Thermal resistance testing device for heat conduction material

Abstract

The utility model provides a thermal resistance testing device for a heat conduction material. The thermal resistance testing device comprises a controller, a sealed box body, and a heating structure, a heat dissipation structure and a driving structure which are respectively arranged in the sealed box body, the heating structure is arranged at the output end of the driving structure and is driven by the driving structure to do lifting motion; the heating structure comprises a heating element and a heating panel connected with the heating element; the heat dissipation structure comprises a heat dissipation panel for placing a heat conduction material; the heating panel and the heat dissipation panel are oppositely arranged in parallel; more than three temperature sensing elements are respectively arranged on the surfaces, facing the heat conduction material, of the heating panel and the heat dissipation panel. By arranging the plurality of temperature sensing elements, the temperature distribution between the heat conduction material and the heating structure as well as the heat dissipation structure can be comprehensively captured, so that the temperature data can be averaged, the measurement error caused by non-uniform local heat distribution is reduced, and the accuracy of the thermal resistance test result is improved.

Description

Technical Field

[0001] This application relates to the technical field of thermal conductive material testing equipment, and in particular to a thermal resistance testing device for thermal conductive materials. Background Technology

[0002] With continuous technological advancements and improvements in the performance of electronic devices, the market demand for efficient heat dissipation solutions is increasing. Thermally conductive materials can effectively conduct heat, preventing overheating and ensuring device reliability. Therefore, accurate measurement of the thermal resistance characteristics of thermally conductive materials has become particularly important.

[0003] Currently, there are various thermal resistance testing devices for thermally conductive materials on the market. These devices generally consist of a heating element and a heat dissipation element. Their working principle is that after the heating element generates heat, it is transferred to the heat dissipation element through the thermally conductive material. By measuring the power consumption of the heating element and the surface temperature of the heating element and the heat dissipation element, the thermal resistance of the material can be calculated. The calculation formula is: R = ΔT / P, where R is the thermal resistance, ΔT is the measured temperature difference, and P is the power consumption.

[0004] However, the accuracy of existing thermal resistance testing devices is not high, and they cannot fully reflect the overall thermal conductivity of thermally conductive materials. Utility Model Content

[0005] In view of the aforementioned problems, this application is made to provide a thermal resistance testing apparatus for thermally conductive materials that overcomes or at least partially solves the problems, comprising:

[0006] A thermal resistance testing device for thermally conductive materials includes a controller, a sealed housing, and a heating structure, a heat dissipation structure, and a driving structure respectively installed inside the sealed housing. The heating structure is located at the output end of the driving structure and moves up and down under the drive of the driving structure. The heating structure includes a heating element and a heating panel connected to the heating element. The heat dissipation structure includes a heat dissipation panel for placing the thermally conductive material. The heating panel and the heat dissipation panel are arranged in parallel and opposite to each other. The surfaces of the heating panel and the heat dissipation panel facing the thermally conductive material are respectively provided with three or more temperature sensing elements. The driving structure, the heating element, and the temperature sensing elements are electrically connected to the controller.

[0007] Preferably, the heating panel and the heat dissipation panel each include a metal plate, a temperature sensing element, and a wire; the surface of the metal plate facing the heat-conducting material is provided with a groove that matches the shape of the temperature sensing element, and the interior is provided with a through hole extending from the groove to the surface of the metal plate facing away from the heat-conducting material; the temperature sensing element is embedded inside the groove; one end of the wire is connected to the temperature sensing element, and the other end passes through the through hole and extends to the controller.

[0008] Preferably, the temperature sensing elements are distributed in an array on the surfaces of the heating panel and the heat dissipation panel.

[0009] Preferably, a pressure sensing element is provided at the connection between the driving structure and the heating structure; the pressure sensing element is electrically connected to the controller.

[0010] Preferably, the drive structure is an electric telescopic rod.

[0011] Preferably, it further includes a temperature regulating component and an air circulation system installed inside the sealed enclosure; the temperature regulating component and the air circulation system are electrically connected to the controller, respectively.

[0012] Preferably, the air circulation system is installed on the top wall of the sealed enclosure; the temperature regulation components are installed on the two side walls of the sealed enclosure.

[0013] Preferably, the temperature regulating component includes a heating element and a cooling element; the heating element and the cooling element are respectively electrically connected to the controller.

[0014] Preferably, at least one side of the sealed box has an opening, and a door is movably installed at the opening.

[0015] Preferably, at least one side of the sealed enclosure is provided with a transparent observation window.

