Semiconductor wafer ultrasonic cutting machine

Abstract

According to the semiconductor wafer ultrasonic cutting machine, an annular groove is formed in the end face, facing a gap, of a main shaft shell, a plurality of blind holes are formed in the bottom of the annular groove, pistons are arranged in the blind holes in a sliding mode, the peripheral side walls of the pistons are attached to the inner walls of the blind holes, and reset springs are connected between the blind ends of the blind holes and the pistons; the piston is fixedly connected with an ejector rod, the ejector rod extends into the annular groove, and the ends, located in the annular groove, of all the ejector rods are jointly connected with a sealing ring. An auxiliary air channel with an outlet facing the piston is formed in the main shaft shell, and airflow blown out of the auxiliary air channel can push the piston to move towards the blind end of the blind hole. When the ultrasonic slicing air floatation main shaft stops working, the auxiliary air channel does not blow out air flow any more, at the moment, the piston moves in the direction away from the blind end of the blind hole, namely, moves towards the gap, the sealing ring is pushed into the gap for sealing, it is guaranteed that impurities cannot enter the space between the main shaft shell and the connecting flange, and then the influence on air floatation rigidity is avoided.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor wafer processing, and particularly to a semiconductor wafer ultrasonic cutting machine. BACKGROUND

[0002] A wafer refers to a silicon wafer used for manufacturing a silicon semiconductor circuit, and its raw material is silicon. High-purity polysilicon is dissolved and then doped into a silicon crystal seed, and then slowly pulled out to form a cylindrical single-crystal silicon. After grinding, polishing and slicing, the silicon crystal rod forms a silicon wafer, that is, a wafer.

[0003] In the Chinese utility model patent with the application number 202022644251.7 filed by the applicant on November 16, 2020, a kind of semiconductor wafer grinding is disclosed with ultrasonic wave static pressure permanent magnet synchronous electric main shaft, the utility model is applied in semiconductor wafer cutting, compared with traditional cutting mode effect is better, and in the scheme, between main shaft shell and connecting flange, there is a labyrinth type waterproof dustproof mechanism, although it can avoid impurities entering between the rotating shaft and the main shaft shell during work, but once the work of cutting semiconductor wafer stops, the gap between the main shaft shell and the connecting flange will still enter impurities, affecting the rigidity of air floatation. UTILITY MODEL CONTENTS

[0004] In order to solve the problem that impurities enter the gap between the main shaft shell and the connecting flange in the prior art, affecting the rigidity of air floatation, the utility model provides a kind of semiconductor wafer ultrasonic cutting machine, so that the gap between the main shaft shell and the connecting flange will not enter impurities, thereby ensuring the rigidity of air floatation.

[0005] The utility model provides a kind of semiconductor wafer ultrasonic cutting machine, including main shaft shell, the ultrasonic wave slice air floatation main shaft of rotation and the moving mechanism for changing the position of ultrasonic wave slice air floatation main shaft that are arranged in main shaft shell, the part of ultrasonic wave slice air floatation main shaft that extends out of main shaft shell is connected with cutting piece by connecting flange, there is gap between connecting flange and main shaft shell, and labyrinth seal structure is arranged between connecting flange and main shaft shell, the end face of main shaft shell towards gap is provided with annular groove, a plurality of blind holes are arranged in the bottom of annular groove, piston is slidably arranged in blind hole, the circumferential wall of piston is attached to the inner wall of blind hole, reset spring is connected between the blind end of blind hole and piston, piston is fixedly connected with top rod, and top rod extends into annular groove, one end of all top rods in annular groove is commonly connected with sealing ring, vice gas channel is arranged on main shaft shell, and the outlet of vice gas channel faces piston, the airflow blown by vice gas channel can drive piston to move to the blind end of blind hole.

