Photovoltaic silicon wafer polishing jig and photovoltaic silicon wafer polishing device
By designing a polishing fixture and polishing device for photovoltaic silicon wafers, and utilizing gear meshing and lifting mechanisms, the problems of edge chipping and fragmentation during the polishing process of photovoltaic silicon wafers were solved, thereby improving the yield of silicon wafers.
Patent Information
- Application Number
- CN202422468953.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-11
- Publication Date
- 2025-12-12
- Estimated Expiration
- 2034-10-11
AI Technical Summary
Existing photovoltaic silicon wafers are prone to edge chipping and fragmentation during the polishing process.
A polishing fixture and polishing device for photovoltaic silicon wafers were designed, including a disc-shaped fixture body and multiple fixture inner rings. Combined with a drive sun gear, polishing ring and power component, the silicon wafers are effectively polished through gear meshing and lifting mechanism.
It effectively reduces the problems of fragmentation and edge chipping during the polishing process, and improves the yield of silicon wafers.
Smart Images
Figure CN223656767U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to single crystal silicon rod preparation field, concretely is a kind of polishing jig and photovoltaic silicon wafer polishing device of photovoltaic silicon wafer. BACKGROUND
[0002] Photovoltaic silicon wafer processing needs to be polished, and the existing technology photovoltaic silicon wafer is easy to cause the problem such as edge collapse, abnormal fragment in polishing process, in order to solve the technical problem, present the polishing jig and photovoltaic silicon wafer polishing device of photovoltaic silicon wafer. SUMMARY
[0003] One of the technical problems to be solved by the present disclosure is that the existing technology photovoltaic silicon wafer is easy to cause the problem such as edge collapse, abnormal fragment in polishing process.
[0004] To solve the above technical problems, the present disclosure provides a kind of.
[0005] To achieve the above object, the utility model provides the following technical scheme:
[0006] A kind of polishing jig of photovoltaic silicon wafer, comprising: jig main body, the jig main body is discoid, gear is fixedly sleeved on the outer side of the jig main body, a plurality of jig inner circles are arranged on the jig main body, the jig inner circle is the through-hole on the jig main body, and the jig inner circle is used to place photovoltaic silicon wafer.
[0007] In some embodiments, the number of jig inner circles can be four, five or six.
[0008] A kind of photovoltaic silicon wafer polishing device, comprising: mounting seat, the second polishing ring is rotationally arranged with driving sun gear, the first polishing ring is arranged on the outer side of the driving sun gear, the first polishing ring is sleeved on the outer side of driving sun gear, the second polishing ring is rotationally installed on the mounting seat;The mounting seat is also provided with inner tooth ring, the inner tooth ring is concentrically arranged with driving sun gear, a plurality of jig main bodies as claimed in claim are arranged between the driving sun gear and the inner tooth ring, and the driving sun gear and the inner tooth ring are all engaged with the gear on the outer side of jig main body, the driving sun gear is arranged with a plurality of jig main bodies on the outer side.
[0009] In some embodiments, the mounting seat is also provided with power component that drives driving sun gear, mounting seat and the rotation of second polishing ring, and the power component provides power for the rotation of driving sun gear, second polishing ring and mounting seat.
[0010] In some embodiments, the power component comprises a plurality of drive motors arranged on the mounting base, one of which is in driving connection with the driving sun gear, one of which is in driving connection with the first polishing ring, and one of which is in driving connection with the second polishing ring.
[0011] In some embodiments, the first polishing ring is installed on the mounting base through a lifting mechanism, the lifting mechanism is fixedly installed on the mounting base, and the first polishing ring is rotatably installed on the lifting mechanism, and the drive motor for driving the first polishing ring to rotate is also fixedly installed on the output end of the lifting mechanism.
[0012] In some embodiments, the first polishing ring is provided with a first grinding disc at the bottom, and the second polishing ring is provided with a second grinding disc at the top.
[0013] In some embodiments, the lower end of the first polishing ring abuts against the upper part of the jig body, and the upper end of the second polishing ring abuts against the lower part of the jig body.
[0014] In some embodiments, the driving sun gear is installed on the power component, the driving sun gear is provided with a step on the outside, the inner tooth ring is also provided with a step on the inside, and the lower end of the jig body abuts against the steps of the driving sun gear and the inner tooth ring.