[0016] This application has the following advantages:

[0017] In the embodiments of this application, to address the problem of low accuracy in existing thermal resistance testing devices, this application provides a solution by setting multiple temperature sensing elements on two heat-conducting panels facing the surface of the thermally conductive material. Specifically, it is described as follows: "A thermal resistance testing device for thermally conductive materials includes a controller, a sealed housing, and a heating structure, a heat dissipation structure, and a driving structure respectively installed within the sealed housing; the heating structure is located at the output end of the driving structure and moves up and down under the drive of the driving structure; the heating structure includes a heating element and a heating panel connected to the heating element; the heat dissipation structure includes a heat dissipation panel for placing the thermally conductive material; the heating panel and the heat dissipation panel are arranged parallel to each other; each of the heating panel and the heat dissipation panel has three or more temperature sensing elements on its surface facing the thermally conductive material; the driving structure, the heating element, and the temperature sensing elements are electrically connected to the controller." By setting multiple temperature sensing elements on the surfaces of the heating panel and the heat dissipation panel, the temperature distribution between the thermally conductive material and the heating and heat dissipation structures can be captured more comprehensively, allowing the controller to average the temperature data, thereby effectively reducing measurement errors caused by uneven local heat distribution and improving the accuracy of the thermal resistance test results. By designing the sealed enclosure, the sealing and stability of the testing environment can be improved, preventing the external environment from affecting the internal temperature regulation. By designing the drive structure, the lifting and lowering movement of the heating structure can be intelligently controlled, improving the level of automation in the testing process. Attached Figure Description

[0018] To more clearly illustrate the technical solution of this application, the drawings used in the description of this application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the structure of a thermal resistance testing device provided in an embodiment of this application;

[0020] Figure 2 This is a cross-sectional structural diagram of the heating panel or heat dissipation panel in a thermal resistance testing device provided in an embodiment of this application.

[0021] Figure 3 This is a schematic diagram of the thermal resistance material contact surface of the heating panel or heat dissipation panel in an embodiment of the thermal resistance testing device provided in this application;

[0022] Figure 4 This is a schematic diagram of the sealed housing, temperature control components, and air circulation system in a thermal resistance testing device provided in an embodiment of this application.

[0023] The reference numerals in the accompanying drawings are as follows:

[0024] 10. Controller; 20. Sealed enclosure; 30. Heating structure; 31. Heating element; 32. Heating panel; 321. Metal plate; 322. Temperature sensing element; 323. Wire; 40. Heat dissipation structure; 41. Heat dissipation panel; 50. Drive structure; 60. Temperature regulation component; 70. Air circulation system. Detailed Implementation

[0025] To make the objectives, features, and advantages of this application more apparent and understandable, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments. Obviously, the described embodiments are only some, not all, of the embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0026] The inventors discovered through analysis of existing technologies that in existing thermal resistance testing devices, temperature measurement is performed only at a single point on the heating element and the heat dissipation element. This may lead to errors in the measured temperature values ​​due to uneven local heat distribution, thereby affecting the accuracy of the test results.

[0027] It should be noted that, in any embodiment of this application, the thermally conductive material includes at least one of thermally conductive silicone grease, thermally conductive pad, thermally conductive adhesive, thermally conductive ceramic, metal thermally conductive material, carbon-based thermally conductive material, and thermally conductive composite material.

[0028] Reference Figures 1-4 This application illustrates a thermal resistance testing device for thermally conductive materials according to an embodiment of the present application. The device includes a controller 10, a sealed housing 20, and a heating structure 30, a heat dissipation structure 40, and a driving structure 50 respectively installed within the sealed housing 20. The heating structure 30 is disposed at the output end of the driving structure 50 and moves up and down under the drive of the driving structure 50. The heating structure 30 includes a heating element 31 and a heating panel 32 connected to the heating element 31. The heat dissipation structure 40 includes a heat dissipation panel 41 for placing the thermally conductive material. The heating panel 32 and the heat dissipation panel 41 are arranged parallel to each other. Each of the heating panel 32 and the heat dissipation panel 41 has three or more temperature sensing elements 322 on its surface facing the thermally conductive material. The driving structure 50, the heating element 31, and the temperature sensing elements 322 are electrically connected to the controller 10.

[0029] By setting multiple temperature sensing elements 322 on the surfaces of the heating panel 32 and the heat dissipation panel 41, the temperature distribution between the thermally conductive material and the heating structure 30 and the heat dissipation structure 40 can be captured more comprehensively. This allows the controller 10 to average the temperature data, effectively reducing measurement errors caused by uneven local heat distribution and improving the accuracy of thermal resistance test results. The sealed enclosure 20 improves the sealing and stability of the test environment, preventing the external environment from affecting internal temperature regulation. The drive structure 50 intelligently controls the lifting and lowering movement of the heating structure 30, improving the automation level of the test.

