High-precision automatic semiconductor die bonder

Abstract

The utility model relates to the technical field of die bonders, in particular to a high-precision automatic semiconductor die bonder which comprises a feeding assembly, a wafer assembly, an ejector pin assembly, a die bonding head assembly, a dispensing assembly, a die bonding platform assembly and a discharging assembly which are arranged on a rack. The die bonding head assembly transfers a chip to a printed circuit board on the die bonding platform assembly for installation, the transfer platform is used for adjusting the angle of the chip transferred by the die bonding head assembly, and the bottom flying shooting assembly is arranged on the rack and used for shooting the chip transferred by the die bonding head assembly. The size of a bearing station, used for bearing a printed circuit board, of the die bonding platform assembly is adjustable so as to improve the die bonding range, the transfer platform adjusts the angle and the position of a chip so as to carry out primary positioning on the chip, and the bottom flying shooting assembly carries out secondary shooting positioning on the chip on the die bonding head assembly so as to ensure the fixing and packaging precision and stability.

Description

TECHNICAL FIELD

[0001] The utility model relates to a fixed crystal machine technical field especially a high accuracy automation semiconductor fixed crystal machine. BACKGROUND

[0002] Fixed crystal is also called die mounting, which bonds the die to the designated area of the support through the colloid to form the thermal path or the electrical path, and provides the condition for the subsequent wire bonding connection, and is mainly used for the lead cabinet support plate of various gold wire ultrasonic welding equipment and various suction nozzles, thimbles, dispensing heads, porcelain nozzles, needles, motors, carbon brushes, encoders, transmission belts and various spare parts of automatic mechanical hands of various chip mounting equipment and instruments.

[0003] At present, the fixed crystal equipment in the market, due to the low fixed crystal precision of the fixed crystal equipment, the fixed crystal range is relatively small, and in the case of automation, only one type of chip can be fixed in the same station, so that the efficiency of the fixed crystal equipment is low when the chip is pasted on the printed circuit board, and the precision and stability are insufficient. UTILITY MODEL CONTENTS

[0004] The utility model discloses a high accuracy automation semiconductor fixed crystal machine, which aims to solve the problems of small fixed crystal range, low efficiency and limitations in the above technical problems, and improve the fixed packaging efficiency and stability.

[0005] The technical problems in the utility model are solved by the following technical solutions:

[0006] The high accuracy automation semiconductor fixed crystal machine comprises:

[0007] A rack;

[0008] A feeding assembly arranged on the rack and used for conveying the printed circuit board without fixed crystal to the fixed crystal platform assembly;

[0009] A die component arranged on the rack and used for transporting the die ring to the die taking position;

[0010] A thimble assembly arranged on the die component and used for lifting the chip on the die ring;

[0011] A fixed crystal bonding head assembly arranged on the rack and used for adsorbing and transporting the chip lifted by the thimble assembly;

[0012] A dispensing assembly arranged beside the fixed crystal platform assembly and used for dispensing the printed circuit board on the fixed crystal platform assembly;

[0013] The receiving station size of the fixed die platform assembly for receiving the printed circuit board is adjustable, and the fixed die bump head assembly transfers the chip to the printed circuit board on the fixed die platform assembly for installation;

[0014] The blanking assembly is used for transferring the printed circuit board with completed fixed die out of the fixed die platform assembly.

[0015] The transfer platform is arranged on the rack and is used for adjusting the angle of the chip transferred by the fixed die bump head assembly.

[0016] The bottom flying camera assembly is arranged on the rack and is used for shooting the chip transferred by the fixed die bump head assembly.

[0017] The utility model discloses still have following technical features:

[0018] In an embodiment of the utility model, the bottom flying camera assembly is arranged below the fixed die bump head assembly, and the shooting angle of the bottom flying camera assembly vertically points upwards to the chip on the fixed die bump head assembly.

[0019] In an embodiment of the utility model, the fixed die bump head assembly includes a wafer taking bump head and a fixed die bump head, the wafer taking bump head and the fixed die bump head are installed on vertical sliding units respectively, the vertical sliding units drive the wafer taking bump head and the fixed die bump head to reciprocate horizontally, the vertical sliding units are installed on horizontal sliding units, and the horizontal sliding units drive the wafer taking bump head and the fixed die bump head to move horizontally.

[0020] In an embodiment of the utility model, the wafer taking camera is arranged on the wafer taking bump head, is used for identifying the position information and angle information of the chip, and feeds back the information to the control unit, the control unit controls the wafer taking bump head to adjust the angle of the chip.

[0021] In an embodiment of the utility model, the lifting camera is arranged above the transfer platform, is used for identifying the position information and angle information on the transfer platform, feeds back the information to the control unit, and the control unit controls the transfer platform to adjust the position and angle of the chip.

[0022] In an embodiment of the utility model, the bottom flying camera assembly is arranged on the horizontal moving path of the fixed die bump head.

[0023] In an embodiment of the utility model, the wafer taking bump head and the fixed die bump head all include:

[0024] The first mounting base is installed on the vertical sliding unit.

