Film coating device for cleaning silicon wafer

Abstract

The utility model belongs to the technical field of solar silicon wafer manufacturing, and particularly relates to a film coating device for cleaning silicon wafers, which comprises a vacuum film coating box, a sliding pushing structure and a jacking structure are arranged in the vacuum film coating box, a steam splitter plate is mounted on the top side of the inner wall of the vacuum film coating box, a feeding pipe is connected onto the steam splitter plate, and a discharging pipe is connected onto the feeding pipe. An exhaust pipe is connected to the vacuum coating box, the two supporting frames can be driven to slide outwards by pulling the handle, and silicon wafers are placed on the supporting frames dragged to the outer portion of the vacuum coating box, so that it is guaranteed that the bearing view is clear, placement is stable, accurate pushing can be achieved, the silicon wafer placement and feeding process is stable, and the operation view is clear; by arranging the jacking structure, lifting is carried out through the lifting rod, the lifting rod and the insulation pad are located at the bottom of the silicon wafer, ion interference can be reduced, meanwhile, the insulation pad cannot be contaminated with a film coating object, pollution to the insulation pad can be guaranteed, and subsequent repeated use is facilitated.

Description

TECHNICAL FIELD

[0001] The utility model belongs to solar silicon wafer manufacturing technical field, specifically a kind of film plating device of clean silicon wafer. BACKGROUND

[0002] Silicon wafer film plating is an important process in semiconductor manufacturing and photovoltaic industry, it is deposited on the surface of silicon wafer one or more thin films to improve the performance of silicon wafer or give it new functions;

[0003] Among them, evaporation film plating is heated film source material in vacuum environment, makes it sublimate and deposit on the surface of silicon wafer;

[0004] In the prior art, the evaporation film plating device with publication number CN 101876056 B includes a wire winding mechanism, a wire feeding mechanism, an evaporation source mechanism and a baffle assembly arranged in a vacuum cavity. The evaporation source mechanism includes an electrode, a film thickness sensor and an evaporator fixed on the electrode. During the evaporation process, the film thickness sensor detects the film thickness deposited thereon in a timely manner. The system can obtain the film thickness deposited on the workpiece according to the detected film thickness and a certain conversion formula, so as to control the film thickness deposited on the workpiece by deposition efficiency or deposition time, to make the film thickness on the workpiece accurate, and thus to improve the quality of the film layer. The evaporation wire is wound on the wire winding mechanism according to actual needs. The evaporation wire is smoothly and uniformly fed to the evaporator by the wire feeding mechanism, which prolongs the replacement period of the evaporation wire and does not damage the vacuum environment in the vacuum cavity due to replacement of the evaporation wire, thereby improving the quality of the film layer formed by evaporation film plating. The evaporation film plating device has high automation degree.

[0005] The existing film plating device needs to stably deliver the silicon wafer into the vacuum box, and the delivery and placement process is not easy to operate. Since the silicon wafer is a fragile object, it is easy to cause damage to the silicon wafer. In addition, during the film plating process, the position of the silicon wafer cannot be adjusted to adjust the thickness and uniformity of the film plating, which affects the film plating effect. Therefore, a film plating device for cleaning silicon wafer is proposed to solve the above problems. UTILITY MODEL CONTENTS

[0006] In order to make up for the shortcomings of the prior art, the existing equipment stably delivers the silicon wafer into the vacuum box, and the delivery and placement process is not easy to operate. Since the silicon wafer is a fragile object, it is easy to cause damage to the silicon wafer. In addition, during the film plating process, the position of the silicon wafer cannot be adjusted to adjust the thickness and uniformity of the film plating, which affects the film plating effect. Therefore, a film plating device for cleaning silicon wafer is proposed to solve the above problems. The sliding pushing structure and the jacking structure can realize stable delivery and lifting of the silicon wafer, and better facilitate film plating operation.

