Vacuum welding furnace for chip welding

Abstract

The utility model relates to the technical field of welding furnaces, in particular to a vacuum welding furnace for chip welding. The vacuum welding furnace comprises an upper cavity, a lower cavity, a hollow structure jig, a plurality of upper heating pipes and a plurality of lower heating pipes, the upper cavity is arranged above the lower cavity, the upper cavity and the lower cavity form a sealed vacuum cavity, the upper heating pipe is arranged in the upper cavity, the lower heating pipe is arranged in the lower cavity, and the hollow structure jig is arranged in the vacuum cavity. And the condition of local overheating or non-uniform temperature in the welding process of the vacuum welding furnace is avoided.

Description

TECHNICAL FIELD

[0001] The utility model relates to welding furnace technical field especially relates to a chip welding vacuum welding furnace. BACKGROUND

[0002] The prior art vacuum welding equipment is a professional equipment used for workpiece welding, which mainly comprises a controller, a sealable cavity, a vacuum pumping device, a heating device, a heating plate and a cooling device. The heating plate is located in the sealable cavity, and the workpiece is placed on the heating plate. The heating device and the cooling device are respectively below the heating plate and are respectively connected with the controller. Under the control of the controller, the heating plate is heated or cooled. The vacuum pumping device is arranged outside the sealable cavity, and performs vacuum pumping treatment on the sealable cavity to ensure that the welding process is carried out in an oxygen-free state, ensure the welding quality, and reduce the internal porosity of the welding part and improve the reliability of the welding part.

[0003] The prior art vacuum welding furnace has the problems of local overheating or uneven temperature during the welding process. SUMMARY

[0004] The utility model provides a chip welding vacuum welding furnace to solve the problem of local overheating or uneven temperature during the welding process of the prior art vacuum welding furnace.

[0005] A chip welding vacuum welding furnace comprises an upper cavity, a lower cavity, a hollow structure jig, a plurality of upper heating pipes and a plurality of lower heating pipes. The upper cavity is arranged above the lower cavity, the upper cavity and the lower cavity form a sealed vacuum cavity, the upper heating pipes are arranged in the upper cavity, the lower heating pipes are arranged in the lower cavity, and the hollow structure jig is arranged in the vacuum cavity.

[0006] According to the chip welding vacuum welding furnace, the hollow structure jig comprises a jig frame and a plurality of supporting legs, the jig frame is of a hollow structure, and the supporting legs are arranged on the two sides of the inside of the jig frame.

[0007] According to the chip welding vacuum welding furnace, the workpiece assembly is arranged on the supporting legs, and the workpiece assembly comprises a workpiece frame and a workpiece, and the workpiece is arranged on the workpiece frame.

[0008] According to the chip welding vacuum welding furnace, a quartz glass heating plate is arranged below the hollow structure jig.

[0009] The chip welding vacuum welding furnace of the utility model, the first cooling pipe and the second cooling pipe are arranged below the hollow structure jig, the first cooling pipe and the second cooling pipe are arranged in the lower cavity frame, and the first cooling pipe and the second cooling pipe are arranged above the lower heating pipe.

[0010] The chip welding vacuum welding furnace of the utility model, the bottom inside of the lower cavity frame is provided with a water cooling pipeline.

[0011] The chip welding vacuum welding furnace of the utility model, the upper cavity further comprises an upper cavity frame and an observation window, the observation window is arranged in the middle of the upper cavity frame, and a water cooling pipeline is arranged in the top inside of the upper cavity frame.

[0012] The chip welding vacuum welding furnace of the utility model further comprises a supporting structure, the lower cavity is arranged above the supporting structure, and a plurality of rollers are arranged below the supporting structure.

[0013] The chip welding vacuum welding furnace of the utility model, the lower cavity is provided with a vacuumizing interface below.

[0014] The chip welding vacuum welding furnace of the utility model, the upper heating pipe and the lower heating pipe are vertically arranged, and the upper heating pipe and the lower heating pipe are infrared radiation heating sleeve pipes.

