Monocrystalline silicon sample wafer manufacturing equipment

Abstract

The utility model discloses monocrystalline silicon sample wafer manufacturing equipment, and aims to provide monocrystalline silicon sample wafer manufacturing equipment which is easy to operate, improves efficiency and has small size difference between a sample wafer and a standard sample wafer. The device comprises a base, a sample wafer manufacturing station, a positioning mechanism and a sliding mechanism are arranged on the base, a cutting mechanism is arranged on the sliding mechanism in a sliding fit mode, the sample wafer manufacturing station is located on a moving path of the cutting mechanism, and the positioning mechanism and the sample wafer manufacturing station are correspondingly arranged. The utility model is applied to the technical field of monocrystalline silicon.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of monocrystalline silicon, especially to a monocrystalline silicon sample piece manufacturing equipment. BACKGROUND

[0002] In the monocrystalline silicon rod product, the oxygen and carbon element content has a great influence on the quality. At present, the industry adopts the method of cutting off 2.5mm-3.5mm thick round pieces from the silicon rod, then making a square sample piece with a side length of 4.5cm-5.0cm from the center position of the round piece (the closer the sample piece is to the center of the round piece, the more accurate the sample piece detection value is, and the more it can represent the oxygen and carbon content of the silicon rod), and then detecting it with a specific device after removing the surface impurities. However, at present, the industry generally adopts the method of manually knocking the round piece with pliers from the center position of the round piece. Due to the characteristics of the fragile round silicon piece, when the sample is completely knocked by the artificial, the shape and standard size of the sample piece are greatly different, which cannot be detected by the equipment, and the sample piece needs to be re-made to meet the standard. The center position sample piece is easy to break, and after breaking, a sample piece of standard size needs to be re-made at a non-center position, which greatly affects the accuracy of the oxygen and carbon content detection value. If the sample piece cannot be made to meet the requirements, the round piece needs to be cut off again, which increases the detection cycle time and greatly affects the efficiency. UTILITY MODEL CONTENT

[0003] The utility model solves the technical problems of the prior art, and provides a monocrystalline silicon sample piece manufacturing equipment which is easy to operate, improves the efficiency, and has small differences between the sample piece and the standard size.

[0004] The utility model adopts the technical scheme that the utility model discloses a base, sample piece manufacturing stations, positioning mechanisms and sliding mechanisms are arranged on the base, cutting mechanisms are slidably connected to the sliding mechanisms, the sample piece manufacturing stations are located on the moving paths of the cutting mechanisms, and the positioning mechanisms are arranged in correspondence with the sample piece manufacturing stations.

[0005] Further, the cutting mechanisms include mounting plates and cutting heads, the cutting heads are mounted on the mounting plates, and the mounting plates are slidably connected to the sliding mechanisms.

[0006] Further, the cutting heads are rotatably connected to the mounting plates.

[0007] Further, the cutting heads have two cutting portions at the bottom, and the two cutting portions are arranged side by side.

[0008] Further, the sliding mechanisms include two guide mechanisms, the two guide mechanisms are located on the two sides of the sample piece manufacturing stations respectively, sliding blocks are slidably connected to the two guide mechanisms, and the cutting mechanisms are arranged on the two sliding blocks.

[0009] Further, the guiding mechanism comprises two guiding rod supports, and a guiding rod is arranged between the two guiding rod supports.

[0010] Further, the positioning mechanism comprises a plurality of positioning blocks, and the positioning blocks are arranged correspondingly to the sample manufacturing stations.

[0011] Further, the number of the positioning blocks is two.

[0012] Further, the sample manufacturing station is provided with a sample rotating part.

[0013] Further, the sample manufacturing station is provided with a rotating indication scale.

[0014] The beneficial effects of the present application are as follows:

[0015] Compared with the prior art, in the present application, when the device is operated, the circular silicon wafer is placed on the sample manufacturing station and contacts the positioning mechanism to be positioned, and then the cutting mechanism is further pressed by hand to draw across the circular silicon wafer, and the circular silicon wafer is further rotated and contacted with the positioning mechanism, and then the cutting mechanism is further pressed by hand to draw across the circular silicon wafer, so that the cutting mechanism forms a cross-shaped cutting path at the center position of the circular silicon wafer, and the sample at the center position is lightly folded or tapped to fall off, thereby completing the sample manufacturing, and therefore, the present application can manufacture samples with standard size and position, solve the problem of large difference between the shape of the manually manufactured sample and the standard size and the problem of easily broken sample affecting the efficiency of re-manufacturing, reduce the experience and skill work of manual operation, reduce the sample manufacturing time and difficulty, and make the present application have the advantages of easy operation, improved efficiency and small difference between the sample and the standard size. BRIEF DESCRIPTION OF DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed in the following embodiment or prior art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained from the structures shown in the drawings without creative labor.

[0017] Figure 1 is a schematic diagram of the three-dimensional structure of the present application Figure 1 ;

[0018] Figure 2 is a schematic diagram of the three-dimensional structure of the present application Figure 2 ;

[0019] Figure 3 is a schematic diagram of the planar structure of the present application.

[0020] The reference signs are as follows:

[0021] 1. Base; 2. Sample making station; 3. Positioning mechanism; 5. Sliding mechanism; 6. Cutting mechanism; 7. Mounting plate; 8. Cutting head; 9. Cutting part; 10. Guide mechanism; 11. Slider; 12. Guide rod support; 13. Guide rod; 15. Positioning block.

[0022] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.

[0024] It should be noted that all directional indicators in this utility model embodiment, such as up, down, left, right, front, back, clockwise, counterclockwise, etc., are only used to explain the relative positional relationship and movement of each component in a specific posture. If the specific posture changes, the directional indicator will also change accordingly.

