Diamond single crystal wafer polishing device

Abstract

The utility model discloses a diamond single crystal wafer polishing device, and belongs to the technical field of diamond polishing. A diamond single crystal wafer polishing device comprises a workbench, a polishing mechanism and a limiting mechanism are arranged on the workbench, the limiting mechanism and the workbench are connected through a lifting mechanism, the limiting mechanism comprises a limiting disc, limiting blocks, a pressing block and a pressure mechanism, a plurality of holes are formed in the limiting disc, the limiting blocks are connected in the holes in a clamped mode, and the pressing block is connected with the limiting disc in a clamped mode. A limiting groove is formed in the limiting block; according to the single crystal wafer polishing device, the limiting grooves are formed in the limiting blocks and can be used for limiting the single crystal wafers in the horizontal direction, the limiting blocks are connected with the limiting disc in a clamped mode, the limiting blocks with the limiting grooves of different sizes and shapes can be replaced conveniently, and therefore polishing operation can be conducted on the single crystal wafers of different sizes and shapes at the same time; therefore, the problem that in the prior art, multiple specifications of diamond single crystal wafers cannot be machined at the same time during polishing is solved.

Description

TECHNICAL FIELD

[0001] The utility model relates to diamond polishing technical field especially relates to a kind of diamond single wafer polishing device. BACKGROUND

[0002] Diamond single wafer is a kind of wafer made of single crystal diamond material.Diamond is the allotrope of carbon,with extremely high hardness,thermal conductivity and wear resistance.The processing process mainly includes single crystal slicing,grinding,finishing film,etc.The surface polishing of diamond single wafer is the key process in processing.

[0003] In the prior art, polishing machine is generally used for polishing diamond single wafer, and the operation steps are usually as follows: the product to be polished is placed in the limiting groove of the limiting disc, the surface to be polished is contacted with the polishing wheel, and then the single wafer is subjected to appropriate pressure by the pressure mechanism, and the polishing operation is carried out by rotating the polishing wheel. However, the limiting groove of the limiting disc in the prior art is fixed and single in shape, and different shapes and sizes of products cannot be processed simultaneously, so it needs to be improved. UTILITY MODEL CONTENT

[0004] The utility model aims at solving the problem that diamond single wafer cannot be processed simultaneously in the prior art, and provides a kind of diamond single wafer polishing device.

[0005] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme:

[0006] A kind of diamond single wafer polishing device, including workbench, the workbench is provided with polishing mechanism and limiting mechanism, the limiting mechanism and workbench are connected by lifting mechanism, the limiting mechanism includes limiting disc, limiting block, pressing block and pressure mechanism, a plurality of holes are formed in the limiting disc, each hole is clamped with limiting block, limiting groove is formed in the limiting block, the shape of the pressing block is matched with the limiting groove, and the pressing block is detachably connected with the pressure mechanism.

[0007] Preferably, the lifting mechanism includes a second telescopic rod, the second telescopic rod is fixedly arranged on the workbench, and the telescopic end of the second telescopic rod is fixedly provided with a mounting beam.

[0008] Preferably, the limiting disc and the bottom surface of the mounting beam are detachably connected by a connecting piece.

[0009] Preferably, the pressure mechanism includes a first telescopic rod, the first telescopic rod is fixedly arranged on the bottom surface of the mounting beam, the top surface of the pressing block is fixedly provided with a connecting barrel, the telescopic end surface of the first telescopic rod is fixedly provided with a magnet, and the first telescopic rod and the connecting barrel are detachably connected by the magnet.

[0010] Preferably, the connecting piece comprises a connecting column, the top end of the connecting column is fixedly connected with the mounting beam, the top surface of the limiting disc is fixedly provided with a fixed cylinder, and the connecting column and the fixed cylinder are detachably connected through bolts.

[0011] Preferably, the polishing mechanism comprises a polishing wheel, the polishing wheel is rotationally arranged on the workbench and below the limiting disc, and the polishing wheel is driven to rotate by a motor.

[0012] Preferably, the workbench is further provided with a spray pipe, and a spray opening of the spray pipe faces the polishing wheel.

