wire supply is pulled through the wire bonding tool and a wire tail having a predetermined length is formed beneath the wire bonding tool. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] The present invention can be better understood by reading the following detailed description in conjunction with the accompanying drawings. It should be emphasized that, according to common practice, the various features in the drawings are not drawn to scale. Instead, the dimensions of the various features are arbitrarily expanded or reduced for clarity. The drawings include the following schematic diagrams:

[0012] Figures 1A to 1F are various perspective views of various parts of a wire bonding system according to an exemplary embodiment of the present invention;

[0013] Figures 2A to 2B is a perspective view of a wire bonding tool source according to an exemplary embodiment of the present invention;

[0014] Figures 2C to 2D is a perspective view of another wire bonding tool source according to an exemplary embodiment of the present invention;

[0015] Figures 3A to 3H yes Figures 1A to 1F Various block diagram side views of the wire bonding system;

[0016] Figures 4A to 4D are various perspective views of components of another wire bonding system according to an exemplary embodiment of the present invention;

[0017] Figures 5A to 5H yes Figures 3A to 3D Various block diagram side views of the components of the wire bonding system;

[0018] Figures 6A to 6E are various perspective views illustrating a wire bonding system according to another exemplary embodiment of the present invention;

[0019] 7A to 7F yes Figures 6A to 6E Various block diagram side views of the components of the wire bonding system;

[0020] Figure 8A and Figure 8B is a perspective view illustrating another wire bonding system according to an exemplary embodiment of the present invention;

[0021] Figure 9A and Figure 9B is a perspective view illustrating elements of a wire bonding tool changing system according to an exemplary embodiment of the present invention; and

[0022] Figure 10 and Figure 11 is a flow chart illustrating various exemplary embodiments of the present invention. DETAILED DESCRIPTION

[0023] Various wire bonding systems (and components thereof) and related methods are provided herein. In certain embodiments, the wire bonding system includes a wire bonding tool replacement system. In certain embodiments, the wire bonding tool replacement system can be configured to automatically replace a wire bonding tool (e.g., a capillary). The wire bonding tool replacement system can be configured to: precisely position a clamping mechanism (e.g., a "gripper") to clamp the wire bonding tool to a welding system (e.g., a welding machine, a "welder," etc.); loosen a screw (e.g., a "cap screw" or other tightening mechanism) using a robotic wrench; and / or remove a used wire bonding tool from a transducer (e.g., an ultrasonic transducer) of the wire bonding system. In certain embodiments, the wire bonding tool replacement system can be configured to: pick up a new wire bonding tool from a wire bonding tool source (e.g., a capillary supply); insert the new wire bonding tool into a wire bonding tool hole of the transducer; and / or tighten (e.g., automatically tighten) a screw before a subsequent wire bonding operation. In certain embodiments, the wire tool changing system can be configured to provide real-time communication with the bonding system (e.g., a computer of the bonding system) regarding: positioning the clamping mechanism with the target wire tool; positioning the wire tool; and / or positioning the wrench (e.g., associated with a servo and / or robotic wrench arm assembly). In certain embodiments, the wire tool changing system can be configured to provide feedback control associated with robotic positioning. In certain embodiments, open / short circuit detection can be used for wire tool changes (e.g., removing the wire tool, picking up the wire tool, inserting the wire tool, tightening / loosening screws, etc.).

[0024] Certain embodiments of the present invention provide certain advantages, such as automatically changing wire bonding tools, thereby reducing labor hours (eg, man-hours).

[0025] Certain embodiments of the present invention provide a wire bonding system, comprising a wire replacement system configured to: (i) remove a portion of a wire engaged with a wire bonding tool; and (ii) replace a portion of the wire (e.g., with the same portion of the wire, with another portion of the wire). Certain embodiments provide automated wire threading using a robotic mechanism (e.g., during a wire bonding tool replacement operation in a wire bonding system). Certain embodiments include: partially cutting (e.g., a "half-cut" cut) a wire (e.g., at a location between a wire clamp and a transducer) using a cutting mechanism (e.g., a blade, a cutting portion of a clamping mechanism, etc.); moving a clamping mechanism (e.g., a gripper) below the wire bonding tool; pulling the wire downward so that the partial cut / cut is located at / near a middle portion of an inner bore of the wire bonding tool; closing the wire clamp and clamping mechanism of the bonding head assembly; pulling the wire downward with the clamping mechanism so that the lead is disconnected at the partial cut / cut; completing the wire threading process after removing the wire bonding tool; and / or inserting another (e.g., new) wire bonding tool. Other embodiments include removing a lead portion engaged with a wire bonding tool and replacing the lead portion with an identical lead portion (eg, after replacing the wire bonding tool) without cutting and / or breaking the lead portion.

[0026] Certain embodiments of the present invention provide certain advantages, such as automating wire threading (e.g., associated with wire bonding tool changes), thereby reducing labor hours (e.g., man-hours). Other advantages include consistent wire disconnection to secure the lead tail position, which is located just below the transducer surface within the hole of the wire bonding tool. Certain methods do not require additional mechanisms to secure the position of the lead against the hole of the wire bonding tool, yet provide a high success rate (e.g., due in part to the highly reliable alignment calibration provided by the wire bonding system).

[0027] Referring now to the accompanying drawings, Figure 1AA wire bonding system 100 is illustrated. Wire bonding system 100 includes a bonding head assembly 102 (partially shown) configured to carry a wire bonding tool 110. Bonding head assembly 102 is illustrated as including a wire clamp 104 and a transducer 106. Wire clamp 104 is configured to switch between (i) allowing a wire supply 108 to pass freely through and (ii) grasping wire supply 108 to prevent relative movement between wire supply 108 and bonding head assembly 102. The present invention is not limited to any particular operation of wire clamp 104 (e.g., one portion of wire clamp 104 can be moved relative to another portion to grasp wire supply 108, multiple portions of wire clamp 104 can be moved relative to each other to grasp wire supply 108, etc.). Wire supply 108 is illustrated as being disposed through both wire clamp 104 (e.g., in a closed configuration) and transducer 106. Wire supply 108 can be continuous with a wire source (eg, a wire spool of a wire bonding system). Wire portion 108a of wire supply 108 is shown disposed through wire bonding tool 110.

