Novel silicon wafer drying machine with automatic box cover mechanism

Abstract

The utility model discloses a novel silicon wafer dryer with an automatic box cover mechanism, which relates to the technical field of silicon wafer drying and comprises a drying box, support frames are mounted at two ends of outer walls of two sides of the drying box, the automatic box cover mechanism is arranged at the top of the drying box, and the automatic box cover mechanism comprises a box cover body transversely and slidably connected to the top of the drying box. Multiple sets of air holes penetrating through the drying box are formed in the side walls of the periphery of the drying box, air inlet covers communicating with the air holes are installed on the outer walls of the periphery of the drying box, a sealing box is connected to the bottom of the drying box, an air inlet is formed in the bottom wall of the sealing box, and a fan and an electric heating pipe are connected to an inner cavity of the sealing box through a support. And communicating air pipes are mounted on the peripheral side walls of the sealing box. The novel silicon wafer drying machine is provided with the automatic box cover mechanism, opening and closing of the drying box are facilitated, negative pressure can be generated after the fan works, heat generated by the electric heating pipe can be blown to the silicon wafer from the periphery, and the drying efficiency of the silicon wafer is effectively improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of silicon wafer drying, in particular to a novel silicon wafer dryer provided with an automatic box cover mechanism. BACKGROUND

[0002] The novel silicon wafer dryer is a device for drying silicon wafers. It has the advantages of high efficiency, fast drying speed, low energy consumption, simple operation and easy control, and is widely used for drying various silicon wafer-shaped chemical products, such as black silicon carbide wafers and silicon carbide micro-powder. Most existing novel silicon wafer dryers are not provided with an automatic box cover mechanism, and the opening and closing of the box cover is troublesome, which is inconvenient for placing and taking out the silicon wafers. Moreover, most novel silicon wafer dryers can only blow hot air to the silicon wafers from a single direction, and the drying efficiency of the silicon wafers on the side not facing the hot air is generally low, and the drying effect is not good. Therefore, we propose a novel silicon wafer dryer provided with an automatic box cover mechanism. SUMMARY

[0003] The utility model aims at providing a novel silicon wafer dryer provided with an automatic box cover mechanism to solve the problems mentioned in the background.

[0004] To achieve the above-mentioned purpose, the utility model provides the following technical scheme:

[0005] A novel silicon wafer dryer provided with an automatic box cover mechanism, comprising a drying box, support frames are installed at both ends of the outer walls on both sides of the drying box, and an automatic box cover mechanism is arranged on the top of the drying box. The automatic box cover mechanism comprises a box cover body which is horizontally and slidingly connected to the top of the drying box.

[0006] A plurality of groups of air holes are formed in the peripheral side walls of the drying box, and air inlet covers are installed on the peripheral outer walls of the drying box and communicate with the air holes. A sealed box is connected to the bottom of the drying box, an air inlet is formed in the bottom wall of the sealed box, and a fan and an electric heating pipe are connected to the inner cavity of the sealed box through a support. Air pipes are installed on the peripheral side walls of the sealed box and are in communication, and the other ends of the air pipes communicate with the air inlet covers.

[0007] Further, the automatic box cover mechanism further comprises a U-shaped box which is connected to the left end of the rear outer wall of the drying box through a support, and the U-shaped box is located directly above the box cover body.

[0008] Further, a stepper motor is arranged on the front end face of the U-shaped box, a drive shaft is connected to the output end of the stepper motor, a gear is installed on the drive shaft, a plurality of groups of meshing grooves are formed in the box cover body, and the meshing grooves are in meshing connection with the gear.

[0009] Further, a T-shaped guide slot is formed in the front end face of the box cover body, and a T-shaped piece is installed on the front end outer wall of the drying box and is in sliding connection with the T-shaped guide slot.

[0010] Further, the inner wall of the air inlet is connected with a dust screen.

[0011] Further, a sealing strip is arranged at the connecting position of the box cover body and the drying box.

[0012] Further, a cushion plate is arranged at the bottom of each group of support frames, and an antiskid pad is arranged on the lower surface of the cushion plate.