[0013] Preferably, the number of the pressing blocks corresponds to the number of the limiting blocks, and the number of the first telescopic rods corresponds to the number of the pressing blocks.

[0014] Preferably, the bottom surface of the mounting beam is fixedly provided with a protective cover, and the protective cover covers the upper part of the limiting mechanism.

[0015] Compared with the prior art, the diamond single crystal wafer polishing device has the following beneficial effects.

[0016] 1、The limiting groove arranged on the limiting block can be used for horizontal limiting of the single crystal wafer, the limiting block is clamped with the limiting disc, different sizes and shapes of the limiting blocks of the limiting groove can be conveniently replaced, so that polishing operation can be simultaneously performed on multiple single crystal wafers of different sizes and shapes, and the problem that multiple specifications of diamond single crystal wafers cannot be simultaneously machined in polishing in the prior art is solved.

[0017] 2、The pressure mechanism arranged can be used for applying a certain force to the single crystal wafer, so that the single crystal wafer can be in contact with the polishing wheel of the polishing mechanism for polishing.

[0018] Other advantages, objects and features of the present application will be described in the subsequent description; and to some extent, it will be obvious to those skilled in the art based on the study of the following; or can be taught from the practice of the present application. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 It is a whole structure schematic view of the present application.

[0020] Figure 2 It is a partial structure schematic view of the present application.

[0021] Figure 3 It is a structure schematic view of the limiting mechanism and the mounting beam in the present application.

[0022] Figure 4The structure schematic diagram of the limiting mechanism and the mounting beam is split and installed.

[0023] In the drawings:

[0024] 1, workbench; 2, polishing wheel; 3, limiting disc; 4, limiting block; 5, connecting cylinder; 6, connecting column; 7, first telescopic rod; 8, protective cover; 9, mounting beam; 10, second telescopic rod; 11, spray pipe; 12, pressing block; 13, limiting groove; 14, bolt; 15, fixed cylinder. DETAILED DESCRIPTION

[0025] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments.

[0026] Referring to Figures 1-4 A diamond single crystal wafer polishing device, including workbench 1, workbench 1 is provided with polishing mechanism and limiting mechanism, limiting mechanism and workbench 1 are connected through lifting mechanism, limiting mechanism includes limiting disc 3, limiting block 4, pressing block 12 and pressure mechanism, limiting disc 3 is provided with a plurality of holes, each hole is clamped with limiting block 4, limiting groove 13 is formed in limiting block 4, the shape of pressing block 12 is matched with limiting groove 13, and pressing block 12 is detachably connected with pressure mechanism.

[0027] In the specific embodiments of the utility model, six holes are formed in limiting disc 3, and six limiting blocks 4 can be placed in the holes, the limiting grooves 13 in the six limiting blocks 4 can be different in shape and size, that is, the limiting blocks 4 corresponding to the shape of the diamond single crystal wafer to be polished are clamped on limiting disc 3 when in use, so that batch polishing of single crystal wafers of different sizes and shapes can be realized, and the same limiting blocks 4 can be selected to perform polishing work on single crystal wafers of the same specification in batches, limiting block 4 and pressing block 12 are used in a complete set, that is, the shape of limiting groove 13 in limiting block 4 is what the shape of pressing block 12 is, and the function of pressing block 12 is to be able to extend into limiting groove 13 and exert a certain force on the diamond single crystal wafer under the action of pressure mechanism, so that the polishing surface of the diamond single crystal wafer is in contact with the polishing part of the polishing mechanism. The lifting mechanism can drive the limiting mechanism to move up and down.

[0028] The lifting mechanism includes second telescopic rod 10, and the second telescopic rod 10 is fixedly arranged on workbench 1. The telescopic end of the second telescopic rod 10 is fixedly provided with mounting beam 9. When in use, the second telescopic rod 10 is used to drive mounting beam 9 to move up and down.

[0029] The bottom surface of the mounting beam 9 is detachably connected with the limiting disc 3 through a connecting piece. Through the arrangement, different sizes of the limiting disc 3 can be conveniently replaced, such as a larger limiting disc 3 or a limiting disc 3 with more holes, so as to adjust the specifications of the limiting disc 3 according to actual needs.