[0028] The wire bonding system 100 also includes a wire bonding tool replacement system 112a (partially shown). It should be understood that the wire bonding tool replacement system 112a is not identical to that described elsewhere herein (e.g., Figures 4A to 4D 、 Figures 5A to 5H 、 Figures 6A to 6E 、 7A to 7F The wire replacement system 112b and / or the wire replacement system 112b′ described in connection with the wire bonding systems 300 and 600 share many of the same elements and aspects. For example, both the wire bonding tool replacement system 112a and the wire replacement system 112b include a clamping mechanism 114.

[0029] The wire bonding tool replacement system 112a is configured to replace the wire bonding tool 110 with another wire bonding tool (e.g., another wire bonding tool 110 or a different type of wire bonding tool). The wire bonding tool replacement system 112a is illustrated as including a clamping mechanism 114 for clamping and / or removing the wire bonding tool 110 from the bonding head assembly 102. The clamping mechanism 114 is illustrated as being carried by a movable arm assembly 128 (partially shown).

[0030] The clamping mechanism 114 can be configured to clamp the wire bonding tool 110 (e.g., to remove the wire bonding tool 110 from the bonding head assembly 102). In certain embodiments, the clamping mechanism 114 can be configured to include a clamping portion (e.g., a first clamping portion 114a and / or a second clamping portion 114b). In certain embodiments, the clamping mechanism 114 includes: (i) a gripping portion for gripping the wire supply 108; (ii) a cutting portion for partially cutting the wire supply 108; (iii) a threading portion for threading the wire supply 108; and / or (iv) a tool gripping portion for gripping the wire bonding tool 110.

[0031] The clamping mechanism 114 is shown as including a first clamping portion 114a (e.g., a movable clamping portion) and an adjacent second clamping portion 114b (e.g., a fixed clamping portion). The second clamping portion 114b is shown as including a gripping portion 114b1 (e.g., for gripping and / or clamping the wire supply 108 and / or the wire bonding tool 110) and a tool gripping portion 114b2 (e.g., for clamping the wire bonding tool 110). It should be understood that in certain embodiments, each clamping portion 114a / 114b may include one or more gripping portions and a tool gripping portion. The first clamping portion 114a can be configured to move relative to the second clamping portion 114b in at least one direction (e.g., laterally along the x-axis).

[0032] The wire bonding tool changing system 112a is configured to provide a clamping force sufficient to support, hold, remove, and / or replace the wire bonding tool 110 during a clamping operation and / or a wire bonding tool changing operation. In certain embodiments, the clamping mechanism 114 may include a spring 122 (e.g., a leaf spring) for providing a clamping force associated with the clamping operation. The spring 122 may be configured to actuate at least a portion of the first clamping portion 114a (e.g., a moving clamping portion, a gripping portion, a cutting portion, a threading portion, a tool clamping portion) relative to the second clamping portion 114b (e.g., a stationary clamping portion).

[0033] Now refer to Figure 1B , the figure shows that the wire bonding tool replacement system 112a and the clamping mechanism 114 have been moved (i.e., along the y-axis) below the transducer 106 and around the wire bonding tool 110. A wrench 118 (e.g., a cap screw wrench) is shown rotated about the x-axis to loosen the screw 116 (e.g., a cap screw), thereby loosening the transducer 106 to release the wire bonding tool 110. Before (or while) tightening the transducer 106, the clamping mechanism 114 can clamp the wire bonding tool 110 with a desired clamping force (e.g., by moving the first clamping portion 114a relative to the second clamping portion 114b). In certain embodiments, the wrench 118 can be included in the wire bonding tool replacement system 112a (e.g., controlled by a general purpose computing system associated with the clamping mechanism 114).

[0034] Now refer to Figure 1C , wire bonding tool replacement system 112a and clamping mechanism 114 are shown moving wire bonding tool 110 away (i.e., along the z-axis) from bond head assembly 102 and transducer 106. After wire bonding tool 110 is removed (e.g., a "used" or damaged wire bonding tool), wire bonding tool replacement system 112a can discard wire bonding tool 110.

[0035] Now refer to Figure 1D, the figure shows the wire tool replacement system 112a and the clamping mechanism 114 removing the wire tool 110 from the wire tool source 120 (ie, along the z-axis). The wire tool source 120 defines a storage area for waste material (e.g., Figures 4A to 4D and Figures 5A to 5H 1. A receiving portion 120a of a wire bonding tool 110 (e.g., a used wire bonding tool 110, a portion of wire bonded after being removed by a wire replacement system) is shown. A gripping mechanism 114 is shown gripping a wire bonding tool 110 (e.g., a "new" or undamaged wire bonding tool) and beginning to move the wire bonding tool 110 away from the wire bonding tool source 120 (i.e., along the z-axis).

[0036] The gripping mechanism 114 is configured to extract the wire bonding tool 110 from the wire bonding tool source 120 and carry the wire bonding tool 110 to the bonding head assembly 102. Such configuration may include specific gripping portions sized to enable the gripping mechanism 114 to extract one of a plurality of wire bonding tools 110. Such configuration may also include mechanically coupling portions of the gripping mechanism 114 to a motion system (e.g., of the wire bonding tool changing system 112a) to move the gripping mechanism 114 across a range of motion (e.g., from the bonding head assembly 102 to the wire bonding tool source 120). Such a motion system may be configured to execute computer-readable instructions; such computer-readable instructions may include information related to the plurality of wire bonding tools 110 (e.g., position or size information of each of the plurality of wire bonding tools 110) and motion profiles, and / or predetermined events (e.g., number of bonding operations, time since installation, other information related to automatically changing a wire bonding tool upon the occurrence of a predetermined event, etc.).

[0037] Although Figure 1D The wire bonding tool source 120 is shown in a particular configuration, but the present invention is not limited thereto. Other configurations of the wire bonding tool source are contemplated. For example, any number of slots for multiple wire bonding tools 110 are contemplated. The wire bonding tool source can be configured to be on the top side rather than Figure 1D The bottom side of the wire bonding tool 110 is shown. Such a wire bonding tool source is illustrated and described herein (e.g., see Figures 2A to 2D ). Wire bonding tools are available individually or as part of a cassette set (see, for example, Figures 2C to 2D The wire tool source may be included as part of the wire tool replacement system and / or lead replacement system (eg, structurally integrated, electrically integrated), or may be separate from the wire tool replacement system. No receiving portion is required.

