Carrier for chemical plating of single chip

Abstract

The utility model discloses a carrier for chemical plating of a single chip. The carrier for chemical plating of the single chip comprises a retainer, a lower limiting piece, an upper limiting piece and a pressing plate, wherein the retainer is used for placing the chip and limiting plane movement of the chip; the lower limiting piece is used for limiting the chip from falling from the lower part of the retainer; the upper limiting piece is used for limiting the chip from falling from the upper part of the retainer; the base is used for fixing the lower limiting piece and containing the holder, the hook is used for being connected with the base and hung on a plating solution tank, the holder is arranged in the base and is provided with a holding cavity penetrating through the holder, the holding cavity is used for placing a chip, the lower limiting piece is provided with a lower flow channel communicated with the holding cavity, and the lower flow channel is communicated with the holding cavity. The upper limiting piece is provided with an upper flow channel communicated with the maintaining cavity, the pressing plate is provided with an upper channel communicated with the upper flow channel, and the pressing plate is detachably installed on the base. According to the carrier for chemical plating of the single chip, the single chip can be subjected to chemical plating.

Description

TECHNICAL FIELD

[0001] The utility model relates to chip lead-out end coating technology field especially relates to a kind of for single chip chemical plating carrier. BACKGROUND

[0002] The I / O lead-out end of chip is chemically plated, so that the I / O lead-out end is plated with nickel, palladium and gold, etc. This can improve the reliability and solderability of the lead-out end. For mass-produced chips, nickel, palladium and gold, etc. are usually chemically plated on the I / O lead-out end. Wafer-level chemical plating process is usually used, that is, wafer is used as the main body for chemical plating.

[0003] Due to the fact that the number of chips required for research and development projects or is very small, when the chips are taped out, they are often assembled in a way. Different chips have different processing technologies, which results in the fact that some chips on the same wafer need to be chemically plated, while others do not. Such wafers cannot be chemically plated using existing wafer-level chemical plating processes. The current chemical plating equipment is designed for whole wafers. For assembled chips or single chips, it is not possible to use existing equipment, which results in the fact that assembled chips and single chips cannot be chemically plated, and thus cannot be subjected to post-chemical plating bumping. This also results in the fact that the reliability of the subsequent gold wire bonding process is not stable enough, and the solderability of the chip cannot be improved. SUMMARY

[0004] The utility model provides a kind of carrier for single chip chemical plating, which can carry single chip for chemical plating.

[0005] To solve the above problems, the utility model provides a kind of carrier for single chip chemical plating, which includes a holder for placing chips and limiting the movement of the plane of the chips, a lower limiting piece for limiting the falling of the chips from below the holder, an upper limiting piece for limiting the falling of the chips from above the holder, a pressing plate for limiting the upper limiting piece on the top surface of the holder, a base for fixing the lower limiting piece and accommodating the holder, and a hook for connecting with the base and hanging on the plating bath. The holder is placed in the base. The holder has a holding cavity that penetrates the holder. The holding cavity is used to place the chips. The lower limiting piece has a lower flow channel that communicates with the holding cavity. The plating solution in the plating bath directly or indirectly enters the holding cavity through the lower flow channel. The upper limiting piece has an upper flow channel that communicates with the holding cavity. The pressing plate has an upper channel that communicates with the upper flow channel. The pressing plate can be detachably installed on the base.

[0006] Further, the base has an accommodating cavity with upper and lower ends communicating with the outside world. The holder is located in the accommodating cavity. The lower limiting piece is located at the lower end of the accommodating cavity. Alternatively, the base has a lower channel for communicating the outside world with the lower flow channel.

[0007] Further, the pressing plate is provided with an upper perforation for the flow of plating solution in the plating solution tank, and the upper perforation is an upper channel.

[0008] Further, the pressing plate is installed on the base by interference fit, screwing or clamping.

[0009] Further, the lower limiting member and the upper limiting member are both provided with a plurality of meshes, and the meshes of the lower limiting member and the upper limiting member are composed of silk weaving, and the meshes of the lower limiting member serve as a lower flow channel, and the meshes of the upper limiting member serve as an upper flow channel.

