Electronic device

Abstract

The utility model provides electronic equipment, and relates to the technical field of terminals. The electronic equipment comprises a shell and an electronic component. The shell comprises a first wall plate, a second wall plate and a connecting plate, the first wall plate and the second wall plate are oppositely arranged in the first direction, and the surface, facing the first wall plate, of the second wall plate is provided with a first avoiding area. The connecting plate is connected between one end of the first wall plate in the second direction and one end of the second wall plate in the second direction. The first avoiding area extends to the edge of the second wall plate in the second direction and in the direction away from the connecting plate. The two ends of the first avoiding area in the second direction are a first end and a second end respectively, and the second end is far away from the connecting plate relative to the first end. The second side face of the electronic component abuts against the first end through the elastic structure, and the first receding area does not tend to extend towards the second wall plate in the second direction and in the direction from the first end to the second end. Therefore, disassembly and assembly are convenient.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of terminal, and particularly relates to an electronic device. BACKGROUND

[0002] In the related art, when electronic components such as a loudspeaker module are assembled with a shell, the electronic components cannot be assembled to the correct position, resulting in misassembly and affecting assembly efficiency. Even if the electronic components are assembled to the correct position, disassembly can easily cause the electronic components to break or deform, and even cause the electronic components to be unusable. CONTENT OF THE UTILITY MODEL

[0003] Therefore, the present application provides an electronic device, which sets a first avoiding area on the second wall plate, so that the elastic structure abuts at the first end of the first avoiding area. In this way, the elastic structure abuts against the second wall plate, solving the problems of assembly and disassembly difficulty between the electronic components and the shell.

[0004] To achieve the above object, the present application adopts the following technical scheme:

[0005] In a first aspect, the present application provides an electronic device, comprising: a shell and an electronic component. The shell comprises a first wall plate, a second wall plate and a connecting plate, the first wall plate and the second wall plate are oppositely arranged in a first direction, and the surface of the second wall plate facing the first wall plate has a first avoiding area. The connecting plate is connected between one end of the first wall plate in a second direction and one end of the second wall plate in the second direction. The first avoiding area extends to the edge of the second wall plate in the second direction and away from the connecting plate. The first avoiding area has a first end and a second end in the second direction, and the second end is away from the connecting plate relative to the first end. The electronic component has a first side and a second side oppositely arranged in the first direction, the first side abuts against the first wall plate, and the second side is provided with an elastic structure protruding from the second side, and the second side abuts against the first end through the elastic structure.

[0006] Wherein, in the direction along the second direction and from the first end to the second end, the first avoiding area has no tendency to extend towards the first wall plate.

[0007] According to the electronic device, on one hand, the elastic structure can be in abutment with the first avoiding area to play a role of pre-fixing, so that the electronic component and the shell inside are further assembled, and the problem of the electronic component being lifted or popped after being pre-fixed is effectively solved. On the other hand, when the electronic component is disassembled, the elastic structure can move along the first avoiding area from the first end to the second end. Since the first avoiding area has no tendency to extend towards the first wall plate along the thickness direction of the electronic device and from the first end to the second end, the first avoiding area has little or no interference with the movement of the elastic structure, so that the electronic component can be disassembled conveniently, the disassembly efficiency of the electronic component is improved, the processing cost of the second wall plate is saved, the production difficulty of the second wall plate is reduced, the structural strength of the second wall plate is improved, and the loss during maintenance and disassembly of the electronic component is overcome.

[0008] In some possible implementation manners of the first aspect of the present application, the first avoiding area extends obliquely towards the direction away from the second side surface along the thickness direction of the electronic device and from the first end to the second end, or the first avoiding area is arranged perpendicularly to the connecting plate. In this way, the first avoiding area has little or no interference with the movement of the elastic structure, so that the electronic component can be disassembled conveniently, and the disassembly efficiency of the electronic component is improved.

[0009] In some possible implementation manners of the first aspect of the present application, the first avoiding area is a plane. In this way, the plane has the characteristics of simple structure, easy processing and maintenance, and the processing cost of the first avoiding area is saved.

[0010] In some possible implementation manners of the first aspect of the present application, the electronic component includes a shell, and the shell includes a first plate body facing the second wall plate, and the first plate body has a deformation hole penetrating through the first plate body. The elastic structure is located at the deformation hole and connected to the inner circumferential surface of the deformation hole. In this way, on one hand, the elastic structure is compact. On the other hand, the elastic structure being connected to the inner circumferential surface of the deformation hole can be more conducive to the deformation of the elastic structure.

[0011] In some possible implementation manners of the first aspect of the present application, the elastic structure includes an elastic cantilever and a boss, the elastic cantilever is located in the deformation hole, and the two ends of the length direction of the elastic cantilever are connected to the inner circumferential surface of the deformation hole respectively. The boss is fixed to the side surface of the elastic cantilever facing the second wall plate, the boss protrudes from the second side surface and abuts against the first end. In this way, on one hand, the layout of the elastic structure is reasonable and the structure is simple. On the other hand, by connecting the elastic cantilever to the inner circumferential surface of the deformation hole, the deformation of the first plate body is concentrated in the area of the elastic cantilever, and the deformation range of the first plate body is reduced.

[0012] In some possible implementation manners of the first aspect of the present application, the boss is located at the middle of the elastic cantilever. In this way, on the one hand, the deformation range of the elastic cantilever can be increased. On the other hand, based on the interference fit of the electronic component in the shell, when the boss pushes the elastic structure to deform in the direction of the first wall plate, the boss located at the middle of the elastic cantilever can make the stress of the elastic cantilever uniform, and improve the structural strength and stability of the elastic cantilever.

[0013] In some possible implementation manners of the first aspect of the present application, a thinning groove is formed at a region corresponding to the boss on the side surface of the elastic cantilever facing away from the second wall plate. In this way, when the boss deforms in the direction of the first wall plate against the elastic structure, the thinning groove can improve the deformation capacity of the elastic cantilever.

[0014] In some possible implementation manners of the first aspect of the present application, the depth of the thinning groove ranges from greater than 0 to less than or equal to 0.3 mm. In this way, on the one hand, the elastic deformation capacity of the elastic cantilever can be improved. On the other hand, the structural strength of the elastic cantilever can be prevented from being weakened due to the excessively large depth of the thinning groove, and the risk of fracture of the elastic cantilever can be reduced.

[0015] In some possible implementation manners of the first aspect of the present application, the boss and the first end are in surface contact. In this way, the surface contact can improve the reliability of the abutment between the boss and the first avoiding area, increase the area of the abutment surface, and also avoid stress concentration in the abutment process between the boss and the first end.

[0016] In some possible implementation manners of the first aspect of the present application, the end surface of the boss abutting against the first end is a plane. The plane has the characteristics of simple structure and easy processing and manufacturing. Moreover, when the first avoiding area is a plane, the end surface of the boss abutting against the first end being a plane is conducive to realizing the surface contact between the boss and the first end.

[0017] In some possible implementation manners of the first aspect of the present application, from the direction in which the second wall plate points to the first wall plate, the two side surfaces of the boss in the second direction extend in a direction away from each other. In this way, the interference between the second wall plate and the two side surfaces of the boss during disassembly and assembly of the electronic component can be avoided.

[0018] In some possible implementation manners of the first aspect of the present application, the width of the elastic cantilever ranges from 0.5 mm to 2 mm. In this way, the width of the elastic cantilever is less than or equal to 2 mm, which can ensure the elastic deformation capacity of the elastic cantilever, and the width of the elastic cantilever is greater than or equal to 0.5 mm, which is conducive to ensuring the structural strength of the elastic cantilever.

[0019] In some possible implementation manners of the first aspect of the present application, the length of the elastic cantilever ranges from 2 mm to 6 mm. In this way, the length of the elastic cantilever is greater than or equal to 2 mm, which can ensure the elastic deformation capability of the elastic cantilever, and the length of the elastic cantilever is less than or equal to 6 mm, which is conducive to ensuring the structural strength of the elastic cantilever.

[0020] In some possible implementation manners of the first aspect of the present application, the thickness of the boss ranges from 0.15 mm to 0.5 mm. In this way, the boss and the elastic cantilever can achieve the optimal deformation amount when the boss abuts against the second wall plate, thereby ensuring the reliability of the electronic component when being pre-fixed in the housing. The thickness of the boss is prevented from being too small, so that the deformation amount of the boss is too small when the boss abuts against the second wall plate, the interference fit gap between the electronic component and the housing is too large, and the pre-fixing of the electronic component in the housing fails. The thickness of the boss is also prevented from being too large, so that the interference fit gap between the electronic component and the housing is too small, and the assembly and disassembly of the electronic component and the housing are difficult.

[0021] In some possible implementation manners of the first aspect of the present application, the electronic component is a loudspeaker module, and the first wall plate is provided with a sound hole. The loudspeaker module includes a shell, and the shell has a sound channel opposite and communicating with the sound hole. In this way, the structure layout is reasonable, and the loudspeaker module can ensure smooth sound emission.

[0022] In some possible implementation manners of the first aspect of the present application, the electronic device further includes a sealing ring, which is arranged between the first wall plate and the first side surface and surrounds the sound channel and the sound hole. In this way, the sealing ring can seal the gap between the first side surface and the first wall plate, and the waterproof effect of the electronic device is improved.