[0007] The utility model discloses a technical scheme that solves its technical problem is a kind of coating device for cleaning silicon wafer, including vacuum coating box, the inside of vacuum coating box is provided with sliding push structure and jacking structure, the inner wall top side of vacuum coating box is installed with vapor splitter, vapor splitter is connected with feed pipe, vacuum coating box is connected with exhaust pipe, exhaust pipe is connected with the vacuum pump of outside;

[0008] Sealing box door, the port of vacuum coating box is hinged with sealing box door;

[0009] Second slide rail, the sliding push structure includes second slide rail, two second slide rails are arranged in parallel on the bottom tank wall of vacuum coating box, sliding block is slidably installed on the second slide rail, connecting rod is connected between two sliding blocks;

[0010] Support frame, the top of sliding block is fixed with support rod, the top of support rod is provided with sliding slot, first slide rail is slidably arranged in sliding slot, support frame is installed on the first slide rail, handle is connected between two support frames, and silicon wafer is arranged between two support frames;

[0011] Support plate, the jacking structure includes support plate, servo motor is arranged on the support plate, bidirectional screw rod is rotatably installed between two servo motors, the outside of servo motor is provided with mounting bracket, and the output shaft of mounting bracket is connected with one end of bidirectional screw rod.

[0012] The top side of support plate is provided with third slide rail, the third slide rail is located between two bidirectional screw rods, support push plate is slidably installed on the third slide rail, screw holes are respectively formed in the inside of support push plate, the bidirectional screw rod is two-section structure, and the thread directions of two sections are opposite, and the thread directions of two support push plates on the bidirectional screw rods are opposite.

[0013] Preferably, the top side of support plate and the outer surface of lifting rod are respectively provided with connecting seat, the connecting seat on support plate is connected with movable plug rod, movable sleeve is installed on the connecting seat of the top side of support plate, and the bottom end of movable plug rod is movably inserted into the inside of movable sleeve.

[0014] Preferably, the middle outer surface of lifting rod and the top side of third slide rail are respectively provided with fixed seat, and the two fixed seats are connected with push plate, so that the lifting rod can be lifted under the cooperation of push plate.

[0015] Preferably, the top side of support plate is fixed with side stand, sliding hole is formed in the inside of side stand, screw rod is slidably arranged in sliding hole, nut is rotatably installed on the screw rod, and the end of screw rod is located on one side of support push plate, so that the limiting operation of support push plate can be realized.

[0016] Preferably, the two support frames are provided with openings, and the two side edges of the silicon wafer are arranged on the openings of the support frames, so that the silicon wafer can be better supported.

[0017] The utility model discloses the beneficial effect lies in:

[0018] The evaporated coating material is conveyed to the steam distribution plate through the feeding pipe, is sprayed out through the steam distribution plate, realizes the coating operation of the silicon wafer, when the silicon wafer is put, can drive two support frames to slide outwards by pulling handle, and the silicon wafer is placed on the support frame that is dragged to the outside of the vacuum coating box, guarantees that the bearing field of vision is clear, and the stable placement can be accurately pushed, can guarantee the stable placement feeding process of the silicon wafer, and guarantees the clear operation field of vision.

[0019] When the support push plate moves to the fixed position of the screw rod, the end of the screw rod blocks the movement of the support push plate, guarantees that the lifting height of the two lifting rods is same, guarantees that the evaporation deposition interval of the silicon wafer is equal, better guarantees the coating quality, and lifting is carried out through the lifting rod, and the lifting rod and the insulating pad are located at the bottom of the silicon wafer, can reduce ion interference, and the coating material cannot be attached on the insulating pad, so that the pollution of the insulating pad can be guaranteed, and subsequent reuse is facilitated. BRIEF DESCRIPTION OF DRAWINGS

[0020] In order to more clearly illustrate the technical scheme in the embodiments of the utility model or the prior art, the following will briefly introduce the drawings needed to be used in the embodiment or the prior art description, and obviously, the drawings in the following description are only some embodiments of the utility model, and for those skilled in the art, other drawings can be obtained according to these drawings without paying creative labor.