[0025] a second mounting base, forming a vertical sliding fit with the first mounting base;

[0026] a driving unit, configured to drive the second mounting base to move vertically along the first mounting base;

[0027] a displacement measuring unit, configured to measure a vertical displacement of the second mounting base on the first mounting base;

[0028] a suction nozzle, vertically disposed on the second mounting base and connected to the negative pressure end of the air source;

[0029] The rotating unit is used to drive the suction nozzle to rotate.

[0030] In one embodiment of the present invention, the transfer platform includes:

[0031] Adsorption cap, used for adsorbing the chip to be transferred;

[0032] A transfer upper seat, wherein the adsorption cap is rotatably mounted on the transfer upper seat with the rotation axis vertical;

[0033] A rotation adjustment unit is used to drive the adsorption cap;

[0034] a first transfer translation unit, the transfer upper seat being arranged on the first transfer translation unit, and the first transfer translation unit driving the transfer upper seat to translate along a first direction;

[0035] a second transfer translation unit, wherein the first transfer translation unit is mounted on the second transfer translation unit, and the second transfer translation unit drives the transfer upper seat to translate along a second direction;

[0036] The first direction and the second direction are horizontal and perpendicular to each other.

[0037] In one embodiment of the present invention, it further includes a transfer middle seat and a transfer lower seat, the transfer upper seat and the transfer middle seat form a sliding fit along the first direction, and the transfer middle seat and the transfer lower seat form a sliding fit along the second direction.

[0038] In one embodiment of the present invention, the die bonding platform assembly includes a fixed side plate and a movable side plate;

[0039] A top plate is provided between the fixed side plate and the movable side plate, and the printed circuit board is located above the top plate and has two sides abutting against the fixed side plate and the movable side plate;

[0040] The distance between the fixed side panel and the movable side panel is adjustable;

[0041] A cover plate is provided above the fixed side plate;

[0042] When the lifting unit drives the top plate to move upward, the printed circuit board is linked to abut against the cover plate to implement position limiting of the printed circuit board.

[0043] Compared with the existing technology, the beneficial effects of the present invention are reflected in: the feeding assembly, wafer assembly, solid crystal head assembly, ejector pin assembly, dispensing assembly, solid crystal platform assembly and unloading assembly form a complete automated handling system, so that the entire work process of printed circuit boards from loading to unloading after solid crystal is completed can be handled automatically, thereby reducing the errors and damage risks that may occur during the operation and improving the fixed packaging efficiency. The size of the receiving station of the solid crystal platform assembly for receiving printed circuit boards is adjustable to increase the solid crystal range. The angle of the chip transferred by the solid crystal head assembly is adjusted through the transfer platform to perform the initial positioning of the chip. The bottom flying shot assembly re-shoots and positions the chip on the solid crystal head assembly to ensure the accurate installation of the chip and the printed circuit board, thereby improving the fixed packaging accuracy and stability. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] Figure 1 and Figure 2 They are schematic diagrams from two perspectives of a high-precision automated semiconductor die bonder in one embodiment of the present invention;

[0045] Figure 3 This is a schematic structural diagram of a wafer assembly in one embodiment of the present invention;

[0046] Figure 4 This is a front view of a wafer assembly in one embodiment of the present invention;

[0047] Figure 5 This is a schematic structural diagram of an ejector pin assembly in one embodiment of the present invention;

[0048] Figure 6 This is a schematic structural diagram of a die-bonding header assembly in one embodiment of the present invention;

[0049] Figure 7 This is a schematic structural diagram of a vertical drive unit in one embodiment of the present invention;

[0050] Figure 8 This is a schematic structural diagram of a crystal bonding head or a solid crystal bonding head in one embodiment of the present invention;

[0051] Figure 9 This is a schematic structural diagram of a lifting camera in one embodiment of the present invention;

[0052] Figure 10 This is a schematic structural diagram of a transfer platform in one embodiment of the present invention;

[0053] Figure 11 This is a schematic structural diagram of the bottom flying swatter assembly in one embodiment of the present invention;

[0054] Figure 12 This is a structural diagram of a dispensing assembly in one embodiment of the present invention;

[0055] Figure 13 This is a schematic structural diagram of a die-bonding platform assembly in one embodiment of the present invention;

[0056] Figure 14 and Figure 15 They are respectively schematic structural diagrams of a feeding assembly in one embodiment of the present invention;

[0057] Figure 16 This is a schematic structural diagram of a transfer docking station component in a blanking component in one embodiment of the present invention;

[0058] Figure 17 This is a schematic structural diagram of a discharge lifting assembly in a blanking assembly in one embodiment of the present invention;

[0059] Description of Figure Numbers:

[0060] Rack 10;