[0023] In some possible implementation manners of the first aspect of the present application, the shell includes a first part and a second part, and one side of the first part facing the connecting plate is open to form an open hole. The loudspeaker module further includes a core, which is mounted in the first part and divides the space in the first part into a front cavity and a rear cavity. The front cavity is in communication with the sound channel, and the rear cavity is in communication with the open hole. In this way, on the one hand, the end wall plate of the first part adjacent to the connecting plate is cancelled, thereby reducing the thickness of the loudspeaker module and further reducing the overall thickness of the electronic device. On the other hand, the open hole can be used to communicate the rear cavity with the space between the shell and the connecting plate, so as to expand the capacity of the rear cavity and improve the low-frequency effect of the loudspeaker module.

[0024] In some possible implementation manners of the first aspect of the present application, the electronic device further includes a supporting foam, which is located at the opening and supported between the connecting plate and the core. The supporting foam is configured to support the speaker module in the shell, and to reduce vibration of the speaker module when the speaker module emits sound.

[0025] In some possible implementation manners of the first aspect of the present application, the shell includes a frame and a middle plate, and the frame is arranged around an edge of the middle plate. The second wall plate is located in the frame, and two ends of the second wall plate in the third direction are connected to the frame respectively. A section of the frame forms the first wall plate, and a section of the middle plate between the second wall plate and the first wall plate forms the connecting plate. In this way, the structure is compact and the layout is reasonable.

[0026] In some possible implementation manners of the first aspect of the present application, the electronic device further includes a first circuit board, a second circuit board and a signal wire. The first circuit board is mounted on the middle plate and located on a side of the second wall plate away from the first wall plate. The second circuit board is mounted on the middle plate and located between the first wall plate and the second wall plate. The second part is located outside the first part, the first part is arranged side by side with the second circuit board in a direction perpendicular to the second direction, and the second part is arranged in layers on a side of the second circuit board away from the connecting plate. A wire slot is formed on a surface of the shell away from the middle plate, the signal wire is fixed and electrically connected between the first circuit board and the second circuit board, and a part of the signal wire is accommodated in the wire slot. In this way, the structure is compact and the layout is reasonable.

[0027] In a second aspect, the present application further provides an electronic device, which includes a shell and electronic components. The shell includes a first wall plate, a second wall plate and a connecting plate. The first wall plate and the second wall plate are arranged opposite to each other in a first direction. The connecting plate is connected between one end of the first wall plate in a second direction and one end of the second wall plate in the second direction. The wall surface of the second wall plate facing the first wall plate is provided with an elastic structure protruding from the second wall plate. The electronic components have a first side and a second side arranged opposite to each other in the first direction. The first side abuts against the first wall plate, and the second side has a first avoiding area extending to an edge of the second side in the second direction and in a direction close to the connecting plate. The first avoiding area has a first end and a second end in the second direction, and the first end is away from the connecting plate relative to the second end. The elastic structure abuts against the first end.

[0028] In the direction from the first end to the second end along the second direction, the first avoiding area has no tendency to extend towards the second wall plate.

[0029] In this way, on the one hand, the elastic structure can abut against the first avoiding area to play a pre-fixing role, so as to facilitate the further assembly of the electronic components inside the shell, and effectively solve the problem of the electronic components being lifted or popped after being pre-fixed. On the other hand, since the first end is away from the connecting plate relative to the second end, the elastic structure abuts against the first end, and along the second direction and from the first end to the second end, the first avoiding area has no tendency to extend towards the second wall plate. In this way, the first avoiding area can avoid the elastic structure except for the position of the first end, and the interference between the first avoiding area and the elastic structure is small or no interference, so that the electronic components can be easily disassembled, the disassembly efficiency of the electronic components is improved, the production difficulty of the second wall plate is reduced, the structural strength of the second wall plate is improved, and the loss of the electronic components during maintenance and disassembly is overcome. BRIEF DESCRIPTION OF DRAWINGS

[0030] Figure 1 A perspective view of an electronic device according to some embodiments of the present application;

[0031] Figure 2 An exploded view of an electronic device according to Figure 1 ;

[0032] Figure 3 An internal structure diagram of an electronic device without a back cover according to Figure 1 ;

[0033] Figure 4 A cross-sectional view of an electronic device according to Figure 3 ;

[0034] Figure 5 A cross-sectional view of an electronic device according to some other embodiments of the present application;

[0035] Figure 6 A partial exploded view of an electronic device according to Figure 5 ;

[0036] Figure 7 A structure diagram of a first mounting space in an electronic device according to still other embodiments of the present application;

[0037] Figure 8 A partial diagram of the assembly process of a loudspeaker module and a first mounting space in an electronic device according to still other embodiments of the present application;

[0038] Figure 9 A cross-sectional view of an assembled electronic device at B-B line according to Figure 8 ;

[0039] Figure 10 A cross-sectional view of an assembled electronic device at B-B line according toFigure 9 Enlarged view of the structure shown in

[0040] Figure 11 For the shell structure of the loudspeaker module shown in Figure 8

[0041] Figure 12 For the shell structure of the loudspeaker module shown in Figure 11 Enlarged view of the structure shown in

[0042] Figure 13 For the shell structure of the loudspeaker module shown in Figure 8 Top view of the elastic structure shown in the electronic device

[0043] Figure 14 For the cross-sectional view of the electronic device in another embodiment of the present application

[0044] Figure 15 For the shell structure of the loudspeaker module shown in Figure 14 Partial enlarged view of the structure shown in

[0045] Reference signs:

[0046] 100, electronic device

[0047] 1, screen; 11, light-transmitting cover plate; 12, display screen

[0048] 2, middle frame; 21, frame; 211, first wall plate; 2112, sound transmission hole; 212, second wall plate; 2121, matching groove; 2122, first avoidance area; 2122a, first end; 2122b, second end; 213, third wall plate; 214, first side plate; 215, second side plate; 216, third side plate; 217, fourth side plate; 218, fifth side plate; 219, sixth side plate; 210, fourth wall plate; 22, middle plate; 221, connecting plate; 222, first plate; 223, second plate

[0049] 3, back cover

[0050] 4, first circuit board

[0051] 5, second circuit board

[0052] 6, battery

[0053] 7, loudspeaker module; 71, shell; 711, open hole; 712, first part; 7121, front cavity; 7122, rear cavity; 713, second part; 714, sound channel; 715, first side surface; 716, first plate body; 7161, second side surface; 7162, deformation hole; 717, elastic structure; 7171, elastic cantilever; 7172, boss; 7173, thinning groove; 72, core; 73, buckle​

[0054] 8, signal line; 81, line groove;

[0055] 9, sealing ring;

[0056] N, layer of adhesive material; M, support foam; K, first mounting space; Q, second mounting space; J, third mounting space. DETAILED DESCRIPTION

[0057] In the embodiments of the present application, the term "exemplarily" or "for example" and the like are used to represent as an example, illustration or description. Any embodiment or design scheme described as "exemplarily" or "for example" in the embodiments of the present application should not be interpreted as more preferred or more advantageous than other embodiments or design schemes. Rather, the term "exemplarily" or "for example" and the like are intended to present the relevant concept in a specific manner.

[0058] In the description of the embodiments of the present application, the term "and / or" means and covers any and all possible combinations of one or more of the associated listed items. The term "and / or" is a description of the association relationship of the associated objects, which means that there can be three relationships, for example, A and / or B can represent: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " in the present application generally represents that the front and rear associated objects are in an "or" relationship.

[0059] In the description of the embodiments of the present application, unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connecting" should be understood in a broad sense, for example, "connecting" can be detachable connection, or can be non-detachable connection; can be direct connection, or indirect connection through intermediate medium.

[0060] In the description of the embodiments of the present application, the terms "including", "containing" or any other variants thereof are intended to cover non-exclusive containing, so that the process, method, article or device including a series of elements not only includes those elements, but also includes other elements not explicitly listed, or includes elements inherent to such process, method, article or device. Without more limitation, the element defined by the sentence "including a…" does not exclude the existence of other same elements in the process, method, article or device including the element. Without more limitation, the element defined by the sentence "including a…" does not exclude the existence of other same elements in the process, method, article or device including the element.

[0061] The present application provides an electronic device. Specifically, the electronic device can be a portable electronic device or other suitable electronic device. For example, the electronic device can be a mobile phone, a tablet personal computer, a laptop computer, a personal digital assistant (PDA), a camera, a personal computer, a notebook computer, a vehicle-mounted device, a wearable device (e.g., a watch or a bracelet), augmented reality (AR) glasses, an AR helmet, virtual reality (VR) glasses, or a VR helmet, etc.

[0062] Referring to Figure 1 and Figure 2 wherein, Figure 1 a perspective view of an electronic device 100 according to some embodiments of the present application; Figure 2 a perspective view of an electronic device 100 according to some embodiments of the present application; Figure 1 An exploded view of the electronic device 100 is shown in FIG. 1B. In the present embodiment, the electronic device 100 is a mobile phone. The electronic device 100 can include a screen 1, a housing, a first circuit board 4, a second circuit board 5, a battery 6, and a speaker module 7.