[0006] As a further optimization of the utility model kind semiconductor wafer ultrasonic cutting machine: the annular groove is fixedly provided with a mounting ring, the auxiliary air duct includes an air inlet channel and an air outlet channel which are communicated with each other and are arranged on the mounting ring, the air inlet channel extends along the radial direction of the main shaft housing and is communicated with an air source, and the air outlet channel extends along the axial direction of the main shaft housing, and the outlet of the air outlet channel faces the side of the piston close to the gap.

[0007] As a further optimization of the utility model kind semiconductor wafer ultrasonic cutting machine: the auxiliary air duct includes an air inlet channel and an air outlet channel which are communicated with each other and are arranged on the main shaft housing, the air inlet channel extends along the axial direction of the main shaft housing, the air outlet channel extends along the radial direction of the main shaft housing, the air inlet channel is communicated with the main air duct on the main shaft housing, and the air outlet channel is communicated with the air inlet channel.

[0008] As a further optimization of the utility model kind semiconductor wafer ultrasonic cutting machine: the air inlet channel penetrates to one end of the main shaft housing facing the cutting piece and is sealed by a sealing plug.

[0009] As a further optimization of the utility model kind semiconductor wafer ultrasonic cutting machine: a guide rod extending along the axial direction of the blind hole is arranged at the blind end of the blind hole, and the piston is sleeved on the guide rod.

[0010] As a further optimization of the utility model kind semiconductor wafer ultrasonic cutting machine: a limiting block is arranged at the end of the guide rod close to the opening of the blind hole.

[0011] As a further optimization of the utility model kind semiconductor wafer ultrasonic cutting machine: a gas bearing turntable matched with the ultrasonic cutting piece gas bearing spindle is fixedly arranged on the Y-axis supporting plate.

[0012] As a further optimization of the utility model kind semiconductor wafer ultrasonic cutting machine: the moving mechanism includes an X-axis moving assembly, a Y-axis moving assembly and a Z-axis moving assembly, the X-axis moving assembly is used for driving the ultrasonic cutting piece gas bearing spindle to move along the X-axis direction, the Y-axis moving assembly is used for driving the gas bearing turntable to move along the Y-axis direction, and the Z-axis moving assembly is used for driving the ultrasonic cutting piece gas bearing spindle to move along the Z-axis direction.

[0013] As a further optimization of the utility model kind semiconductor wafer ultrasonic cutting machine: the cutting machine includes a bed body;

[0014] The X-axis moving assembly includes an X-axis linear motor and an X-axis gantry type column for mounting the X-axis linear motor, the X-axis gantry type column is fixedly arranged on the bed body, and the top of the X-axis gantry type column is fixedly provided with an X-axis linear guide rail;

[0015] The Y-axis moving assembly comprises two Y-axis linear guides, a Y-axis supporting plate slidingly arranged on the two Y-axis linear guides and a Y-axis linear motor for driving the Y-axis supporting plate to slide, the two Y-axis linear guides are fixedly arranged on the bed body through mounting pads, and the air floating turntable is fixedly arranged on the Y-axis supporting plate.

[0016] The Z-axis moving assembly comprises a Z-axis stand fixedly arranged on the X-axis linear guide, a Z-axis linear guide fixedly arranged on the Z-axis stand and a Z-axis linear motor for driving the Z-axis linear guide to slide, the Z-axis linear motor is fixedly arranged on the Z-axis stand, and the ultrasonic slicing air floating main shaft is slidingly arranged on the Z-axis linear guide through the Z-axis supporting plate.

[0017] Compared with the prior art, the utility model has the advantages of:

[0018] 1) the utility model discloses a ring groove is set up on the end face of the main shaft shell towards the gap, a plurality of blind holes are formed in the bottom of the ring groove, a piston is slidingly arranged in the blind hole, the peripheral sidewall of the piston is attached to the inner wall of the blind hole, a return spring is connected between the blind end of the blind hole and the piston, the piston is fixedly connected with a jacking rod, the jacking rod extends into the ring groove, and one end of all the jacking rods in the ring groove is connected with a sealing ring.