[0015] The plurality of workpiece assemblies of the utility model are arranged on the hollow structure jig, heating and cooling are all in one cavity, cost is low, the hollow structure makes heat evenly reach each part of the workpiece, and local overheating or uneven temperature is avoided. BRIEF DESCRIPTION OF DRAWINGS

[0016] In order to more clearly illustrate the technical scheme in the embodiments of the utility model or the prior art, the drawings needed to be used in the embodiment or the prior art description will be briefly introduced as follows.

[0017] Figure 1 It is a perspective view structural schematic diagram of the chip welding vacuum welding furnace;

[0018] Figure 2 It is a perspective view structural schematic diagram of the lower cavity;

[0019] Figure 3 is a structure diagram of an enlarged view of a part A;

[0020] Figure 4 is a structure diagram of a perspective view of a hollow structure;

[0021] Figure 5 is a structure diagram of a top view of a hollow structure;

[0022] Figure 6 is a structure diagram of a perspective view of a workpiece;

[0023] Figure 7 is a structure diagram of a perspective view of an upper cavity;

[0024] The drawings show that: 1, upper cavity; 2, lower cavity; 3, support structure; 4, roller; 5, alarm lamp; 6, gas spring; 7, hollow structure jig; 8, workpiece assembly; 11, upper cavity frame; 12, upper heating pipe; 13, observation window; 21, lower cavity frame; 22, temperature sensor support; 23, nitrogen pipe support; 24, lower heating pipe; 25, first cooling pipe; 26, second cooling pipe; 71, jig frame; 72, support leg; 81, workpiece frame; 82, workpiece. DETAILED DESCRIPTION

[0025] The embodiments of the present application will be further described in detail below with reference to the drawings and examples. The following examples are used to illustrate the present application, but cannot be used to limit the scope of the present application.

[0026] In the description of the embodiments of the present application, it should be explained that the orientation or position relationship indicated by the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like is based on the orientation or position relationship shown in the drawings, and is only for the convenience of describing the embodiments of the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements indicated must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the embodiments of the present application. In addition, the terms "first", "second", "third" are only for the purpose of description, and cannot be understood as indicating or implying relative importance.

[0027] In the description of the embodiments of the present application, it should be explained that, unless otherwise explicitly specified and limited, the terms "connected", "connected" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium. For those skilled in the art, the specific meaning of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0028] In the embodiments of the present application, unless otherwise explicitly specified and limited, the first feature is "on" or "under" the second feature, which can be that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature can be "above", "over" and "on" the second feature, which can be that the first feature is directly above or obliquely above the second feature, or only means that the horizontal height of the first feature is higher than that of the second feature. The first feature can be "under", "below" and "underneath" the second feature, which can be that the first feature is directly below or obliquely below the second feature, or only means that the horizontal height of the first feature is less than that of the second feature.

[0029] In the description of the present application, the description of the terms "one embodiment", "some embodiments", "an example", "a specific example" or "some examples" means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present application, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, the skilled in the art can combine and combine the different embodiments or examples described in the present application and the features of the different embodiments or examples without contradiction.

[0030] The following will be described in detail Figures 1-7 A chip welding vacuum welding furnace is described in the embodiments of the present application, which comprises an upper cavity 1, a lower cavity 2, a hollow structure jig 7, a plurality of upper heating pipes 12 and a plurality of lower heating pipes 24. The upper cavity 1 is arranged above the lower cavity 2, and the upper cavity 1 and the lower cavity 2 form a sealed vacuum cavity. The upper heating pipe 12 is arranged in the upper cavity 1, the lower heating pipe 24 is arranged in the lower cavity 2, and the hollow structure jig 7 is arranged in the vacuum cavity. A temperature sensor bracket 22 is arranged above the hollow structure jig 7, and the temperature sensor bracket 22 is movable and used for placing a temperature sensor. A gas spring 6 is arranged on the side of the vacuum cavity. An alarm lamp 5 is arranged on the side of the vacuum cavity.

[0031] In some embodiments, the hollow structure jig 7 comprises a jig frame 71 and a plurality of supporting legs 72; the jig frame 71 is a hollow structure, and the supporting legs 72 are arranged on both sides of the inside of the jig frame 71.

[0032] In some embodiments, a workpiece assembly 8 is further included, and the workpiece assembly 8 is arranged on the supporting leg 72; the workpiece assembly 8 comprises a workpiece frame 81 and a workpiece 82, and a plurality of workpieces 82 are arranged on the workpiece frame 81. This embodiment is the first embodiment of the hollow structure jig 7.