[0030] The thermal resistance testing apparatus in this exemplary embodiment will now be further described.

[0031] In this embodiment, the heating panel 32 and the heat dissipation panel 41 respectively include a metal plate 321, a temperature sensing element 322, and a wire 323. The surface of the metal plate 321 facing the heat-conducting material has a groove matching the shape of the temperature sensing element 322, and an internal through-hole extending from the groove to the surface of the metal plate 321 facing away from the heat-conducting material. The temperature sensing element 322 is embedded inside the groove. One end of the wire 323 is connected to the temperature sensing element 322, and the other end passes through the through-hole and extends to the controller 10. Specifically, the metal plate 321 is made of a metal material with good thermal conductivity (such as aluminum or copper). By providing a groove on the surface of the metal plate 321 that matches the shape of the temperature sensing element 322, it can be ensured that the temperature sensing element 322 can be tightly embedded in the groove, thereby improving thermal contact efficiency. The temperature sensing element 322 includes at least one of a thermocouple and a thermistor. By embedding the temperature sensing element 322 into the metal plate 321, the temperature change of the metal plate 321 can be accurately sensed and converted into an electrical signal, which is then transmitted to the controller 10 through the wire 323.

[0032] In this embodiment, the surface of the conductor 323 is provided with a high-temperature resistant protective layer. Specifically, the high-temperature resistant protective layer is made of polytetrafluoroethylene, silicone rubber, glass fiber braided layer or ceramic coating, which can effectively cope with high-temperature testing environments.

[0033] In this embodiment, the temperature sensing elements 322 are distributed in an array on the surfaces of the heating panel 32 and the heat dissipation panel 41. By distributing the temperature sensing elements 322 in an array, the surface temperatures of the heating panel 32 and the heat dissipation panel 41 can be monitored comprehensively and uniformly.

[0034] In this embodiment, the heat dissipation structure 40 further includes heat dissipation fins disposed on the surface of the heat dissipation panel 41 facing away from the thermally conductive material. Specifically, the heat dissipation fins include at least one of sheet-shaped heat dissipation fins, finned heat dissipation fins, needle-shaped heat dissipation fins, and hollow heat dissipation fins. By providing the heat dissipation fins, the heat of the heat dissipation panel 41 can be quickly dissipated, preventing heat accumulation.

[0035] In this embodiment, a pressure sensing element is provided at the connection between the driving structure 50 and the heating structure 30; the pressure sensing element is electrically connected to the controller 10. Specifically, the pressure sensing element includes at least one of a piezoelectric sensor, a strain gauge sensor, a piezoresistive resistor, and a spring displacement sensor. Sufficient contact pressure can ensure better thermal contact, thereby improving heat transfer efficiency. By setting the pressure sensing element, the contact pressure between the heating panel 32 and the thermally conductive material can be monitored in real time, so that the contact pressure can be adjusted to a suitable range by controlling the lifting and lowering movement of the heating structure 30.

[0036] In this embodiment, the drive structure 50 is an electric telescopic rod (such as a servo electric telescopic rod), which can perform telescopic movements under set parameters to achieve precise positioning and speed control.

[0037] In this embodiment, a temperature regulating component 60 and an air circulation system 70 are also installed inside the sealed chamber 20; the temperature regulating component 60 and the air circulation system 70 are electrically connected to the controller 10. Specifically, the temperature regulating component 60 has heating and cooling functions. On the one hand, it can use a heating element to raise the air temperature to simulate a high-temperature environment; on the other hand, it can use a cooling element to quickly lower the internal temperature to simulate a low-temperature environment. By setting the temperature regulating component 60, the needs of various environmental experiments can be met (such as testing the change in thermal resistance performance of the thermally conductive material after passing through different environmental temperatures). By setting the air circulation system 70, the uniformity of airflow inside the test chamber can be ensured, avoiding excessively high or low local temperatures.

[0038] In this embodiment, the air circulation system 70 is installed on the top wall of the sealed enclosure 20; the temperature regulation components 60 are installed on the two side walls of the sealed enclosure 20. This layout effectively utilizes the internal space of the sealed enclosure 20, allowing various components to be arranged in an orderly manner, facilitating maintenance and replacement, while also providing sufficient space for other experimental equipment or samples.

[0039] In this embodiment, the temperature regulating component 60 includes a heating element and a cooling element; the heating element and the cooling element are electrically connected to the controller 10, respectively. Specifically, the heating element includes at least one of a resistance heater and an infrared heating lamp. The cooling element includes at least one of a compressor, a thermoelectric refrigeration module, and an evaporative cooler.