[0019] 2) the utility model discloses a vice gas channel, which comprises a gas guide channel and an air outlet channel, which are arranged on the mounting ring and are in communication with each other, and an air inlet channel and a gas guide channel, which are arranged on the main shaft shell and are in communication with each other, the outlet of the air outlet channel is towards the side of the piston close to the gap, the air inlet channel is in communication with the main gas channel on the main shaft shell, and the gas guide channel is in communication with the gas guide channel. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 It is a sectional view of the ultrasonic slicing air floating main shaft.

[0021] Figure 2 It is a schematic view of the sealing ring in the ring groove.

[0022] Figure 3 It is a schematic view of the sealing ring in the gap.

[0023] Figure 4It is the overall schematic view of the utility model;

[0024] Figure 5 It is the structure schematic view of the utility model;

[0025] Marked in the drawing: 1, ultrasonic wave slice air floatation main shaft, 101, main shaft axle seat, 102, cutting piece, 103, connecting flange, 104, main shaft casing, 105, main air channel, 106, annular groove, 107, blind hole, 2, air floatation rotary table, 3, push assembly, 301, piston, 302, top rod, 303, guide rod, 304, reset spring, 305, limit block, 4, Y axis linear motor, 401, Y axis linear guide rail, 402, Y axis supporting plate, 5, Z axis linear motor, 501, Z axis linear guide rail, 502, Z axis supporting plate, 503, Z axis stand column, 6, X axis linear motor, 601, X axis linear guide rail, 602, X axis gantry type stand column, 7, bed body, 8, air inlet channel, 801, air guide channel, 802, mounting ring, 8021, air guide channel, 8022, air outlet channel, 803, sealing plug, 9, gap, 901, sealing ring. DETAILED DESCRIPTION

[0026] The technical scheme of the utility model will be further described in detail in combination with specific embodiments, and the parts not described and disclosed in the following embodiments of the utility model should be understood as the prior art known or should be known by the person skilled in the art, such as the model of cutting piece 102, the model of air source, how the air source is used in cooperation with ultrasonic wave slice air floatation main shaft 1, the model of air floatation rotary table 2, the model and working principle of X axis linear motor 6, Y axis linear motor 4 and Z axis linear motor 5.

[0027] Embodiment 1

[0028] A kind of semiconductor wafer ultrasonic wave cutting machine, such as Figures 1-3As shown, the ultrasonic slicing air-floating spindle 1 is arranged in the spindle shell 104, and the part of the ultrasonic slicing air-floating spindle 1 extending out of the spindle shell 104 is connected with the cutting piece 102 through the connecting flange 103, and the cutting piece 102 is used for cutting a semiconductor wafer. The gap 9 is arranged between the connecting flange 103 and the spindle shell 104, so as to avoid friction and damage to the spindle shell 104 when the semiconductor wafer is cut. The labyrinth seal structure is arranged between the connecting flange 103 and the spindle shell 104, the annular groove 106 is arranged on the end face of the spindle shell 104 facing the gap 9, the bottom of the annular groove 106 is provided with a plurality of blind holes 107, the piston 301 is arranged in the blind hole 107 in a sliding mode, the peripheral side wall of the piston 301 is attached to the inner wall of the blind hole 107, the reset spring 304 is connected between the blind end of the blind hole 107 and the piston 301, the top rod 302 is fixedly connected with the piston 301, the top rod 302 extends into the annular groove 106, the sealing ring 901 is connected at one end of all the top rods 302 located in the annular groove 106, the auxiliary air channel is arranged on the spindle shell 104 and has an outlet facing the piston 301, the airflow blown out of the auxiliary air channel can drive the piston 301 to move towards the blind end of the blind hole 107, and the piston 301 and the top rod 302 jointly form the pushing assembly 3. The high-pressure airflow blown out of the auxiliary air channel drives the sealing ring 901 to move towards the blind end of the blind hole 107 during the movement of the piston 301, that is, during the working process of the ultrasonic slicing air-floating spindle 1, the sealing ring 901 is away from the gap 9 and does not contact the connecting flange 103, so as to avoid the influence of the friction between the sealing ring 901 and the connecting flange 103 on the working of the ultrasonic slicing air-floating spindle 1; after the use of the ultrasonic slicing air-floating spindle 1 is completed, the auxiliary air channel will not blow out high-pressure airflow, at this time, the reset spring 304 is restored from the compressed state to the initial state, and the sealing ring 901 enters the gap 9 again, so as to reduce the entry of impurities and improve the rigidity of air floating. The working principle of the ultrasonic slicing air-floating spindle 1 is a conventional prior art in the field, and will not be described in detail here.