[0061] Feed assembly 20; lifting linear module 201; module mounting block 202; pusher screw stepper motor 203; screw nut seat 204; pusher mounting plate 205; pusher connecting plate 206; pusher extension plate 207; lower horizontal adjustment plate 208; ejector rod mounting plate 209; pusher rod 210; pusher linear guide rail 211; feed lifting platform fixed edge 212; lifting bottom plate 213; feed lifting platform movable edge 214; substrate blocking assembly 215;

[0062] Wafer assembly 30; crystal ring base 31; X-axis linear motor assembly 32; X-axis linear guide 321; Y-axis grating assembly 33; X-axis grating assembly 34; crystal ring middle plate 35; Y-axis linear guide 361; Y-axis linear motor assembly 36; crystal ring fixing assembly 37; crystal ring upper plate 38;

[0063] Ejector assembly 40; ejector lifting module 41; module support plate 42; module mounting base 43; Z-axis grating assembly 44; ejector base adjustment assembly 45; voice coil motor 46; ejector base 47; ejector 48;

[0064] Crystal bonding head assembly 50; crystal removal head 51; crystal bonding head 52; marble column 501; marble column 502; X-axis base plate 503; linear motor mover 504; linear motor stator 505; linear guide rail 506; tension spring assembly 507; grating sensor assembly 508; Z-axis bonding head mounting plate 509; marble crossbeam 5091; X-axis linear guide rail 5092; crystal removal head 51; crystal removal camera 511; crystal bonding head 52; lifting camera 521; camera base 5211; camera base reinforcement strip 5212; camera adjustment base 5213; cross guide rail 5214; adjustment ruler mounting base 5215; micrometer 5216; camera adjustment clamping base 5217; vision assembly 5218; light source 5219; first mounting base 53; second mounting base 54; suction nozzle 55;

[0065] Transfer platform 60; adsorption cap 61; transfer upper seat 62; transfer middle seat 63; transfer lower seat 64;

[0066] Glue dispensing assembly 70; glue dispensing column 71; glue dispensing head adjustment base 72; adjustment center seat 73; cross guide 74; glue dispensing upper seat 75; adjustment handwheel assembly 76; glue dispensing motor 77; glue tray support seat 78; glue cup rotation assembly 79; glue dispensing head assembly 710; voice coil motor 711; glue cup rotation motor 712; adjustment center seat 713; cross guide 714; glue dispensing upper seat 715; handwheel assembly 716; glue dispensing motor 717;

[0067] Die bonding platform assembly 80; X-axis base 801; X-axis linear motor 802; X-axis linear guide 803; Y-axis base 804; Y-axis linear motor 805; Y-axis linear guide 806; roller motor 807; drive wheel assembly 808; belt 809; cylinder 810; fixed side plate 81; movable side plate 82; top plate 83; cover plate 84;

[0068] Unloading assembly 90; transfer docking platform assembly 91; docking platform bottom plate 911; first docking platform vertical plate 912; second docking platform vertical plate 913; docking platform flat plate 914; motor 915; docking platform fixed edge 916; docking platform movable edge 917; screw motor 918; linear guide rail 919; screw nut seat 920; linked belt 921; discharge lifting assembly 92;

[0069] Bottom flying shot assembly 100; bottom flying shot vision base 101; vision lifting adjustment seat 102; horizontal adjustment bearing seat 103; adjustment hand wheel 104; bottom vision holding seat 105; vision assembly 106; light source holding seat 107; light source 108. DETAILED DESCRIPTION

[0070] The following describes the embodiments of the present invention through specific examples. Those skilled in the art will readily understand the other advantages and benefits of the present invention from the disclosure herein. The present invention may also be implemented or applied through various other specific embodiments, and the details in this specification may be modified or altered based on different perspectives and applications without departing from the spirit of the present invention.

[0071] It should be noted that the illustrations provided in this embodiment are only used to schematically illustrate the basic concept of the present invention. Therefore, the illustrations only show components related to the present invention and are not drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component can be changed at will, and the component layout type may also be more complicated.

