Ceramic copper-clad plate solder heating device

Abstract

The utility model discloses a ceramic copper-clad plate welding flux heating device, which belongs to the technical field of ceramic copper-clad plate welding flux, and comprises an operation box, a heating box is fixedly connected to the top of the operation box, a box door is hinged to the outer surface of the heating box, two symmetrically distributed clamping plates are slidably connected to the bottom of the heating box, and the ceramic copper-clad plate welding flux heating device further comprises a heating assembly. The heating device is positioned in the heating box and is used for uniformly heating the ceramic copper-clad plate solder positioned in the heating box; the positioning assembly is located in the operation box and used for driving the two clamping plates to clamp the ceramic copper-clad plate welding flux located in the heating box, the electric heating pipes are distributed on the inner wall of the top of the heating box in a criss-cross mode at equal intervals, uniform distribution of heat is ensured, meanwhile, uniform transfer of the heat is further promoted through rotation of the heating plate, and the welding quality of the ceramic copper-clad plate is improved. And the condition of local overheating or insufficient temperature is avoided, so that the welding quality and the consistency of products are improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to ceramic clad copper plate solder technical field more specifically, relate to a kind of ceramic clad copper plate solder heating device. BACKGROUND

[0002] As a kind of high-performance electronic packaging material, ceramic clad copper plate (CCCP) has been widely used in high-end fields such as aerospace, automotive electronics, communication equipment and medical electronics due to its excellent thermal stability, high thermal conductivity, good electrical insulation and mechanical strength. Ceramic clad copper plate is usually composed of a ceramic substrate and a copper foil through special process, where the copper foil layer is used for circuit pattern making and connection with external components, and the ceramic substrate provides good thermal conduction and mechanical support.

[0003] In the manufacturing process of ceramic clad copper plate, welding is a crucial link. The quality of welding directly affects the electrical connection reliability, thermal conduction efficiency and long-term working stability of ceramic clad copper plate. Traditional welding methods such as laser welding and hot press welding can meet the welding requirements to some extent, but often have problems such as low welding efficiency, unstable welding quality and high cost. Especially in the interconnection process of ceramic clad copper plate and electronic components, the selection of solder and heating method are crucial to the quality of welding. Solder needs to have good wettability, fluidity, electrical conductivity and thermal stability to ensure the strength and reliability of the welded joint, and the heating method needs to be able to uniformly and quickly heat the solder to avoid local overheating or insufficient temperature leading to welding defects such as solder balls and welding cracks. The existing ceramic clad copper plate solder heating device often has the problem of uneven heating, which can cause uneven melting of solder and form welding defects such as solder balls and welding cracks. SUMMARY

[0004] To overcome the shortcomings of the prior art, the utility model provides a ceramic clad copper plate solder heating device, which solves the above problems.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical scheme: a ceramic clad copper plate solder heating device, comprising an operation box, a heating box is fixedly connected to the top of the operation box, a box door is hingedly connected to the outer surface of the heating box, and two symmetrically distributed clamping plates are slidingly connected to the bottom of the heating box; further comprising:

[0006] A heating assembly is located inside the heating box and is used to uniformly heat the ceramic clad copper plate solder located inside the heating box.

[0007] A positioning assembly is located inside the operation box and is used to drive the two clamping plates to clamp the ceramic clad copper plate solder located inside the heating box.

[0008] Preferably, the heating assembly comprises a power supply, an electric heating tube and a heating plate, a plurality of longitudinal and horizontal staggered electric heating tubes are fixedly installed on the top inner wall of the heating box, the plurality of electric heating tubes are equidistantly distributed, the power supply is fixedly installed on the top of the heating box, and the power supply is electrically connected with the adjacent electric heating tubes, and the heating plate is rotatably connected in the heating box and away from the box door.

[0009] Preferably, the first gear and the second gear are rotatably connected to the outer surface of the heating box, the first gear is meshedly connected with the second gear, the support plate is fixedly connected to the outer surface of the heating box, the driving motor is fixedly installed on the outer surface of the support plate, the first gear and the second gear are located in the interior of the support plate, the output end of the driving motor is fixedly connected with the first gear, and the second gear is fixedly connected with the heating plate.