[0021] Figure 1 It is the first three-dimensional structure schematic diagram of whole;

[0022] Figure 2 It is the second three-dimensional structure schematic diagram of whole;

[0023] Figure 3 It is the sliding push structure schematic diagram;

[0024] Figure 4 It is the sliding push structure and the position structure schematic diagram of jacking structure;

[0025] Figure 5 It is the jacking structure schematic diagram;

[0026] As shown in FIG. 1, a vacuum coating box 1, an inlet pipe 2, an exhaust pipe 3, a sealing box door 4, a handle 5, a silicon wafer 6, a support frame 7, a steam distribution plate 8, a first sliding rail 9, a connecting rod 10, a sliding block 11, a support rod 12, a second sliding rail 13, an insulating pad 14, a lifting rod 15, a support plate 16, a bidirectional screw rod 17, a third sliding rail 18, a movable plug rod 19, a movable sleeve 20, a side stand 21, a screw rod 22, a sliding hole 23, a push plate 24, a nut 25, a mounting frame 27, a servo motor 27, and a support push plate 28. DETAILED DESCRIPTION

[0027] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0028] Please refer to Figures 1-5 As shown in FIG. 1, a vacuum coating box 1, an inlet pipe 2, an exhaust pipe 3, a sealing box door 4, a handle 5, a silicon wafer 6, a support frame 7, a steam distribution plate 8, a first sliding rail 9, a connecting rod 10, a sliding block 11, a support rod 12, a second sliding rail 13, an insulating pad 14, a lifting rod 15, a support plate 16, a bidirectional screw rod 17, a third sliding rail 18, a movable plug rod 19, a movable sleeve 20, a side stand 21, a screw rod 22, a sliding hole 23, a push plate 24, a nut 25, a mounting frame 27, a servo motor 27, and a support push plate 28.

[0029] A sealing box door 4 is hingedly installed at the port of the vacuum coating box 1.

[0030] A second sliding rail 13, the sliding push structure includes a second sliding rail 13, two second sliding rails 13 are arranged side by side on the bottom wall of the vacuum coating box 1, a sliding block 11 is slidingly installed on the second sliding rail 13, and a connecting rod 10 is connected between the two sliding blocks 11.

[0031] Support frame 7, the top of the sliding block 11 is fixed with support rod 12, the top of the support rod 12 is provided with a sliding groove, the first sliding rail 9 is slidably arranged in the sliding groove, the support frame 7 is installed on the first sliding rail 9, the handle 5 is connected between the two support frames 7, the silicon wafer 6 is arranged between the two support frames 7, the two support frames 7 are provided with an opening, the two sides of the silicon wafer 6 are arranged on the opening of the support frame 7, when coating, the film source material is heated in a vacuum environment to sublimate and deposit on the surface of the silicon wafer, the evaporated coating material is transported to the vapor distribution plate 8 through the feed pipe 2, and the coating operation of the silicon wafer is realized by the vapor distribution plate 8. When the silicon wafer is put in, the handle 5 can drive the two support frames 7 to slide outward, and the support frame 7 can realize one-level sliding on the support rod 12 under the cooperation of the first sliding rail 9. When the support rod 12 is located at the tail end of the first sliding rail 9, continue to pull, the sliding block 11 can move along the second sliding rail 13, the support frame 7 can be pulled out, the silicon wafer 6 is placed on the support frame 7 pulled out of the vacuum coating box 1, the bearing field of view is clear, stable, and can be accurately pushed;

[0032] After the silicon wafer 6 is placed on the support frame 7, the silicon wafer can be stably pushed into the cavity of the vacuum coating box 1, the silicon wafer 6 can be stably placed and fed, and the operation field of view is clear;

[0033] Support plate 16, the lifting structure comprises a support plate 16, the support plate 16 is provided with a servo motor 27, two servo motors 27 are rotatably installed between the two-way screw rod 17, wherein the outer side of the servo motor 27 is provided with a mounting bracket 26, and the output shaft of the mounting bracket 26 is connected with one end of the two-way screw rod 17.

[0034] The top side of the support plate 16 is provided with a third sliding rail 18, the third sliding rail 18 is located between the two two-way screw rods 17, the support plate 28 is slidably installed on the third sliding rail 18, the support plate 28 is respectively provided with a screw hole in the inside, the two-way screw rod 17 is a two-section structure, and the thread directions of the two sections are opposite, and the two support plates 28 are respectively located on the two-way screw rods 17 with opposite thread directions.