[0038] Now refer to Figure 1E , the figure shows the wire bonding tool replacement system 112a and the clamping mechanism 114 moving the wire bonding tool 110 below the transducer 106 (ie, along the z-axis).

[0039] Now refer to Figure 1F , wire bonding tool 110 is disposed within transducer 106. Wrench 118 (e.g., a cap screw wrench) is shown rotated about the x-axis to tighten screw 116 (e.g., a cap screw), thereby tightening transducer 106 to grasp wire bonding tool 110. After (and / or while) tightening transducer 106, clamping mechanism 114 may unclamp from wire bonding tool 110 (e.g., by moving first clamping portion 114a relative to second clamping portion 114b).

[0040] Although the wire bonding tool replacement system 112a / lead replacement system 112b can be included in a single wire bonding system (e.g., a single wire bonding machine), the present invention is not limited thereto. In certain embodiments, the wire bonding tool replacement system 112a / lead replacement system 112b can be configured to be removed from the wire bonding system 100 and used in conjunction with another wire bonding system. In certain embodiments, the wire bonding tool replacement system 112a / lead replacement system 112b can be automatically moved (e.g., via a robot) between multiple wire bonding systems.

[0041] Now refer to Figures 2A to 2D , the figure shows a wire bonding tool source that can be used to replace the wire bonding tool source 120. In particular, Figure 2A and Figure 2B Wire bonding tool source 120' is shown, and Figure 2C and Figure 2D A wire bonding tool source 120' is illustrated. Wire bonding tool sources 120' and 120" are configured to simultaneously (i) provide a plurality of wire bonding tools 110 (e.g., each of the plurality of wire bonding tools 110 is mountable in a slot of wire bonding tool source 120' / 120"), and (ii) provide a receiving portion (such as receiving portion 120a' defined by wire bonding tool source 120', or an empty slot 120b' or 120b1") to receive a wire bonding tool from a wire bonding system (e.g., to receive a used wire bonding tool, etc.).

[0042] Figure 2A A wire replacement system 112b' is shown interacting with a wire bonding tool source 120' (the wire replacement system 112b' will be combined with Figures 6A to 6E 106 )(wherein the wire replacement system 112b' is configured to replace the wire bonding tool 110). The wire replacement system 112b' carries the wire bonding tool 110 with the clamping mechanism 114' (eg, a used wire bonding tool 110 that has been removed from the transducer 106, such as Figure 1C). Wire replacement system 112b' is aligned with empty slot 120b' so that wire bonding tool 110 (e.g., a used wire bonding tool) can be installed in empty slot 120b'. By receiving wire bonding tool 110 in this manner, empty slot 120b' can be used as a receiving portion (different from used receiving portion 120a') for receiving wire bonding tool 110 (e.g., a used wire bonding tool) to remove waste from the wire bonding system.

[0043] Although Figure 2A The figure shows the use of an empty slot 120b' to receive the wire bonding tool 110, but the present invention is not limited thereto. It is envisioned that the receiving portion 120a' can be used to receive (i) a wire bonding tool (e.g., a used wire bonding tool) and (ii) a lead (e.g., Figures 5E to 5F As described herein, at least one of the lead portions 108a) has been removed.

[0044] exist Figure 2B In FIG. 1 , a wire bonding tool 110 has been inserted into an empty slot 120b′, and a wire replacement system 112b′ has removed another wire bonding tool 110 from a wire bonding tool source 120′, creating a new empty slot 120b′ (e.g., another “used” wire bonding tool 110 may be inserted into the new empty slot 120b′). The wire replacement system 112b′ may install the wire bonding tool 110 into the transducer of the wire bonding system (e.g., see FIG. 1 ). Figure 1E and Figure 1F ).

[0045] When some or all of the plurality of wire bonding tools 110 have been removed from the wire bonding tool source 120' (and possibly replaced with used wire bonding tools 110), the wire bonding tool source 120' can be removed from the wire replacement system 112b'. Alternatively, the used wire bonding tools 110 can be removed and / or replaced individually (e.g., manually or via an automated process).

[0046] exist Figure 2C , a wire bonding tool source 120 ″ includes a wire bonding tool box 120 b ″ that accommodates a plurality of wire bonding tools 110 and an empty slot 120 b 1 . The wire bonding tool box 120 b ″ is an example of a mechanism for holding a plurality of wire bonding tools 110 , such that the plurality of wire bonding tools 110 can be efficiently loaded into the wire bonding tool source 120 ″. Figure 2C 1. The lead replacement system 112b' (including the clamping portion 114) is shown to insert the wire bonding tool 110 into the empty slot 120b1 (eg, to Figure 2A and Figure 2B similar manner as described in the related section).

[0047] exist Figure 2DIn FIG, a wire bonding tool cassette 120b″ is being removed from a wire bonding tool source 120″, revealing a cassette base 120c″ defined by the wire bonding tool source 120″. The cassette base 120c″ is configured to receive another wire bonding tool cassette 120b″. After removal, the wire bonding tool cassette 120b″ can be discarded or reloaded with additional / new wire bonding tools (e.g., manually or via an automated process). The wire bonding tool cassette 120b″ can be configured to include a cover to protect the plurality of wire bonding tools 110 from damage during shipping and handling.

[0048] Although Figures 2A to 2D The diagram illustrates the interaction between the lead replacement system 112b' and the wire tool sources 120', 120", but the present invention is not limited thereto. That is, any wire tool replacement system or lead replacement system within the scope of the present invention (e.g., the wire tool replacement system 112a, the lead replacement system 112b, etc.) can be used to interact with any wire tool source within the scope of the present invention (e.g., the wire tool sources 120', 120").

[0049] Now refer to Figures 3A to 3H , which illustrates various block diagram side views of selected portions of the wire bonding system 100. Figure 3A , the wire bonding system 100 is illustrated as including a bonding head assembly 102 (including a transducer 106). A wire bonding tool 110 is illustrated as being carried by the bonding head assembly 102 and disposed within the transducer 106. The wire bonding system 100 also includes a wire bonding tool replacement system 112a (partially illustrated). The wire bonding tool replacement system 112a is configured to replace the wire bonding tool 110 with another wire bonding tool (e.g., another wire bonding tool 110). The wire bonding tool replacement system 112a is illustrated as including a clamping mechanism 114 for clamping and removing the wire bonding tool 110 from the bonding head assembly 102. The clamping mechanism 114 includes a first clamping portion 114a (e.g., a moving clamping portion) and a second clamping portion 114b (e.g., a fixed clamping portion) adjacent to the first clamping portion 114a. Figure 3B , a clamping mechanism 114 is shown gripping the wire bonding tool 110 .