[0010] Preferably, the positioning assembly comprises a support frame, a guide rail and a sliding block, four support frames symmetrically distributed and arranged are fixedly connected to the top of the operation box, the four support frames are all arranged in L-shaped structure, the guide rails are all fixedly connected to the top of the four support frames, the sliding blocks are all slidably connected to the top of the four guide rails, and the top of the two sliding blocks is fixedly connected with the corresponding clamping plates.

[0011] Preferably, the top of the operation box is fixedly connected with a fixed column, the outer surface of the fixed column is rotatably connected with a second connecting rod, the two ends of the second connecting rod are rotatably connected with first connecting rods, the two first connecting rods are rotatably connected with the interiors of the corresponding clamping plates, the top of the operation box is fixedly installed with a push cylinder, and the output end of the push cylinder is fixedly connected with the adjacent clamping plate.

[0012] Preferably, the top of the fixed column is fixedly connected with a fixed disc, and the fixed disc is located above the two first connecting rods.

[0013] Preferably, the first connecting rod, the fixed disc and the second connecting rod are all located above the bottom of the heating box.

[0014] Compared with the prior art, the ceramic copper-clad plate solder heating device has the following beneficial effects:

[0015] The ceramic copper-clad plate solder heating device, the electric heating tubes are longitudinally and horizontally staggered and equidistantly distributed on the top inner wall of the heating box, the uniform distribution of heat is ensured, the rotation of the heating plate further promotes the uniform transmission of heat, the local overheating or temperature deficiency is avoided, and the welding quality and the consistency of products are improved.

[0016] The ceramic copper-clad plate solder heating device realizes stable clamping of the ceramic copper-clad plate solder through the cooperation of the push cylinder, the clamping plate, the first connecting rod, the second connecting rod and the fixing disc, ensures the stability of the solder in the heating process, can adapt to ceramic copper-clad plate solders of different sizes, and improves the versatility and practicality of the equipment. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 It is a structural schematic view of the utility model;

[0018] Figure 2 It is a structural side view of the utility model;

[0019] Figure 3 It is a structural schematic view of the first gear of the utility model;

[0020] Figure 4 It is a structural schematic view of the heating plate of the utility model;

[0021] Figure 5 It is a structural schematic view of the guide rail of the utility model;

[0022] Figure 6 It is a structural schematic view of the first connecting rod of the utility model;

[0023] Figure 7 It is a structural schematic view of the second connecting rod of the utility model.

[0024] In the drawing: 1, operation box; 2, heating box; 3, push cylinder; 4, power supply; 5, box door; 6, driving motor; 7, first gear; 8, second gear; 9, electric heating tube; 10, clamping plate; 11, heating plate; 12, support frame; 13, guide rail; 14, sliding block; 15, first connecting rod; 16, fixing disc; 17, second connecting rod; 18, fixed column. DETAILED DESCRIPTION

[0025] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the utility model.

[0026] Please refer to Figures 1-7 The utility model provides a technical scheme:

[0027] The utility model provides a kind of ceramic copper-clad plate solder heating device, including operation box 1, the top of operation box 1 is fixedly connected with heating box 2, the outer surface of heating box 2 is hinged with box door 5, the bottom of heating box 2 is slidably connected with two symmetrical distribution's clamping plate 10, further including:

[0028] Heating assembly is located in the inside of heating box 2, for the ceramic copper-clad plate solder in heating box 2 is heated evenly;

[0029] Positioning assembly is located in the inside of operation box 1, for two clamping plate 10 with the ceramic copper-clad plate solder in heating box 2 is clamped, the clamping of two clamping plate 10 to ceramic copper-clad plate solder, this clamping mode is not only stable and reliable, but also can adapt to the ceramic copper-clad plate solder of different size.

[0030] Further, heating assembly includes power supply 4, electric heating tube 9 and heating plate 11, the top inner wall of heating box 2 is fixedly installed with multiple longitudinal and transverse staggered electric heating tube 9, multiple electric heating tube 9 is equidistant distribution, the top of heating box 2 is fixedly installed with power supply 4, power supply 4 is electrically connected with similar electric heating tube 9, the inside of heating box 2 is rotatably connected with heating plate 11, heating plate 11 is away from box door 5, power supply 4 provides electric energy for electric heating tube 9, electric heating tube 9 starts to heat, generates heat, because electric heating tube 9 is longitudinal and transverse staggered and equidistant distribution on the top inner wall of heating box 2, can ensure that the ceramic copper-clad plate solder in heating box 2 is heated evenly.