[0010] Further, the height of the holding cavity is greater than the thickness of the chip, and the height of the holding cavity is less than the length of the short side of the chip.

[0011] Further, the holder is provided with a taking hole or rod for taking force.

[0012] Further, the hook comprises a hanging member for hanging with the plating solution tank and a connecting rod for connecting the hanging member and the base, and the hanging member is screwed on the connecting rod.

[0013] Further, the base comprises an outer frame seat for connecting with the hook and an inner frame seat for fixing with the outer frame seat, and the lower limiting member is clamped and fixed between the inner frame seat and the outer frame seat, and the inner frame seat and the outer frame seat are connected by screwing, interference fit or clamping.

[0014] The utility model discloses a carrier for single chip chemical plating, which can limit a single chip in a holder by a holder, an upper limiting member and a lower limiting member, and place the holder and the chip in the holder in a plating solution tank by a hook for chemical plating, so as to realize the chemical plating process of a single chip. Therefore, the post ball mounting after the under bump metallization based on the chemical plating process can be carried out for the tiled wafer or single chip, the reliability of the subsequent gold wire bonding process can be improved, and the solderability of the chip can be improved. ACCURATE DRAWINGS

[0015] Figure 1 It is a structure schematic view of the carrier for single chip chemical plating.

[0016] Figure 2 It is an explosion view of the carrier for single chip chemical plating.

[0017] Figure 3 It is a sectional view of the carrier for single chip chemical plating.

[0018] Figure 4 It is a structure schematic view of the base.

[0019] Figure 5 is a structural schematic view of the retainer.

[0020] Figure 6 is a structural schematic view of the pressing plate.

[0021] Figure 7 is a structural schematic view of another embodiment of the pressing plate.

[0022] Figure 8 is a method for electroless plating of single-chip using a carrier.

[0023] Figure 9 is a structural schematic view of another embodiment of the base.

[0024] Figure 10 is a structural schematic view of another embodiment of the base.

[0025] The meanings of the various reference signs in the drawings are as follows:

[0026] retainer 1, retaining cavity 11, taking hole 12, lower limiting piece 2, upper limiting piece 3, pressing plate 4, upper passage 40, connecting part 41, limiting part 42, buckling groove 43, base 5, accommodating cavity 501, lower passage 502, inner frame seat 51, outer frame seat 52, mounting part 521, hook 6, hooking piece 61, connecting rod 62. DETAILED DESCRIPTION

[0027] The utility model will be further described below in combination with the drawings.

[0028] Example 1

[0029] As Figures 1 to 3The preferable embodiment of the utility model discloses a carrier for single chip chemical plating includes the holder 1 for placing chip and limiting chip plane movement, the lower limit piece 2 for limiting chip from the holder 1 below drop, the upper limit piece 3 for limiting chip from the holder 1 above drop, the pressing plate 4 for the upper limit piece 3 pressure setting in the holder 1 top surface, the base 5 for fixing lower limit piece 2 and containing holder 1 and the hook 6 for being connected with base 5 and hanging in plating bath. The holder 1 is placed in the base 5, the holder 1 has the holding cavity 11 through the holder 1, and the chip needing chemical plating is placed in the holding cavity 11, and the shape of holding cavity 11 is adapted to the shape of chip, that is, holding cavity 11 is quadrilateral, to ensure that the chip does not rotate in the holding cavity 11. The lower limit piece 2 is located on the bottom surface of the holder 1, and the lower limit piece 2 is used to limit the chip in the holding cavity 11 from falling out of the lower end of the holding cavity 11. The plating solution in the plating bath can pass through the base 5 and the lower limit piece 2 into the holding cavity 11. The upper limit piece 3 is placed on the top surface of the holder 1, and the upper limit piece 3 is used to limit the chip in the holding cavity 11 from falling out of the upper end of the holding cavity 11. In other embodiments, as shown in the figure, the upper limit piece 3 can also be fixed on the pressing plate 4. The pressing plate 4 can be detachably installed on the base 5, and the pressing plate 4 presses the upper limit piece 3 tightly on the top surface of the holder 1, so that the upper limit piece 3 is attached to the top surface of the holder 1. The plating solution in the plating bath can pass through the pressing plate 4 and the lower limit piece 2 into the holding cavity 11, so that the chip in the holding cavity 11 is chemically plated.