[0033] In some embodiments, a quartz glass heating plate is arranged below the hollow structure jig 7. The hollow structure jig 7 and the quartz glass heating plate are the second embodiment.

[0034] In some embodiments, an inner container is further arranged in the vacuum cavity, and the upper heating pipe 12 and the lower heating pipe 24 are arranged in the inner container. The inner container is preferably a mirror surface to improve the heat reflection effect.

[0035] In some embodiments, the lower cavity 2 comprises a lower cavity frame 21, a first cooling pipe 25 and a second cooling pipe 26. The first cooling pipe 25 and the second cooling pipe 26 are arranged below the hollow structure jig 7 and staggered. The lower cavity 2 is water-in at one end and water-out at the other end. The first cooling pipe 25 and the second cooling pipe 26 are arranged in the lower cavity frame 21 and above the lower heating pipe 24.

[0036] In some embodiments, a water cooling pipe is arranged inside the bottom of the lower cavity frame 21.

[0037] In some embodiments, the upper cavity 1 further comprises an upper cavity frame 11 and an observation window 13. The observation window 13 is arranged in the middle of the upper cavity frame 11. A water cooling pipe is arranged inside the top of the upper cavity frame 11.

[0038] In some embodiments, a support structure 3 is further arranged, and the lower cavity 2 is arranged above the support structure 3. A plurality of rollers 4 are arranged below the support structure 3.

[0039] In some embodiments, a vacuum interface is arranged below the lower cavity 2.

[0040] In some embodiments, the upper heating pipe 12 and the lower heating pipe 24 are arranged vertically and are infrared radiation heating sleeves.

[0041] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit them. Although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacements to some technical features. These modifications or replacements do not make the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A chip soldering vacuum soldering furnace, characterized by, Including upper cavity, lower cavity, hollow structure fixture, a plurality of upper heating pipe and a plurality of lower heating pipe;The upper cavity is arranged above the lower cavity, the upper cavity and the lower cavity form a sealed vacuum cavity, the upper heating pipe is arranged in the upper cavity, the lower heating pipe is arranged in the lower cavity, the hollow structure fixture is arranged in the vacuum cavity.

2. The chip bonding vacuum bonding furnace according to claim 1, characterized by The hollow structure fixture includes a jig frame and a plurality of support legs;The jig frame is a hollow structure, and the support legs are arranged on both sides of the inside of the jig frame.

3. The chip bonding vacuum bonding furnace according to claim 2, characterized by It also includes a workpiece assembly, which is arranged on the support leg;The workpiece assembly includes a workpiece frame and a workpiece, and the workpiece is arranged on the workpiece frame.

4. The chip bonding vacuum bonding furnace according to claim 1, characterized by It includes a quartz glass heating plate, which is arranged below the hollow structure fixture.

5. The chip bonding vacuum bonding furnace according to claim 1, characterized by The lower cavity includes a lower cavity frame, a first cooling pipe and a second cooling pipe;The first cooling pipe and the second cooling pipe are arranged below the hollow structure fixture, and the first cooling pipe and the second cooling pipe are arranged in the lower cavity frame, and the first cooling pipe and the second cooling pipe are arranged above the lower heating pipe.

6. The chip bonding vacuum bonding furnace according to claim 5, characterized by The bottom inside of the lower cavity frame is provided with a water cooling pipeline.

7. The chip soldering vacuum welding furnace according to claim 1, wherein, The upper cavity further includes an upper cavity frame and an observation window;The observation window is arranged in the middle of the upper cavity frame, and a water cooling pipeline is arranged in the top inside of the upper cavity frame.

8. The chip bonding vacuum bonding furnace according to claim 1, characterized by It also includes a support structure, and the lower cavity is arranged above the support structure, and a plurality of rollers are arranged below the support structure.

9. The chip bonding vacuum bonding furnace according to claim 4, characterized by A vacuum extraction interface is arranged below the lower cavity.

10. The chip bonding vacuum bonding furnace according to claim 1, characterized by The upper heating pipe and the lower heating pipe are arranged vertically, and the upper heating pipe and the lower heating pipe are infrared radiation heating sleeves.

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