[0015] In some embodiments, the number of jig bodies is three, four or five.
[0016] Compared with the prior art, the utility model has the advantages that in the polishing process, the jig body is installed on the polishing device, the photovoltaic silicon wafer is placed inside the inner circle of the jig, and then polishing is carried out, the utility model effectively reduces the adverse problems caused by too high broken pieces and edge collapse, and can effectively improve the yield of polished silicon wafers. BRIEF DESCRIPTION OF DRAWINGS
[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure or the prior art, the drawings needed in the following embodiment or prior art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present disclosure, and other drawings can also be obtained by those skilled in the art without creative labor.
[0018] Figure 1 It is a structure schematic view of the polishing jig for photovoltaic silicon wafers in the embodiments of the utility model.
[0019] Figure 2 It is a structure schematic view of the polishing device for photovoltaic silicon wafers in the embodiments of the utility model.
[0020] In the figure: 1 - gear, 2 - fixture inner ring, 3 - fixture body, 4 - drive sun gear, 5 - first polishing ring, 6 - second polishing ring, 7 - mounting seat, 8 - inner tooth ring. DETAILED DESCRIPTION
[0021] The embodiments of the present disclosure will be further described below in conjunction with the drawings and examples. The detailed description of the following examples and drawings are used to exemplarily illustrate the principles of the present disclosure, but cannot be used to limit the scope of the present disclosure, and the present disclosure can be implemented in many different forms, not limited to the specific examples disclosed herein, but includes all technical solutions falling within the scope of the claims.
[0022] The present disclosure provides these examples in order to make the present disclosure thorough and complete, and fully convey the scope of the present disclosure to those skilled in the art. It should be noted that: unless otherwise specified, the relative arrangement of components and steps, the composition of materials, numerical expressions and values set forth in these examples should be interpreted as merely exemplary, and not as a limitation.
[0023] It should be noted that, in the description of the present disclosure, unless otherwise specified, the meaning of "a plurality of" is greater than or equal to two; the orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", "inner", "outer" and the like is only for the purpose of facilitating the description of the present disclosure and simplifying the description, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation to the present disclosure. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.
[0024] In addition, the "first", "second" and similar words used in the present disclosure do not represent any order, number or importance, but are only used to distinguish different parts. "Vertical" is not strictly vertical, but within the allowable range of error. "Parallel" is not strictly parallel, but within the allowable range of error. "Include" or "contain" and similar words mean that the elements before the word cover the elements listed after the word, and do not exclude the possibility of also covering other elements.
[0025] It should also be noted that, in the description of the present disclosure, unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connection" should be understood broadly, for example, it can be a fixed connection, or a detachable connection, or an integral connection; it can be directly connected, or indirectly connected through an intermediate medium. For those skilled in the art, the specific meaning of the above terms in the present disclosure can be understood according to the specific circumstances. When it is described that a specific device is located between a first device and a second device, there can be an intermediate device between the specific device and the first device or the second device, or there can be no intermediate device.
[0026] All terms used in the present disclosure have the same meaning as understood by those of ordinary skill in the art to which the present disclosure pertains, unless otherwise specifically defined. It should also be understood that terms defined in a general dictionary should be interpreted to have meanings consistent with their meanings in the context of the relevant technology, and should not be interpreted in an idealized or extremely formalized sense, unless otherwise explicitly defined herein.
[0027] Techniques, methods, and apparatus known to those of ordinary skill in the relevant art can not be discussed in detail, but should be considered part of the specification where appropriate.
[0028] Referring to Figure 1 and Figure 2 , Figure 1 is a structural schematic view of a polishing jig for a photovoltaic silicon wafer in an embodiment of the present application. Figure 2 is a structural schematic view of a polishing device for a photovoltaic silicon wafer in an embodiment of the present application. The photovoltaic silicon wafer processing process needs to be polished, and the existing technology photovoltaic silicon wafer is easy to cause edge collapse, fragment abnormality and other problems in the polishing process. In order to solve the technical problem, the polishing jig for the photovoltaic silicon wafer and the polishing device for the photovoltaic silicon wafer are proposed.
[0029] Some embodiments of the present application will be described in detail below with reference to the accompanying drawings. In the case of no conflict, the following examples and features in the examples can be combined with each other.
