Metal connecting piece, metal connecting piece array and packaging structure

Abstract

The utility model provides a metal connecting piece, a metal connecting piece array and a packaging structure, and relates to the field of electronic component packaging. Comprising a first connecting piece, a second connecting piece and a third connecting piece which are integrally connected in sequence; the first connecting piece, the second connecting piece and the third connecting piece are arranged in parallel in a staggered mode, and the first connecting piece is located between the horizontal plane of the second connecting piece and the horizontal plane of the third connecting piece. The first connecting piece is vertically connected with the second connecting piece, and the second connecting piece is obliquely connected with the third connecting piece; the length of the first connecting piece is smaller than that of the third connecting piece. According to the invention, conductive connection and packaging of electronic components can be carried out, the packaging volume is reduced, and the conductive stability is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to electronic component packaging field, specifically, relate to a metal connecting piece, metal connecting piece array and packaging structure. BACKGROUND

[0002] With the development of electronic products to miniaturization, high integration, the packaging technology of electronic components and the manufacturing technology of printed circuit board to interconnection material requirement more and more strict, the traditional interconnection material has been unable to meet the needs of environment and technology.

[0003] Generally use metal connecting piece to electronic component and package, and the reliability and stability of metal connecting piece are required to be higher, but the stability of metal connecting piece in prior art still needs to be improved, and in the packaging process, the volume requirement of the package is to obtain lower package volume to adapt to the miniaturization and high integration development of electronic components. UTILITY MODEL CONTENTS

[0004] The utility model discloses a metal connecting piece, metal connecting piece array and packaging structure can carry out electrically conductive connection and the packaging of electronic component, reduce the package volume, improve the electrically conductive stability.

[0005] To solve the above technical problem, the utility model adopts the technical scheme that:

[0006] A metal connecting piece, including the first connecting piece, the second connecting piece and the third connecting piece that are integrally connected in sequence, the first connecting piece, the second connecting piece and the third connecting piece are arranged in parallel and staggered, and the first connecting piece is located between the horizontal plane of the second connecting piece and the third connecting piece, the first connecting piece and the second connecting piece are connected vertically, and the second connecting piece and the third connecting piece are connected obliquely, and the length of the first connecting piece is less than the length of the third connecting piece.

[0007] Further, in the utility model, the width of the first connecting piece is greater than the width of the third connecting piece, and a U-shaped notch is formed in the end of the first connecting piece away from the third connecting piece.

[0008] Further, in the utility model, the first connecting piece and the third connecting piece are provided with a concave-convex undulating surface on the side face away from the second connecting piece.

[0009] Further, in the utility model, the concave parts of the undulating surface of the first connecting piece are of the same height, and the concave parts of the undulating surface of the third connecting piece are of the same height.

[0010] Further, in the utility model, the shape of the concave part of the undulating surface is inverted cone, granular, columnar or massive.

[0011] Further, in the utility model, the inside of the first connecting sheet, the second connecting sheet and the third connecting sheet is embedded with a nano elastic layer.

[0012] Further, in the utility model, the material of the first connecting sheet, the second connecting sheet and the third connecting sheet is copper.

[0013] A metal connecting piece array, comprising a plurality of the above metal connecting sheets and a connecting strip, each second connecting sheet is provided with a connecting part at both ends in the width direction, and each metal connecting piece is connected to the connecting strip one by one through the connecting part.

[0014] A packaging structure, comprising the above metal connecting piece, further comprising a frame and a wafer, the wafer is arranged on the base island of the frame, the third connecting sheet is welded to the wafer through solder, and the first connecting sheet is welded to the pin of the frame through solder.