[0050] Now refer to Figure 3C , wrench 118 (e.g., a cap screw wrench) is shown rotated about the x-axis to loosen screw 116 (e.g., a cap screw), thereby loosening transducer 106 to release wire bonding tool 110. Prior to (and / or concurrently with) loosening transducer 106, clamping mechanism 114 may clamp wire bonding tool 110 (e.g., by moving first clamping portion 114a relative to second clamping portion 114b).

[0051] Now refer to Figure 3D, the figure shows that the clamping mechanism 114 moves the wire bonding tool 110 away from (ie, along the z-axis) the bond head assembly 102 and the transducer 106. The wire bonding tool 110 can be discarded before retrieving another wire bonding tool.

[0052] Now refer to Figure 3E , the wire bonding tool source 120 ′ is shown as including a plurality of wire bonding tools 110 (ie, Figures 3E to 3F In the block diagram representation of FIG, only four wire bonding tools 110 and corresponding slots are shown.) The second clamping portion 114b is shown adjacent to the wire bonding tool source 120'.

[0053] Now refer to Figure 3F , the clamping mechanism 114 is shown removing the wire bonding tool 110 from the wire bonding tool source 120 ′ (ie, along the z-axis).

[0054] Now refer to Figure 3G , the figure shows the clamping mechanism 114 moving the wire bonding tool 110 below the transducer 106 (ie, along the z-axis).

[0055] Now refer to Figure 3H , a wire bonding tool 110 is shown disposed within transducer 106. Wrench 118 (e.g., a cap screw wrench) is shown rotated about the x-axis to tighten screw 116 (e.g., a cap screw), thereby tightening transducer 106 to grip wire bonding tool 110. After (and / or while) tightening transducer 106, clamping mechanism 114 may unclamp from wire bonding tool 110 (e.g., by moving first clamping portion 114a relative to second clamping portion 114b).

[0056] Although the wire bonding system 100 (combined Figures 1A to 1F and Figures 3A to 3H 10 is configured to (e.g., automatically) remove and replace a wire bonding tool, but the present invention is not limited thereto. For example, a similar wire bonding system can be used to (e.g., automatically) remove and replace a lead. The movable arm assembly 128 and / or the clamping mechanism 114 can be configured to remove a lead from the wire bonding tool 110, and to replace a lead in connection with replacing the wire bonding tool 110. In one aspect, the clamping mechanism can include (i) a gripping portion for gripping the lead, (ii) a cutting portion for partially cutting the lead, and (iii) a threading portion for threading the lead (in addition to a tool clamping portion for gripping the wire bonding tool).

[0057] Now refer to Figure 4A , the figure shows the lead replacement system 112b (partially shown) of the wire bonding system 300. It should be understood that the lead replacement system 112b is different from other parts of this document (e.g., Figures 1A to 1D 、 Figures 3A to 3HThe wire bonding tool replacement system 112a described in connection with the wire bonding system 100 shares many of the same elements and aspects. For example, Figure 4A Various elements of the clamping mechanism 114 are illustrated, including the wire bonding tool 110 being illustrated being clamped by the clamping mechanism 114 .

[0058] Lead replacement system 112b is configured to: (i) remove a portion of a lead engaged with wire bonding tool 110; and (ii) replace the lead portion (e.g., with the same lead portion or another lead portion). Lead replacement system 112b includes a clamping mechanism 114 configured to clamp a lead.

[0059] The clamping mechanism 114 is shown as including a first clamping portion 114a (e.g., a movable clamping portion) and a second clamping portion 114b (e.g., a fixed clamping portion) disposed adjacent to the first clamping portion 114a. The clamping mechanism 114 is shown as including a spring 122 configured to actuate the movable clamping portion (e.g., the first clamping portion 114a) relative to the fixed clamping portion (e.g., the second clamping portion 114b). The clamping mechanism 114 is shown as including a gripping portion 114a1 / 114b1 for gripping a lead. The clamping mechanism 114 is shown as including a cutting portion 324 for cutting a lead (e.g., completely cutting a lead, half-cutting a lead, partially cutting a lead, creating a notch, etc.). The clamping mechanism 114 is shown as including a threading portion 326 for threading a wire. The clamping mechanism 114 is shown as including a tool gripping portion 114b2 for gripping the wire bonding tool 110. In particular embodiments, the clamping mechanism 114 may be carried by a movable arm assembly 128 .

[0060] The movable arm assembly 128 is configured to move the clamping mechanism 114 independently of the bond head assembly 102 and / or the XY stage that carries the bond head assembly 102. Thus, the clamping mechanism 114 differs from the wire clamp 104 in that the wire clamp 104 is part of the bond head assembly 102 and, therefore, cannot be moved independently of the bond head assembly 102. The movable arm assembly 128 may have its own motion system / positioning system, for example, where the motion system / positioning system is housed within the wire bonding tool changing system 112a / wire changing system 112b.

[0061] Now refer to Figure 4B , a wire bonding system 300 is shown. Wire bonding system 300 includes a bonding head assembly 102 (partially shown) configured to carry a wire bonding tool 110. Bonding head assembly 102 is shown as including a wire clamp 104 and a transducer 106. A wire supply 108 is shown disposed through both wire clamp 104 and transducer 106. A wire portion 108a of wire supply 108 is shown disposed through wire bonding tool 110.

[0062] The wire bonding system 300 also includes a wire replacement system 112b (partially illustrated) that is configured to (i) remove a portion of a wire that is engaged with the wire bonding tool and (ii) replace the wire portion (e.g., with the same wire portion or another wire portion). It should be appreciated that while the wire replacement system 112b can primarily replace the wire, the present disclosure is not so limited; in particular embodiments, the wire replacement system 112b can be configured to provide (or remove from) the bond head assembly 102 the wire bonding tool 110. It should be appreciated that the wire bonding tool 110 can be provided to the transducer 106 (of the bond head assembly 102) by the wire replacement system 112b.