[0030] The pressure mechanism comprises a first telescopic rod 7 fixedly arranged on the bottom surface of the mounting beam 9. The top surface of the pressing block 12 is fixedly provided with a connecting cylinder 5. The telescopic end surface of the first telescopic rod 7 is fixedly provided with a magnet. The first telescopic rod 7 is detachably connected with the connecting cylinder 5 through the magnet. When connected, the telescopic end of the first telescopic rod 7 is inserted into the connecting cylinder 5, and then the inner bottom surface of the connecting cylinder 5 is adsorbed by the magnet to realize the connection of the first telescopic rod 7 and the connecting cylinder 5. When separated, the connecting cylinder 5 is only needed to be held by hand and moved downward to be separated from the adsorption of the magnet, and the separation is completed.

[0031] The connecting piece comprises a connecting column 6. The top end of the connecting column 6 is fixedly connected with the mounting beam 9. The top surface center of the limiting disc 3 is fixedly provided with a fixed cylinder 15. The connecting column 6 is detachably connected with the fixed cylinder 15 through a bolt 14. The lower part of the connecting column 6 is provided with a screw hole. The fixed cylinder 15 is provided with a through hole. When the limiting disc 3 is installed, the fixed cylinder 15 on the limiting disc 3 is sleeved on the bottom of the connecting column 6, and the through hole and the screw hole are corresponded, and then the bolt 14 is screwed into the screw hole to complete the installation.

[0032] The polishing mechanism comprises a polishing wheel 2 rotatably arranged on the workbench 1 and below the limiting disc 3. The polishing wheel 2 is driven to rotate by a motor. The polishing wheel 2 is a conventional device. Its use mode and principle are the same as those of the prior art, and will not be described here.

[0033] The workbench 1 is further provided with a spray pipe 11. The nozzle of the spray pipe 11 faces the polishing wheel 2. The spray pipe 11 can be used to connect a water pump to spray polishing liquid on the polishing wheel 2.

[0034] The number of the pressing blocks 12 corresponds to the number of the limiting blocks 4. The number of the first telescopic rods 7 corresponds to the number of the pressing blocks 12.

[0035] In the embodiment, the first telescopic rod 7 and the second telescopic rod 10 can both be electric telescopic rods.

[0036] The bottom surface of the mounting beam 9 is fixedly provided with a protective cover 8. The protective cover 8 covers the upper part of the limiting mechanism. The protective cover 8 can be used to protect the limiting mechanism.

[0037] Work flow: according to the shape and quantity of the diamond single crystal wafer to be processed to select the corresponding limit block 4 and pressure block 12, after selecting, the lifting mechanism is used to drive the limiting disc 3 to be close to the polishing wheel 2, then the first telescopic rod 7 is retracted, the limiting block 4 is placed in the hole of the limiting disc 3, at this time the bottom of the limiting block 4 is removed from the polishing wheel 2, then the single crystal wafer is placed on the limiting groove 13 of the limiting block 4, so that the single crystal wafer contacts the polishing wheel 2, and the single crystal wafer is limited to move horizontally by the limiting groove 13, then the corresponding pressure block 12 is placed in the limiting groove 13 and pressed on the single crystal wafer, then the telescopic end of the first telescopic rod 7 is inserted into the connecting barrel 5 on the pressure block 12 and is attracted and connected by the magnet, then the motor is started to drive the polishing wheel 2 to rotate, and the polishing liquid is sprayed out of the spray pipe 11 to perform the polishing operation, when polishing, the first telescopic rod 7 drives the pressure block 12 to apply a certain pressure on the single crystal wafer, so that the single crystal wafer can tightly contact the polishing wheel 2 to achieve the polishing effect, after polishing, the rotation of the polishing wheel 2 is stopped, the lifting mechanism drives the entire limiting mechanism to move upwards, when the limiting disc 3 moves upwards, the single crystal wafer remains on the polishing wheel 2, then it can be taken out. If the next time the diamond single crystal wafer to be processed is not of the same specification, only the corresponding limiting block 4 and pressure block 12 need to be replaced according to the specification.

