Anti-oxidation PCB convenient for element surface mounting

Abstract

The utility model relates to a PCB (Printed Circuit Board), and provides an anti-oxidation PCB convenient for element surface mounting, which comprises a substrate, a nano plating layer, a gold layer, a positioning target spot and the like, a plurality of positioning target spots are arranged on the base plate, a gold layer is laid on the base plate, and a nano plating layer is laid on the surface of the gold layer. According to the utility model, the nano plating layer made of a composite material or a coating with a self-repairing function is laid on the base plate of the PCB, and the plating layer is uniformly and flatly covered on the base plate in an atomic deposition mode; the coating has high oxidation resistance, the materials can better resist corrosive gas and moisture in the environment, and meanwhile the high-flatness coating is beneficial to welding during element surface mounting.

Description

Technical Field

[0001] This utility model relates to a PCB board, and more particularly to an anti-oxidation PCB board that facilitates component mounting. Background Technology

[0002] In the electronics manufacturing industry, printed circuit boards (PCBs) are the foundation for assembling electronic components. With the increasing demand for miniaturization and high performance in electronic products, surface mount technology (SMT) has become the mainstream method for mounting electronic components. By directly mounting components onto the surface of the PCB, SMT not only improves the integration of the circuit board but also reduces production costs and time.

[0003] However, PCBs are susceptible to oxidation during production and storage, especially in environments with high humidity, high temperature, or corrosive gases. Oxidation leads to the formation of an oxide film on the PCB surface, which affects soldering quality and reliable component connections. To prevent oxidation, existing anti-oxidation PCBs employ techniques such as silver and nickel plating, which offer good solderability, but the plating surface is easily contaminated, affecting soldering performance. While organic fluxes are lower in cost, their anti-oxidation properties are limited and easily affected by processing conditions. Therefore, the anti-oxidation layers of existing PCBs still have some shortcomings. Utility Model Content

[0004] To overcome the shortcomings of existing PCB board anti-oxidation layers, where oxidation may still occur on the PCB surface during actual processing and storage, potentially leading to unreliable component mounting, the purpose of this invention is to provide an anti-oxidation PCB board that facilitates component mounting and solves one of the aforementioned problems.

[0005] The technical solution is as follows: an anti-oxidation PCB board that facilitates component mounting, comprising a substrate, a nano-plating layer, a gold layer, and positioning targets. The substrate is provided with multiple positioning targets, the gold layer is deposited on the substrate, and the surface of the gold layer is covered with a nano-plating layer.

[0006] As an improvement to the above scheme, the nano-coating is prepared by atomic layer deposition (ALD) and its surface roughness Ra is less than 0.5 nanometers.

[0007] As an improvement to the above solution, a palladium layer is further included, wherein the palladium layer is deposited between the nano-coating and the gold layer. As an improvement to the above solution, the thickness of the nano-coating is between 3 and 5 micrometers (μm); the thickness of the palladium layer is between 0.05 and 0.1 micrometers (μm); and the thickness of the gold layer is between 0.05 and 0.25 micrometers (μm).

[0008] As an improvement to the above scheme, a nano-coating layer, a gold layer, and a palladium layer are used to coat the upper and lower surfaces of the substrate.

[0009] As an improvement to the above solution, it also includes thermal conductive pads and thermal conductive plates. Multiple thermal conductive pads are arranged on the substrate, and thermal conductive paths are added to the substrate through the thermal conductive pads. A thermal conductive plate is connected between one end of the thermal conductive pads.

[0010] The beneficial effects are as follows:

[0011] This invention utilizes a composite structure of nano-plating, palladium, and gold layers, ensuring that these layers are uniformly and smoothly applied to the substrate. This coating exhibits high oxidation resistance, and these materials can better resist corrosive gases and moisture in the environment. At the same time, the high flatness of the coating facilitates soldering during component mounting. This PCB board possesses extremely high oxidation resistance and can operate stably for extended periods in harsh environments.

[0012] This invention effectively improves the bonding force between the gold layer and the nano-plating layer by adding a palladium layer, making the welding process more reliable and reducing circuit failures caused by poor welding.

[0013] This invention, through the design of thermally conductive patches and thermally conductive plates, enables the PCB board to have excellent heat dissipation performance, which can quickly dissipate heat into the air and reduce the risk of oxidation and circuit failure caused by high temperature. Attached Figure Description

[0014] Figure 1 This is a three-dimensional structural diagram of the present invention.

[0015] Figure 2 This is an exploded view of the present invention.