[0030] As Figure 4 As shown in the figure, the base 5 has a containing cavity 501 with the upper end and the lower end being communicated with the outside, the holder 1 is located in the containing cavity 501, and the lower limit piece 2 is located at the lower end of the containing cavity 501. The base 5 is usually made of plastic, such as polytetrafluoroethylene, so that the base 5 remains absolutely inert in the chemical plating solution and does not react with the plating solution, protecting the solution from being contaminated. The base 5 includes an inner frame seat 51 and an outer frame seat 52, the inner frame seat 51 and the outer frame seat 52 are fixed by interference fit, the inner frame seat 51 is located in the outer frame seat 52, and the inner frame seat 51 and the outer frame seat 52 fix the lower limit piece 2 by clamping; the outer frame seat 52 is provided with a mounting portion 521, and the hook 6 is fixed on the mounting portion 521; the inner frame seat 51 and the outer frame seat 52 are both tubular. It should be known that the interference fit of the inner frame seat 51 and the outer frame seat 52 is not easy to be easily removed, which ensures the stable connection of the inner frame seat 51 and the outer frame seat 52; of course, in other embodiments, the inner frame seat 51 and the outer frame seat 52 can also be screwed or clamped.

[0031] As Figure 5As shown, the holding cavities 11 are multiple, each of the holding cavities 11 penetrates the holder 1 in the thickness direction, so the height of the holding cavities 11 is the same as the thickness of the holder 1, the holding cavities 11 are uniformly distributed on the holder 1, and multiple holding cavities 11 can be used for chemical plating of multiple chips at one time. The thickness of the holder 1 is less than the short side of the chip, that is, the height of the holding cavities 11 is less than the short side of the chip, even if the chip is flipped with the center of the short side as the base point, it will be limited by the upper limit piece 3 and the lower limit piece 2, so that the chip cannot be flipped in the holding cavity 11. The thickness of the holder 1 is greater than the thickness of the chip, that is, the height of the holding cavities 11 is greater than the thickness of the chip, effectively avoiding friction between the chip in the holding cavity 11 and the upper limit piece 3. The outer diameter of the holder 1 is adapted to the inner diameter of the inner frame 51, so as to ensure that the holder 1 will not abut against the end face of the inner frame, and the inner frame will not be subjected to the thrust of the pressing plate 4 when the pressing plate 4 presses the upper limit piece 3, ensuring the stability of the interference fit between the inner frame and the outer frame. The holder 1 is provided with a taking hole 12, the taking hole 12 is two, which is convenient for taking the holder 1 into or out of the base 5 by taking the hole 12 as the fulcrum with tools such as tweezers. In other embodiments, a force applying rod can also be provided on the holder 1, and of course a corresponding avoiding hole or slot is provided on the upper limit piece 3 and the pressing plate 4. The holder 1 is usually made of plastic, such as polytetrafluoroethylene, so that the holder 1 remains absolutely inert in the chemical plating solution and does not react with the plating solution, protecting the solution from contamination.

[0032] The lower limit piece 2 has a lower flow channel, which communicates with the holding cavity 11, and the plating solution in the plating solution tank enters the holding cavity 11 through the flow channel; since the lower limit piece 2 is located on the end face of the base 5, the plating solution directly enters the holding cavity 11 through the lower flow channel in this embodiment. The lower limit piece 2 has a plurality of mesh holes so that the lower limit piece 2 is mesh-shaped, and the mesh holes serve as the lower flow channel. The mesh is usually made of plastic, such as polytetrafluoroethylene, so that the lower limit piece 2 remains absolutely inert in the chemical plating solution and does not react with the plating solution, protecting the solution from contamination. It should be understood that those skilled in the art can select a mesh with a suitable mesh count according to the needs to ensure that the chip and the plating solution can fully react, that is, the reaction between the chip and the plating solution is not affected; the mesh holes of the lower limit piece 2 are usually formed by weaving plastic wires.