[0035] The top side of the support plate 16 and the outer surface of the lifting rod 15 are respectively provided with connecting seats, wherein the connecting seat on the support plate 16 is connected with a movable plug rod 19, the connecting seat on the top side of the support plate 16 is provided with a movable sleeve 20, and the bottom end of the movable plug rod 19 is movably inserted into the movable sleeve 20.

[0036] The middle outer surface of the lifting rod 15 and the top side of the third sliding rail 18 are respectively provided with fixed seats, and the two fixed seats are connected with a push plate 24.

[0037] The top side of the support plate 16 is fixed with a side stand 21, a sliding hole 23 is formed in the side stand 21, a screw rod 22 is slidably arranged in the sliding hole 23, a nut 25 is rotatably arranged on the screw rod 22, and the end of the screw rod 22 is located on one side of a support push plate 28;

[0038] When the silicon wafer 6 is evaporated and plated, in order to ensure that the evaporated and plated material can be uniformly deposited on the top side of the silicon wafer 6, the silicon wafer 6 is pushed into the vacuum plating box 1 under the cooperation of the sliding push structure, the screw rod 22 is loosened, the screw rod 22 is slid along the sliding hole 23, and the screw rod 22 can be adjusted to a suitable position;

[0039] Under the cooperation of the mounting frame 26, the bidirectional screw rod 17 can be rotated, the support push plate 28 can be slid along the third sliding rail 18 during the rotation of the bidirectional screw rod 17, the lifting rod 15 can be lifted under the cooperation of the toggle plate 24 when the support push plate 28 moves, the silicon wafer 6 placed on the support frame 7 can be lifted and held up under the cooperation of the insulating pad 14, the lifting height of the two lifting rods 15 is ensured to be the same when the support push plate 28 moves to the fixed position of the screw rod 22, the end of the screw rod 22 blocks the movement of the support push plate 28, the evaporation and deposition distance of the silicon wafer 6 is ensured to be equal, the film quality is better ensured, the lifting rod 15 and the insulating pad 14 are located at the bottom of the silicon wafer 6, ion interference is reduced, the insulating pad 14 is not contaminated by the plated material, and the pollution of the insulating pad 14 is ensured, so that the insulating pad 14 can be reused subsequently.

[0040] The working principle is that when evaporated and plated, the film source material is heated in a vacuum environment to sublimate and deposit on the surface of the silicon wafer, the evaporated and plated material is transported to the vapor distribution plate 8 through the feeding pipe 2, is distributed and sprayed out through the vapor distribution plate 8, and the plating operation on the silicon wafer is realized, when the silicon wafer is put in, the handle 5 is pulled to slide the two support frames 7 outward, the support frame 7 is slid above the support rod 12 in cooperation with the first sliding rail 9, the support frame 7 is pulled out by pulling the sliding block 11 to move along the second sliding rail 13 when the support rod 12 is located at the tail end of the first sliding rail 9, the silicon wafer 6 is placed on the support frame 7 pulled out of the vacuum plating box 1, the bearing field of view is clear, the placement is stable, and the silicon wafer 6 can be accurately pushed;

[0041] After the silicon wafer 6 is placed on the support frame 7, the silicon wafer 6 can be stably pushed into the cavity of the vacuum plating box 1, the placement and feeding process of the silicon wafer 6 is stable, and the operation field of view is clear;

[0042] In the evaporation plating of the silicon wafer 6, in order to ensure that the evaporation plating material can be uniformly deposited on the top side of the silicon wafer 6, the silicon wafer 6 is pushed into the vacuum plating box 1 under the cooperation of the sliding pushing structure, and the screw rod 22 can be slid along the sliding hole 23 by loosening the screw rod 22, so that the screw rod 22 can be adjusted to a suitable position;

[0043] Under the cooperation of the mounting frame 26, the bidirectional screw rod 17 can be rotated, and the supporting push plate 28 can be slid along the third sliding rail 18 during the rotation of the bidirectional screw rod 17. When the supporting push plate 28 moves, the lifting rod 15 can be lifted under the cooperation of the actuating plate 24. Under the cooperation of the insulating pad 14, the silicon wafer 6 placed on the supporting frame 7 can be lifted. When the supporting push plate 28 moves to the fixed position of the screw rod 22, the end of the screw rod 22 blocks the movement of the supporting push plate 28, so that the lifting height of the two lifting rods 15 is the same, the evaporation deposition distance of the silicon wafer 6 is equal, and the film quality is better guaranteed. At the same time, the lifting rod 15 and the insulating pad 14 are located at the bottom of the silicon wafer 6, so that the ion interference is reduced, and the insulating pad 14 is not contaminated by the plating material, so that the pollution of the insulating pad 14 is guaranteed, and the subsequent reuse is facilitated.