[0072] It's important to note that the die bonding process is a critical step in the semiconductor packaging process. Its primary purpose is to precisely place the die in a designated area on a holder and bond them together using a colloid, creating a thermal or electrical path that facilitates subsequent wire bonding. This process is crucial for applications such as LED packaging, chip semiconductor packaging, and precision camera placement. The following takes chip semiconductor packaging as an example. After the existing wafer is produced through the previous cutting process, there will be chips arranged in an array on the blue film. The chips are pasted on the blue film, and the chips on the blue film are adsorbed and picked up by the adsorption head and transferred to the crystal bonding station. The printed circuit board on the crystal bonding station is transferred by the transfer equipment. Since the entire system can only adapt to the packaging of a single model of printed circuit boards, in actual production, the efficiency of chip and printed circuit board bonding is low. In addition, since the existing crystal bonding equipment lacks precise positioning of the chip, it can only rely on the positioning of the crystal ring and the printed circuit board to ensure the installation accuracy of the chip and the printed circuit board. Therefore, there is a problem of insufficient accuracy when the actual chip and printed circuit board are bonded and installed. It is necessary to adjust the position and angle of the crystal ring or the position and angle of the printed circuit board at all times. Therefore, the production efficiency of the entire equipment is low, and the installation accuracy is not high. To this end, the utility model proposes a high-precision automated semiconductor crystal bonding machine, including: a frame 10; a feeding assembly 20, which is arranged on the frame 10 and is used to transport the unbonded printed circuit boards To the crystal bonding platform assembly 80; the wafer assembly 30 is provided on the rack 10 and is used to transport the crystal ring to the crystal retrieval position; the ejector assembly 40 is provided on the wafer assembly 30 and is used to lift the chip on the crystal ring; the crystal bonding head assembly 50 is provided on the rack 10 and is used to absorb and transport the chip lifted by the ejector assembly 40; the glue dispensing assembly 70 is provided next to the crystal bonding platform assembly 80 and implements the glue dispensing operation on the printed circuit board on the crystal bonding platform assembly 80; the crystal bonding platform assembly 80 is used to undertake the printing The receiving station size of the circuit board is adjustable, and the die bonding head assembly 50 transfers the chip to the printed circuit board on the die bonding platform assembly 80 for installation; the unloading assembly 90 is used to transfer the printed circuit board after die bonding out of the die bonding platform assembly 80; wherein, it also includes a transfer platform 60, which is provided on the rack 10 and is used to adjust the angle of the chip transferred by the die bonding head assembly 50; the bottom flying shot assembly 100 is provided on the rack 10 and is used to photograph the chip transferred by the die bonding head assembly 50.

[0073] In one embodiment, see Figure 1 and Figure 2 The frame 10 is an integral large plate for supporting and installing the various components of the entire die bonder.

[0074] In one embodiment, the structure of the wafer assembly 30 is first described. Figure 3 andFigure 4 The wafer assembly 30 is used to position and transport the crystal ring, and transport it to the crystal retrieval position of the crystal fixing head assembly 50, wherein the wafer assembly 30 includes a crystal ring base 31, an X-axis linear motor assembly 32, an X-axis linear guide 321, a Y-axis grating assembly 33, an X-axis grating assembly 34, a crystal ring middle plate 35, a Y-axis linear guide 361, a Y-axis linear motor assembly 36, a crystal ring fixing assembly 37, and a crystal ring upper plate 38.

[0075] In one embodiment, the wafer ring base 31 is mounted on the frame 10, and the wafer ring is fixed to the wafer ring fixing assembly 37. The X-axis linear motor assembly 32 and X-axis linear guide 321 drive the wafer ring middle plate 35 and its upper components in the X-axis direction. The Y-axis linear motor assembly 36 and Y-axis linear guide 361 drive the wafer ring upper plate 38 and its upper wafer ring fixing assembly 37 in the Y-axis direction. Based on real-time feedback from the X-axis grating assembly 34 and Y-axis grating assembly 33, the die bonder's control unit controls the wafer assembly 30 to transport the chips on the wafer ring to the desired retrieval position.

[0076] In one embodiment, see Figure 5 The ejector assembly 40 includes an ejector lift module 41, a module support plate 521, a module mounting base 43, a Z-axis grating assembly 44, an ejector base adjustment assembly 45, a voice coil motor 46, an ejector base 47, and ejectors 48. When lifting the chip on the wafer assembly 30, the ejector assembly 40 is fixed to the frame 10 via the module mounting base 43. The ejector base adjustment assembly 45 is fixed to the module support plate 521. The ejector lift module 41 drives the module tray 521 to adjust the ejector 48 up and down. When the wafer assembly 30 moves significantly in the Y-axis direction, the ejector assembly will descend to avoid interference.

[0077] In a specific embodiment, the ejector base adjustment component 45 can adjust the X and Y direction positions of the ejector to achieve an accurate working position; the voice coil motor 46 drives the ejector 48 to move up and down at high speed to pierce the blue film and eject the chip, and the Z-axis grating component 44 feeds back the height parameters of the ejector 48's rise and fall to the control unit of the entire die bonder for monitoring.

[0078] In one embodiment, to perform the wafer extraction operation on the chip on the wafer assembly 30, refer to Figure 6 The crystal bonding head assembly 50 includes a crystal removal head 51 and a crystal bonding head 52. The crystal removal head 51 and the crystal bonding head 52 are respectively installed on a vertical sliding unit. The vertical sliding unit drives the crystal removal head 51 and the crystal bonding head 52 to reciprocate horizontally. The vertical sliding unit is installed on a horizontal sliding unit. The horizontal sliding unit drives the crystal removal head 51 and the crystal bonding head 52 to move horizontally.

[0079] In one embodiment, see Figure 6 The crystal removal head 51, the crystal fixing head 52 and the vertical sliding unit of the crystal fixing head assembly 50 are installed on the frame 10 through the marble columns 501 and the marble columns 502. The marble columns 501 and the marble columns 502 are used as heat dissipation bases to reduce or avoid the problem of precision reduction caused by slight deformation of components.