[0015] The utility model has at least the following advantages or beneficial effects:

[0016] The utility model discloses a first connecting sheet, a second connecting sheet and a third connecting sheet are integrally connected, the first connecting sheet and the third connecting sheet at both ends are used for connecting the frame pin and the chip respectively, realizing the conduction of electronic components, the first connecting sheet is used for contacting the frame pin by being arranged as perpendicular connection between the first connecting sheet and the second connecting sheet, the contact stability with the pin can be improved while reducing the volume, the second connecting sheet is used for contacting the chip by being arranged as inclined connection between the second connecting sheet and the third connecting sheet and making the length of the first connecting sheet less than the length of the third connecting sheet, the contact area between the third connecting sheet and the chip wafer can be increased, the contact stability can be improved, and the third connecting sheet can adapt to different specifications of chips, and the compatibility can be improved. BRIEF DESCRIPTION OF DRAWINGS

[0017] In order to more clearly illustrate the technical scheme of the embodiments of the utility model, the following will briefly introduce the drawings needed to be used in the embodiments, and should be understood that the following drawings only show some embodiments of the utility model, and should not be regarded as the limitation to the scope, and for the ordinary skilled person in the art, other related drawings can be obtained without the creative labor on the premise of the drawings.

[0018] Figure 1 The top view of the metal connecting piece and the packaging structure provided for the application embodiment;

[0019] Figure 2A side view of a metal connecting piece and a packaging structure provided for an application embodiment;

[0020] Figure 3 An enlarged schematic view of a part of a structure in which a third connecting piece contacts a wafer provided for an application embodiment;

[0021] Figure 4 A structural schematic view of an array of metal connecting pieces provided for an application embodiment;

[0022] Figure 5 A structural schematic view of a connecting part provided for an application embodiment.

[0023] Icon: 1-metal connecting piece, 11-first connecting piece, 111-notch, 12-second connecting piece, 13-third connecting piece, 14-undulating surface, 141-recess, 2-frame, 21-wafer, 22-pin, 3-connecting strip, 31-connecting part. DETAILED DESCRIPTION

[0024] In order to make the purpose, technical scheme and advantages of the embodiments of the present application more clear, the technical scheme in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments of the present application. The components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations.

[0025] Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative labor fall within the scope of protection of the present application. EMBODIMENT

[0026] Please refer to Figures 1-3 , which is a structural schematic view of a metal connecting piece in an embodiment of the present application;

[0027] The present embodiment provides a metal connecting piece, which comprises a first connecting piece 11, a second connecting piece 12 and a third connecting piece 13 connected integrally in sequence; the first connecting piece 11, the second connecting piece 12 and the third connecting piece 13 are arranged in parallel with each other in a staggered manner, and the first connecting piece 11 is located between the horizontal planes of the second connecting piece 12 and the third connecting piece 13; the first connecting piece 11 is connected perpendicularly to the second connecting piece 12, and the second connecting piece 12 is connected obliquely to the third connecting piece 13; the length of the first connecting piece 11 is less than the length of the third connecting piece 13.

[0028] Next, a metal connecting piece according to the present exemplary embodiment will be further described.

[0029] In some embodiments of the present application, with reference to Figure 1 and Figure 2 The first connecting piece 11, the second connecting piece 12 and the third connecting piece 13 are integrally connected in sequence, and the integral connection structure has good stability. The second connecting piece 12 is located in the middle position between the first connecting piece 11 and the third connecting piece 13, and the first connecting piece 11 and the third connecting piece 13 are respectively located at both ends, for connecting with the pin 22 of the frame 2 and the chip. The first connecting piece 11, the second connecting piece 12 and the third connecting piece 13 are arranged in parallel with staggered positions, that is, the first connecting piece 11, the second connecting piece 12 and the third connecting piece 13 are not in the same horizontal plane, so as to adapt to the different heights of the chip and the pin 22 in the frame 2. The first connecting piece 11 is vertically connected with the second connecting piece 12, and the second connecting piece 12 is obliquely connected with the third connecting piece 13. The length of the first connecting piece 11 is less than the length of the third connecting piece 13. Since the pin 22 of the frame 2 has a narrow welding point design, the length of the first connecting piece 11 is designed to be less than the length of the third connecting piece 13, so that they can be adapted. In order to achieve a larger contact area in a narrow welding point to improve the contact stability, and at the same time to minimize the packaging size, the first connecting piece 11 and the second connecting piece 12 are vertically connected through a vertical connecting part, thereby improving the contact stability between the first connecting piece 11 and the pin 22 of the frame 2, improving the conductivity stability and reliability, and reducing the packaging size. Since the chip has different specifications and sizes, in order to improve the contact stability of the third connecting piece 13 and the chip and make it compatible with different specifications of the chip, the length of the third connecting piece 13 is designed to be longer, which improves the bonding area of the third connecting piece 13 and the chip, thereby increasing the welding stability of the chip.

