CPP film anti-adhesion treatment device
The combination of a thermostat-controlled semiconductor cooling chip and an ion fan solves the problem of CPP film sticking due to static electricity and high temperature during the winding process, achieving an effective anti-sticking effect.
Patent Information
- Application Number
- CN202423076972.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-13
- Publication Date
- 2025-10-28
- Estimated Expiration
- 2034-12-13
AI Technical Summary
During the production and storage of existing CPP films, factors such as static electricity, temperature, and pressure can cause adhesion between film layers, resulting in sticking and affecting subsequent processing and ease of use.
A CPP film anti-sticking treatment device is used, which uses a thermostat-controlled semiconductor cooling chip to reduce the temperature and uses a blower and an ion fan to eliminate static electricity, ensuring that the film does not stick together during the winding process.
It effectively reduces film temperature and eliminates static electricity, preventing films from sticking together during winding and improving ease of use later.
Smart Images
Figure CN223478131U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of CPP film production technology, and in particular to a CPP film anti-adhesion treatment device. Background Art
[0002] During production and storage, CPP (cast polypropylene) film can easily adhere to each other due to factors such as static electricity, temperature, pressure, smooth film surface, and excessively tight winding, creating a vacuum between film layers. If the film roll has severe adhesion, a hissing peeling sound will be heard during the unwinding process (for slitting or subsequent processing). In more severe cases, it can cause tearing of the film surface, resulting in appearance defects such as sharkskin. Specialized CPP film anti-adhesion treatment equipment is required for this purpose.
[0003] Previous CPP film anti-adhesion treatment devices have the following drawbacks: 1. The cooling effect on CPP film is not significant, and it does not have the function of removing surface static electricity. Due to high temperature and static electricity, CPP films stick together during the winding process, resulting in poor anti-adhesion treatment effect. Therefore, those skilled in the art have provided a CPP film anti-adhesion treatment device to solve the problems mentioned in the background art. Utility Model Content
[0004] The main objective of this invention is to provide a CPP film anti-adhesion treatment device to solve the problems mentioned in the background art.
[0005] To achieve the above objectives, this utility model provides the following technical solution:
[0006] A CPP film anti-adhesion treatment device includes an L-shaped support foot, a treatment box, and a cooling cylinder;
[0007] The bottom of the processing box is bolted with L-shaped support feet on both sides. The top of the processing box is provided with an air inlet, and an ion fan is installed in the air inlet through a mounting base. A refrigeration cylinder is installed on one side of the processing box through a mounting bracket. A thermostat is installed on the top side of the refrigeration cylinder with screws, and a semiconductor refrigeration chip is installed at the lower end of the thermostat through a mounting hole. A spiral heat exchange copper tube is sleeved inside the refrigeration cylinder, and the bottom of the spiral heat exchange copper tube is connected to an air inlet pipe. The air inlet pipe passes through the refrigeration cylinder and is equipped with a blower. Side plates are bolted to both outer sides of the processing box. An end block is welded to the top of the inner side of the side plate, and a U-shaped plate is connected to the bottom of the end block through a support spring. An upper pressure roller is connected to the U-shaped plate through a bearing. A lower pressure roller is connected to the lower end of the side plate and closely attached to the upper pressure roller through a bearing.
[0008] As a further embodiment of this utility model: the detection end of the temperature controller is located inside the refrigeration cylinder, and the output end of the temperature controller is electrically connected to the input end of the semiconductor refrigeration chip through a wire, thereby automatically controlling the semiconductor refrigeration chip to maintain a constant temperature and reduce the internal temperature inside the refrigeration cylinder.
[0009] As a further embodiment of this invention: the cooling end of the semiconductor refrigeration chip is located inside the refrigeration cylinder, and the heating end of the semiconductor refrigeration chip is located outside the refrigeration cylinder.
[0010] As a further improvement of this utility model: the top of the spiral heat exchange copper tube is connected to the processing box through a bend pipe, and the bend pipe passes through the refrigeration cylinder.
[0011] As a further embodiment of this utility model: both the upper and lower pressure rollers are made of rubber material, and rectangular pre-reserved openings are provided at both ends of the processing box and directly opposite the contact points of the upper and lower pressure rollers. The CPP film to be rolled up after production is inserted through the rectangular pre-reserved opening at one end of the processing box and exited through the rectangular pre-reserved opening at the other end of the processing box.
[0012] As a further improvement of this utility model, both ends of the support spring are connected to the end block and the U-shaped plate respectively through positioning plates and positioning screws.