[0080] In one embodiment, see Figure 6 The wafer head 51 is provided with a wafer camera 511, which is used to identify the position information and angle information of the chip and feed the information back to the control unit. The control unit controls the wafer assembly 30 to adjust the chip position, and the control unit controls the wafer head 51 to adjust the chip angle.

[0081] In a specific embodiment, the crystal retrieval camera 511 includes a camera base, a camera base reinforcement strip, a crystal retrieval vision mounting plate, a crystal retrieval vision clamping base, a vision component, and a light source. The height of the vision component can be adjusted by manually adjusting the height of the crystal retrieval vision clamping base.

[0082] In one embodiment, a lifting camera 521 is provided above the transfer platform 60. The lifting camera 521 is used to identify the position information and angle information on the transfer platform 60 and feed the information back to the control unit. The control unit controls the transfer platform 60 to adjust the position and angle of the chip.

[0083] Specifically, see Figure 9 The lifting camera 521 includes a camera base 5211, a camera base reinforcement strip 5212, a camera adjustment base 5213, a cross guide rail 5214, an adjustment ruler mounting base 5215, a micrometer 5216, a camera adjustment clamping base 5217, a vision assembly 5218, and a light source 5219. The height of the vision assembly 5218 can be adjusted manually by adjusting the micrometer 5216.

[0084] In one embodiment, the crystal bond removal head 51 and the crystal bond fixing head 52 are respectively mounted on respective vertical sliding units, and the crystal bond removal head 51 and the crystal bond fixing head 52 are driven to reciprocate along the horizontal direction by the respective vertical sliding units.

[0085] Specifically, see Figure 7The vertical sliding unit for installing the crystal removal head 51 and the crystal fixing head 52 includes an X-axis base plate 503, a linear motor mover 504, a linear motor stator 505, a linear guide rail 506, a tension spring assembly 507, a grating sensor assembly 508, and a head Z-axis mounting plate 509. The high-precision and high-acceleration linear motor composed of the linear motor mover 504 and the linear motor stator 505 is used as the power source, and two precision linear guide rails 506 are used to make the entire vertical sliding unit more stable.

[0086] Specifically, see Figure 6 A marble beam 5091 is set on the marble column 501 and the marble column 502, and the X-axis base plate 503 is slidably set on the marble beam 5091 through the Bangtou X-axis linear guide 5092, and the vertical reciprocating drive of the entire vertical sliding unit is implemented through the Bangtou X-axis linear motor stator and the X-axis linear guide 5092.

[0087] Among them, the crystal removal head 51 and the crystal bonding head 52 both include a first mounting base 53, which is installed on the horizontal sliding unit; a second mounting base 54, which forms a vertical sliding fit with the first mounting base 53; a driving unit, which drives the second mounting base 54 to move in the vertical direction along the first mounting base 53; a displacement measuring unit, which is used to measure the vertical displacement of the second mounting base 54 on the first mounting base 53; a suction nozzle 55, which is vertically arranged on the second mounting base 54 and connected to the negative pressure end of the air source; and a rotating unit, which is used to implement rotational drive of the suction nozzle 55.

[0088] Specifically, the driving unit can use a force-controlled voice coil motor as the power source. When the height of the crystal removal head 51 or the crystal bonding head 52 is adjusted through the vertical driving unit, the force-controlled voice coil motor controls the pressure of the bonding head to remove the crystal and bond the crystal, and the rotating unit is a DD motor. The DD motor controls the rotation of the suction nozzle 55, and then adjusts the angle of the chip on the suction nozzle 55, and the crystal can be bonded at any angle of ±180°.

[0089] In one embodiment, see Figure 10 The transfer platform 60 includes an adsorption cap 61 for adsorbing the chip to be transferred; a transfer upper seat 62, the adsorption cap is rotatably mounted on the transfer upper seat 62 and the rotation axis is vertical; a rotation adjustment unit is used to drive the adsorption cap; a first transfer translation unit, the transfer upper seat 62 is arranged on the first transfer translation unit, and the first transfer translation unit drives the transfer upper seat in a first direction; a second transfer translation unit, the first transfer translation unit is mounted on the second transfer translation unit, and the second transfer translation unit drives the transfer upper seat in a second direction; the first direction and the second direction are horizontal and perpendicular to each other.

[0090] Specifically, the transfer platform 60 further comprises a transfer middle seat 63 and a transfer lower seat 64, the transfer upper seat 62 and the transfer middle seat 63 constitute a sliding fit along the first direction, and the transfer middle seat 63 and the transfer lower seat 64 constitute a sliding fit along the second direction.

[0091] The first transfer translation unit and the second transfer translation unit of the transfer platform 60 adopt high-precision high-acceleration linear motors as power sources, and are installed in a cross guide rail in a matched manner, so that the mechanism is compact and has high precision; the displacement of the transfer platform is accurately controlled through a grating reading head assembly of X and Y axes. The chip is moved from the crystal ring to the adsorption cap 61 through the pick-up head 51, and after the chip position angle information is fed back by the lifting camera 521, the chip is adjusted to a suitable position, and then the DD motor of the rotating adjustment unit drives the adsorption cap 61 to rotate and adjust the chip angle. After the chip is adjusted, the chip position angle information is fed back to the control system by the lifting camera 521, and finally the chip is transferred from the transfer platform 60 to the printed circuit board to be die-bonded by the die-bonding head 52.