[0044] In the description of the present specification, the description of the terms "one embodiment", "example", "specific example" and the like means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In the present specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0045] The basic principles, main features and advantages of the present application are shown and described above. It should be understood by those skilled in the art that the present application is not limited by the above embodiments, and the above embodiments and descriptions in the specification are only to illustrate the principles of the present application. Without departing from the spirit and scope of the present application, various changes and improvements can be made to the present application, and these changes and improvements all fall within the scope of the claimed present application.

Claims

1. A coating apparatus for cleaning silicon wafers, characterized in that: Include: Vacuum coating box (1), the inside of the vacuum coating box (1) is provided with sliding push structure and jacking structure, the inner wall top side of the vacuum coating box (1) is installed with vapor distribution plate (8), the vapor distribution plate (8) is connected with feed pipe (2), the vacuum coating box (1) is connected with exhaust pipe (3), the exhaust pipe (3) is connected with the vacuum pump outside; Sealing box door (4), the port of the vacuum coating box (1) is hinged with sealing box door (4); Second sliding rail (13), the sliding push structure includes second sliding rail (13), two second sliding rails (13) are arranged side by side on the bottom tank wall of the vacuum coating box (1), the sliding block (11) is slidably installed on the second sliding rail (13), and the connecting rod (10) is connected between the two sliding blocks (11); Support frame (7), the top of the sliding block (11) is fixed with support rod (12), the top of the support rod (12) is provided with a sliding groove, the first sliding rail (9) is slidably arranged in the sliding groove, the support frame (7) is installed on the first sliding rail (9), the handle (5) is connected between the two support frames (7), and the silicon wafer (6) is arranged between the two support frames (7); Support plate (16), the jacking structure includes support plate (16), the support plate (16) is provided with servo motor (27), the two servo motors (27) are rotatably installed with bidirectional screw rod (17), wherein the outer side of the servo motor (27) is installed with mounting bracket (26), and the output shaft of the mounting bracket (26) is connected with one end of the bidirectional screw rod (17).

2. The apparatus for cleaning a silicon wafer according to claim 1, wherein: The top side of the support plate (16) is provided with third sliding rail (18), the third sliding rail (18) is located between the two bidirectional screw rods (17), the support push plate (28) is slidably installed on the third sliding rail (18), the support push plate (28) is respectively provided with screw holes in the inner portion, the bidirectional screw rod (17) is two-section structure, and the thread directions of the two sections are opposite, and the two support push plates (28) are respectively located on the bidirectional screw rods (17) with opposite thread directions.

3. The apparatus of claim 1, wherein: the first and second rollers are spaced apart by a distance of about 0.5 to 2 inches. The top side of the support plate (16) and the outer surface of the lifting rod (15) are respectively provided with connecting seats, wherein the connecting seat on the support plate (16) is connected with movable insertion rod (19), the connecting seat on the top side of the support plate (16) is installed with movable sleeve (20), and the bottom end of the movable insertion rod (19) is movably inserted into the inside of the movable sleeve (20).

4. The apparatus of claim 3, wherein: The middle outer surface of the lifting rod (15) and the top side of the third sliding rail (18) are respectively installed with fixed seats, and the two fixed seats are connected with the push plate (24).

5. The apparatus of claim 1, wherein: the substrate is a silicon wafer. The top side of the support plate (16) is fixed with side stand (21), the side stand (21) is provided with sliding hole (23) in the inner portion, the screw rod (22) is slidably arranged in the sliding hole (23), the nut (25) is rotatably installed on the screw rod (22), and the end portion of the screw rod (22) is located on one side of the support push plate (28).

6. The apparatus of claim 1, wherein: Two support frames (7) are provided with openings, and the two side edges of the silicon wafer (6) are arranged on the openings on the support frames (7).

Images