[0025] Furthermore, the use of terms such as "first" and "second" in this utility model is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. Additionally, the technical solutions of the various embodiments can be combined with each other, but only on the basis of being achievable by those skilled in the art. When the combination of technical solutions is contradictory or impossible to implement, such a combination of technical solutions should be considered non-existent and not within the scope of protection claimed by this utility model.

[0026] like Figures 1 to 3 As shown, in this embodiment, the present invention includes a base 1, on which a sample making station 2, a positioning mechanism 3 and a sliding mechanism 5 are provided. A cutting mechanism 6 is slidably engaged on the sliding mechanism 5. The sample making station 2 is located on the moving path of the cutting mechanism 6. The positioning mechanism 3 is correspondingly arranged with the sample making station 2.

[0027] With respect to the deficiencies of the prior art, in the utility model, when the equipment is operated, the circular silicon wafer is placed on the sample production station 2 and contacts the positioning mechanism 3 to be positioned, further through artificial pressing and crossing the circular silicon wafer with the cutting mechanism 6, further rotating the circular silicon wafer 90 degrees and contacting the positioning mechanism 3, further pressing and crossing the circular silicon wafer with the cutting mechanism 6, the cutting mechanism 6 forms a cross-shaped cutting path on the center position of the circular silicon wafer, and the sample at the center position is broken off, thereby completing the production of the sample, therefore, the utility model can produce the sample meeting the standard size and position, solves the problem that the sample produced manually has large shape and standard size difference and is easy to break and needs to be re-produced, reduces the artificial experience and skill work, reduces the sample production time and difficulty, and the utility model has the advantages of easy operation, improved efficiency and small sample and standard size difference.

[0028] In certain embodiments, the cutting mechanism 6 comprises a mounting plate 7 and a cutting head 8, the cutting head 8 is installed on the mounting plate 7, the mounting plate 7 is slidingly fitted on the sliding mechanism 5; the cutting head 8 is rotationally connected to the mounting plate 7; the bottom of the cutting head 8 has two cutting parts 9, and the two cutting parts 9 are arranged side by side. Specifically, through the arrangement that the cutting head 8 is rotationally connected to the mounting plate 7, the cutting head 8 can be flipped to adjust the cutting angle relative to the mounting plate 7.

[0029] In certain embodiments, the sliding mechanism 5 comprises two guide mechanisms 10, the two guide mechanisms 10 are respectively located on the two sides of the sample production station 2, two sliding blocks 11 are slidingly fitted on the two guide mechanisms 10, and the cutting mechanism 6 is arranged on the two sliding blocks 11; the guide mechanism 10 comprises two guide rod supports 12, and a guide rod 13 is arranged between the two guide rod supports 12. Specifically, by pressing and pushing the cutting mechanism 6, the cutting mechanism 6 can slide on the guide rod 13 through the sliding block 11, so as to cut.

[0030] In certain embodiments, the positioning mechanism 3 comprises a plurality of positioning blocks 15, the positioning blocks 15 are arranged correspondingly with the sample production station 2; the number of the positioning blocks 15 is two.

[0031] In certain embodiments, the sample production station 2 is provided with a sample rotating part; the sample production station 2 is provided with a rotating indication scale. Specifically, the circular silicon wafer is placed on the sample rotating part and rotated through the sample rotating part, and the rotating degree is indicated through the rotating indication scale during rotation.

[0032] The above merely describes preferred embodiments of the present application, and does not limit the patent scope of the present application, and any equivalent structural transformation, direct / indirect application in other related technical fields under the inventive concept of the present application, or the contents of the present application specification and drawings are included in the patent protection scope of the present application.

Claims

1. A single-crystal silicon sample fabrication device, characterized in that: It includes base (1), be provided with sample preparation station (2), positioning mechanism (3) and sliding mechanism (5) on the base (1), the sliding mechanism (5) is slidably matched with cutting mechanism (6), the sample preparation station (2) is located on the moving path of the cutting mechanism (6), the positioning mechanism (3) is correspondingly arranged with the sample preparation station (2).

2. The apparatus according to claim 1, wherein: The cutting mechanism (6) includes mounting plate (7) and cutting head (8), the cutting head (8) is installed on the mounting plate (7), and the mounting plate (7) is slidably matched on the sliding mechanism (5).

3. An apparatus for producing a single crystal silicon wafer according to claim 2, wherein: The cutting head (8) is rotatably connected to the mounting plate (7).

4. The apparatus according to claim 3, wherein: The bottom of the cutting head (8) has two cutting parts (9), and the two cutting parts (9) are arranged side by side.

5. The apparatus according to claim 1, wherein: The sliding mechanism (5) includes two guide mechanisms (10), two guide mechanisms (10) are respectively located on both sides of the sample preparation station (2), and two sliding blocks (11) are slidably matched on two guide mechanisms (10), and the cutting mechanism (6) is arranged on two sliding blocks (11).

6. An apparatus for producing a single crystal silicon wafer according to claim 5, wherein: The guide mechanism (10) includes two guide rod supports (12), and a guide rod (13) is arranged between the two guide rod supports (12).

7. The apparatus according to claim 1, wherein: The positioning mechanism (3) includes a plurality of positioning blocks (15), and the positioning blocks (15) are correspondingly arranged with the sample preparation station (2).

8. An apparatus for producing a single crystal silicon wafer according to claim 7, wherein: The number of the positioning block (15) is two.

9. The apparatus according to claim 1, wherein: The sample preparation station (2) is provided with a sample rotating part.

10. The apparatus for producing a single crystal silicon wafer according to claim 9, wherein: The sample preparation station (2) is provided with a rotating indicating scale.

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