[0038] If the next time is to polish the same specification of diamond single crystal wafer, the limiting block 4 and the pressure block 12 do not need to be replaced, the lifting mechanism is directly used to drive the limiting disc 3 to move downwards, so that the bottom of the limiting block 4 contacts the polishing wheel 2, then the first telescopic rod 7 drives the pressure block 12 to move upwards, so that the pressure block 12 moves out of the limiting groove 13, then the diamond single crystal wafer is placed into the limiting groove 13, and then the first telescopic rod 7 drives the pressure block 12 to re-enter the limiting groove 13.

[0039] The above is only a preferred specific implementation of the present application, but the protection scope of the present application is not limited to this, any person skilled in the art can make equivalent replacement or change according to the technical scheme and the inventive concept of the present application within the technical range disclosed by the present application, which should be covered within the protection scope of the present application.

[0040] In the description of the present application, the description of the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present application, the illustrative description of the above terms is not necessarily for the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, the person skilled in the art can combine and combine the different embodiments or examples described in the present application and the features of the different embodiments or examples without contradiction.

[0041] Although the embodiments of the present application have been shown and described above, it should be understood by those skilled in the art that the above embodiments are exemplary and cannot be construed as limiting the present application, and those skilled in the art can make changes, modifications, replacements and variations to the above embodiments within the scope of the present application.

Claims

1. A diamond single-crystal polishing apparatus, characterized in that, The device includes a worktable (1), on which a polishing mechanism and a limiting mechanism are provided. The limiting mechanism and the worktable (1) are connected by a lifting mechanism. The limiting mechanism includes a limiting plate (3), a limiting block (4), a pressing block (12), and a pressure mechanism. The limiting plate (3) has several holes, and a limiting block (4) is engaged in each hole. The limiting block (4) has a limiting groove (13). The shape of the pressing block (12) matches the limiting groove (13). The pressing block (12) is detachably connected to the pressure mechanism.

2. The diamond single-crystal polishing apparatus according to claim 1, characterized in that, The lifting mechanism includes a second telescopic rod (10), which is fixedly mounted on the workbench (1), and the telescopic end of the second telescopic rod (10) is fixedly mounted with an installation beam (9).

3. The diamond single-crystal polishing apparatus according to claim 2, characterized in that, The limiting plate (3) and the bottom surface of the mounting beam (9) are detachably connected by a connector.

4. The diamond single-crystal polishing apparatus according to claim 2, characterized in that, The pressure mechanism includes a first telescopic rod (7), which is fixedly installed on the bottom surface of the mounting beam (9). A connecting cylinder (5) is fixedly installed on the top surface of the pressure block (12). A magnet is fixedly installed on the telescopic end face of the first telescopic rod (7). The first telescopic rod (7) and the connecting cylinder (5) are detachably connected by the magnet.

5. The diamond single-crystal polishing apparatus according to claim 3, characterized in that, The connector includes a connecting column (6), the top of which is fixedly connected to the mounting beam (9), and a fixing cylinder (15) is fixedly provided at the center of the top surface of the limiting plate (3). The connecting column (6) and the fixing cylinder (15) are detachably connected by bolts (14).

6. The diamond single-crystal polishing apparatus according to claim 1, characterized in that, The polishing mechanism includes a polishing wheel (2), which is rotatably mounted on the worktable (1) and below the limiting plate (3). The polishing wheel (2) is driven to rotate by a motor.

7. The diamond single-crystal polishing apparatus according to claim 6, characterized in that, The workbench (1) is also equipped with a nozzle (11), the nozzle of which faces the polishing wheel (2).

8. The diamond single-crystal polishing apparatus according to claim 4, characterized in that, The number of pressure blocks (12) corresponds to the number of limiting blocks (4), and the number of the first telescopic rods (7) corresponds to the number of pressure blocks (12).

9. A diamond single-crystal polishing apparatus according to claim 2, characterized in that, A protective cover (8) is fixedly installed on the bottom surface of the mounting beam (9), and the protective cover (8) covers the upper part of the limiting mechanism.

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