[0092] Further preferably, in order to further photograph the chip on the die-bonding head 52 to ensure the accuracy of the position and angle of the chip, and to determine whether there are problems such as damage and cracking on the chip, the bottom flying photographing assembly 100 is arranged below the die-bonding head assembly 50, and the photographing angle of the bottom flying photographing assembly 100 is vertically upwardly directed to the chip on the die-bonding head assembly 50.

[0093] Specifically, the bottom flying photographing assembly 100 is arranged on the horizontal movement path of the die-bonding head 52.

[0094] In a specific embodiment, referring to Figure 11 The bottom flying photographing assembly 100 comprises a bottom flying photographing visual base 101, a visual lifting adjustment seat 102, a horizontal adjustment bearing seat 103, an adjustment hand wheel 104, a bottom visual holding seat 105, a visual assembly 106, a light source holding seat 107, and a light source 108. The bottom flying photographing assembly 100 is fixed on the rack 10 through the bottom flying photographing visual base 101. The height of the visual assembly 106 can be adjusted by manually adjusting the visual lifting adjustment seat 102, and the position of the visual assembly 106 in the front-rear direction can be adjusted by adjusting the adjustment hand wheel 104. The bottom flying photographing assembly 100 photographs the chip position angle information on the die-bonding head 52 to feed back.

[0095] In an embodiment, referring to Figure 14 and Figure 15The feeding assembly 20 includes a lifting linear module 201, a module mounting block 202, a pushing material screw rod stepping motor 203, a screw rod nut base 204, a pushing material mounting plate 205, a pushing material connecting plate 206, a pushing rod extension plate 207, a horizontal lower adjusting plate 208, a material withdrawal rod mounting plate 209, a pushing material rod 210, a pushing material linear guide rail 211, a feeding lifting platform fixed edge 212, a lifting bottom plate 213, a feeding lifting platform movable edge 214, and a base plate blocking assembly 215. The feeding assembly 20 is fixed on the rack 10 through the module mounting block 202 and can be compatible with two feeding modes. One is base plate box feeding, and the other is feeding of the base plate directly through an external device after being connected online.

[0096] Specifically, when the base plate box feeding mode is enabled, the box is placed on the lifting bottom plate 213, the cylinder of the feeding lifting platform movable edge 214 is extended, so that the base plate box is clamped between the feeding lifting platform fixed edge 212 and the feeding lifting platform movable edge 214. By adjusting the distance between the feeding lifting platform fixed edge 214 and the feeding lifting platform movable edge 214, different base plate boxes and base plates can be realized. The lifting linear module 201 serves as a power source to drive the base plate box to rise and fall. When the base plate box needs to be fed, the lifting linear module 201 drives the base plate box to the working position, the pushing material screw rod stepping motor 203 drives the pushing material rod 210 of the pushing material assembly to push the base plate of the current layer of the base plate box to the die bonding platform assembly 80 for die bonding. After the base plate is die bonded, it can flow to the next station, or the base plate can flow back into the base plate box through the belt reversal of the die bonding platform assembly 80, and the above actions are repeated until the base plate in the base plate box is completely die bonded. The cylinder of the feeding lifting platform movable edge 214 is retracted to unlock the base plate box, and the next box is replaced manually.

[0097] In an embodiment, when the base plate is fed through an external device, the pushing material assembly is cancelled, and the base plate is transported by the belt of the feeding lifting platform fixed edge 212 and the feeding lifting platform movable edge 214. The distance between the fixed plate and the movable edge can also be adjusted to be compatible with different base plates.

[0098] In a specific embodiment, referring to Figure 13 The die bonding platform assembly 80 includes a fixed side plate 81 and a movable side plate 82. A top plate 83 is arranged between the fixed side plate 81 and the movable side plate 82. The printed circuit board is located above the top plate 83 and abuts against the fixed side plate 81 and the movable side plate 82 on both sides. The distance between the fixed side plate 81 and the movable side plate 82 is adjustable. A cover plate 84 is arranged above the fixed side plate 81. When the lifting unit drives the top plate 83 to move upward, the printed circuit board and the cover plate 84 abut against each other to limit the printed circuit board.