[0030] Example 1
[0031] Please refer to Figure 1 , the structural diagram of the polishing jig for the photovoltaic silicon wafer provided in the embodiment 1 of the present application, the polishing jig comprises: a jig main body 3, the jig main body 3 is disc-shaped, a gear 1 is fixedly sleeved outside the jig main body 3, a plurality of jig inner circles 2 are arranged in an array on the jig main body 3, the jig inner circle 2 is a through hole on the jig main body 3, and the jig inner circle 2 is used for placing the photovoltaic silicon wafer.
[0032] In the polishing process, the jig main body 3 is installed on the polishing device, the photovoltaic silicon wafer is placed inside the jig inner circle 2, and then polishing is carried out. The present application effectively reduces the adverse problems caused by too high fragments and edge collapse, and can effectively improve the polishing output wafer yield.
[0033] As a preferred embodiment of the present application, the number of the jig inner circles 2 can be four, five or six, and the specific number can be set according to the needs.
[0034] Example 2
[0035] As Figure 2As shown in the utility model embodiment 2 further provides a photovoltaic silicon wafer polishing device, include: mounting seat 7, the second polishing ring 6 is rotationally arranged with drive sun gear 4, the first polishing ring 5 is arranged on the outside of drive sun gear 4, the first polishing ring 5 is set in drive sun gear 4 outside, the second polishing ring 6 is arranged below the first polishing ring 5, the second polishing ring 6 is rotationally installed on mounting seat 7;The mounting seat 7 is also provided with inner tooth ring 8, the inner tooth ring 8 is concentrically arranged with drive sun gear 4, a plurality of jig main bodies 3 are arranged between drive sun gear 4 and inner tooth ring 8, drive sun gear 4 and inner tooth ring 8 are all engaged with the gear 1 of the outside of jig main body 3, a plurality of jig main bodies 3 are arranged on the outside of drive sun gear 4;The first polishing ring 5 and the second polishing ring 6 are used to polish the photovoltaic silicon wafer of the inside of jig inner ring 2 two sides respectively.
[0036] As a preferred embodiment of the utility model, in order to drive drive sun gear 4, the first polishing ring 5 and the second polishing ring 6 rotate, therefore the mounting seat 7 is also provided with the power component of drive drive sun gear 4, mounting seat 7 and the second polishing ring 6 rotation, and the power component provides power for the rotation of drive sun gear 4, the second polishing ring 6 and mounting seat 7.The power component can include a plurality of drive motors arranged on mounting seat 7, wherein one drive motor is in transmission connection with drive sun gear 4, one drive motor is in transmission connection with the first polishing ring 5, and one drive motor is in transmission connection with the second polishing ring 6.A plurality of drive motors are all fixedly installed on mounting seat 7.The power component is prior art and will not be described in detail here.
[0037] As a preferred embodiment of the utility model, it should be noted that the first polishing ring 5 can be arranged in a lifting manner, so that the jig main body 3 can be removed from between the first polishing ring 5 and the second polishing ring 6.Specifically, the first polishing ring 5 can be installed on the mounting seat 7 by a lifting mechanism, the lifting mechanism is fixedly installed on the mounting seat 7, the first polishing ring 5 is rotationally installed on the lifting mechanism, and the drive motor for driving the first polishing ring 5 to rotate is also fixedly installed on the output end of the lifting mechanism.
[0038] As a preferred embodiment of the utility model, the first polishing ring 5 is provided with a first grinding disc at the bottom, the second polishing ring 6 is provided with a second grinding disc at the top, and the first grinding disc and the second grinding disc are used for grinding the photovoltaic silicon wafer in the jig inner ring 2.
[0039] As a preferred embodiment of the utility model, the first polishing ring 5 is abutted on the upper part of the jig main body 3, and the second polishing ring 6 is abutted on the lower part of the jig main body 3. In this way, the upper and lower sides of the jig main body 3 can be polished at the same time.
[0040] As one preferred embodiment of the utility model, the driving sun gear 4 is installed on the power component, the driving sun gear 4 outside is provided with a step, the inner tooth ring 8 inside is also provided with a step, and the jig main body 3 lower end is in contact with the step of driving sun gear 4 and the step of inner tooth ring 8. In order to limit jig main body 3.