[0063] In Figure 4B In particular embodiments, the wire replacement system 112b is illustrated as cutting the wire supply 108 with a cutting portion 324 (e.g., a“half-cutting blade”) to partially cut (e.g.,“half-cut”) the wire supply 108. The clamping mechanism 114 has been positioned (e.g., along the z-axis in the“open” configuration) and then closed to perform the cutting operation, thereby forming a“half-cut” (or partial severance) on the wire supply 108. It should be appreciated that the cutting portion 324 can be controlled by a spring (e.g., using the spring 122) and can provide a clamping force that is different than the gripping force or the cutting force. During this cutting operation, the wire clamp 104 can be in the“closed” configuration.

[0064] After cutting the wire supply 108, the wire clamp 104 can be opened (i.e., in the“open” configuration) and the clamping mechanism 114 of the wire replacement system 112b can be moved away from the wire clamp 104 (i.e., downward or along the z-axis) so as to feed the wire supply 108 through the wire bonding tool 110.

[0065] In Figure 4C In particular embodiments, the cutting operation and the first wire feeding operation have been completed. The clamping mechanism 114 of the wire replacement system 112b is illustrated as having been moved below the wire bonding tool 110. The clamping mechanism 114 can grip the wire portion 108a with the gripping portion 114al (and the gripping portion 114bl, not illustrated in the figure) and feed the wire supply 108 in connection with a feeding operation. This feeding operation can be repeated for multiple cycles (e.g., two cycles, three cycles, etc.). This feeding operation includes opening and closing the wire clamp 104 in connection with each cycle. At the end of the feeding operation, the partial cut is approximately aligned with the top of the wire bonding tool 110. The wire clamp 104 is then closed and the clamping mechanism 114 can pull the wire supply 108 (e.g., along the z-axis) so that the wire supply 108 is severed at the partial cut. In particular embodiments, a new wire bonding tool can be provided after the wire supply 108 is severed at the partial cut.

[0066] In Figure 4D , the lead supply 108 has been disconnected at the partial cut / incision, and the clamping mechanism 114 of the lead replacement system 112b is shown as having been moved above the transducer 106. The clamping mechanism 114 is shown closed around the lead supply 108 using a threading portion 326 (e.g., a threading blade). The clamping mechanism 114 can be moved away from the lead clamp 104 in association with the lead threading process. Such a threading process can be repeated for multiple cycles (e.g., two cycles, three cycles, etc.). Such a threading process includes opening and closing the lead clamp 104 in association with each cycle. Such a threading process is repeated until the lead portion 108a is extended to the desired length (e.g., as shown in FIG. 1 ). Figure 4D As shown, the lead portion 108a extends from the wire bonding tool 110. After the threading process is completed, the lead clamp 104 is closed.

[0067] Figures 5A to 5H Various cross-sectional block diagrams of portions of the wire bonding system 300 and / or the lead replacement system 112b are illustrated in connection with certain exemplary embodiments of the present invention.

[0068] exist Figure 5A FIGURE 1 illustrates a clamping mechanism 114 of a lead replacement system 112b. The clamping mechanism 114 is shown as including a first clamping portion 114a (a movable clamping portion) and a second clamping portion 114b (e.g., a fixed clamping portion) disposed adjacent to the first clamping portion 114a. The first clamping portion 114a is configured to move in at least one direction relative to the second clamping portion 114b. The clamping mechanism 114 is shown as including a gripping portion 114a1 for gripping a lead, a cutting portion 324 for cutting (e.g., half-cutting) the lead, and a threading portion 326 for threading a wire. The clamping mechanism 114 is shown as including a tool gripping portion 114b2 for gripping a tool (e.g., the wire bonding tool 110).

[0069] The clamping mechanism 114 is shown as including a spring 122, which is configured to actuate the first clamping portion 114a relative to the second clamping portion 114b. The spring 122 is shown as including a plurality of springs, including a spring 122a (configured to provide a cutting force to the cutting portion 324) and a spring 122b (configured to provide a gripping force to the threading portion 326). The cutting portion 324 and the threading portion 326 can be controlled by springs having different mechanical forces (e.g., different spring constants) from each other.

[0070] exist Figure 5B , the clamping mechanism 114 is shown positioned above the transducer 106 prior to a cutting operation. The cutting portion 324 is shown adjacent to the lead supply 108, with the clamping mechanism 114 in an "open" position prior to the cutting operation. The lead clamp 104 is shown in a "closed" position.

[0071] exist Figure 5C , the clamping mechanism 114 has been closed in connection with the cutting operation. The clamping mechanism 114 of the lead replacement system 112b is shown partially cutting the lead supply 108 to create a cut 330. The cut 330 defines the end of the lead portion 108a to be replaced on the wire bonding system 300. The cut 330 has been formed at a location between the lead clamp 104 and the wire bonding tool 110 on the wire bonding system 300. The clamping mechanism 114 can then be moved (e.g., downwardly along the z-axis) in connection with the first feeding operation.

[0072] exist Figure 5D In FIG. 3 , cutout 330 has been formed. Clamping mechanism 114 is shown as having been moved (e.g., downwardly along the z-axis) below wire bonding tool 110 and positioned adjacent to wire supply 108. Clamping mechanism 114 is positioned so that gripping portions 114a1 / 114b1 contact and clamp wire supply 108. Clamping mechanism 114 is shown as being moved further downwardly (i.e., along the z-axis) in connection with the feeding operation. This feeding operation can be repeated for multiple cycles (e.g., two cycles, three cycles, etc.). This feeding operation includes opening and closing wire clamp 104 in connection with each cycle.

[0073] exist Figure 5E , the feeding operation has been completed, and the notch 330 is approximately aligned with the top of the wire bonding tool 110. The lead clamp 104 is closed, and the clamping mechanism 114 can pull the lead portion 108a (e.g., along the z-axis) so that the lead supply 108 is broken at the notch 330.

[0074] exist Figure 5F In FIG. 1 , lead portion 108a has been removed, thereby forming new lead end portion 108a1. Removed lead portion 108a may be discarded in a receiving portion (e.g., for waste, such as used wire bonding tools or leads) of lead replacement system 112b. Figure 1D In the receiving part 120a).