[0040] In this embodiment, the sealed enclosure 20 has an opening on at least one side, and a door is movably installed at the opening. By providing the opening and the door, it is convenient for users to enter the sealed enclosure 20 to retrieve items, perform maintenance, or operate the equipment, effectively improving the ease of operation.

[0041] In this embodiment, at least one side of the sealed enclosure 20 is provided with a transparent observation window. By providing the transparent observation window, users can easily observe the contents inside the sealed enclosure 20, which helps to identify problems in a timely manner and take measures.

[0042] In one specific implementation, the operation method of the thermal resistance testing device is as follows:

[0043] Start the device: Press the power switch to start the thermal resistance test device, check whether the device is working properly, and confirm that the display screen of the controller 10 has the corresponding status information.

[0044] Coverage Test: Apply thermal paste evenly to nine test points along the middle and edges of the heat dissipation structure 40. Press the coverage test button in the operating software to press the heat-generating structure 30 against the heat dissipation structure 40 with a force of 20 kgf and hold for 10 seconds, then reset. Check whether the indentation of the heat-generating structure 30 completely covers the thermal paste at the nine test points.

[0045] Test the thermal resistance of the thermal paste: Apply a 26*26mm layer of thermal paste evenly to the surface of the heat dissipation structure 40. Set the following parameters in the operating software: pressure: 60psi, temperature: 80℃, time: 20min, and press the thermal resistance test button to start the test.

[0046] Results: After a period of time, the system automatically calculates and outputs the thermal resistance of the thermal paste.

[0047] Although preferred embodiments of the present application have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of the embodiments of the present application.

[0048] Finally, it should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or terminal device that includes a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or terminal device. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of additional identical elements in the process, method, article, or terminal device that includes the element.

[0049] The thermal resistance testing device for thermally conductive materials provided in this application has been described in detail above. Specific examples have been used to illustrate the principle and implementation of this application. The description of the above embodiments is only for the purpose of helping to understand the method and core idea of ​​this application. At the same time, for those skilled in the art, there will be changes in the specific implementation and application scope based on the idea of ​​this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A thermal resistance testing device for thermally conductive materials, characterized in that, The device includes a controller, a sealed housing, and a heating structure, a heat dissipation structure, and a driving structure respectively installed inside the sealed housing. The heating structure is located at the output end of the driving structure and moves up and down under the drive of the driving structure. The heating structure includes a heating element and a heating panel connected to the heating element. The heat dissipation structure includes a heat dissipation panel for placing thermally conductive material. The heating panel and the heat dissipation panel are arranged in parallel and opposite to each other. The surfaces of the heating panel and the heat dissipation panel facing the thermally conductive material are respectively provided with three or more temperature sensing elements. The driving structure, the heating element, and the temperature sensing elements are electrically connected to the controller.

2. The thermal resistance testing device according to claim 1, characterized in that, The heating panel and the heat dissipation panel each include a metal plate, a temperature sensing element, and a wire; the surface of the metal plate facing the heat-conducting material is provided with a groove that matches the shape of the temperature sensing element, and the inside is provided with a through hole that extends from the groove to the surface of the metal plate facing away from the heat-conducting material; the temperature sensing element is embedded inside the groove; one end of the wire is connected to the temperature sensing element, and the other end passes through the through hole and extends to the controller.

3. The thermal resistance testing device according to claim 1, characterized in that, The temperature sensing elements are distributed in an array on the surfaces of the heating panel and the heat dissipation panel.

4. The thermal resistance testing device according to claim 1, characterized in that, A pressure sensing element is provided at the connection between the drive structure and the heating structure; the pressure sensing element is electrically connected to the controller.

5. The thermal resistance testing device according to claim 1, characterized in that, The drive structure is an electric telescopic rod.

6. The thermal resistance testing device according to claim 1, characterized in that, It also includes a temperature control component and an air circulation system installed inside the sealed enclosure; the temperature control component and the air circulation system are electrically connected to the controller, respectively.

7. The thermal resistance testing device according to claim 6, characterized in that, The air circulation system is installed on the top wall of the sealed enclosure; the temperature regulation components are installed on the two side walls of the sealed enclosure.

8. The thermal resistance testing device according to claim 6, characterized in that, The temperature regulation component includes a heating element and a cooling element; the heating element and the cooling element are respectively electrically connected to the controller.

9. The thermal resistance testing device according to claim 1, characterized in that, The sealed box has an opening on at least one side, and a door is movably installed at the opening.

10. The thermal resistance testing device according to claim 1, characterized in that, The sealed enclosure has a transparent observation window on at least one side.

Images