[0041] As one preferred embodiment of the utility model, the number of jig main body 3 can be three, four or five, and specific setting is according to need.
[0042] So far, various embodiments of the present disclosure have been described in detail. In order to avoid obscuring the concept of the present disclosure, some details known in the art are not described. Those skilled in the art can fully understand how to implement the technical solutions disclosed herein according to the above description.
[0043] Although some specific embodiments of the present disclosure have been described in detail through examples, those skilled in the art should understand that the above examples are only for illustration, not for limiting the scope of the present disclosure. Those skilled in the art should understand that the above embodiments can be modified or some technical features can be replaced equivalently without departing from the scope and spirit of the present disclosure. In particular, as long as there is no structural conflict, the technical features mentioned in each embodiment can be combined in any way.
Claims
1. A polishing fixture for photovoltaic silicon wafers, characterized in that, include: The fixture body (3) is disc-shaped. A gear (1) is fixedly sleeved on the outside of the fixture body (3). Several fixture inner rings (2) are arranged in an array on the fixture body (3). The fixture inner rings (2) are through holes on the fixture body (3) and are used to place photovoltaic silicon wafers.
2. The polishing fixture for photovoltaic silicon wafers according to claim 1, characterized in that, The number of the fixture body (3) is three, four or five.
3. The polishing fixture for photovoltaic silicon wafers according to claim 1, characterized in that, The number of inner rings (2) of the fixture is four, five or six.
4. A photovoltaic silicon wafer polishing device, characterized in that, include: Mounting base (7), drive sun gear (4), a first polishing ring (5) is provided on the outside of the drive sun gear (4), the first polishing ring (5) is sleeved on the outside of the drive sun gear (4), a second polishing ring (6) is provided below the first polishing ring (5), the second polishing ring (6) is rotatably mounted on the mounting base (7), and the drive sun gear (4) is rotatably mounted on the second polishing ring (6); the mounting base (7) is also provided with an internal gear ring (8), the internal gear ring (8) is concentrically arranged with the drive sun gear (4), a plurality of fixture bodies (3) as described in claims 1-2 are arranged between the drive sun gear (4) and the internal gear ring (8), the drive sun gear (4) and the internal gear ring (8) are both meshed with the gear (1) on the outside of the fixture body (3), and a plurality of fixture bodies (3) are arranged on the outside of the drive sun gear (4).
5. The photovoltaic silicon wafer polishing apparatus according to claim 4, characterized in that, The mounting base (7) is also provided with a power component that drives the sun gear (4), the mounting base (7) and the second polishing ring (6) to rotate. The power component provides power for driving the sun gear (4), the second polishing ring (6) and the mounting base (7) to rotate.
6. The photovoltaic silicon wafer polishing apparatus according to claim 5, characterized in that, The power component includes several drive motors mounted on the mounting base (7), one of which is connected to the drive sun gear (4), one of which is connected to the first polishing ring (5), and one of which is connected to the second polishing ring (6).
7. A photovoltaic silicon wafer polishing apparatus according to claim 6, characterized in that, The first polishing ring (5) is mounted on the mounting base (7) via a lifting mechanism. The lifting mechanism is fixedly mounted on the mounting base (7). The first polishing ring (5) is rotatably mounted on the lifting mechanism. The drive motor that drives the first polishing ring (5) to rotate is also fixedly mounted on the output end of the lifting mechanism.
8. The photovoltaic silicon wafer polishing apparatus according to claim 7, characterized in that, The first polishing ring (5) has a first grinding disc at its bottom and the second polishing ring (6) has a second grinding disc at its top.
9. A photovoltaic silicon wafer polishing apparatus according to claim 8, characterized in that, The lower end of the first polishing ring (5) abuts against the upper part of the fixture body (3), and the upper end of the second polishing ring (6) abuts against the lower part of the fixture body (3).
10. A photovoltaic silicon wafer polishing apparatus according to claim 4, characterized in that, The driving sun gear (4) is mounted on the power component. A step is provided on the outer side of the driving sun gear (4), and a step is also provided on the inner side of the internal gear ring (8). The lower end of the fixture body (3) abuts against the step of the driving sun gear (4) and the step of the internal gear ring (8).