[0075] exist Figure 5G In the present invention, another wire bonding tool 110 is provided (for example, using a combination of Figures 1A to 1F and / or Figures 3A to 3HThe clamping mechanism 114 has moved between the wire clamp 104 and the transducer 106 such that the threading portion 326 is positioned to perform a wire threading process. The wire threading process includes pulling the end portion of the wire supply 108 through the bonding tool 110 with the clamping mechanism 114. For example, the clamping mechanism 114 can grasp the end portion of the wire supply 108. Then, as the wire clamp 104 opens, the clamping mechanism 114 can move such that the end portion of the wire supply 108 moves downward. Then, the clamping mechanism 114 can open, the wire clamp 104 can close, and the clamping mechanism 114 can move upward relative to the wire supply 108 and the wire clamp 104. The threading process can repeat for a number of cycles (e.g., two cycles, three cycles, etc.). Such a threading process includes opening and closing the wire clamp 104 in relation to each cycle. Such a threading process repeats until the wire portion 108a extends to a desired length (e.g., such that the wire portion 108a extends out from the bonding tool 110; such that a proper wire tail of the desired length is formed, etc.). After the threading process is complete, the wire clamp 104 closes.

[0076] In Figure 5H the threading process has been completed, and a new wire end portion 108al has now been threaded through the bonding tool 110.

[0077] While Figures 4A to 4D and Figures 5A to 5H While the process of using a half-cut to facilitate removal of a portion of the wire during a bonding tool change process is illustrated and described, the present disclosure is not limited thereto. Figures 6A to 6E An exemplary process of removing a portion of the wire from the bonding tool without cutting the wire on the bonding system 600 is illustrated. Figures 6A to 6E Each of the figures in

[0078] In Figure 6A the wire change system 112b' is positioned above the bonding head assembly 102. The clamping mechanism 114' of the wire change system 112b' engages against the wire supply 108, preventing the wire supply 108 from moving relative to the clamping mechanism 114' (e.g., moving / actuating the clamping portion to press the wire supply 108 against the stationary clamping portion). The wire clamp 104 is in an open position, allowing the wire supply 108 to pass freely.

[0079] In Figure 6B1 , the bond head assembly 102, including the wire clamp 104, the transducer 106, and the wire bonding tool 110, moves downward (i.e., away from the clamping mechanism 114'). Since the wire clamp 104 is opened, the bond head assembly 102 and the transducer 106 pass over the wire supply 108, allowing the end of the wire supply 108 to move upward relative to the wire bonding tool 110.

[0080] exist Figure 6C 1 , the wire supply 108 moves upwardly along the clamping mechanism 114'. The wire clamp 104 closes, preventing the wire supply 108 from moving relative to the bond head assembly 102. The bond head assembly 102 moves upwardly toward the clamping mechanism 114'. From the moment the wire clamp 104 closes, the wire supply 108 moves upwardly along with the bond head assembly 102 and through the clamping mechanism 114'.

[0081] exist Figure 6D , the clamping mechanism 114' is closed again, and the wire clamp 104 is opened. The bond head assembly 102 moves downward, allowing the wire supply 108 to pass through the wire bonding tool 110 until the wire supply 108 is removed from the wire bonding tool 110 (eg, completely removed).

[0082] exist Figure 6E In the embodiment, wire supply 108 is removed from wire bonding tool 110 so that wire bonding tool 110 can be used as described herein (e.g., see Figures 1A to 1F 、 Figures 2A to 2B and Figures 3A to 3H ) are removed and replaced. In addition, in conjunction with 6A to 6D After the described process, the wire supply 108 can be rethreaded / replaced by the wire bonding tool 110 (e.g., see Figure 4D and Figure 5G , as described herein).

[0083] 7A to 7F Various cross-sectional block diagrams of portions of the wire bonding system 600 and / or the lead replacement system 112b' are illustrated that are relevant to certain exemplary embodiments of the present invention. 7A to 7F The diagram shows Figures 6A to 6E The diagram shows a similar process.

[0084] Figure 7A The diagram illustrates a lead replacement system 112b'. The lead replacement system 112b' includes a clamping mechanism 114', which includes a first clamping portion 114a' (a movable clamping portion) and a second clamping portion 114b' (a fixed clamping portion). The first clamping portion 114a' includes a wire threading portion 326'. The wire threading portion 326' is actuated by a spring 122b' (e.g., a leaf spring). The second clamping portion 114b' includes a tool clamping portion 114b2' for gripping the wire bonding tool 110.

[0085] exist Figure 7B , wire supply 108 is shown engaged by threading portion 326' of clamping mechanism 114' at an upper position relative to wire clamp 104. Wire clamp 104 is open. Thus, wire supply 108 cannot move relative to clamping mechanism 114', but bond head assembly 102 (including wire clamp 104, transducer 106, and wire bonding tool 110) can move relative to wire supply 108. Figure 7B The bond head assembly 102 is shown beginning to move downward. This downward movement will cause the wire supply 108 to move upward relative to the bond head assembly 102.

[0086] exist Figure 7C , the bonding head assembly 102 has moved downward relative to the wire supply 108 (ie, the wire supply 108 is no longer Figure 7B 1. The wire is completely threaded through wire bonding tool 110 as in FIG. 1. Clamping mechanism 114′ is now open, and wire clamp 104 is now closed. Thus, wire supply 108 can move relative to clamping mechanism 114′, and movement of bond head assembly 102 is transferred to wire supply 108. Figure 7C The bond head assembly 102 is shown beginning to move upward. This upward movement will cause the bond head assembly 102 and the wire supply 108 to move upward relative to the clamping mechanism 114'. This upward movement of the wire may be facilitated by an air guide (not shown) of the wire bonding system 600.

[0087] Figure 7D The bond head assembly 102 is shown having moved upward. The clamping mechanism 114' is closed again, and the wire clamp 104 is opened again. The bond head assembly 102 begins to move downward so that the bond head assembly 102 will move downward relative to the wire supply 108 and the clamping mechanism 114'. Figure 7E The bond head assembly 102 is shown having been moved downward and the wire supply 108 further removed from the wire bonding tool 110 .

[0088] Figures 7B to 7E The illustrated process may be repeated multiple times until wire supply 108 is completely removed from wire bonding tool 110 . Figure 7F After the wire supply 108 is removed from the wire bonding tool 110, the wire bonding tool 110 may be replaced with another wire bonding tool 110 (e.g., Figures 1A to 1F 、 Figures 2A to 2B and Figures 3A to 3H ) replacement, and the lead replacement system 112b' can replace the lead supply 108 by threading the lead supply into the wire bonding tool 110 (for example, as shown in FIG. Figure 4D and Figures 5G to 5H shown).