[0063] The screen 1 is used to display image information, video information, etc. The screen 1 includes a light-transmitting cover plate 11 and a display screen 12. The light-transmitting cover plate 11 is in the shape of a flat plate. Specifically, the shape of the light-transmitting cover plate 11 includes, but is not limited to, a rectangular flat plate, a square flat plate, an oblong flat plate, a circular flat plate, and an elliptical flat plate. The material of the light-transmitting cover plate 11 includes, but is not limited to, glass, plastic, and ceramic. The light-transmitting cover plate 11 is arranged in layers with the display screen 12 and is fixedly connected. The connection between the light-transmitting cover plate 11 and the display screen 12 includes, but is not limited to, adhesion. The light-transmitting cover plate 11 is mainly used to protect and prevent dust from the display screen 12.

[0064] The display screen 12 can be a flexible display screen or a rigid display screen. For example, the display screen 12 can be an organic light-emitting diode (OLED) display screen, an active-matrix organic light-emitting diode (AMOLED) display screen, a mini organic light-emitting diode display screen, a micro organic light-emitting diode display screen, a micro organic light-emitting diode display screen, a quantum dot light-emitting diode (QLED) display screen, or a liquid crystal display (LCD), etc. The display surface of the display screen 12 faces the light-transmitting cover plate 11, so that the image, video, etc. displayed by the display screen 12 can be observed by the user through the light-transmitting cover plate 11.

[0065] To facilitate the description of the following embodiments, a coordinate system is established for the electronic device 100. Specifically, the thickness direction of the electronic device 100 (i.e. the stacking direction of the light-transmitting cover plate 11 and the display screen 12) is defined as the Z-axis direction (i.e. the second direction), the directions perpendicular to the Z-axis are defined as the Y-axis direction (i.e. the first direction) and the X-axis direction (i.e. the third direction) respectively, and the Y-axis direction and the X-axis direction are perpendicular. Specifically, in this embodiment, the electronic device 100 is in the shape of a rectangular flat plate, wherein the length direction of the electronic device 100 is the Y-axis direction and the width direction of the electronic device 100 is the X-axis direction. It can be understood that the coordinate system of the electronic device 100 can be flexibly set according to actual needs, which is not specifically limited here.

[0066] Please continue to refer to Figure 2 The shell includes a middle frame 2 and a back cover 3. The middle frame 2 includes a frame 21 and a middle plate 22.

[0067] The frame 21 is in the shape of a ring frame. The frame 21 surrounds the screen 1. The connection relationship between the frame 21 and the screen 1 includes but is not limited to adhesion, clamping, etc.

[0068] The middle plate 22 is provided in the frame 2, and the frame 2 is arranged around the edge of the middle plate 22. The middle plate 22 is in a flat plate shape. The shape of the middle plate 22 is adapted to the shape of the light-transmitting cover plate 11. The middle plate 22 is located on the side of the display screen 12 away from the light-transmitting cover plate 11, and the middle plate 22 is arranged in a stack with the display screen 12. The middle plate 22 serves as a structural “skeleton” of the electronic device 100, and the first circuit board 4, the second circuit board 5, the battery 6, and the like can be fixed to the middle plate 22.

[0069] The middle frame 2 can be an integrally formed structure, that is, the middle plate 22 and the frame 21 are an integral structure. In this way, the structural strength of the middle frame 2 is improved, and the processing technology of the middle frame 2 is simplified, and the production cost of the middle frame 2 is reduced. Of course, the present application is not limited to this, and in other examples, the middle frame 2 can also be assembled by the frame 21 and the middle plate 22. The connection mode between the frame 21 and the middle plate 22 includes but is not limited to gluing, clamping, screw connection, and welding, etc.

[0070] The back cover 3 is located on the side of the middle plate 22 away from the screen 1, and is arranged in a stack and spaced apart from the middle plate 22. The frame 21 is arranged around the back cover 3, and is fixed to the back cover 3. For example, the frame 21 can be fixedly connected to the back cover 3 by means of adhesive, welding or clamping, etc.

[0071] The back cover 3 is in a flat plate shape. The shape of the back cover 3 includes but is not limited to a rectangular flat plate, an oblong flat plate, a circular flat plate, or an elliptical flat plate. Specifically, the shape of the back cover 3 is adapted to the shape of the light-transmitting cover plate 11. The material of the back cover 3 includes but is not limited to glass, plastic, metal, and ceramic, etc.

[0072] Please continue to refer to Figure 2 The first circuit board 4 is installed on the middle plate 22. For example, the first circuit board 4 can be installed on the surface of the middle plate 22 facing the back cover 3 by means of threaded connection, clamping, gluing or welding, etc.

[0073] The first circuit board 4 is used to integrate a main control chip. The main control chip can be, for example, an application processor (AP), a double data rate (DDR) synchronous dynamic random access memory, and a universal flash storage (UFS), etc. In some embodiments, the first circuit board 4 is electrically connected to the display screen 12, and the first circuit board 4 is used to control the display screen 12 to display images or videos.

[0074] The first circuit board 4 can be a rigid circuit board, a flexible circuit board, or a combination of rigid and flexible circuit board. For example, the first circuit board 4 can be made of FR-4 medium board, Rogers medium board, or a combination of FR-4 and Rogers medium board, etc. Here, FR-4 is a code of a kind of fire-resistant material, and Rogers medium board is a kind of high-frequency board.

[0075] The second circuit board 5 is mounted on the middle plate 22. For example, the second circuit board 5 can be mounted on the surface of the middle plate 22 facing the back cover 3 by screwing, clamping, gluing, welding, or the like. The second circuit board 5 is arranged in the Y-axis direction with the first circuit board 4.

[0076] The second circuit board 5 can be a rigid circuit board, a flexible circuit board, or a combination of rigid and flexible circuit board. The second circuit board 5 can be made of FR-4 medium board, Rogers medium board, or a combination of FR-4 and Rogers medium board, etc. In order to facilitate the electrical connection between the second circuit board 5 and the first circuit board 4, the electronic device 100 further comprises a signal wire (not shown in the figure). The signal wire is fixed and electrically connected between the second circuit board 5 and the first circuit board 4.

[0077] The battery 6 is located between the first circuit board 4 and the second circuit board 5. The battery 6 is used to provide power to the electronic devices in the electronic device 100, such as the display screen 12, the first circuit board 4, the second circuit board 5, the speaker module 7, etc.

[0078] Specifically, the frame 21 forms a first wall plate 211 along a section of the frame 21 in the circumferential direction. For example, the first wall plate 211 can be formed by a section of the frame 21 in the Y-axis direction (i.e., the short side of the frame 21), or by a section of the frame 21 in the X-axis direction (i.e., the long side of the frame 21). The present application takes the section of the frame 21 in the Y-axis direction close to the second circuit board 5 (i.e., the short side of the frame 21 close to the second circuit board 5) as an example to illustrate the first wall plate 211. However, this does not constitute a limitation to the present application.

[0079] The middle frame 2 further comprises a second wall plate 212 and a third wall plate 213.

[0080] Specifically, the second wall plate 212 is fixed on the side surface of the middle plate 22 facing the back cover 3 and is located in the frame 21, and two ends of the second wall plate 212 in the X-axis direction are connected with the frame 21 respectively. Specifically, the second wall plate 212 is spaced apart from and opposite to the first wall plate 211 in the Y-axis direction. Specifically, the second wall plate 212, the middle plate 22 and the frame 21 can be an integrally formed structure, that is, the second wall plate 212, the middle plate 22 and the frame 21 are an integral structure. In this way, the structural strength of the middle frame 2 is improved. Of course, the present application is not limited to this, and in other examples, the second wall plate 212 and at least one of the middle plate 22 and the frame 21 can also be assembled to form, and the assembly manner includes but is not limited to gluing, clamping, screw connection and welding.

[0081] Specifically, the part of the middle plate 22 between the first wall plate 211 and the second wall plate 212 forms a connecting plate 221.

[0082] The part of the opposite two long edges of the frame 21 between the first wall plate 211 and the second wall plate 212 can form a first side plate 214 and a second side plate 215.

[0083] The first wall plate 211, the second wall plate 212, the connecting plate 221, the first side plate 214 and the second side plate 215 together enclose a first mounting space K, and the first mounting space K is used to assemble the second circuit board 5 and the loudspeaker module 7.

[0084] Please continue to refer to Figure 2 The third wall plate 213 is fixed on the surface of the middle plate 22 facing the back cover 3 and is located on the side of the second wall plate 212 away from the first wall plate 211. The two ends of the third wall plate 213 in the X-axis direction are connected with the frame 21 respectively. Specifically, the third wall plate 213, the middle plate 22 and the frame 21 can be an integrally formed structure, that is, the third wall plate 213, the middle plate 22 and the frame 21 are an integral structure. In this way, the structural strength of the middle frame 2 is improved. Of course, the present application is not limited to this, and in other examples, the third wall plate 213 and at least one of the middle plate 22 and the frame 21 can also be assembled to form, and the assembly manner includes but is not limited to gluing, clamping, screw connection and welding.

[0085] The part of the middle plate 22 between the second wall plate 212 and the third wall plate 213 forms a first plate 222. The first plate 222 and the connecting plate 221 are connected in the Y-axis direction.

[0086] The portions of the two opposite long sides of the frame 21 between the second wall panel 212 and the third wall panel 213 may be formed into a third side panel 216 and a fourth side panel 217. The second wall panel 212, the third wall panel 213, the first panel 222, the third side panel 216, and the fourth side panel 217 together enclose a second installation space Q for assembling the battery 6.