[0013] Compared with the prior art, the present application has the following advantages:

[0014] The novel drying machine for silicon wafers is provided with an automatic box cover mechanism, and the gear on the driving shaft is driven to rotate through the work of the stepping motor on the automatic box cover mechanism. Since the gear is in meshing connection with the plurality of meshing grooves, and the box cover is limited in sliding through the T-shaped member and the T-shaped guide groove, the box cover can slide horizontally on the drying box, which facilitates the opening and closing of the drying box. The fan generates negative pressure after work, and the heat generated by the electric heating pipe is delivered into the plurality of air holes through the air pipe and the air inlet cover, and the hot air is blown to the silicon wafers from all directions, which effectively improves the drying efficiency of the silicon wafers. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 It is a structural schematic diagram of the present application;

[0016] Figure 2 It is a bottom view structural schematic diagram of the present application;

[0017] Figure 3 It is a front view structural sectional view of the sealing box of the present application;

[0018] Figure 4 It is a front view connecting structural sectional view of the U-shaped box and the box cover body of the present application.

[0019] In the figure: 1, drying box; 2, support frame; 3, automatic box cover mechanism; 300, box cover body; 301, U-shaped box; 302, meshing groove; 303, stepping motor; 304, T-shaped guide groove; 305, T-shaped member; 306, driving shaft; 307, gear; 4, air hole; 5, air pipe; 6, air inlet cover; 7, sealing box; 8, air inlet; 9, dust screen; 10, fan; 11, electric heating pipe. DETAILED DESCRIPTION

[0020] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0021] Embodiment 1:

[0022] Please refer to Figures 1-4 The utility model provides a technical scheme: a novel silicon wafer drying machine provided with an automatic box cover mechanism, which comprises a drying box 1, support frames 2 are installed at both ends of the outer walls on both sides of the drying box 1, and an automatic box cover mechanism 3 is arranged on the top of the drying box 1; before use, the electrical terminals of various electrical equipment are electrically connected to the electrical terminals of an external power supply and a controller through wires; the automatic box cover mechanism 3 can drive the box cover body 300 to slide horizontally on the top of the drying box 1; after a certain distance is formed between the box cover body 300 and the drying box 1, the silicon wafer can be placed in the drying box 1, and the silicon wafer can also be conveniently taken out; after the box cover body 300 is connected to the drying box 1, a sealing effect can be achieved, and the silicon wafer can be dried, which facilitates the placing and taking of the silicon wafer.

[0023] A plurality of air holes 4 are formed in the peripheral side walls of the drying box 1, air inlet covers 6 are installed on the peripheral outer walls of the drying box 1 and communicate with the air holes 4, a sealing box 7 is connected to the bottom of the drying box 1, an air inlet 8 is formed in the bottom wall of the sealing box 7, a fan 10 and an electric heating pipe 11 are connected to the inner cavity of the sealing box 7 through supports, air pipes 5 are installed on the peripheral side walls of the sealing box 7 and are in communication, and the other ends of the air pipes 5 communicate with the air inlet covers 6; after the silicon wafer is placed, the fan 10 (exhaust fan) works to generate negative pressure, air is sucked into the sealing box 7, the electric heating pipe 11 generates heat, and the hot air is delivered into the air inlet covers 6 through the air pipes 5 by the exhaust of the fan 10, and finally the hot air is blown into the drying box 1 through the plurality of air holes 4 to dry the silicon wafer from all directions.

[0024] Preferably, the automatic box cover mechanism 3 further comprises a U-shaped box 301, the U-shaped box 301 is connected to the left end of the rear outer wall of the drying box 1 through a support, and the U-shaped box 301 is located directly above the box cover body 300; the U-shaped box 301 is fixedly connected to the drying box 1 through a support.