[0013] Compared with the prior art, the beneficial effects of the present invention are:
[0014] 1. A thermostat is used to automatically control the semiconductor cooling chip to maintain a constant temperature inside the cooling cylinder and reduce the internal temperature. A blower is used to blow outside gas into the spiral heat exchange copper tube to quickly achieve heat exchange. The cooled gas enters the processing box through the bend pipe to reduce the temperature inside the processing box. The CPP film to be rolled up after production is inserted into the rectangular pre-reserved opening at one end of the processing box and exited through the rectangular pre-reserved opening at the other end of the processing box. The CPP film passes through the bonding area between the upper and lower pressure rollers. The elasticity of the support spring keeps the film in a taut state inside the processing box, which greatly improves the heat dissipation effect of the CPP film.
[0015] 2. Turning on the ion fan inside the air inlet facilitates the delivery of positively and negatively charged gas into the processing chamber, which helps to eliminate static electricity on the surface of the CPP film. This avoids the problem of the CPP film sticking together during the winding process due to high temperature and static electricity, and improves the convenience of subsequent use of the CPP film. Attached Figure Description
[0016] Figure 1 This is a schematic diagram of the overall structure of a CPP film anti-adhesion treatment device according to the present invention.
[0017] Figure 2 This is a side view of a CPP film anti-adhesion treatment device according to the present invention.
[0018] Figure 3 This utility model relates to a CPP film anti-adhesion treatment device. Figure 1 A schematic diagram of the structure at point A.
[0019] Figure 4 This is a schematic diagram of the spiral heat exchange copper tube structure of a CPP film anti-adhesion treatment device according to this utility model.
[0020] In the diagram: 1. Upper pressure roller; 2. U-shaped plate; 3. Lower pressure roller; 4. L-shaped support foot; 5. End block; 6. Side plate; 7. Rectangular reserved opening; 8. Processing box; 9. Air inlet; 10. Ionizing fan; 11. Bend connecting pipe; 12. Temperature controller; 13. Semiconductor cooling chip; 14. Mounting bracket; 15. Cooling cylinder; 16. Blower; 17. Air inlet pipe; 18. Support spring; 19. Positioning plate; 20. Spiral heat exchange copper tube. DETAILED DESCRIPTION
[0021] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.
[0022] Please see Figure 1-4 In this embodiment of the utility model, a CPP film anti-adhesion treatment device includes an L-shaped support foot 4, a treatment box 8, and a cooling cylinder 15.
[0023] The bottom of the processing box 8 is bolted with L-shaped support feet 4 on both sides. The top of the processing box 8 is provided with an air inlet 9 and an ion fan 10 is installed in the air inlet 9 through a mounting base. A cooling cylinder 15 is installed on one side of the processing box 8 through a mounting bracket 14. A thermostat 12 is installed on the top side of the cooling cylinder 15 through screws and a semiconductor cooling chip 13 is installed at the lower end of the thermostat 12 through a mounting hole. A spiral heat exchange copper tube 20 is sleeved inside the cooling cylinder 15 and the bottom of the spiral heat exchange copper tube 20 is connected to an air inlet pipe 17. The air inlet pipe 17 passes through the cooling cylinder 15 and a blower 16 is installed on the air inlet pipe 17. Side plates 6 are bolted to both outer sides of the processing box 8. An end block 5 is welded to the top of the inner side of the side plate 6 and a U-shaped plate 2 is connected to the bottom of the end block 5 through a support spring 18. An upper pressure roller 1 is connected to the U-shaped plate 2 through a bearing. A lower pressure roller 3 is connected between the lower ends of the side plates 6 and close to the upper pressure roller 1 through a bearing.
[0024] The temperature controller 12 has its detection end located inside the refrigeration cylinder 15, and its output end is electrically connected to the input end of the thermoelectric cooler 13 via a wire. The temperature controller 12 automatically controls the thermoelectric cooler 13 to maintain a constant temperature and reduce the internal temperature of the refrigeration cylinder 15.
[0025] The cooling end of the semiconductor refrigeration chip 13 is located inside the refrigeration cylinder 15, and the heating end of the semiconductor refrigeration chip 13 is located outside the refrigeration cylinder 15; the semiconductor refrigeration chip 13 cools the inside of the refrigeration cylinder 15 to reduce the internal temperature.
[0026] The top of the spiral heat exchange copper tube 20 is connected to the processing box 8 through the bend pipe 11, and the bend pipe 11 passes through the refrigeration cylinder 15; the cooled gas enters the processing box 8 through the bend pipe 11 to reduce the temperature inside the processing box 8.