[0099] Specifically, the solid crystal platform assembly 80 also includes an X-axis base 801, an X-axis linear motor 802, an X-axis linear guide 803, a Y-axis base 804, a Y-axis linear motor 805, a Y-axis linear guide 806, a rolling motor 807, a transmission wheel group 808, a movable side plate 82, a belt 809, and a cylinder 810. It is installed on the frame 10 through the X-axis base 801. The working process of this assembly is that the pushing cylinder pushes the substrate in the material box to the solid crystal platform. During the pushing process, the rolling motor 807 drives the movable side plate 82 and the belt 809 of the fixed side plate 81 to feed the material through the transmission wheel group 808. After the material is fed to the group block, the cylinder 810 extends, driving the top plate 83 to lift the substrate, while the cover plate 84 acts as an upper limit to hold the substrate in place. The substrate is driven by the X-axis linear guide 803 on the X-axis base 801 and the linear motor 802 that controls the X-axis motion. The substrate is driven by the Y-axis linear guide 806 on the Y-axis base 804 and the linear motor 805 that controls the Y-axis motion. This adjusts the die bonding position to be directly below the die bonding head suction nozzle, allowing the die bonding head 52 to complete the die bonding. Once die bonding is complete, the cylinder 810 descends to release the substrate, and the belt 809 drives the substrate to the next station, or the belt 809 reverses and returns the substrate to the magazine, completing the die bonding process. The distance between the movable side plate 82 and the fixed side plate 81 is adjusted to accommodate products of varying widths.

[0100] In one embodiment, see Figure 10 The dispensing assembly 70 includes a dispensing column 71, a dispensing head adjustment base 72, an adjustment middle seat 73, a cross guide rail 74, a dispensing upper seat 75, an adjustment handwheel assembly 76, a dispensing motor 77, a glue disc support seat 78, a glue cup rotation assembly 79, a dispensing head assembly 710, a voice coil motor 711, and a glue cup rotation motor 712. The dispensing assembly 70 is installed on the frame 10 through the dispensing column 711. The dispensing head adjustment base 72 is provided with a cross guide rail 74 for the lateral guidance of the dispensing head and a longitudinal guide installed on the adjustment middle seat 73. The dispensing upper seat 75 is installed on the cross guide rail 74, and the lateral and longitudinal positions can be adjusted by adjusting the handwheel assembly 76 by the handwheel. The dispensing motor 77 is installed on the dispensing upper seat 75. The working process of the component is that when the lifting camera 521 at the crystal bonding position finds the crystal bonding position on the substrate, the crystal bonding head 52 places the chip in front of the crystal bonding position, and the dispensing head assembly 710 is dipped in solder paste or silver glue from the glue cup rotating assembly 79. The dispensing motor 77 drives the dispensing head assembly 710 to rotate to the crystal bonding position, and the voice coil motor 711 drives the dispensing head assembly 710 to move downward to dip the solder paste or silver glue on the crystal bonding position, and then return to its position, and the dispensing work is completed in this reciprocating manner.

[0101] In one embodiment, see Figure 16The unloading assembly 90 comprises a transfer docking platform assembly 91 and a discharging lifting assembly 92. The transfer docking platform assembly 91 comprises a docking platform bottom plate 911, a first docking platform vertical plate 912, a second docking platform vertical plate 913, a docking platform flat plate 914, a motor 915, a docking platform fixed edge 916, a docking platform movable edge 917, a screw rod motor 918, a linear guide rail 919, a screw rod nut seat 920 and a linkage belt 921.

[0102] The transfer docking platform assembly 91 is installed on the rack 10 through the docking platform bottom plate 911. The transfer docking platform assembly 91 drives the linkage belt 921 through the motor 915 to transport the substrate after the die bonding platform assembly 80 completes die bonding to the next station. The docking platform movable edge 917 is connected with the screw rod nut seat 920, and the screw rod nut seat 920 is driven by the screw rod motor 918 to automatically adjust the position of the docking platform movable edge 917, thereby being compatible with substrates of different sizes.

[0103] Referring to Figure 17 The discharging lifting assembly 92 is compared with the feeding assembly 20, and lacks a pushing assembly, and the rest is mirror-symmetric. The discharging lifting assembly 92 is used to receive the die-bonded substrate transported by the transfer docking platform assembly 91, and store the die-bonded substrate into a substrate box or flow into the next machine table connected in line.

[0104] In summary, the die bonder comprises the feeding assembly 20, the wafer assembly 30, the die bonding head assembly 50, the thimble assembly 40, the dispensing assembly 70, the die bonding platform assembly 80 and the unloading assembly 90 to form a complete automatic handling system, so that the entire working process of the printed circuit board from feeding to unloading after die bonding is automatically handled, thereby reducing the error and damage risk that may occur in the operation process, improving the die bonding efficiency, and the die bonding platform assembly is used to adjust the size of the receiving station for receiving the printed circuit board, so as to improve the die bonding range, and the transfer platform is used to adjust the angle of the chip transported by the die bonding head assembly to preliminarily position the chip, and the bottom flying camera assembly 100 is used to re-shoot and position the chip on the die bonding head assembly 50 to ensure the accurate installation of the chip and the printed circuit board, and ensure the die bonding precision and stability.