[0033] The upper limiting member 3 has an upper flow channel through which the plating solution in the plating solution tank enters the holding cavity 11. The upper limiting member 3 is placed on the holder 1. The upper limiting member 3 has a plurality of mesh holes so that the upper limiting member 3 is mesh-shaped. The mesh holes serve as lower flow channels. The mesh is usually made of plastic, such as polytetrafluoroethylene. The upper limiting member 3 is absolutely inert in the electroless plating solution and does not react with the plating solution, thereby protecting the solution from being contaminated. It should be understood that those skilled in the art can select a mesh with a suitable mesh count according to requirements to ensure that the chip can fully react with the plating solution, i.e., the reaction between the chip and the plating solution is not affected. The mesh holes of the upper limiting member 3 are usually formed by weaving plastic wires.

[0034] As shown in Figure 6 , the pressing plate 4 and the base 5 are installed in an interference fit. It should be understood that the interference fit between the pressing plate 4 and the base 5 can be disassembled or assembled by using relatively light force, thereby facilitating disassembly and assembly for use. In other embodiments, the pressing plate 4 and the base 5 can also be connected in a screwing or clamping manner or other detachable manner. The pressing plate 4 has an upper passage 40 through which the plating solution passes. The upper passage 40 is in communication with the upper flow channel to ensure that the plating solution can smoothly enter the upper flow channel. The center of the pressing plate 4 is provided with an upper through hole, which is the upper passage 40. The through hole can cover all the holding cavities 11 on the holder 1. In other embodiments, as shown in Figure 7 , a plurality of upper through holes can be provided on the pressing plate 4. Each upper through hole is provided correspondingly to a holding cavity 11. The pressing plate 4 is usually made of plastic, such as polytetrafluoroethylene. The pressing plate 4 is absolutely inert in the electroless plating solution and does not react with the plating solution, thereby protecting the solution from being contaminated. The pressing plate 4 has a buckle groove 43. When the pressing plate 4 is disassembled, the hand is inserted into the buckle groove 43 to facilitate force application. Of course, the buckle groove 43 can also be a force application position of a tool. Specifically, the pressing plate 4 includes a connecting portion 41 and a limiting portion 42. The connecting portion 41 is interference-fitted with the base 5 and presses the upper limiting member 3. The limiting portion 42 is located at the upper end of the connecting portion 41 and is formed by extending outward from the upper end of the connecting portion 41. The buckle groove 43 is provided on the limiting portion 42. The limiting portion 42 is used to prevent the connecting portion 41 from moving downward too much, thereby avoiding extrusion of the lower limiting member 2 and causing the lower limiting member 2 to fall off.

[0035] The hook 6 includes a hooking member 61 and a connecting rod 62. The hooking member 61 is used to be hooked with the plating solution tank. The lower end of the connecting rod 62 is fixed with the base 5. The upper end of the connecting rod 62 is connected with the hooking member 61. The connecting rod 62 connects the hooking member 61 and the base 5 to form an integral whole. In order to facilitate adjustment of the height of the base 5, the hooking member 61 is provided with a threaded hole. The upper end of the connecting rod 62 is provided with an external thread. The connecting rod 62 is screwed on the threaded hole.

[0036] As Figure 8 shown, the method for electroless plating by using the carrier comprises the following steps:

[0037] S1, placing the chip, specifically: placing the holder 1 in the base 5, and then placing the chip in the holding cavity 11 of the holder 1;

[0038] S2, fixing the chip, specifically: placing the upper limiting piece 3 on the holder 1, and assembling the pressing plate 4 on the base 5;

[0039] S3, placing the carrier in the plating bath for electroless plating, specifically: using the hook 6 to hang the entire carrier in the plating bath, so that the chip, the base 5, the pressing plate 4, the upper limiting piece 3 and the lower limiting piece 2 are immersed in the plating solution, to complete the electroless plating of the chip;

[0040] S4, taking out the carrier from the plating bath, specifically: taking out the entire electroless plating carrier from the plating bath after the electroless plating is completed;

[0041] S5, taking out the chip, specifically: disassembling the pressing plate 4, then taking out the upper limiting piece 3 and the holder 1, and finally taking out the electroless plated chip.