[0089] Now refer to Figure 8A and Figure 8B illustrates a wire bonding system 800. As shown, the wire bonding system 800 can include any of the wire tool change system 112a, the lead change system 112b, or the lead change system 112b'. It should be understood that the wire tool change system 112a shares many of the same elements and aspects as the lead change systems 112b and 112b' described elsewhere herein (e.g., Figs. Figures 4A to 4D , Figures 5A to 5H etc.).

[0090] In Figure 8A and Figure 8B , the wire tool change system 112a (or the lead change system 112b, 112b') is extracting a wire tool 110 from a wire tool source 120, 120', 120" and installing the wire tool 110 into a transducer 106. A support structure 800b is configured to support a workpiece during a wire bonding operation. The support structure 800b and the wire tool change system 112a (or the lead change system 112b, 112b') are supported by a machine base 800a. The wire tool change system 112a (or the lead change system 112b, 112b') is illustrated as including: (i) a clamping mechanism 114 / 114' carried by a movable arm assembly 128; (ii) a wrench 118; and (iii) a wire tool source 120, 120', 120".

[0091] In Figure 8A , the movable arm assembly 128 is illustrated at the wire tool source 120, 120', 120". In such a position, the clamping mechanism 114 / 114' can pick up a new wire tool 110 (e.g., see Figure 1D , Figure 2A , Figure 2C , Figure 3E and Figure 3F ). In Figure 8B , the movable arm assembly 128 has moved the clamping mechanism 114 / 114' toward the wire tool 110 (e.g., to install the wire tool 110, as in Figures 1A to 1F and Figures 3A to 3H , and / or to change a lead, as in Figures 4A to 4D , Figures 5A to 5H and Figures 6A to 6E ). In Figure 8B , the wire tool 110 has been installed into the transducer 106 (e.g., see Figures 1E to 1F ).

[0092] It is contemplated that the wire tool replacement system 112a and / or the lead replacement system 112b / 112b' can be removed from the machine base 800a. For example, the machine base 800a and the wire tool replacement system 112a can each include, for example: (i) electrical connectors for power and / or data communication, and / or (ii) guide pins / locating holes for alignment.

[0093] In many operations performed by the wire tool replacement system 112a and / or the lead replacement system 112b, 112b', high precision is required to prevent damage or errors (e.g., failure to grasp the wire tool, improper threading, misplacing another wire tool, etc.). As such, it is contemplated that the wire tool replacement system 112a and / or the lead replacement system 112b / 112b' will include a positioning system for controlling the position of the clamping mechanism, the movable arm assembly, and / or the wrench. An exemplary positioning system may communicate with the wire system. The wire tool replacement system may be configured to provide feedback control associated with the positioning system. The positioning system may be configured to utilize open / short circuit detection, servo controller feedback, and / or a vision system for positioning.

[0094] It is contemplated that the vision system of the wire bonding system may be used to determine the precise position of the clamping mechanism 114 / 114' (and / or movable arm assembly and / or wrench) of the wire bonding tool changing system 112a and / or lead changing system 112b / 112b'. Such use of the vision system is described with reference to Figure 9A and Figure 9B The present invention is illustrated and described and may be used with any wire tool replacement system or lead replacement system within the scope of the present invention (eg, wire tool replacement system 112a, lead replacement system 112b / 112b', etc.).

[0095] Figure 9A Certain common features of the wire bonding tool replacement system 112a and the lead replacement system 112b' are illustrated, including a clamping mechanism 114', a first clamping portion 114a' (eg, a moving clamping portion), and a second clamping portion 114b' (eg, a fixed clamping portion). Figure 9A Provide with Figure 9B Related references. Figure 9A and Figure 9B The prism 114b3' is shown, referring to Figure 9B Described in more detail.

[0096] Figure 9BThe figure illustrates additional details of the second clamping portion 114b'. An eye point 114b4' is disposed on the second clamping portion 114b' and is oriented toward the wire bonding system (i.e., in the negative Y direction, as shown). The eye point 114b4' provides a reference feature for determining the position of the clamping mechanism 114'. As shown, the eye point 114b4' includes a specific image registration feature, but any image registration feature (e.g., a marking or other feature) may be used. The second clamping portion 114b' includes a prism 114b3'. The prism 114b3' is configured to reflect an image of the eye point 114b4' toward the vision system 140 of the wire bonding system. The prism 114b3' is a reflective optical element configured to reflect the image of the eye point 114b4' at an angle of approximately 90° (e.g., within a range of 70°-110°). The vision system 140 includes a computer (or other processing device, not shown) configured to determine the position of the exit point 114b4' (and therefore the clamping mechanism 114') based on the images collected by the vision system 140. Because the exit point 114b4' is rigidly attached to the clamping mechanism 114', the images provided by the vision system 140 can be used to determine the precise position of the clamping mechanism 114'. Such position information can be used to determine the position of the clamping mechanism 114' during the wire bonding tool replacement process (e.g., Figures 1A to 1F and Figures 3A to 3H ) and / or lead replacement procedures (e.g., as shown and described in Figures 4A to 4D 、 Figures 5A to 5H and Figures 6A to 6E Movement of the clamping mechanism 114' in FIG.

[0097] Figures 9A to 9B The diagram illustrates imaging the exit point 114b4' (or other image registration feature) by providing a prism 114b3' in the optical path. For example, such a prism may be included to extend the working distance of the imaging path to provide a clear image of the exit point. However, it should be understood that a prism (or other reflective optical element) is not required. For example, a more direct imaging path may be adopted without the need for a prism or reflective optical element. In a specific example, a refractive optical element (e.g., glass, plastic, etc.) may be provided in the imaging path to reduce the working distance of the imaging path, thereby providing a clear image of the exit point (or other image registration feature). Such a refractive optical element may be provided at (or adjacent to) the exit point (or other image registration feature). Of course, other configurations are envisioned.

[0098] Figure 10 and Figure 11The flowcharts are flow charts illustrating exemplary embodiments and / or aspects of the present invention. As will be appreciated by those skilled in the art, certain steps included in the flow charts may be omitted; certain additional steps may be added; and the order of the steps may be altered from the order illustrated, all within the scope of the present invention.