[0105] It is apparent for those skilled in the art that the present application is not limited to the details of the above exemplary embodiments, but can be implemented in other concrete forms without departing from the spirit or essential characteristics of the present application. Therefore, the embodiments should be regarded as exemplary and non-limiting, and the scope of the present application is defined by the appended claims rather than the above description, and all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the present application. Any reference signs in the claims should not be regarded as limiting the claims involved.

[0106] In addition, it should be understood that although this specification is described in terms of implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

Claims

1. High-precision automated semiconductor die bonder, characterized by: include: frame; A feeding assembly is provided on the frame and is used to convey unbonded printed circuit boards to the die-bonding platform assembly; a wafer assembly, disposed on the rack and used to transport the wafer ring to a wafer retrieval position; A pin assembly is provided on the wafer assembly and is used to lift the chip on the wafer ring; A die bonding head assembly is provided on the frame and is used to absorb and transport the chips lifted by the ejector pin assembly; A glue dispensing component is arranged beside the die-bonding platform component and performs a glue dispensing operation on the printed circuit board on the die-bonding platform component; The receiving station size of the die-bonding platform component for receiving the printed circuit board is adjustable, and the die-bonding header component transfers the chip to the printed circuit board on the die-bonding platform component for installation; A blanking assembly, used for transferring the printed circuit board after die bonding out of the die bonding platform assembly; The machine further includes a transfer platform, which is provided on the frame and is used to adjust the angle of the chips transferred by the die-bonding header assembly. The bottom flying camera component is arranged on the frame and is used to photograph the chips transported by the die-bonding header component.

2. The high-precision automated semiconductor die bonder according to claim 1, characterized in that: The bottom flying camera assembly is arranged below the die-bonding header assembly, and a shooting angle of the bottom flying camera assembly is vertically upward and directed toward the chip on the die-bonding header assembly.

3. The high-precision automated semiconductor die bonder according to claim 2, characterized in that: The crystal bonding head assembly includes a crystal removal head and a crystal bonding head, which are respectively installed on a vertical sliding unit. The vertical sliding unit drives the crystal removal head and the crystal bonding head to move back and forth in the horizontal direction. The vertical sliding unit is installed on a horizontal sliding unit. The horizontal sliding unit drives the crystal removal head and the crystal bonding head to move horizontally.

4. The high-precision automated semiconductor die bonder according to claim 3, characterized in that: A crystal retrieval camera is provided on the crystal retrieval head, which is used to identify the position information and angle information of the chip and feed the information back to the control unit. The control unit controls the wafer assembly to adjust the chip position, and the control unit controls the crystal retrieval head to adjust the chip angle.

5. The high-precision automated semiconductor die bonder according to claim 4, characterized in that: A lifting camera is provided above the transfer platform, and is used to identify the position information and angle information on the transfer platform and feed the information back to a control unit. The control unit controls the transfer platform to adjust the position and angle of the chip.

6. The high-precision automated semiconductor die bonder according to claim 5, characterized in that: The bottom flying slap assembly is arranged on the horizontal moving path of the crystal bonding head.

7. The high-precision automated semiconductor die bonder according to claim 3, characterized in that: The crystal removal header and the crystal bonding header both include: a first mounting base, mounted on the vertical sliding unit; a second mounting base, forming a vertical sliding fit with the first mounting base; a driving unit, configured to drive the second mounting base to move vertically along the first mounting base; a displacement measuring unit, configured to measure a vertical displacement of the second mounting base on the first mounting base; a suction nozzle, vertically disposed on the second mounting base and connected to the negative pressure end of the air source; The rotating unit is used to drive the suction nozzle to rotate.

8. The high-precision automated semiconductor die bonder according to claim 5, characterized in that: The transfer platform includes: Adsorption cap, used for adsorbing the chip to be transferred; A transfer upper seat, wherein the adsorption cap is rotatably mounted on the transfer upper seat with the rotation axis vertical; A rotation adjustment unit is used to drive the adsorption cap; a first transfer translation unit, the transfer upper seat being arranged on the first transfer translation unit, and the first transfer translation unit driving the transfer upper seat to translate along a first direction; a second transfer translation unit, wherein the first transfer translation unit is mounted on the second transfer translation unit, and the second transfer translation unit drives the transfer upper seat to translate along a second direction; The first direction and the second direction are horizontal and perpendicular to each other.

9. The high-precision automated semiconductor die bonder according to claim 8, characterized in that: It also includes a transfer middle seat and a transfer lower seat. The transfer upper seat and the transfer middle seat form a sliding fit along the first direction, and the transfer middle seat and the transfer lower seat form a sliding fit along the second direction.

10. The high-precision automated semiconductor die bonder according to claim 1, wherein: The die-bonding platform assembly includes a fixed side plate and a movable side plate; A top plate is provided between the fixed side plate and the movable side plate, and the printed circuit board is located above the top plate and has two sides abutting against the fixed side plate and the movable side plate; The distance between the fixed side panel and the movable side panel is adjustable; A cover plate is provided above the fixed side plate; When the lifting unit drives the top plate to move upward, the printed circuit board is linked to abut against the cover plate to implement position limiting of the printed circuit board.

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