[0087] The frame 21 forms a fourth wall plate 210 along a section of its circumference away from the first wall plate 211 . The fourth wall plate 210 is disposed on a side of the third wall plate 213 away from the second wall plate 212 and is disposed opposite to the third wall plate 213 .

[0088] The portion of the middle plate 22 between the third wall plate 213 and the fourth wall plate 210 is formed as a second plate 223. The second plate 223 is provided on a side of the first plate 222 away from the connecting plate 221, and the second plate 223 and the first plate 222 are connected in the Y-axis direction.

[0089] The portion of the frame 21 located between the third wall panel 213 and the fourth wall panel 210 can be formed into a fifth side panel 218 and a sixth side panel 219. The fourth wall panel 210, the third wall panel 213, the second panel 223, the fifth side panel 218, and the sixth side panel 219 together enclose a third installation space J for assembling the first circuit board 4.

[0090] Of course, the present application is not limited to this. In other embodiments, the third wall panel 213 may not be provided. That is, the second installation space Q and the third installation space J are connected. In other embodiments, at least a portion of the two long sides of the frame 21 may be respectively provided as the first wall panel 211 and the second wall panel 212. For example, the first side panel 214 may be provided as the first wall panel 211, and the second side panel 215 may be provided as the second wall panel 212. Alternatively, the third side panel 216 may be provided as the first wall panel 211, and the fourth side panel 217 may be provided as the second wall panel 212. Alternatively, the fifth side panel 218 may be provided as the first wall panel 211, and the sixth side panel 219 may be provided as the second wall panel 212.

[0091] See also Figure 3 and Figure 4 , Figure 3 Based on Figure 1 The internal structure diagram of the electronic device 100 is shown without the back cover 3. Figure 4 Based on Figure 3 The speaker module 7 includes a housing 71 and a core 72 .

[0092] The housing 71 includes a first portion 712 and a second portion 713 .

[0093] The first part 712 is arranged side by side with the second circuit board 5 in the XY direction. The second part 713 is located at the outer periphery of the first part 712, and the second part 713 is arranged in a stacked manner on the side of the second circuit board 5 opposite the connecting plate 221. In this way, the structure is compact and the layout is reasonable.

[0094] In some embodiments, the first wall plate 211 is provided with a sound hole 2112. The shell 71 has a sound passage 714 opposite and communicating with the sound hole 2112. In this way, the structure layout is reasonable, and the sound passage of the loudspeaker module 7 can be ensured to be unobstructed.

[0095] The surface of the shell 71 opposite the middle plate 22 is provided with a wiring groove 81. Part of the signal wiring 8 is accommodated in the wiring groove 81. In this way, the positioning of the signal wiring 8 can be facilitated, and displacement and deviation of the signal wiring 8 can be prevented. Of course, it can be understood that in other embodiments, the shell 71 can also not be provided with the wiring groove 81.

[0096] The loudspeaker module 7 has a first side surface 715 and a second side surface 7161 arranged opposite in the Y-axis direction. The first side surface 715 faces the first wall plate 211. The second side surface 7161 faces the second wall plate 212.

[0097] In some embodiments, in order to reduce the assembly difficulty of the loudspeaker module 7 and the first mounting space K, the first side surface 715 can be provided as an inclined surface. In a direction perpendicular to the connecting plate 221 and from the connecting plate 221 to the first wall plate 211, the first side surface 715 is inclined toward the direction close to the first wall plate 211. Similarly, the surface of the first wall plate 211 facing the loudspeaker module 7 is consistent with the inclination direction of the first side surface 715, so that the space between the first wall plate 211 and the second wall plate 212 can be formed in a flared shape, facilitating the installation of the loudspeaker module 7.

[0098] The first side surface 715 abuts against the first wall plate 211. In some embodiments, the electronic device further includes a sealing ring 9. The sealing ring 9 is arranged between the first wall plate 211 and the first side surface 715. One side of the sealing ring 9 is fixedly connected to the side of the first wall plate 211 facing the second wall plate 212, and the connection mode includes but is not limited to threaded connection, clamping, gluing or welding and the like. The other side of the sealing ring 9 (i.e. the side away from the first wall plate 211) abuts against the first side surface 715 of the loudspeaker module 7. That is, in this embodiment, the abutment between the first side surface 715 and the first wall plate 211 is indirect, and the first side surface 715 abuts against the sealing ring 9 fixed to the first wall plate 211. The sealing ring 9 is arranged around the sound passage 714 and the sound hole 2112. In this way, the gap between the first side surface 715 and the first wall plate 211 can be sealed by the sealing ring 9, and the waterproof effect of the electronic device 100 can be improved.

[0099] The material of the sealing ring 9 includes, but is not limited to, flexible materials such as silica gel or rubber. It can be understood that in other embodiments, the first side surface 715 can also directly abut the first wall plate 211.

[0100] The inner core 72 is a core sound unit of the speaker module 7. The inner core 72 is installed in the first part 712, and divides the space in the first part 712 into a front cavity 7121 and a rear cavity 7122. The front cavity 7121 communicates with the sound channel 714.

[0101] In the related art, in the actual assembly process of the speaker module 7, the speaker module 7 is directly fixed into the shell by fasteners such as screws, and there is a lack of a pre-positioning process, which causes the speaker module 7 to be misaligned or offset in the hole position, and then the speaker module 7 needs to be repeatedly moved to the correct position for installation, resulting in low assembly efficiency.

[0102] Moreover, as described above, the other side of the sealing ring 9 (i.e., the side away from the first wall plate 211) abuts the first side surface 715 of the speaker module 7. In this way, when the speaker module 7 is installed, the speaker module 7 will generate a pressing force on the sealing ring 9 in the direction towards the first wall plate 211. Since the sealing ring 9 is inclined away from the first wall plate 211 and has an elastic characteristic, the sealing ring 9 will generate a rebound force F1 (as shown in FIG. 8) on the speaker module 7 in the direction towards the second wall plate 212. Therefore, before the speaker module 7 and the shell are fixed, the speaker module 7 will be warped towards the side of the second wall plate 212 under the action of the rebound force F1, which not only brings difficulty to the fixing of the speaker module 7, but also causes the signal wire 8 on the shell 71 to be loosened from the wire slot 81, resulting in the connection head of the signal wire 8 being loose or loosely connected to the second circuit board 5. Figure 4

[0103] Based on this, in order to solve the problem of the speaker module 7 being warped towards the side of the second wall plate 212, please continue to refer to Figure 4 , a layer of adhesive material N, such as adhesive, is arranged between the first part 712 and the connecting plate 221. Specifically, the side of the first part 712 towards the connecting plate 221 is provided with a planar structure protruding from the bottom surface of the speaker module 7 (not shown in the figure), and the layer of adhesive material N is attached to the planar structure. The first part 712 is bonded to the connecting plate 221 by the adhesive material N, so as to realize the pre-positioning of the speaker module 7 in the first mounting space K, and then further connect the speaker module 7 and the shell by fasteners such as screws.

[0104] ​To further ensure the stability of the predetermined position of the loudspeaker module 7 in the first mounting space K, a buckle 73 is arranged on the peripheral wall of the shell 71, and a matching groove 2121 is arranged in the surface of the first wall plate 211 and the second wall plate 212 respectively, which faces each other. The buckle 73 and the matching groove 2121 are in one-to-one correspondence, so as to realize the predetermined position of the loudspeaker module 7 in the first mounting space K. In this way, during the process of assembling the loudspeaker module 7 into the first mounting space K by the production line workers, the loudspeaker module 7 will not be dislocated or deviated from the hole position, and the loudspeaker module 7 will not be raised. However, considering the processing cost and assembly difficulty, the following disadvantages exist:

[0105] (1) A new adhesive material layer N is added between the first part 712 and the connecting plate 221. Based on the arrangement of the adhesive material layer N, the surface of the first part 712 facing the connecting plate 211 needs to be provided with a protruding planar structure. The existence of the adhesive material layer N and the planar structure increases the overall thickness of the electronic device 100 by more than 0.5 mm, which is contrary to the thin design of the electronic device 100 and affects the competitiveness of the product.

[0106] (2) The adhesive material layer N increases the additional cost.

[0107] (3) In the after-sales maintenance and service scene, the difficulty and cost of maintenance and service are increased; and when the adhesive material layer N is a back glue, the adhesion has a time limit, and new back glue needs to be replaced regularly, increasing the maintenance cost.

[0108] (4) Due to the arrangement of the matching groove 2121, when the buckle 73 is inserted into the matching groove 2121, the buckle 73 needs to be extruded and deformed to be inserted into the matching groove 2121. Not only is it difficult to assemble, but it is also easy to cause the fracture of the buckle 73 and the deformation of the wall plate where the matching groove 2121 is located. When disassembling the loudspeaker module 7, the arrangement of the matching groove 2121 also greatly limits the disengagement of the buckle 73 from the matching groove 2121. Not only is it difficult to disassemble, but it also increases the risk of fracture of the buckle 73 and deformation of the wall plate where the matching groove 2121 is located.