[0042] The electroless plating process of a single chip is realized, so that the under bump metallization and ball placement based on the electroless plating process can be carried out for a single chip, the reliability of the subsequent gold wire bonding process can be improved, the solderability of the chip can be improved, and the split wafer can be divided into single chips for electroless plating. The holder 1 is detachable and replaceable, different holding cavities 11 can be selected according to different sizes of chips, and a plurality of specifications of single chips can be electrolessly plated by replacing the holder 1, so that the application range is wide.

[0043] Embodiment two

[0044] As Figure 9 shown, the difference between the present embodiment and embodiment one is that the inner frame seat 51 of the base 5 has a lower channel 502, the inner frame seat 51 is provided with a plurality of through holes, and the through holes are used as the lower channel 502, and the inner diameter of the inner frame seat 51 is the same as the inner diameter of the outer frame seat 52. Of course, in other embodiments, as Figure 10 shown, the inner frame seat 51 can also be annular, that is, the inner frame seat 51 has a larger diameter to cover all the holding cavities 11.

[0045] The above is only an embodiment of the present application, and does not limit the patent range of the present application, and any equivalent structure made by using the content of the present application specification and drawings, directly or indirectly used in other related technical fields, is also within the patent protection range of the present application.

Claims

1. A carrier for single-chip electroless plating, characterized by: The application relates to a chip plating device, which comprises a holder for placing a chip and limiting the movement of the chip plane, a lower limiting piece for limiting the falling of the chip from below the holder, an upper limiting piece for limiting the falling of the chip from above the holder, a pressing plate for limiting the upper limiting piece on the top surface of the holder, a base for fixing the lower limiting piece and containing the holder, and a hook for connecting with the base and hanging on a plating solution tank, the holder is arranged in the base, the holder has a holding cavity penetrating through the holder, the holding cavity is used for placing the chip, the lower limiting piece has a lower flow channel in communication with the holding cavity, plating solution in the plating solution tank directly or indirectly enters the holding cavity through the lower flow channel, the upper limiting piece has an upper flow channel in communication with the holding cavity, the pressing plate has an upper passage in communication with the upper flow channel, and the pressing plate is detachably arranged on the base.

2. A carrier for single chip electroless plating as claimed in claim 1, wherein: The base has a containing cavity with upper and lower ends in communication with the outside, the holder is arranged in the containing cavity, and the lower limiting piece is arranged at the lower end of the containing cavity, or the base has a lower passage for connecting the outside with the lower flow channel.

3. The carrier for single chip electroless plating according to claim 1, wherein: The pressing plate is provided with an upper perforation for the flow of plating solution in the plating solution tank, and the upper perforation is the upper passage.

4. The carrier for single chip electroless plating according to claim 1, wherein: The pressing plate is arranged on the base in a mode of interference fit, screwing or clamping.

5. The carrier for single chip electroless plating according to claim 1, wherein: The lower limiting piece and the upper limiting piece each have a plurality of meshes, the meshes of the lower limiting piece and the upper limiting piece are composed of silk weaving, the meshes of the lower limiting piece are used as the lower flow channel, and the meshes of the upper limiting piece are used as the upper flow channel.

6. The carrier for single chip electroless plating according to claim 1, wherein: The height of the holding cavity is greater than the thickness of the chip, and the height of the holding cavity is less than the length of the short side of the chip.

7. The carrier for single chip electroless plating according to claim 1, wherein: The holder is provided with a taking hole or rod for taking force.

8. The carrier for single chip electroless plating according to claim 1, wherein: The hook comprises a hanging piece for hanging with the plating solution tank and a connecting rod for connecting the hanging piece with the base, and the hanging piece is screwed on the connecting rod.

9. The carrier for single chip electroless plating as claimed in claim 1, wherein: The base comprises an outer frame seat for connecting with the hook and an inner frame seat for fixing with the outer frame seat, the lower limiting piece is clamped and fixed between the inner frame seat and the outer frame seat, and the inner frame seat and the outer frame seat are connected in a mode of screwing, interference fit or clamping.

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