[0031] Further, the outer surface of heating box 2 is rotatably connected with first gear 7 and second gear 8, first gear 7 is meshedly connected with second gear 8, the outer surface of heating box 2 is fixedly connected with support plate, the outer surface of support plate is fixedly installed with drive motor 6, first gear 7 and second gear 8 are located in the inside of support plate, the output end of drive motor 6 is fixedly connected with first gear 7, second gear 8 is fixedly connected with heating plate 11, the output end of drive motor 6 drives first gear 7 to rotate, because first gear 7 is meshedly connected with second gear 8, so second gear 8 also rotates, the rotation of second gear 8 drives heating plate 11 to rotate in the inside of heating box 2, so the heat on heating plate 11 can be more evenly transferred to ceramic copper-clad plate solder.

[0032] Further, positioning assembly includes support frame 12, guide rail 13 and sliding block 14, the top of operation box 1 is fixedly connected with four mutually symmetrical distribution settings support frame 12, four support frames 12 are all set as L-shaped structure, the top of four support frames 12 is fixedly connected with guide rail 13, the top of four guide rails 13 is slidably connected with sliding block 14, the top of two sliding blocks 14 is fixedly connected with corresponding clamping plate 10, the output end of push cylinder 3 pushes clamping plate 10 fixedly connected with it, makes clamping plate 10 slide along guide rail 13 and move to heating box 2 inside under the action of sliding block 14.

[0033] Further, the top of the operation box 1 is fixedly connected with a fixed column 18, the outer surface of the fixed column 18 is rotatably connected with a second connecting rod 17, both ends of the second connecting rod 17 are rotatably connected with a first connecting rod 15, both first connecting rods 15 are rotatably connected with the inside of the corresponding clamping plate 10, the top of the operation box 1 is fixedly installed with a push cylinder 3, the output end of the push cylinder 3 is fixedly connected with the adjacent clamping plate 10, due to the linkage of the first connecting rod 15, the second connecting rod 17 and the fixed disc 16, when one side of the clamping plate 10 moves, the other side of the clamping plate 10 is driven to move synchronously through the rotation of the first connecting rod 15 and the second connecting rod 17, so as to realize the clamping of the two clamping plates 10 to the ceramic copper-clad plate solder.

[0034] Further, the top of the fixed column 18 is fixedly connected with a fixed disc 16, the fixed disc 16 is located above the two first connecting rods 15, the ceramic copper-clad plate solder is placed on the fixed disc 16 by opening the box door 5.

[0035] Further, the first connecting rod 15, the fixed disc 16 and the second connecting rod 17 are all located above the bottom of the heating box 2.

[0036] Working principle: when the staff needs to use the ceramic copper-clad plate solder heating device, before the heating process, it is necessary to ensure that the ceramic copper-clad plate solder is stably clamped in the heating box 2, open the box door 5 to place the ceramic copper-clad plate solder on the fixed disc 16, then start the push cylinder 3, the output end of the push cylinder 3 pushes the clamping plate 10 fixedly connected therewith, so that the clamping plate 10 slides along the guide rail 13 and moves to the inside of the heating box 2 under the action of the sliding block 14, due to the linkage action of the first connecting rod 15, the second connecting rod 17 and the fixed disc 16, when one side of the clamping plate 10 moves, the other side of the clamping plate 10 is driven to move synchronously through the rotation of the first connecting rod 15 and the second connecting rod 17, so as to realize the clamping of the ceramic copper-clad plate solder by the two clamping plates 10, this clamping mode is not only stable and reliable, but also can adapt to ceramic copper-clad plates of different sizes, after fixing, start the heating assembly, the power supply 4 provides power for the electric heating tube 9, the electric heating tube 9 starts to heat and generate heat, since the electric heating tube 9 is distributed in the top inner wall of the heating box 2 in a longitudinal and transverse staggered manner, therefore, uniform heating of the ceramic copper-clad plate solder in the heating box 2 can be ensured, the heating plate 11 also plays a role in auxiliary heating, in order to enhance the heating effect and promote the uniform distribution of heat, the driving motor 6 starts to work, the output end of the driving motor 6 drives the first gear 7 to rotate, since the first gear 7 is meshed and connected with the second gear 8, therefore, the second gear 8 also rotates, the rotation of the second gear 8 drives the heating plate 11 to rotate in the heating box 2, so that the heat on the heating plate 11 can be more uniformly transmitted to the ceramic copper-clad plate solder, when the heating is completed, the driving motor 6 stops working, the heating plate 11 stops rotating, at the same time, the output end of the push cylinder 3 retracts, drives the clamping plate 10 to slide along the guide rail 13 and move to the outside of the heating box 2, so as to release the clamped ceramic copper-clad plate solder, open the box door 5 to take out the heated ceramic copper-clad plate solder for next operation.