[0109] To solve the above problems (1)-(3), some other embodiments of the present application provide an electronic device 100. Please refer to Figure 5 and Figure 6 , Figure 5 a cross-sectional schematic view of the electronic device 100 provided by some other embodiments of the present application; Figure 6 according to Figure 5The local partial exploded view of the electronic device 100 is shown. The side of the first part 712 facing the connecting plate 221 is open to form an open port 711, and the rear cavity 7122 communicates with the open port 711. In this way, on the one hand, the end wall of the first part 712 adjacent to the connecting plate 211 is cancelled, thereby reducing the thickness of the loudspeaker module 7, and further reducing the overall thickness of the electronic device 100; on the other hand, the space between the connecting plate 211 and the housing 71 can be used to communicate the rear cavity 7122 and the open port, so as to expand the capacity of the rear cavity 7122 and improve the low-frequency effect of the loudspeaker module 7.

[0110] Moreover, due to the arrangement of the open port 711, the adhesive layer N is no longer needed to bond the first part 711 and the connecting plate 211, thereby saving cost and reducing maintenance difficulty.

[0111] On this basis, in order to facilitate the support of the loudspeaker module 7, the electronic device 100 further comprises a supporting foam M. The supporting foam M is located at the open port 711 and supports between the connecting plate 221 and the core 72. The arrangement of the supporting foam M, on the one hand, supports the loudspeaker module 7 in the first mounting space K; on the other hand, it plays a role in reducing vibration when the loudspeaker module 7 is sounding.

[0112] In this embodiment, due to the arrangement of the above-mentioned open port 711, the sealing requirement of the side of the loudspeaker module 7 facing the connecting plate 221 is higher. In order to achieve the purpose of predetermined position and at the same time meet the sealing requirement of the loudspeaker module 7, the cooperation gap between the loudspeaker module 7 and the inner circumferential surface of the first mounting space K should not be set too large, otherwise it will lead to poor air tightness, and the interference fit is the best. However, the interference fit will lead to no margin for the movement of the loudspeaker module 7, which will further increase the difficulty of disassembly and assembly of the buckle 73 and the cooperation groove 2121, and further lead to the difficulty of assembly and disassembly of the loudspeaker module 7 and the first mounting space K, and the buckle 73 of the loudspeaker module 7 is easy to break or deform during the disassembly and assembly process. Moreover, in order to ensure the buckling of the buckle 73 and the cooperation groove 2121, the buckling amount of the buckle 73 and the cooperation groove 2121 is at least 0.2mm, and the groove depth of the cooperation groove 2121 needs to be processed more than 0.25mm. In this way, on the one hand, it leads to the reduction of the structural strength of the second wall plate 212, and the second wall plate 212 has the risk of breaking or deforming; on the other hand, when the thickness of the second wall plate 212 is small, the cooperation groove 2121 needs to be very careful in the processing process, otherwise it is easy to lead to the breaking of the second wall plate 212, so the processing difficulty of the cooperation groove 2121 is relatively large.

[0113] In addition, in this embodiment, if the buckle 73 and the matching groove 2121 are not provided, the predetermined positioning of the speaker module 7 is achieved only by supporting the foam M. When the inner periphery of the first mounting space K and the matching gap of the speaker module 7 are too large, the foam M will form a rebound force F2 (as shown in Figure 5 ) in the direction of the connecting plate 221 during the assembly of the speaker module 7 in the Z-axis direction. At the same time, the speaker module 7 is subjected to a rebound force F1 from the sealing ring 9, causing the speaker module 7 to be forced to float, lift or misalign after assembly, resulting in poor air tightness, affecting the yield of product manufacturing, and also causing the equipment for assembling the speaker module 7 to alarm, affecting the processing efficiency.

[0114] Therefore, in order to solve the above Figure 5 and Figure 6 technical problems not solved by the embodiments shown in the above, some embodiments of the present application provide an electronic device 100. Please refer to Figure 7 , Figure 7 for the structural schematic diagram of the first mounting space K in the electronic device 100 provided by some embodiments of the present application. The surface of the second wall plate 212 of the electronic device 100 facing the first wall plate 211 has a first avoiding area 2122. The first avoiding area 2122 extends to the edge of the second wall plate 212 in the direction of the Z-axis and away from the connecting plate 221. The two ends of the first avoiding area 2122 in the Z-axis direction are respectively a first end 2122a and a second end 2122b, and the second end 2122b is away from the connecting plate 221 relative to the first end 2122a.

[0115] Please refer to Figure 8 , Figure 9 and Figure 10 , Figure 8 for the partial schematic diagram of the assembly process of the speaker module 7 and the first mounting space K in the electronic device 100 provided by some embodiments of the present application; Figure 9 for the cross-sectional view of the electronic device 100 at B-B line after assembly according to the structure shown in Figure 8 ; Figure 10 for the enlarged view of the structure at C according to the structure shown in Figure 9 .

[0116] The second side surface 7161 is provided with an elastic structure 717 protruding from the second side surface 7161, and the second side surface 7161 abuts against the first end 2122a through the elastic structure 717.

[0117] Exemplarily, the elastic structure 717 can be integrally connected to the second side surface 7161, which is advantageous to improve the structural strength of the housing 71 and the elastic structure 717, and to simplify the processing technology of the loudspeaker module 7 and reduce the production cost of the loudspeaker module 7. Of course, the present embodiment is not limited thereto, and in other examples, the housing 71 and the elastic structure 717 can be assembled, and the connection mode between the second side surface 7161 and the elastic structure 717 includes but is not limited to gluing, clamping, screwing and welding, etc.

[0118] In the direction along the Z-axis and from the first end 2122a to the second end 2122b, the first avoiding area 2122 does not have a tendency to extend towards the first wall plate 211. Specifically, in the direction along the Z-axis and from the first end 2122a to the second end 2122b, the first avoiding area 2122 neither inclines towards the first wall plate 211 nor protrudes towards the first wall plate 211.

[0119] Exemplarily, in the direction along the Z-axis and from the first end 2122a to the second end 2122b, the first avoiding area 2122 inclines to extend towards the direction away from the first wall plate 211. Further exemplarily, in the direction along the Z-axis and from the first end 2122a to the second end 2122b, the first avoiding area 2122 can first incline to extend towards the direction away from the first wall plate 211, then extend along the Z-axis, and then incline to extend towards the direction away from the first wall plate 211. Still further exemplarily, in the direction along the Z-axis and from the first end 2122a to the second end 2122b, the first avoiding area 2122 can first extend along the Z-axis, then incline to extend towards the direction away from the first wall plate 211, and then extend along the Z-axis. Still further exemplarily, in the direction along the Z-axis and from the first end 2122a to the second end 2122b, the first avoiding area 2122 always extends along the Z-axis, and at this time, the first avoiding area 2122 is perpendicular to the connecting plate 221.

[0120] The present application sets the first avoiding area 2122 on the second wall plate 212, so that the elastic structure 717 abuts at the first end 2122a of the first avoiding area 2122. In this way, the abutment of the elastic structure 717 and the second wall plate 212 is used to replace the clamping of the buckle 73 and the cooperating groove 2121 on the second wall plate 212.

[0121] In this way, on one hand, the elastic structure 717 can be used to abut against the first avoiding area 2122 to achieve the pre-positioning, so as to facilitate the further assembly of the speaker module 7 and the shell, and effectively solve the problem of the speaker module 7 being lifted or popped after pre-positioning. On the other hand, since the first avoiding area 2122 does not extend towards the first wall plate 211 along the Z-axis direction from the first end 2122a to the second end 2122b, when the speaker module 7 is assembled and disassembled, the other areas of the first avoiding area 2122 except the first end 2122a have little or no interference with the elastic structure 717, so that the speaker module 7 can be conveniently disassembled and assembled, the disassembly efficiency of the speaker module 7 is improved, and the cooperating groove 2121 does not need to be arranged, thereby saving the processing cost of the second wall plate 212, reducing the production difficulty of the second wall plate 212, improving the structural strength of the second wall plate 212, and overcoming the loss when the speaker module 7 is disassembled for maintenance.

[0122] The material of the elastic structure 717 includes but is not limited to silica gel or rubber.

[0123] In some embodiments, the materials of the first wall plate 211 and the second wall plate 212 are metal, for example, aluminum, titanium alloy, stainless steel, etc. In this way, the strength of the first wall plate 211 and the second wall plate 212 can be improved. In other embodiments, the materials of the first wall plate 211 and the second wall plate 212 can also be plastic.

[0124] In some embodiments of the present application, the number of the elastic structure 717 can be one or more. The more the number of the elastic structure 717, the more firmly the speaker module 7 is pre-positioned in the electronic device 100.

[0125] In some embodiments of the present application, the number of the first avoiding area 2122 can be one or more. One first avoiding area 2122 can correspond to multiple elastic structures 717, or one first avoiding area 2122 can correspond to one elastic structure 717. Here, no limitation is made, as long as the elastic structure 717 can abut against the first end of the first avoiding area 2122 to ensure the effective pre-positioning of the speaker module 7 in the electronic device 100.

[0126] Please continue to refer to Figure 9 and Figure 10 The first avoiding area 2122 is a plane. The plane has the characteristics of simple structure, easy processing and maintenance, and saves the processing cost of the first avoiding area 2122. Of course, the present application is not limited thereto, and in other embodiments, the first avoiding area 2122 can also be a curved surface, a combination of curved and straight surfaces, or other special surfaces.