[0025] Preferably, a stepping motor 303 is arranged on the front end face of the U-shaped box 301, a drive shaft 306 is connected to the output end of the stepping motor 303, a gear 307 is installed on the drive shaft 306, a plurality of meshing grooves 302 are formed in the box cover body 300, and the meshing grooves 302 are in meshing connection with the gear 307; the stepping motor 303 can drive the gear 307 fixedly connected to the drive shaft 306 to rotate forward or reverse, and the box cover body 300 can move horizontally due to the meshing connection between the gear 307 and the plurality of meshing grooves 302.

[0026] Preferably, the front end surface of the box cover body 300 is provided with a T-shaped guide groove 304, the front end outer wall of the drying box 1 is provided with a T-shaped piece 305, and the T-shaped piece 305 is in sliding connection with the T-shaped guide groove 304; the T-shaped piece 305 is fixedly connected with the front end surface of the drying box 1, and after the sliding and limiting of the T-shaped piece 305 and the T-shaped guide groove 304, the box cover body 300 is more smooth in transverse sliding and will not be separated from the top of the drying box 1.

[0027] Preferably, the inner wall of the air inlet 8 is connected with a dustproof net 9; the dustproof net 9 plays a dustproof role, avoids dust from being sucked into the inner cavity of the sealing box 7, and guarantees the neatness of the silicon wafer after drying.

[0028] Preferably, the connecting position of the box cover body 300 and the drying box 1 is provided with a sealing strip; the sealing strip plays a sealing role and avoids heat leakage.

[0029] Embodiment 2:

[0030] With reference to Figure 1 The difference between this embodiment and the first embodiment is that the bottom of each set of support frames 2 is provided with a base plate, and the lower surface of the base plate is bonded with a non-slip pad; the base plate and the non-slip pad can increase the friction with the ground and improve the stability of the entire novel silicon wafer drying machine in use.

[0031] Although the embodiments of the present application have been shown and described, it can be understood by those skilled in the art that various changes, modifications, replacements and modifications can be made to these embodiments without departing from the principles and spirits of the present application, and the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A novel silicon wafer dryer equipped with an automatic lid mechanism, comprising a drying chamber (1), characterized in that: The drying box (1) has support frames (2) installed at both ends of the outer walls on both sides, and the drying box (1) has an automatic lid mechanism (3) on the top. The automatic lid mechanism (3) includes a lid body (300) that is laterally slidably connected to the top of the drying box (1). The drying box (1) has multiple sets of through-holes (4) on its four sides. The drying box (1) has air inlet covers (6) that connect to the air holes (4) on its four sides. The drying box (1) has a sealing box (7) connected to its bottom. The sealing box (7) has an air inlet (8) on its bottom wall. The sealing box (7) has a fan (10) and an electric heating tube (11) connected to its inner cavity via a bracket. The sealing box (7) has air pipes (5) that connect to its four sides. The other end of the air pipes (5) is connected to the air inlet cover (6). The automatic box lid mechanism (3) also includes a U-shaped box (301), which is connected to the left end of the rear outer wall of the drying box (1) via a bracket, and the U-shaped box (301) is located directly above the box lid body (300); The front end of the U-shaped box (301) is provided with a stepper motor (303), the output end of the stepper motor (303) is connected to a drive shaft (306), a gear (307) is installed on the drive shaft (306), and multiple sets of meshing grooves (302) are opened on the box cover body (300), and the meshing grooves (302) are meshed with the gears (307).

2. A novel silicon wafer dryer with an automatic lid mechanism according to claim 1, characterized in that: The front end face of the box cover body (300) is provided with a T-shaped guide groove (304), and a T-shaped part (305) is installed on the front outer wall of the drying box (1), and the T-shaped part (305) is slidably connected to the T-shaped guide groove (304).

3. A novel silicon wafer dryer with an automatic lid mechanism according to claim 1, characterized in that: The inner wall of the air inlet (8) is connected to a dustproof net (9).

4. A novel silicon wafer dryer with an automatic lid mechanism according to claim 1, characterized in that: A sealing strip is provided at the connection between the box cover body (300) and the drying box (1).

5. A novel silicon wafer dryer with an automatic lid mechanism according to claim 1, characterized in that: Each set of support frames (2) has a pad installed at the bottom, and the lower surface of the pad is glued with an anti-slip mat.

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