[0029] The above is the basic embodiment of the utility model, which can be further improved, optimized and limited on the basis of the above, so as to obtain the following embodiments:

[0030] Embodiment 2

[0031] This embodiment is an improved scheme based on embodiment 1, and the main structure is the same as that of embodiment 1, and the improvement lies in that Figure 2 and Figure 3As shown, in order to facilitate processing, the annular groove 106 is fixedly provided with a mounting ring 802, the auxiliary air passage includes an air inlet channel 8021 and an air outlet channel 8022 which are communicated and arranged on the mounting ring 802, the air inlet channel 8021 extends along the radial direction of the main shaft shell 104 and is communicated with the air source, the air outlet channel 8022 extends along the axial direction of the main shaft shell 104, and the outlet of the air outlet channel 8022 is directed to the side of the piston 301 close to the gap 9. In operation, the air source is also started synchronously, the high-pressure airflow is communicated into the air inlet channel 8021, then into the air outlet channel 8022 through the air inlet channel 8021, and finally blown to the piston 301 from the air passage to make the piston 301 move to the blind end of the blind hole 107.

[0032] Embodiment 3

[0033] This embodiment is an improved scheme based on embodiment 2, and the main structure is the same as that of embodiment 2, and the improvement lies in that, as shown in Figure 2 and Figure 3 As shown, the auxiliary air passage includes an air inlet channel 8 and a gas guide channel 801 which are communicated and arranged on the main shaft shell 104, in order to facilitate processing, the air inlet channel 8 extends along the axial direction of the main shaft shell 104, and the gas guide channel 801 extends along the radial direction of the main shaft shell 104, the ultrasonic wave slicing air floating main shaft 1 is used, and the high-pressure airflow will be communicated into the main air passage 105 on the main shaft shell 104, therefore, the air inlet channel 8 is communicated with the main air passage 105 on the main shaft shell 104, in this way, when the high-pressure airflow is communicated into the main air passage 105, the high-pressure airflow can also be transmitted into the air inlet channel 8 of the auxiliary air passage, transmitted to the gas guide channel 801 through the air inlet channel 8, communicated to the air inlet channel 8021 through the gas guide channel 801, and then transmitted to the air outlet channel 8022 through the air inlet channel 8021.

[0034] The air source communicated with the auxiliary air passage is the air source of the main air passage 105, and both share the same air source. Or the air inlet channel 8021 of the auxiliary air passage is communicated with a separate air source, and it is ensured that the air source communicated with the main air passage 105 and the air source communicated with the air inlet channel 8021 are started or stopped synchronously. The selection of the air source is a conventional prior art in the field, and will not be described in detail here.

[0035] In order to ensure the sealing property of the auxiliary air passage, the air inlet channel 8 penetrates to the end of the main shaft shell 104 directed to the cutting piece 102 and is sealed by a sealing plug 803.

[0036] Embodiment 4

[0037] This embodiment is an improved scheme based on embodiment 1, and the main structure is the same as that of embodiment 1, and the improvement lies in that, as shown in Figure 2 and Figure 3As shown, in order to ensure the smoothness of the sliding of the piston 301, the blind end of the blind hole 107 is provided with a guide rod 303 extending along the axial direction of the blind hole 107, and the piston 301 is sleeved on the guide rod 303. In order to ensure that the piston 301 will not fall off from the guide rod 303, a limiting block 305 is arranged at the end of the guide rod 303 close to the opening of the blind hole 107.