[0127] Please refer toFigure 11 and Figure 12 , Figure 11 is a structural schematic view of a housing 71 of a speaker module 7 according to Figure 8 is a structural schematic view of a housing 71 of a speaker module 7 according to Figure 12 is an enlarged view of W in the structure shown in Figure 11 The housing 71 includes a first plate body 716 facing the second wall plate 212. The first plate body 716 has a deformation hole 7162 extending through the first plate body 716. The elastic structure 717 is located at the deformation hole 7162 and connected to the inner peripheral surface of the deformation hole 7162. In this way, on the one hand, the elastic structure 717 is compact; on the other hand, the elastic structure 717 is connected to the inner peripheral surface of the deformation hole 7162, which can be more conducive to the deformation of the elastic structure 717.

[0128] The deformation hole 7162 can extend to one end of the first plate body 716 facing the connecting plate 221, so that the deformation hole 7162 is formed as a notch extending through the first plate body 716, and the inner peripheral surface of the deformation hole 7162 is an open loop. In other embodiments, the deformation hole 7162 can also not extend to one end of the first plate body 716 facing the connecting plate 221, and the inner peripheral surface of the deformation hole 7162 is a closed loop.

[0129] In some embodiments of the present application, the number of deformation holes 7162 can be one or more, and the number of deformation holes 7162 is adapted to the number of elastic structures 717.

[0130] The shape of the deformation hole 7162 includes but is not limited to a racetrack shape, a waist circle shape, an oblong shape, an elliptical shape, a circular shape, a semicircular shape, a polygonal shape, or a special shape.

[0131] Please continue to refer to Figure 11 , Figure 12 and Figure 13 , Figure 13 is a top view of the elastic structure 717 shown in the electronic device according to Figure 8 In some embodiments of the present application, the elastic structure 717 includes an elastic cantilever 7171 and a boss 7172, the elastic cantilever 7171 is located in the deformation hole 7162, and the two ends of the elastic cantilever 7171 in the length direction are respectively connected to the inner peripheral surface of the deformation hole 7162, and the rest of the elastic cantilever 7171 is spaced apart from the inner peripheral surface of the deformation hole 7162. For example, the two opposite ends of the elastic cantilever 7171 in the X-axis direction can be connected to the inner peripheral surface of the deformation hole 7162; or the two opposite ends of the elastic cantilever 7171 in the Z-axis direction can be connected to the inner peripheral surface of the deformation hole 7162.

[0132] The boss 7172 is fixed to the side surface of the elastic cantilever 7171 facing the second wall plate 212, protrudes from the second side surface 7161, and abuts against the first end 2122a. In this way, on the one hand, the elastic structure 717 is rationally arranged and simple in structure; on the other hand, the elastic cantilever 7171 is connected with the inner circumferential surface of the deformation hole 7162, so that the deformation of the first plate body 716 is concentrated in the area of the elastic cantilever 7171, and the deformation range of the first plate body 716 is reduced.

[0133] In some embodiments of the present application, the boss 7172 is located in the middle of the elastic cantilever 7171. In this way, on the one hand, it is beneficial to increase the deformation amplitude of the elastic cantilever 7171. On the other hand, when the boss 7172 deforms the elastic structure 717 in the direction of the first wall plate 211, the boss 7172 located in the middle of the elastic cantilever 7171 can make the elastic cantilever 7171 bear force uniformly, improve the structural strength and stability of the elastic cantilever 7171.

[0134] It is worth understanding that “middle” should be understood in a broad sense. The boss 7172 located in the middle of the elastic cantilever 7171 means that the boss deviates from both ends of the elastic cantilever 7171 in the length direction. For example, the elastic cantilever 7171 can be formed in a symmetrical structure relative to the boss 7172.

[0135] In some embodiments of the present application, a thinning groove 7173 is formed at the region of the side surface of the elastic cantilever 7171 opposite to the second wall plate 212 corresponding to the boss 7172. In this way, the thinning groove 7173 can play a role in improving the deformation capacity of the elastic cantilever 7171.

[0136] In some embodiments of the present application, the boss 7172 and the first end 2122a are in surface contact. The surface contact can improve the reliability of the abutment between the boss 7172 and the first avoiding area 2122, increase the abutment area, and also avoid stress concentration during the abutment between the boss 7172 and the first end 2122a.

[0137] Please continue to refer to Figure 12 In some embodiments of the present application, the end surface of the boss 7172 abutting against the first end 2122a is a plane. The plane has the characteristics of simple structure and easy processing and manufacturing. Moreover, when the first avoiding area 2122 is a plane, the end surface of the boss 7172 abutting against the first end 2122a being a plane is also beneficial to realize the surface contact between the boss 7172 and the first end 2122a.

[0138] In some embodiments of the present application, the side surfaces of the boss 7172 in the Z-axis direction extend obliquely away from each other, from the second wall panel 212 toward the first wall panel 211. This arrangement prevents interference between the second wall panel 212 and the side surfaces of the boss 7172 during disassembly and assembly of the speaker module 7. Of course, the present application is not limited to this. In other embodiments, the boss 7172 may be configured to extend obliquely on only one side in the Z-axis direction, or both side surfaces of the boss 7172 in the Z-axis direction may be perpendicular to the elastic cantilever.

[0139] The side surfaces of the boss 7172 in the Z-axis direction can be symmetrical or asymmetrical, as long as it can ensure that there is no interference between the boss 7172 and the second wall panel 212 when the speaker module 7 is disassembled and assembled.

[0140] In some embodiments of the present application, the shape of the inclined side surface of the boss 7172 includes but is not limited to a straight surface or an arc surface.

[0141] To further prevent disassembly and assembly of the speaker module 7, a chamfer is provided between the end surface of the second wall panel 212 facing away from the connecting plate 221 and the surface of the second wall panel 212 facing the first wall panel 211. For example, the right-angled side of the chamfer is greater than or equal to 0.15 mm.

[0142] Please continue reading Figure 12 and Figure 13 In some embodiments of the present application, the depth of the thinning groove 7173 is H2, and the value range of H2 is greater than 0 and less than or equal to 0.3 mm. This configuration, on the one hand, helps to improve the elastic deformation capability of the elastic cantilever 7171, and on the other hand, helps to prevent the structural strength of the elastic cantilever 7171 from being weakened due to the excessive depth of the thinning groove 7131, thereby reducing the risk of the elastic cantilever 7171 breaking.

[0143] Exemplarily, the depth H2 of the thinning groove 7173 can be: 0.01mm, 0.02mm, 0.03mm, 0.04mm, 0.05mm, 0.06mm, 0.07mm, 0.08mm, 0.09mm, 0.1mm, 0.12mm, 0.13mm, 0.14mm, 0.15mm, 0.16mm, 0.17mm, 0.18mm, 0.19mm, 0.2mm, 0.22mm, 0.23mm, 0.14mm, 0.25mm, 0.26mm, 0.27mm, 0.28mm, 0.29mm or 0.3mm, etc.

[0144] In some embodiments of the present application, the width of the elastic cantilever 7171 is W1, and W1 is in the range of 0.5mm to 2mm. In this way, the width of the elastic cantilever 7171 is less than or equal to 2mm, which ensures the elastic deformation capability of the elastic cantilever 7171, and the width of the elastic cantilever 7171 is greater than or equal to 0.5mm, which is conducive to ensuring the structural strength of the elastic cantilever 7171.

[0145] For example, the width W1 of the elastic cantilever 7171 can be 0.5mm, 0.55mm, 0.6mm, 0.65mm, 0.7mm, 0.75mm, 0.8mm, 0.85mm, 0.9mm, 0.95mm, 1mm, 1.1mm, 1.2mm, 1.3mm, 1.4mm, 1.5mm, 1.6mm, 1.7mm, 1.8mm, 1.9mm or 2mm, etc.

[0146] In some embodiments of the present application, the length of the elastic cantilever 7171 is L1, and L1 is in the range of 2mm to 6mm. In this way, the length of the elastic cantilever 7171 is greater than or equal to 2mm, which ensures the elastic deformation capability of the elastic cantilever 7171, and the length of the elastic cantilever 7171 is less than or equal to 6mm, which is conducive to reducing the size of the elastic structure 717, preventing the size of the elastic structure 717 from being set too large and thus preventing the deformation hole 7162 from being set too large, and thereby avoiding the reduction of the structural strength of the shell 71 of the loudspeaker module 7.

[0147] For example, the length L1 of the elastic cantilever 7171 can be 2mm, 2.2mm, 2.4mm, 2.6mm, 2.8mm, 3mm, 3.2mm, 3.4mm, 3.6mm, 3.8mm, 4mm, 4.2mm, 4.4mm, 4.6mm, 4.8mm, 5mm, 5.2mm, 5.4mm, 5.6mm, 5.8mm, 6mm, etc.

[0148] Please continue to refer to Figure 13 In some embodiments of the present application, the thickness of the boss 7172 is H, and H is in the range of 0.15mm to 0.5mm. Since the elastic cantilever 7171 needs to ensure a certain elastic deformation capability, the overall thickness of the elastic cantilever 7171 cannot be set too large, and the setting of the thinning groove 7173 changes the structural strength of the elastic cantilever 7171, and by making the thickness of the boss 7172 greater than 0.15mm, it is conducive to improving the structural strength of the elastic structure 717 as a whole at the boss 7172, and by making the thickness of the boss 7172 less than 0.5mm, it is conducive to ensuring the deformation capability of the elastic structure 717 as a whole at the boss 7172.