[0037] The basic principle, main features and advantages of the present application are shown and described above. Those skilled in the art should understand that the present application is not limited by the above embodiments, the above embodiments and descriptions in the specification are only preferred examples of the present application and are not intended to limit the present application, various changes and improvements can be made to the present application without departing from the spirit and scope of the present application, and these changes and improvements all fall within the scope of the claimed present application. The scope of protection of the present application is defined by the appended claims and their equivalents.

Claims

1. A ceramic copper-clad laminate solder heating device, comprising an operating box (1), characterized in that: The top of the operating box (1) is fixedly connected to a heating box (2), and a door (5) is hinged to the outer surface of the heating box (2). The bottom of the heating box (2) is slidably connected to two symmetrically distributed snap-fit ​​plates (10), and also includes: A heating component, located inside the heating chamber (2), is used to uniformly heat the ceramic copper-clad laminate solder located inside the heating chamber (2); The positioning component, located inside the operating box (1), is used to drive two snap-fit ​​plates (10) to clamp the ceramic copper-clad laminate solder located in the heating box (2); The heating assembly includes a power supply (4), heating tubes (9) and a heating plate (11). Multiple crisscrossing heating tubes (9) are fixedly installed on the top inner wall of the heating box (2). The multiple heating tubes (9) are distributed at equal intervals. The power supply (4) is fixedly installed on the top of the heating box (2). The power supply (4) is electrically connected to the adjacent heating tubes (9). The heating plate (11) is rotatably connected inside the heating box (2). The heating plate (11) is away from the box door (5). The positioning component includes a support frame (12), a guide rail (13), and a slider (14). The top of the operation box (1) is fixedly connected to four support frames (12) that are symmetrically distributed. The four support frames (12) are all arranged in an L-shape. The top of each of the four support frames (12) is fixedly connected to a guide rail (13). The top of each of the four guide rails (13) is slidably connected to a slider (14). The top of each of the two sliders (14) is fixedly connected to a corresponding snap-fit ​​plate (10).

2. The ceramic copper-clad laminate solder heating device according to claim 1, characterized in that: The outer surface of the heating box (2) is rotatably connected to a first gear (7) and a second gear (8). The first gear (7) and the second gear (8) are meshed together. The outer surface of the heating box (2) is fixedly connected to a support plate. The outer surface of the support plate is fixedly mounted with a drive motor (6). The first gear (7) and the second gear (8) are located inside the support plate. The output end of the drive motor (6) is fixedly connected to the first gear (7). The second gear (8) is fixedly connected to the heating plate (11).

3. The ceramic copper-clad laminate solder heating device according to claim 1, characterized in that: The top of the operation box (1) is fixedly connected to a fixed column (18), and the outer surface of the fixed column (18) is rotatably connected to a second connecting rod (17). Both ends of the second connecting rod (17) are rotatably connected to a first connecting rod (15). The two first connecting rods (15) are rotatably connected to the interior of the corresponding snap-fit ​​plate (10). The top of the operation box (1) is fixedly installed with a push cylinder (3), and the output end of the push cylinder (3) is fixedly connected to the adjacent snap-fit ​​plate (10).

4. The ceramic copper-clad laminate solder heating device according to claim 3, characterized in that: A fixing plate (16) is fixedly connected to the top of the fixing column (18), and the fixing plate (16) is located above the two first connecting rods (15).

5. The ceramic copper-clad laminate solder heating device according to claim 4, characterized in that: The first connecting rod (15), the fixed plate (16) and the second connecting rod (17) are all located above the bottom of the heating box (2).

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