[0038] Embodiment 5

[0039] This embodiment is an improved scheme based on embodiment 1, and the main structure is the same as that of embodiment 1. The improvement lies in that, as shown in Figure 4 and Figure 5 As shown, the Y-axis supporting plate 402 is fixedly provided with an air floating turntable 2 matched with the ultrasonic slicing air floating main shaft 1. The air floating turntable 2 is a conventional prior art in the field, and will not be described in detail here.

[0040] The moving mechanism includes an X-axis moving assembly, a Y-axis moving assembly and a Z-axis moving assembly. The X-axis moving assembly is used to drive the ultrasonic slicing air floating main shaft 1 to move along the X-axis direction. The Y-axis moving assembly is used to drive the air floating turntable 2 to move along the Y-axis direction. The Z-axis moving assembly is used to drive the ultrasonic slicing air floating main shaft 1 to move along the Z-axis direction.

[0041] The cutting machine includes a bed 7.

[0042] The X-axis moving assembly includes an X-axis linear motor 6 and an X-axis gantry type column 602 for mounting the X-axis linear motor 6. The X-axis gantry type column 602 is fixedly arranged on the bed 7. The top of the X-axis gantry type column 602 is fixedly provided with an X-axis linear guide rail 601.

[0043] The Y-axis moving assembly includes two Y-axis linear guide rails 401, a Y-axis supporting plate 402 slidingly arranged on the two Y-axis linear guide rails 401, and a Y-axis linear motor 4 for driving the Y-axis supporting plate 402 to slide. The two Y-axis linear guide rails 401 are fixedly arranged on the bed 7 through a mounting pad. The air floating turntable 2 is fixedly arranged on the Y-axis supporting plate 402. The Y-axis linear motor 4 is fixedly arranged on the mounting pad.

[0044] The Z-axis moving assembly includes a Z-axis column 503 fixedly arranged on the X-axis linear guide rail 601, a Z-axis linear guide rail 501 fixedly arranged on the Z-axis column 503, and a Z-axis linear motor 5 for driving the Z-axis linear guide rail 501 to slide. The Z-axis linear motor 5 is fixedly arranged on the Z-axis column 503. The ultrasonic slicing air floating main shaft 1 is slidingly arranged on the Z-axis linear guide rail 501 through a Z-axis supporting plate 502. The ultrasonic slicing air floating main shaft 1 is fixed on a main shaft base 101, and the main shaft base 101 is fixed on the Z-axis supporting plate 502.

[0045] The above description of disclosed embodiments enables one of ordinary skill in the art to make or use the application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein can be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A semiconductor wafer ultrasonic cutting machine, comprising a spindle housing (104), an ultrasonic slicing air-floating spindle (1) rotatably arranged in the spindle housing (104), and a moving mechanism for changing the position of the ultrasonic slicing air-floating spindle (1), wherein the portion of the ultrasonic slicing air-floating spindle (1) extending out of the spindle housing (104) is connected to a cutting blade (102) via a connecting flange (103), a gap (9) is provided between the connecting flange (103) and the spindle housing (104), and a labyrinth sealing structure is provided between the connecting flange (103) and the spindle housing (104), characterized in that: An annular groove (106) is provided on the end surface of the spindle housing (104) facing the gap (9), and a plurality of blind holes (107) are provided at the bottom of the annular groove (106). A piston (301) is slidably provided in the blind hole (107), and the peripheral side wall of the piston (301) is in contact with the inner wall of the blind hole (107). A return spring (304) is connected between the blind end of the blind hole (107) and the piston (301). The piston (301) is fixedly connected to a push rod (302), and the push rod (302) extends into the annular groove (106). One end of all the push rods (302) located in the annular groove (106) is commonly connected to a sealing ring (901). A secondary airway with an outlet facing the piston (301) is provided on the spindle housing (104), and the airflow blown out of the secondary airway can push the piston (301) to move toward the blind end of the blind hole (107).