[0149] Exemplarily, the thickness H of the boss 7172 can range from 0.15mm, 0.16mm, 0.17mm, 0.18mm, 0.19mm, 0.2mm, 0.21mm, 0.22mm, 0.23mm, 0.24mm, 0.25mm, 0.26mm, 0.27mm, 0.28mm, 0.29mm, 0.3mm, 0.31mm, 0.32mm, 0.33mm, 0.34mm, 0.35mm, 0.36mm, 0.37mm, 0.38mm, 0.39mm, 0.4mm, 0.41mm, 0.42mm, 0.43mm, 0.44mm, 0.45mm, 0.46mm, 0.47mm, 0.48mm, 0.49mm or 0.5mm, etc.

[0150] In some embodiments of the present application, the thickness of the elastic cantilever 7171 is H1, and the value range of H1 is 0.35mm to 2mm. This configuration can, on the one hand, avoid the problem of insufficient structural strength caused by the elastic cantilever 7171 being too thin, thereby preventing the elastic cantilever 7171 from breaking or rupturing. On the other hand, it can avoid the problem of insufficient elastic force caused by the elastic cantilever 7171 being too thick, thereby affecting the assembly and disassembly of the speaker module 7.

[0151] For example, the thickness of the elastic cantilever 7171 can be 0.35mm, 0.36mm, 0.37mm, 0.38mm, 0.39mm, 0.4mm, 0.41mm, 0.42mm, 0.43mm, 0.44mm, 0.45mm, 0.46mm, 0.47mm, 0.48mm, 0.49mm, 0.5mm, 0.51mm, 0.52mm, 0.54mm, 0.56mm, 0.58mm, 0.6mm, 0.62mm, 0.64mm, 0.66mm, 0.68mm, 0.7mm, 0.72mm, 0.74mm, 0.76mm, 0.78mm, 0.8mm, 0.82mm, 0.8 4mm, 0.86mm, 0.88mm, 0.9mm, 0.92mm, 0.94mm, 0.96mm, 0.98mm, 1mm, 1.2mm, 1.4mm, 1.6mm, 1.8mm or 2mm.

[0152] In order to prevent the deformation hole 7162 from interfering with the deformation of the elastic cantilever 7171, for example, a gap W4 is provided between the side surface of the elastic cantilever 7171 in the width direction and the hole wall of the deformation hole 7162, and W4 is greater than or equal to 0.2 mm.

[0153] In some embodiments of the application, the width of the end surface of the boss 7172 that is in abutment with the first end 2122a is W2, and W2 is greater than or equal to 0.1 mm. In this way, the contact area between the boss 7172 and the first end 2122a is increased.

[0154] For example, the width W2 of the end surface of the boss 7172 that is in abutment with the first end 2122a is 0.1 mm, 0.12 mm, 0.14 mm, 0.16 mm, 0.18 mm, 0.2 mm, 0.22 mm, 0.24 mm, 0.26 mm, 0.28 mm, 0.3 mm, 0.32 mm, 0.34 mm, 0.36 mm, 0.38 mm, 0.4 mm, 0.42 mm, 0.44 mm, 0.46 mm, 0.48 mm, 0.5 mm, 0.52 mm, 0.54 mm, 0.56 mm, 0.58 mm, 0.6 mm, 0.62 mm, 0.64 mm, 0.66 mm, 0.68 mm, 0.7 mm, 0.72 mm, 0.74 mm, 0.76 mm, 0.78 mm, 0.8 mm, 0.82 mm, 0.84 mm, 0.86 mm, 0.88 mm, 0.9 mm, 0.92 mm, 0.94 mm, 0.96 mm, 0.98 mm, 0.99 mm, 1.0 mm, 1.02 mm, 1.04 mm, 1.06 mm, 1.08 mm, 1.1 mm, 1.12 mm, 1.14 mm, 1.16 mm, 1.18 mm, 1.2 mm, 1.24 mm, 1.26 mm, 1.28 mm, 1.3 mm, 1.32 mm, 1.34 mm, 1.36 mm, 1.38 mm, 1.4 mm, 1.42 mm, 1.44 mm, 1.46 mm, 1.48 mm, 1.5 mm, 1.52 mm, 1.54 mm, 1.56 mm, 1.58 mm, 1.6 mm, 1.62 mm, 1.64 mm, 1.66 mm, 1.68 mm, 1.7 mm, 1.72 mm, 1.74 mm, 1.76 mm, 1.78 mm, 1.8 mm, 1.85 mm, 1.9 mm, 1.95 mm, or 2 mm, etc.

[0155] The structural strength of the boss 7172 varies with the material of the boss 7172. In some embodiments, the width W2 of the end surface of the boss 7172 that is in abutment with the first end 2122a can be determined in combination with the material of the boss 7172. For example, when the boss 7172 is made of a material with relatively low structural strength, such as plastic, the width W2 of the end surface of the boss 7172 that is in abutment with the first end 2122a is greater than or equal to 0.2 mm. When the boss 7172 is made of a material with relatively high structural strength, such as stainless steel, the width W2 of the end surface of the boss 7172 that is in abutment with the first end 2122a is greater than or equal to 0.1 mm.

[0156] In some embodiments of the present application, the length of the end surface of the boss 7172 that contacts the first end 2122a is L2, and the value of L2 ranges from 0.5 mm to 1 mm. This can avoid the problem of excessive obstruction of the speaker module 7 during assembly caused by the end surface of the boss 7172 that contacts the first end 2122a being too long, thereby reducing the difficulty of assembly. On the other hand, it can also prevent the problem of insufficient contact area between the boss 7172 and the first end 2122a and stress concentration caused by the end surface of the boss 7172 that contacts the first end 2122a being too short, thereby improving the pre-positioning effect.

[0157] Exemplarily, the length L2 of the end surface of the boss 7172 abutting against the first end 2122a can be: 0.5mm, 0.52mm, 0.54mm, 0.56mm, 0.58mm, 0.6mm, 0.62mm, 0.64mm, 0.66mm, 0.68mm, 0.7mm, 0.72mm, 0.74mm, 0.76mm, 0.78mm, 0.8mm, 0.82mm, 0.84mm, 0.86mm, 0.88mm, 0.9mm, 0.92mm, 0.94mm, 0.96mm, 0.98mm, 0.99mm, or 1.0mm.

[0158] In order to adapt to the structural dimensions of the boss 7172 and ensure that no unnecessary interference occurs with the second wall panel 212 when disassembling and assembling electronic components, the width of the side surface of one side of the boss 7172 in the Z-axis direction is W3, and W3 is generally greater than or equal to 0.15 mm.

[0159] For example, the width W3 of the side surface of the boss 7172 on one side in the Z-axis direction can be 0.15 mm, 0.16 mm, 0.18 mm, 0.2 mm, 0.22 mm, 0.24 mm, 0.26 mm, 0.28 mm, 0.3 mm, 0.32 mm, 0.34 mm, 0.36 mm, 0.38 mm, 0.4 mm, 0.42 mm, 0.44 mm, 0.46 mm, 0.48 mm, 0.5 mm, 0.52 mm, 0.54 mm, 0.56 mm, 0.58 mm, 0.6 mm, 0.62 mm, 0.64 mm, 0.66 mm, 0.68 mm, 0.7 mm, 0.72 mm, 0.74 mm, 0.76 mm, 0.78 mm, 0.8 mm, 0.82 mm, 0.84 mm, 0.86 mm, 0.88 mm, 0.9 mm, 0.92 mm, 0.94 mm, 0.96 mm, 0.98 mm, 0.99 mm, 1.0 mm, 1.02 mm, 1.04 mm, 1.06 mm, 1.08 mm, 1.1 mm, 1.12 mm, 1.14 mm, 1.16 mm, 1.18 mm, 1.2 mm, 1.24 mm, 1.26 mm, 1.28 mm, 1.3 mm, 1.32 mm, 1.34 mm, 1.36 mm, 1.38 mm, 1.4 mm, 1.42 mm, 1.44 mm, 1.46 mm, 1.48 mm, 1.5 mm, 1.52 mm, 1.54 mm, 1.56 mm, 1.58 mm, 1.6 mm, 1.62 mm, 1.64 mm, 1.66 mm, 1.68 mm, 1.7 mm, 1.72 mm, 1.74 mm, 1.76 mm, 1.78 mm, 1.8 mm, 1.85 mm, 1.9 mm, 1.95 mm, or 2 mm, etc.

[0160] The above are all examples of the elastic structure 717 being arranged on the first plate body 716 of the loudspeaker module 7 and the first avoiding area 2122 being arranged on the second wall plate 212. Please refer to Figure 14 and Figure 15 , Figure 14 is a cross-sectional view of an electronic device according to another embodiment of the present application; Figure 15 is a partial enlarged view of the structure shown in Figure 14 at D. The difference between this embodiment and the above-mentioned embodiments is that the wall surface of the second wall plate 212 facing the first wall plate 211 is provided with the elastic structure 717 protruding from the second wall plate 212.