[0016] The labels in the diagram are as follows: 1. Substrate, 2. Positioning target, 3. Gold layer, 4. Palladium layer, 5. Nano-coating, 6. Thermal conductive patch, 61. Thermal conductive plate. Detailed Implementation

[0017] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0018] An anti-oxidation PCB board that facilitates component placement aims to solve problems such as susceptibility to environmental corrosion, insufficient soldering reliability, and poor heat dissipation performance of traditional PCB boards during use. Figure 1-2As shown, the PCB includes a substrate 1, which serves as the foundation of the entire PCB board. Multiple positioning targets 2 are provided on the substrate 1 for precise component positioning during the component placement process, ensuring accurate placement of components in predetermined positions, thereby improving production efficiency and product quality. A gold layer 3 is deposited on the substrate 1. The gold layer 3 not only has good conductivity but also provides a reliable adhesion surface for subsequent soldering. A nano-plating layer 5 is deposited on the outermost layer. It is made of composite materials or a self-healing coating and prepared using atomic layer deposition, resulting in extremely low surface roughness and a highly flat surface, which is beneficial for component placement and effectively resists corrosive gases and moisture in the environment. Furthermore, the high oxidation resistance of the nano-plating layer 5 can extend the service life of the PCB board.

[0019] Among them, such as Figure 1-2 As shown, the palladium layer 4 located between the gold layer 3 and the nano-plating layer 5 plays a crucial transitional role. The palladium layer 4 can effectively prevent the diffusion reaction between the gold layer 3 and the nano-plating layer 5, while enhancing the bonding force between the two, further improving the oxidation resistance and soldering reliability of the entire PCB board.

[0020] Specifically, the thickness of the nano-plating layer 5 is between 3 and 5 μm; the thickness of the palladium layer 4 is between 0.05 and 0.1 μm; and the thickness of the gold layer 3 is between 0.05 and 0.25 μm. The coating thickness should be as uniform as possible to ensure the consistency and reliability of the entire circuit board. The thickness of these coatings needs to be adjusted according to their functional requirements. For areas with high soldering performance requirements, the thickness of the gold layer 3 may need to be slightly thicker. By covering the upper and lower surfaces of the substrate 1 with the nano-plating layer 5, the gold layer 3, and the palladium layer 4, this structure not only provides sufficient protection for the substrate 1 but also makes the component soldering process more reliable and reduces circuit failures caused by soldering.

[0021] In addition, such as Figure 2 As shown, the substrate is also provided with thermally conductive pads 6 and thermally conductive plates 61. Multiple thermally conductive pads 6 are arranged on the substrate 1. The thermally conductive pads 6 add heat conduction paths to the substrate 1, forming multiple efficient heat dissipation channels. One end of the thermally conductive pads 6 is connected to the thermally conductive plate 61. The thermally conductive pads 6 can quickly conduct heat from the substrate 1 to the thermally conductive plate 61, and then dissipate the heat into the air through the thermally conductive plate 61, thereby effectively reducing the operating temperature of the PCB board. The arrangement of the thermally conductive pads 6 and the arrangement of the thermally conductive plate 61 avoid the conductive paths and component mounting areas on the substrate 1. The heat dissipation performance is improved by conducting heat, reducing oxidation problems caused by high temperature.

[0022] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the scope of the claims.

Claims

1. An anti-oxidation PCB board that facilitates component mounting, characterized in that, Includes a substrate (1); Its features include positioning target points (2), gold layer (3) and nano coating (5), the substrate (1) is provided with multiple positioning target points (2), the substrate (1) is provided with gold layer (3), and the surface of the gold layer (3) is provided with nano coating (5).

2. The anti-oxidation PCB board for easy component mounting as described in claim 1, characterized in that, The nano-coating (5) is prepared by atomic layer deposition and has a surface roughness Ra of less than 0.5 nanometers.

3. The anti-oxidation PCB board for easy component mounting as described in claim 2, characterized in that, It also includes a palladium layer (4), which is laid between the nano-plating layer (5) and the gold layer (3).

4. The anti-oxidation PCB board for easy component mounting as described in claim 3, characterized in that, The thickness of the nano-coating (5) is between 3 and 5 μm; the thickness of the palladium layer (4) is between 0.05 and 0.1 μm; and the thickness of the gold layer (3) is between 0.05 and 0.25 μm.

5. The anti-oxidation PCB board for easy component mounting as described in claim 4, characterized in that, Nano-coating (5), gold layer (3), and palladium layer (4) are used to coat the upper and lower surfaces of the substrate (1).

6. The anti-oxidation PCB board for easy component mounting as described in claim 5, characterized in that, It also includes thermally conductive patches (6) and thermally conductive plates (61). Multiple thermally conductive patches (6) are arranged on the substrate (1). Thermal conductive paths are added to the substrate (1) through the thermally conductive patches (6). One end of the thermally conductive patches (6) is connected to the thermally conductive plate (61).

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