[0030] As a preferred embodiment, the width of the first connecting piece 11 is greater than the width of the third connecting piece 13, and a U-shaped notch 111 is formed at the end of the first connecting piece 11 away from the third connecting piece 13. Since the plurality of pins 22 of the frame 2 are arranged transversely, the width of the first connecting piece 11 is designed to be relatively wide to ensure good contact with the pins 22. Since solder paste is generally used to achieve conductive connection during packaging welding, the use of more solder paste will cause overflow of the solder paste when the first connecting piece 11 has a relatively wide width. The overflow of the solder paste will cause short circuit of the connection between the chip electrode and the pin 22. There will also be no air to be discharged, which will cause unstable welding and affect the yield. By forming the notch 111 in the first connecting piece 11, the overflow of the solder paste and the discharge of the air are facilitated, thereby avoiding the short circuit phenomenon. At the same time, the discharge of the air in the solder can ensure the reliability of the packaging and improve the product yield. Moreover, the notch 111 is arranged in a U shape, and the U-shaped hole structure is simple and easy to process. At the same time, based on the smooth shape of the U-shaped structure, the risk of damage under stress can be effectively reduced.

[0031] It should be noted that the number of the notch 111 can be one, two or more, and the number is not specifically limited and can be designed according to actual needs.

[0032] As a preferred embodiment, referring to Figure 3 The first connecting piece 11 and the third connecting piece 13 are provided with a concave-convex undulating surface 14 on the side away from the second connecting piece 12. By arranging the concave-convex undulating surface 14 on the side of the first connecting piece 11 and the third connecting piece 13, the concave part 141 can better realize welding with the pin 22 or the chip, thereby having more stable connection performance and better conductive effect. At the same time, the concave part can accommodate the excess solder paste squeezed out from the welding point, so that the solder paste will not easily overflow and affect the welding stability.

[0033] As a preferred embodiment, the heights of the concave parts 141 of the undulating surface 14 of the first connecting piece 11 are the same, and the heights of the concave parts 141 of the undulating surface 14 of the third connecting piece 13 are the same. Here, the height refers to the maximum depth of the concave part inside the first connecting piece or the third connecting piece. In order to reduce the packaging volume and improve the welding stability, the heights of the plurality of concave parts 141 of the first connecting piece 11 are set to be consistent, the heights of the plurality of concave parts 141 of the undulating surface 14 of the third connecting piece 13 are set to be consistent, and the heights of the plurality of concave parts 141 of the first connecting piece 11 and the third connecting piece 13 can be consistent. In this embodiment, the height of the concave part 141 is preferably in the range of 0.2 μm to 15 μm.

[0034] As a preferred embodiment, the concave portions 141 of the undulating surface 14 are in the shape of an inverted cone, a grain, a column or a block. In this embodiment, the shapes of the concave portions 141 of the undulating surface 14 of the first connecting piece 11 and the third connecting piece 13 can be the same or different, as long as the heights are the same. And there is a certain spacing between each concave portion 141, so that the welding points do not affect each other.

[0035] As a preferred embodiment, the first connecting piece 11, the second connecting piece 12 and the third connecting piece 13 are embedded with a nano-elastic layer, such as a carbon nanotube film, between the metal layers, which is used to absorb vibration and compensate for thermal expansion and contraction, and can significantly improve the mechanical stability and thermal stability of the metal connecting piece 1, effectively resisting the influence of vibration and temperature changes.