[0161] The second wall plate 212 and the elastic structure 717 can be an integrated structure, which is conducive to improving the structural strength of the middle frame 2, and simplifying the processing technology of the second wall plate 212 and the elastic structure 717 as a whole, and reducing the production cost of the second wall plate 212 and the elastic structure 717 as a whole. Of course, the present embodiment is not limited thereto, and in other examples, the second wall plate 212 can also be assembled with the elastic structure 717, and the connection mode between the second wall plate 212 and the elastic structure 717 includes but is not limited to gluing, clamping, screw connection and welding, etc.

[0162] The second side surface 7161 has a first avoiding area 2122 extending to the edge of the second side surface 7161 along the Z-axis direction and in the direction close to the connecting plate 221. The two ends of the first avoiding area 2122 in the Z-axis direction are respectively a first end 2122a and a second end 2122b, and the first end 2122a is away from the connecting plate 221 relative to the second end 2122b.

[0163] The elastic structure 717 abuts at the first end 2122a.

[0164] Wherein, along the Z-axis direction and from the first end 2122a to the second end 2122b, the first avoiding area 2122 has no tendency to extend towards the second wall plate 212. Specifically, along the Z-axis direction and from the first end 2122a to the second end 2122b, the first avoiding area 2122 neither inclines nor protrudes towards the second wall plate 212.

[0165] For example, along the Z-axis direction and from the first end 2122a to the second end 2122b, the first avoiding area 2122 inclines and extends in the direction away from the second wall plate 212. For another example, along the Z-axis direction and from the first end 2122a to the second end 2122b, the first avoiding area 2122 can first incline and extend in the direction away from the second wall plate 212, then extend along the Z-axis direction, and then incline and extend in the direction away from the second wall plate 212. For another example, along the Z-axis direction and from the first end 2122a to the second end 2122b, the first avoiding area 2122 can first extend along the Z-axis direction, then incline and extend in the direction away from the second wall plate 212, and then extend along the Z-axis direction. For another example, along the Z-axis direction and from the first end 2122a to the second end 2122b, the first avoiding area 2122 always extends along the Z-axis direction, at this time, the first avoiding area 2122 is perpendicular to the connecting plate 221.

[0166] The first avoiding area 2122 is arranged on the second side surface 7161, so that the elastic structure 717 abuts against the first end 2122a of the first avoiding area 2122. In this way, the elastic structure 717 abuts against the second side surface 7161, instead of the buckle 73 being clamped with the matching groove 2121 on the second wall plate 212.

[0167] In this way, on one hand, the abutment of the elastic structure 717 and the first avoiding area 2122 can play a role of pre-positioning, so as to facilitate the further assembly of the loudspeaker module 7 and the first mounting space K, and effectively solve the problem of the loudspeaker module 7 being lifted or popped after pre-positioning. On the other hand, since the first avoiding area 2122 does not have a tendency to extend towards the second wall plate 212 along the Z-axis direction and from the first end 2122a to the second end 2122b, the other areas of the first avoiding area 2122 except the first end 2122a have little or no interference with the elastic structure 717 when the loudspeaker module 7 is assembled and disassembled, so as to facilitate the disassembly and assembly of the loudspeaker module 7, improve the disassembly and assembly efficiency of the loudspeaker module 7, and improve the structural strength of the second wall plate 212 and overcome the loss during the repair and disassembly of the loudspeaker module 7.

[0168] It can be understood that the foregoing is described by taking the assembly of the loudspeaker module 7 as an example, and the pre-positioning relationship between the electronic components and the shell in the electronic device 100 except the loudspeaker module 7, such as the first circuit board 4, the second circuit board 5 and the battery 6, can also be implemented in the above-described manner. As long as the pre-positioning manner described above is adopted between at least one electronic component in the electronic device 100 and the shell, the pre-positioning manner can be implemented.

[0169] In the description of the present specification, specific features, structures, materials or characteristics can be combined in any one or more embodiments or examples in a suitable manner.

[0170] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. An electronic device, comprising: The application relates to a shell, an electronic component and a loudspeaker module. The shell comprises a first wall plate, a second wall plate and a connecting plate, the first wall plate and the second wall plate are oppositely arranged in a first direction, a surface of the second wall plate towards the first wall plate is provided with a first avoiding area, the connecting plate is connected between one end of the first wall plate in a second direction and one end of the second wall plate in the second direction, and the first avoiding area extends to an edge of the second wall plate in the second direction and away from the connecting plate. The two ends of the first avoiding area in the second direction are a first end and a second end respectively, and the second end is away from the connecting plate relative to the first end. The electronic component has a first side and a second side oppositely arranged in the first direction, the first side abuts against the first wall plate, the second side is provided with an elastic structure protruding from the second side, and the second side abuts against the first end through the elastic structure. In the second direction, from the first end to the second end, the first avoiding area has no tendency to extend towards the first wall plate.

2. The electronic device of claim 1, wherein, In the second direction, from the first end to the second end, the first avoiding area extends obliquely towards a direction away from the second side, or the first avoiding area is vertically arranged relative to the connecting plate.

3. The electronic device of claim 1, wherein, The first avoiding area is a plane.

4. The electronic device of any of claims 1-3, wherein, The electronic component comprises a shell, the shell comprises a first plate body towards the second wall plate, and the first plate body is provided with a deformation hole penetrating through the first plate body. The elastic structure is located at the deformation hole and connected to the inner circumferential surface of the deformation hole.

5. The electronic device of claim 4, wherein, The elastic structure comprises an elastic cantilever and a boss, the elastic cantilever is located in the deformation hole, and the two ends of the elastic cantilever in the length direction are connected to the inner circumferential surface of the deformation hole; the boss is fixed to one side surface of the elastic cantilever towards the second wall plate, the boss protrudes from the second side and abuts against the first end.

6. The electronic device of claim 5, wherein, The boss is located at the middle part of the elastic cantilever.

7. The electronic device of claim 5, wherein, A thinning groove is formed at the area of the side surface of the elastic cantilever opposite to the boss.

8. The electronic device of claim 7, wherein, The depth of the thinning groove is greater than 0 and less than or equal to 0.3 mm.

9. The electronic device of claim 5, wherein, The boss and the first end are in surface contact.

10. The electronic device of claim 5, wherein, The end surface of the boss abutting against the first end is a plane.

11. The electronic device of claim 5, wherein, In the direction from the second wall plate to the first wall plate, the two side surfaces of the boss in the second direction extend obliquely towards a direction away from each other.

12. The electronic device of claim 5, wherein, The width of the elastic cantilever is 0.5 mm to 2 mm; and / or, The length of the elastic cantilever is 2 mm to 6 mm; and / or, The thickness of the boss is 0.15 mm to 0.5 mm.

13. The electronic device of any of claims 1-3, wherein, The electronic component is a loudspeaker module, and a sound hole is formed in the first wall plate. The loudspeaker module comprises a shell, and the shell has a sound channel opposite to and communicating with the sound hole.

14. The electronic device of claim 13, wherein, A sealing ring is arranged between the first wall plate and the first side and surrounds the sound channel and the sound hole.

15. The electronic device of claim 13, wherein, The shell comprises a first part and a second part, a side of the first part facing the connecting plate is open to form an open port; The loudspeaker module further comprises a core, the core is installed in the first part, and the core divides a space in the first part into a front cavity and a rear cavity, the front cavity communicates with the sound channel, and the rear cavity communicates with the open port; The electronic device further comprises a supporting foam, the supporting foam is located at the open port and is supported between the connecting plate and the core.

16. The electronic device of any of claims 1-3, wherein, The shell comprises a frame and a middle plate, the frame is arranged around an edge of the middle plate; The second wall plate is located in the frame, two ends of the second wall plate in a third direction are connected with the frame respectively, A section of the frame forms the first wall plate, and a part of the middle plate between the second wall plate and the first wall plate forms the connecting plate.

17. The electronic device of claim 16, wherein, The electronic device further comprises a first circuit board, a second circuit board and a signal wire, the first circuit board is installed on the middle plate and is located on a side of the second wall plate away from the first wall plate; The second circuit board is installed on the middle plate and is located between the first wall plate and the second wall plate; The electronic device comprises a shell, the shell comprises a first part and a second part, the second part is located at an outer periphery of the first part, the first part and the second circuit board are arranged side by side in a direction perpendicular to the second direction, and the second part is arranged in layers on a side of the second circuit board facing away from the connecting plate; A wire slot is formed on a surface of the shell facing away from the middle plate, the signal wire is fixed and electrically connected between the first circuit board and the second circuit board, and a part of the signal wire is accommodated in the wire slot.

18. An electronic device, comprising: Comprise: A shell, the shell comprises a first wall plate, a second wall plate and a connecting plate, the first wall plate and the second wall plate are arranged opposite in a first direction, the connecting plate is connected between one end of the first wall plate in a second direction and one end of the second wall plate in the second direction, and an elastic structure protruding from the second wall plate is arranged on a wall surface of the second wall plate facing the first wall plate; An electronic device, the electronic device has a first side and a second side arranged opposite in a first direction, the first side abuts against the first wall plate, the second side has a first avoiding area, the first avoiding area extends to an edge of the second side along a second direction and in a direction close to the connecting plate, two ends of the first avoiding area in the second direction are a first end and a second end respectively, and the first end is away from the connecting plate relative to the second end; The elastic structure abuts at the first end; In a direction from the first end to the second end along the second direction, the first avoiding area has no tendency to extend towards the second wall plate.

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