[0099] Now refer to Figure 10 , illustrates a method for replacing a wire bonding tool using a wire bonding tool replacement system on a wire bonding system. At optional step 1000, a portion of the lead (e.g., see Figures 5B to 5F and 7A to 7F ). At step 1002, the wire bonding tool is removed from the bonding head assembly using a wire bonding tool replacement system (e.g., see FIG. Figures 1A to 1D and Figures 3A to 3D At step 1004, another wire bonding tool is provided to the bonding head assembly using a wire bonding tool replacement system (e.g., see Figures 3E to 3H At optional step 1006, a portion of the lead is provided through a wire bonding tool (eg, see Figures 5F to 5H and Figure 6E ).

[0100] Now refer to Figure 11 , illustrates a method for replacing a lead portion on a wire bonding system. At step 1100, a bonding head assembly configured to carry a wire bonding tool (e.g., see Figure 4B The lead portion is engaged with the wire bonding tool. The lead portion is part of the wire supply on the wire bonding system. At step 1102, the lead portion is removed using a lead replacement system (e.g., see Figures 5B to 5F The lead removal process of removing lead portion 108a from wire bonding tool 110 is shown in FIG. 7A to 7F At optional step 1104, the wire bonding tool is removed and a wire bonding tool replacement system is utilized (e.g., see Figures 1A to 1F ) provides another wire bonding tool to the bonding head assembly. At step 1106, a wire bonding tool is provided using a wire changing system (e.g., see Figures 5F to 5H and Figure 6E )Replace the lead portion (e.g., with the removed lead portion or another lead portion).

[0101] While aspects of the present invention are illustrated and described herein with reference to creating a partial cut portion in a wire supply, the present invention is not so limited. It is contemplated that the cutting / gripping portion of a wire tool changing system or a wire changing system can be used to completely cut a wire during a wire change process.

[0102] While the present invention has been illustrated and described herein with reference to specific embodiments, the invention is not limited to the details shown, but rather various modifications may be made to the details within the scope and equivalents of the claims and without departing from the invention.

Claims

1. A wire bonding system, characterized in that: include: a bonding head assembly configured to carry a wire bonding tool; as well as A wire replacement system is configured to: (i) remove a wire portion engaged with a wire bonding tool, the wire portion being part of a wire supply on a wire bonding system; and (ii) replace a wire portion to be engaged with the wire bonding tool.

2. The wire bonding system according to claim 1, wherein: The lead replacement system includes a clamping mechanism configured to clamp a lead.

3. The wire bonding system according to claim 2, wherein: The clamping mechanism includes (i) a fixed clamping portion and (ii) a movable clamping portion disposed adjacent to the fixed clamping portion, the movable clamping portion being configured to move in at least one direction relative to the fixed clamping portion.

4. The wire bonding system according to claim 3, wherein: The clamping mechanism includes a spring configured to actuate the mobile clamping portion relative to the fixed clamping portion.

5. The wire bonding system according to claim 2, wherein: The clamping mechanism is carried by a movable arm assembly.

6. The wire bonding system according to claim 2, wherein: The clamping mechanism includes a threading portion for threading a thread.

7. The wire bonding system according to claim 2, wherein: The clamping mechanism includes a gripping portion for gripping the lead, a cutting portion for partially cutting the lead, and a threading portion for threading the lead.

8. The wire bonding system according to claim 2, wherein: The clamping mechanism includes a tool clamping portion for clamping the wire bonding tool.

9. The wire bonding system according to claim 1, wherein: The wire replacement system is configured to remove and replace the wire bonding tool from the bond head assembly.

10. The wire bonding system according to claim 9, wherein: Also included is a wire bonding tool source configured to provide a plurality of wire bonding tools, the wire replacement system configured to replace the wire bonding tool at the bond head assembly with one of the plurality of wire bonding tools from the wire bonding tool source.

11. The wire bonding system according to claim 1, wherein: The lead replacement system is configured to replace the lead portion by reengaging the lead portion with the wire bonding tool.

12. The wire bonding system according to claim 1, wherein: The lead replacement system is configured to replace the lead portion by engaging another lead portion with the wire bonding tool.

13. The wire bonding system according to claim 12, wherein: Also included is a receiving portion for receiving the lead portion after the lead portion is removed by the lead replacement system.

14. The wire bonding system according to claim 1, wherein: The lead replacement system includes a gripping mechanism configured to grip a lead and including an image registration feature that provides a reference for determining a position of the gripping mechanism.

15. The wire bonding system according to claim 14, wherein: Also included is a vision system configured to determine a position of the clamping mechanism by collecting images of the image registration features.

16. The wire bonding system according to claim 15, wherein: An optical path between the vision system and the image registration feature includes reflective optical elements.

17. The wire bonding system according to claim 15, wherein: An optical path between the vision system and the image registration feature includes a refractive optical element.

18. A lead replacement system for replacing a lead portion of a wire bonding system, characterized in that: The lead replacement system comprises: A clamping mechanism is configured to clamp the lead portion, the clamping mechanism including a threading portion for threading the lead portion through a wire bonding tool of the wire bonding system.

19. The lead replacement system according to claim 18, wherein: The clamping mechanism includes (i) a fixed clamping portion and (ii) a movable clamping portion disposed adjacent to the fixed clamping portion, the movable clamping portion being configured to move in at least one direction relative to the fixed clamping portion.

20. The lead replacement system according to claim 19, wherein: The clamping mechanism includes a spring configured to actuate the mobile clamping portion relative to the fixed clamping portion.

21. The lead replacement system according to claim 18, wherein: Also included is a movable arm assembly configured to move the clamping mechanism.

22. The lead replacement system according to claim 18, wherein: The clamping mechanism includes a gripping portion for gripping the lead and a cutting portion for partially cutting the lead.

23. The lead replacement system according to claim 18, wherein: The clamping mechanism includes a tool clamping portion for clamping the wire bonding tool.

24. The lead replacement system according to claim 23, wherein: Also included is a wire bonding tool source configured to provide a plurality of wire bonding tools, the wire replacement system configured to replace the wire bonding tool at the bonding head assembly of the wire bonding system with one of the plurality of wire bonding tools from the wire bonding tool source.

25. The lead replacement system according to claim 18, wherein: Also included is an image registration feature that provides a reference for determining the position of the clamping mechanism.

Images