[0036] As a preferred embodiment, the first connecting piece 11, the second connecting piece 12 and the third connecting piece 13 are made of copper. Copper is an excellent conductor, its electrical conductivity is only second to silver, but the cost is relatively low, and the metal connecting piece 1 made of copper can reduce energy loss and improve the transmission efficiency of electrical energy when transmitting electrical energy.

[0037] Referring to Figure 4 and Figure 5 , the embodiment of the present application also provides a metal connecting piece 1 array, which comprises a plurality of the above-mentioned metal connecting pieces 1, and further comprises a connecting strip 3 and a connecting portion 31; the two ends of the second connecting piece 12 of each metal connecting piece in the width direction are provided with a connecting portion 31, and each metal connecting piece is connected to the connecting strip 3 one by one through the connecting portion 31.

[0038] As a preferred embodiment, the connecting strip 3 can also be provided with an elastic concave portion near its edge, which is used to separate the layers of the roll-shaped connecting strip 3, and protect the metal connecting piece 1.

[0039] Referring to Figure 1 and Figure 2 , the embodiment of the present application also provides a packaging structure, which comprises the above-mentioned metal connecting piece 1, and further comprises a frame 2 and a wafer 21, the wafer 21 is arranged on the base island of the frame 2, the third connecting piece 13 is welded to the wafer 21 by solder, and the first connecting piece 11 is welded to the pin 22 of the frame 2 by solder. By welding the metal connecting piece 1 with the above-mentioned special structure to the chip and the pin 22 of the frame 2 respectively, the packaging volume of the entire packaging structure can be reduced, and the overall electrical stability of the packaging structure can be improved.

[0040] The above merely is preferred embodiment of the present utility model, and is not for limiting the present utility model, for the person skilled in the art, the present utility model can have various changes and changes. Any modification, equivalent replacement, improvement etc. that is made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.

Claims

1. A metal connector, characterized in that: It includes a first connecting piece, a second connecting piece and a third connecting piece which are integrally connected in sequence; The first connecting piece, the second connecting piece and the third connecting piece are arranged in parallel and staggered with each other, and the first connecting piece is located between the horizontal planes of the second connecting piece and the third connecting piece; the first connecting piece is vertically connected to the second connecting piece, and the second connecting piece is obliquely connected to the third connecting piece; The length of the first connecting piece is smaller than the length of the third connecting piece.

2. The metal connector according to claim 1, characterized in that: The width of the first connecting piece is greater than that of the third connecting piece, and a U-shaped notch is formed at one end of the first connecting piece away from the third connecting piece.

3. The metal connector according to claim 1 or 2, characterized in that: The side surfaces of the first connecting piece and the third connecting piece away from the second connecting piece are provided with uneven undulating surfaces.

4. The metal connector according to claim 3, characterized in that: The concave portions of the undulating surface of the first connecting piece have the same height, and the concave portions of the undulating surface of the third connecting piece have the same height.

5. The metal connector according to claim 4, characterized in that: The concave portion of the undulating surface has a shape of an inverted cone, granular, columnar or block.

6. The metal connector according to claim 1, characterized in that A nano elastic layer is embedded in the first connecting piece, the second connecting piece and the third connecting piece.

7. The metal connector according to claim 1, characterized in that: The first connecting plate, the second connecting plate and the third connecting plate are made of copper.

8. A metal connector array, characterized in that: It comprises a plurality of metal connectors and connecting strips according to any one of claims 1 to 7; connecting parts are provided at both ends of the second connecting piece of each metal connector in the width direction, and each of the metal connectors is connected to the connecting strip one by one through the connecting parts.

9. A packaging structure, characterized in that: The metal connector comprises the metal connector according to any one of claims 1 to 7, and further comprises a frame and a wafer, wherein the wafer is arranged on the base island of the frame, the third connecting piece is welded to the wafer by solder, and the first connecting piece is welded to the pin of the frame by solder.

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