[0027] The upper pressure roller 1 and the lower pressure roller 3 are both made of rubber. Rectangular pre-reserved openings 7 are provided at both ends of the processing box 8 and at the joint of the upper pressure roller 1 and the lower pressure roller 3. The CPP film to be rolled up after production is inserted into the rectangular pre-reserved opening 7 at one end of the processing box 8 and exited through the rectangular pre-reserved opening 7 at the other end of the processing box 8.
[0028] Both ends of the support spring 18 are connected to the end block 5 and the U-shaped plate 2 respectively through positioning plates 19 and positioning screws; the positioning plates 19 and positioning screws facilitate the installation and disassembly of the support spring 18.
[0029] The working principle of this utility model is as follows: The thermostat 12 automatically controls the semiconductor cooling chip 13 to maintain a constant temperature and reduce the internal temperature of the cooling cylinder 15. The blower 16 blows the outside gas into the spiral heat exchange copper tube 20 to quickly achieve heat exchange. The cooled gas enters the processing box 8 through the bent connecting pipe 11 to reduce the temperature inside the processing box 8. The CPP film to be rolled up after production is inserted into the rectangular pre-reserved opening 7 at one end of the processing box 8 and exited through the rectangular pre-reserved opening 7 at the other end of the processing box 8. The CPP film passes through the joint between the upper pressure roller 1 and the lower pressure roller 3. The elastic force of the support spring 18 keeps the film in the processing box 8 in a taut state, which greatly improves the heat dissipation effect of the CPP film. The ion fan 10 in the air inlet 9 is turned on to deliver gas with positive and negative charges into the processing box 8, which helps to eliminate static electricity on the surface of the CPP film. This avoids the problem of the CPP film sticking together during the winding process due to high temperature and static electricity, and improves the convenience of subsequent use of the CPP film.
[0030] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.
Claims
1. A CPP film anti-adhesion treatment device, comprising an L-shaped support foot (4), a treatment box (8), and a cooling cylinder (15); Its characteristics are: The bottom sides of the processing box (8) are bolted with L-shaped support feet (4). The top of the processing box (8) is provided with an air inlet (9) and an ion fan (10) is installed in the air inlet (9) through a mounting base. A cooling cylinder (15) is installed on one side of the processing box (8) through a mounting bracket (14). A temperature controller (12) is installed on one side of the top of the cooling cylinder (15) through screws, and a semiconductor cooling chip (13) is installed at the lower end of the temperature controller (12) through a mounting hole. A spiral heat exchange copper tube (20) is sleeved inside the cooling cylinder (15) and spiral heat exchange... The bottom of the copper tube (20) is connected to an air inlet pipe (17), which passes through the refrigeration cylinder (15) and is equipped with a blower (16). Both ends of the processing box (8) are fitted with side plates (6) by screws. The top of the inner side of the side plate (6) is welded with an end block (5), and the bottom of the end block (5) is connected to a U-shaped plate (2) by a support spring (18). The U-shaped plate (2) is connected to an upper pressure roller (1) by a bearing. The lower end of the side plate (6) is connected to the upper pressure roller (1) by a bearing between and close to the lower pressure roller (1).
2. The CPP film anti-adhesion treatment device according to claim 1, characterized in that: The detection end of the temperature controller (12) is located inside the refrigeration cylinder (15), and the output end of the temperature controller (12) is electrically connected to the input end of the semiconductor refrigeration chip (13) through a wire.
3. The CPP film anti-adhesion treatment device according to claim 1, characterized in that: The cooling end of the semiconductor refrigeration chip (13) is located inside the refrigeration cylinder (15), and the heating end of the semiconductor refrigeration chip (13) is located outside the refrigeration cylinder (15).
4. The CPP film anti-adhesion treatment device according to claim 1, characterized in that: The top of the spiral heat exchange copper tube (20) is connected to the processing box (8) through a bend pipe (11), and the bend pipe (11) passes through the refrigeration cylinder (15).
5. The CPP film anti-adhesion treatment device according to claim 1, characterized in that: The upper pressure roller (1) and the lower pressure roller (3) are both made of rubber material. Rectangular reserved openings (7) are provided at both ends of the processing box (8) and at the joints of the upper pressure roller (1) and the lower pressure roller (3).
6. The CPP film anti-adhesion treatment device according to claim 1, characterized in that: Both ends of the support spring (18) are connected to the end block (5) and the U-shaped plate (2) respectively through positioning plates (19) and positioning screws.