2. The semiconductor wafer ultrasonic cutting machine according to claim 1, wherein: A mounting ring (802) is fixedly provided on the annular groove (106), and the secondary air channel comprises an air inlet channel (8021) and an air outlet channel (8022) which are connected to each other and opened on the mounting ring (802). The air inlet channel (8021) extends along the radial direction of the main shaft housing (104) and is connected to an air source. The air outlet channel (8022) extends along the axial direction of the main shaft housing (104), and the outlet of the air outlet channel (8022) faces the side of the piston (301) close to the gap (9).

3. The semiconductor wafer ultrasonic cutting machine according to claim 2, wherein: The secondary air channel comprises an air intake channel (8) and an air guide channel (801) which are opened on the spindle housing (104) and are in communication with each other. The air intake channel (8) extends along the axial direction of the spindle housing (104), and the air guide channel (801) extends along the radial direction of the spindle housing (104). The air intake channel (8) is in communication with the main air channel (105) on the spindle housing (104), and the air guide channel (801) is in communication with the air induction channel (8021).

4. The semiconductor wafer ultrasonic cutting machine according to claim 3, wherein: The air inlet channel (8) passes through to one end of the spindle housing (104) facing the cutting blade (102) and is sealed by a sealing plug (803).

5. The semiconductor wafer ultrasonic cutting machine according to claim 1, wherein: The blind end of the blind hole (107) is provided with a guide rod (303) extending along the axial direction of the blind hole (107), and the piston (301) is slidably sleeved on the guide rod (303).

6. The semiconductor wafer ultrasonic cutting machine according to claim 5, wherein: A limiting block (305) is provided at one end of the guide rod (303) close to the opening of the blind hole (107).

7. The semiconductor wafer ultrasonic cutting machine according to claim 1, wherein: The moving mechanism includes an X-axis moving assembly, a Y-axis moving assembly, and a Z-axis moving assembly, and the cutting machine includes a bed (7); The X-axis moving assembly is used to drive the ultrasonic slice air-floating spindle (1) to move along the X-axis direction, the X-axis moving assembly includes an X-axis linear motor (6) and an X-axis gantry column (602) for mounting the X-axis linear motor (6), the X-axis gantry column (602) is fixedly arranged on the bed (7), and an X-axis linear guide rail (601) is fixedly arranged on the top of the X-axis gantry column (602); The Y-axis moving assembly comprises two Y-axis linear guide rails (401), a Y-axis support plate (402) slidably arranged on the two Y-axis linear guide rails (401), and a Y-axis linear motor (4) for driving the Y-axis support plate (402) to slide, an air-floating turntable (2) matched with the ultrasonic slicing air-floating main shaft (1) is fixedly arranged on the Y-axis support plate (402), and the Y-axis moving assembly is used to drive the air-floating turntable (2) to move along the Y-axis direction, the two Y-axis linear guide rails (401) are fixedly arranged on the bed (7) through the mounting pad, the air-floating turntable (2) is fixedly arranged on the Y-axis support plate (402), and the Y-axis linear motor (4) is fixedly arranged on the mounting pad; The Z-axis moving assembly is used to drive the ultrasonic slicing air-floating spindle (1) to move along the Z-axis direction. The Z-axis moving assembly comprises a Z-axis column (503) fixedly arranged on the X-axis linear guide rail (601), a Z-axis linear guide rail (501) fixedly arranged on the Z-axis column (503), and a Z-axis linear motor (5) for driving the Z-axis linear guide rail (501) to slide. The Z-axis linear motor (5) is fixedly arranged on the Z-axis column (503), and the ultrasonic slicing air-floating spindle (1) is slidably arranged on the Z-axis linear guide rail (501) via a Z-axis support plate (502).

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